CN101805576B - Epoxy-resin single-component soft adhesive - Google Patents
Epoxy-resin single-component soft adhesive Download PDFInfo
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- CN101805576B CN101805576B CN 201010146355 CN201010146355A CN101805576B CN 101805576 B CN101805576 B CN 101805576B CN 201010146355 CN201010146355 CN 201010146355 CN 201010146355 A CN201010146355 A CN 201010146355A CN 101805576 B CN101805576 B CN 101805576B
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- epoxy
- soft adhesive
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- resin single
- resin
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Abstract
The invention discloses an epoxy-resin single-component soft adhesive. The epoxy-resin single-component soft adhesive is prepared from the following raw materials: 34-46% of epoxy resin, 2-5% of curing agent, 1.5-2.5% of accelerant, 3-6% of plasticizer, 3.6-6.7% of toughener, 4-7.2% of flexibilizer, 1.2-2.6% of rheological agent, 1-1.8% of carbon black, 14.5-26.6% of flame retardant and 18-23% of pearl filler. The epoxy-resin single-component soft adhesive is a pasty sticky matter, does not react at room temperature, and can be solidified into an elastic condensate with the Shaw hardness D of 30-65 after being heated at 80-130 DEG C for 1-3 hours,. When being used for bonding and fixing components, the invention has the advantages of small reaction stress and low shrinkage, and can not cause component cracking after encapsulation.
Description
Technical field
The present invention relates to adhesive for electronic component, particularly relate to a kind of soft adhesive for electronic devices and components such as inducer, transformers.
Background technology
Along with the development that science and technology is maked rapid progress, also at high speed development, the electronic devices and components such as SMD (surface mount device), inducer, transformer all encapsulate with composition epoxy resin the electronic product packaging technology up to now.The many component adhesives of Resins, epoxy of the prior art are solid-state after encapsulation, cause easily breaking of components and parts, can not be satisfactory in the use.
Summary of the invention
The purpose of this invention is to provide a kind of soft adhesive that can form the elasticity cured article behind the components and parts that encapsulates.
The technical solution adopted for the present invention to solve the technical problems is: a kind of epoxy-resin single-component soft adhesive is comprised of the Resins, epoxy of 34-46%, the solidifying agent of 2-5%, the promotor of 1.5-2.5%, the softening agent of 3-6%, the toughner of 3.6-6.7%, the flexibility agent of 4-7.2%, the rheological agent of 1.2-2.6%, the carbon black of 1-1.8%, the fire retardant of 14.5-26.6% and the pearl filler of 18-23%.
Wherein, described Resins, epoxy is comprised of the bisphenol A epoxide resin of 16-20% and the long-chain flexibility Resins, epoxy of 18-26%.
Wherein, described fire retardant is comprised of the zinc borate of 2.5-8.6% and the aluminium hydroxide of 12-18%, and aluminium hydroxide uses as auxiliary flame retardant.
Wherein, described solidifying agent is dicyandiamide, and described promotor is the derivative of urea, and described softening agent is dibutyl phthalate, and described toughner is phenylcarbinol, and described flexibility agent is nonyl phenol, and described rheological agent is aerosil.
In addition, described solidifying agent selects the particle of 30 μ to carry out moistening 10 μ that are crushed to later.
Mixture of the present invention is the paste dope, when normal temperature, do not react, after being warmed to 80 ℃-130 ℃, 1-3 hour, be solidified into resilient cured article, hardness is Shao Shi D:30-65, that the present invention is used for is bonding, fixedly during components and parts, the stress of reaction is little, shrinking percentage is low, can not cause breaking of components and parts after the encapsulation.
Embodiment
Below in conjunction with embodiment the present invention is described in further detail.
Embodiment one
Soft adhesive of the present invention is made by the raw material of following quality proportioning:
A kind of epoxy-resin single-component soft adhesive, the derivative of the bisphenol A epoxide resin by 16%, 26% long-chain flexibility Resins, epoxy, 2% dicyandiamide, 1.5% urea, 3% dibutyl phthalate, 3.6% phenylcarbinol, 4% nonyl phenol agent, 1.2% aerosil, 1% carbon black, 5.7% zinc borate, 18% aluminium hydroxide (using as auxiliary flame retardant) and 18% pearl filler, wherein solidifying agent selects the particle of 30 μ to carry out moistening later 10 μ that are crushed to.
