CN103468194A - Chip inductor packaging single-component glue and preparation method thereof - Google Patents
Chip inductor packaging single-component glue and preparation method thereof Download PDFInfo
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- CN103468194A CN103468194A CN2013104265295A CN201310426529A CN103468194A CN 103468194 A CN103468194 A CN 103468194A CN 2013104265295 A CN2013104265295 A CN 2013104265295A CN 201310426529 A CN201310426529 A CN 201310426529A CN 103468194 A CN103468194 A CN 103468194A
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Abstract
The invention relates to chip inductor packaging single-component glue. The chip inductor packaging single-component glue comprises the following components in parts by weight: 30 to 60 parts of bisphenol A type epoxy resin, 5 to 20 parts of toughening agent which is butadiene-acrylonitrile rubber modified epoxy resin, 1 to 10 parts of curing agent, 30 to 60 parts of filler and 0-3 parts of assistant. The invention also disclosed a preparation method of the chip inductor packaging single-component glue. The preparation method comprises the following steps: mixing raw materials uniformly under the condition of lower than 30 DEG C, grinding to be fine power with the average particle size of lower than 30 microns under the condition of lower than 35 DEG C, and then discharging and filling. The chip inductor packaging single-component glue has the beneficial effects that the shelf life of a product is longer, the surface of a cured product is not likely to seep oil, and after reflow soldering, the product is not likely to crack and short-circuit.
Description
Technical field
The present invention relates to a kind of packaging plastic, specifically, relate to a kind of chip inductor encapsulation single-component glue and preparation method thereof.
Background technology
Packaging plastic of the prior art, as the epoxy glue of main flow mostly is two components,, often there is one or several problem in the cracking short circuit after the surperficial fuel-displaced or Reflow Soldering of short, cured article of shelf lives in operation inconvenience, and the glue of single-component, can't accomplish that the three takes into account.
Along with the miniaturization of intelligent equipment is more and more, corresponding its inner components and parts also require miniaturization, and the chip inductor of one of them is the demand that meets this miniaturization, and its structure is changed into glue and being encapsulated by metal shell; Except reduced volume, also there is the more stable and lower advantage of cost of performance with glue encapsulation, this glue that is applied to frontier need meet the described all properties of leading portion simultaneously and just can achieve the above object.
Summary of the invention
The object of the invention is to, provide long, cured article of a kind of shelf lives the surperficial not single-component packaging plastic of short circuit easy to crack that is difficult for after fuel-displaced and Reflow Soldering.
The present invention is achieved by the following technical solutions:
The prepared chip inductor of the present invention encapsulates single-component glue, comprises the component of following parts by weight: 30～60 parts of bisphenol A type epoxy resins; 5～20 parts of toughner, described toughner is acrylonitrile butadiene rubber modified epoxy resin; 1～10 part, solidifying agent; 30～60 parts of fillers; 0～3 part of auxiliary agent.
Further, described auxiliary agent comprises coupling agent, flow agent and defoamer.
Further, described filler is one or more the mixture in calcium carbonate, barium sulfate and silicon powder.
The invention also discloses a kind of preparation method of chip inductor encapsulation single-component glue, comprise the steps: raw material is mixed under the environment lower than 30 ℃, and be ground to median size lower than the fine powder of 30 microns, rear discharging, filling under the environment lower than 35 ℃.
Above-mentioned raw materials comprises 30～60 parts of bisphenol A type epoxy resins; 5～20 parts of toughner, described toughner is acrylonitrile butadiene rubber modified epoxy resin; 1～10 part, solidifying agent; 30～60 parts of fillers; 0～3 part of auxiliary agent.
Further, described auxiliary agent comprises coupling agent, flow agent and defoamer.
Further, described filler is one or more the mixture in calcium carbonate, barium sulfate and silicon powder.
Further, after discharging, the condition of cure of product is hot setting at least 1 hour in the environment more than 120 ℃.
Beneficial effect of the present invention is that product shelf life is long, cured article is surperficial is difficult for short circuit not easy to crack after fuel-displaced and Reflow Soldering.