Embodiment two
Soft adhesive of the present invention is made by the raw material of following quality proportioning:
A kind of epoxy-resin single-component soft adhesive, the derivative of the bisphenol A epoxide resin by 20%, 18% long-chain flexibility Resins, epoxy, 2% dicyandiamide, 1.5% urea, 3% dibutyl phthalate, 3.8% phenylcarbinol, 5.2% nonyl phenol agent, 2.1% aerosil, 1.8% carbon black, 7.6% zinc borate, 12% aluminium hydroxide (using as auxiliary flame retardant) and 23% pearl filler, wherein solidifying agent selects the particle of 30 μ to carry out moistening later 10 μ that are crushed to.
Embodiment three
Soft adhesive of the present invention is made by the raw material of following quality proportioning:
A kind of epoxy-resin single-component soft adhesive, the derivative of the bisphenol A epoxide resin by 19%, 21% long-chain flexibility Resins, epoxy, 3% dicyandiamide, 2% urea, 4% dibutyl phthalate, 4% phenylcarbinol, 5% nonyl phenol agent, 2% aerosil, 1.5% carbon black, 3.5% zinc borate, 16% aluminium hydroxide (using as auxiliary flame retardant) and 19% pearl filler, wherein solidifying agent selects the particle of 30 μ to carry out moistening later 10 μ that are crushed to.
Claims (1)
1. epoxy-resin single-component soft adhesive, it is characterized in that: the mass percent of each composition is as follows:
Described Resins, epoxy is comprised of the bisphenol A epoxide resin of 16-20% and the long-chain flexibility Resins, epoxy of 18-26%;
Described fire retardant is comprised of the zinc borate of 2.5-8.6% and the aluminium hydroxide of 12-18%, and aluminium hydroxide uses as auxiliary flame retardant;
Described solidifying agent is dicyandiamide;
Described promotor is the derivative of urea;
Described softening agent is dibutyl phthalate;
Described toughner is phenylcarbinol;
Described flexibility agent is nonyl phenol;
Described rheological agent is aerosil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010146355 CN101805576B (en) | 2010-04-09 | 2010-04-09 | Epoxy-resin single-component soft adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010146355 CN101805576B (en) | 2010-04-09 | 2010-04-09 | Epoxy-resin single-component soft adhesive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101805576A CN101805576A (en) | 2010-08-18 |
| CN101805576B true CN101805576B (en) | 2013-03-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010146355 Expired - Fee Related CN101805576B (en) | 2010-04-09 | 2010-04-09 | Epoxy-resin single-component soft adhesive |
Country Status (1)
| Country | Link |
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| CN (1) | CN101805576B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109294498A (en) * | 2018-09-12 | 2019-02-01 | 广东东溢新材料科技有限公司 | A kind of epoxy glue being used to prepare high glass transition temperature cover film and preparation method |
| CN113308217A (en) * | 2021-05-27 | 2021-08-27 | 无锡亚星新材料科技有限公司 | Epoxy resin adhesive |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4866108A (en) * | 1988-01-19 | 1989-09-12 | Hughes Aircraft Company | Flexible epoxy adhesive blend |
| KR100845092B1 (en) * | 2006-12-01 | 2008-07-09 | 주식회사 엘지화학 | Adhesive composition for a semiconductor packing, adhesive film, dicing die bonding film and semiconductor device using the same |
| CN101654605A (en) * | 2008-08-21 | 2010-02-24 | 中山市东溢新材料有限公司 | Modified epoxy resin adhesive and preparation method thereof |
-
2010
- 2010-04-09 CN CN 201010146355 patent/CN101805576B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4866108A (en) * | 1988-01-19 | 1989-09-12 | Hughes Aircraft Company | Flexible epoxy adhesive blend |
| KR100845092B1 (en) * | 2006-12-01 | 2008-07-09 | 주식회사 엘지화학 | Adhesive composition for a semiconductor packing, adhesive film, dicing die bonding film and semiconductor device using the same |
| CN101654605A (en) * | 2008-08-21 | 2010-02-24 | 中山市东溢新材料有限公司 | Modified epoxy resin adhesive and preparation method thereof |
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| Publication number | Publication date |
|---|---|
| CN101805576A (en) | 2010-08-18 |
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Address after: 523000 Guangdong city in Dongguan Province town of Kau River Industrial Zone Patentee after: Guangdong days ring innovation Polytron Technologies Inc Address before: 523000 Guangdong city in Dongguan Province town of Kau River Industrial Zone Patentee before: Dongguan Tianhuan Technology Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
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Granted publication date: 20130320 Termination date: 20190409 |