Embodiment
Below in conjunction with specific embodiment, the present invention is described further:
Embodiment 1
Raw material is mixed under the environment of 25 ℃, and be ground to the approximately fine powder of 20 microns of median size, rear discharging, filling under the environment of 25 ℃.Above-mentioned raw materials comprises 46 parts of bisphenol A type epoxy resins; 8 parts of toughner, described toughner is acrylonitrile butadiene rubber modified epoxy resin; 4 parts, solidifying agent; 40 parts of fillers; 2 parts of auxiliary agents.Described auxiliary agent comprises coupling agent, flow agent and defoamer.Described filler is calcium carbonate.After discharging, the condition of cure of product is hot setting at least 1 hour in the environment more than 120 ℃.
Embodiment 2
Raw material is mixed under the environment of 28 ℃, and be ground to the fine powder of 25 microns of median sizes, rear discharging, filling under the environment of 30 ℃.Above-mentioned raw materials comprises 50 parts of bisphenol A type epoxy resins; 13 parts of toughner, described toughner is acrylonitrile butadiene rubber modified epoxy resin; 5 parts, solidifying agent; 30 parts of fillers; 2 parts of auxiliary agents.Described auxiliary agent comprises coupling agent, flow agent and defoamer.The mixture that described filler is calcium carbonate, barium sulfate and silicon powder.After discharging, the condition of cure of product is hot setting at least 1 hour in the environment more than 120 ℃.
The requirement of commercially available 2 months shelf lifes of single-component glue general satisfaction normal temperature, the cured article surface is not fuel-displaced under normal circumstances, the not short circuit of not ftractureing for 100 times of-40 ℃～125 ℃ cold cycling, 9 Reflow Solderings not short circuit of not ftractureing, the product of above-described embodiment 1,2 gained meets above-mentioned requirements, simultaneously, shelf lives can extend to 3 months, do not occur solidifying, the phenomenon such as precipitation, and the cured article surface also slightly promotes compared with commercially available single-component glue performance in the situation that artificial firmly the extruding can be not fuel-displaced.
The glue that the present invention develops, also have that exothermic peak is low, thermal expansivity and cure shrinkage low, in long-time use, components and parts produce in the situation that thermal value is large can play buffering and provide protection.Detailed correlation data please refer to the below form.
The foregoing is only the preferred embodiment of this patent, can not be interpreted as limitation of the present invention, on basis of the present invention, the equivalent technical solutions that those skilled in the art can association draw according to above disclosed content still falls into the protection domain of this patent.
Claims (7)
1. a chip inductor encapsulates single-component glue, comprises the component of following parts by weight: 30～60 parts of bisphenol A type epoxy resins; 5～20 parts of toughner, described toughner is acrylonitrile butadiene rubber modified epoxy resin; 1～10 part, solidifying agent; 30～60 parts of fillers; 0～3 part of auxiliary agent.
2. according to chip inductor encapsulation single-component glue claimed in claim 1, it is characterized in that: described auxiliary agent comprises coupling agent, flow agent and defoamer.
3. according to chip inductor claimed in claim 1 encapsulation single-component glue, it is characterized in that: described filler is one or more the mixture in calcium carbonate, barium sulfate and silicon powder.
4. the preparation method of chip inductor encapsulation single-component glue, comprise the steps: raw material is mixed under the environment lower than 30 ℃, and be ground to median size lower than the fine powder of 30 microns, rear discharging, filling under the environment lower than 35 ℃; Above-mentioned raw materials comprises 30～60 parts of bisphenol A type epoxy resins; 5～20 parts of toughner, described toughner is acrylonitrile butadiene rubber modified epoxy resin; 1～10 part, solidifying agent; 30～60 parts of fillers; 0～3 part of auxiliary agent.
5. according to the preparation method of chip inductor encapsulation single-component glue claimed in claim 4, it is characterized in that: described auxiliary agent comprises coupling agent, flow agent and defoamer.
6. according to the preparation method of chip inductor claimed in claim 4 encapsulation single-component glue, it is characterized in that: described filler is one or more the mixture in calcium carbonate, barium sulfate and silicon powder.
7. according to the preparation method of the described chip inductor of any one in claim 4-6 encapsulation single-component glue, it is characterized in that: after discharging, the condition of cure of product is hot setting at least 1 hour in the environment more than 120 ℃.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310426529.5A CN103468194B (en) | 2013-09-17 | 2013-09-17 | Patch inductor packaging single-component glue and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310426529.5A CN103468194B (en) | 2013-09-17 | 2013-09-17 | Patch inductor packaging single-component glue and preparation method thereof |
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| CN103468194A true CN103468194A (en) | 2013-12-25 |
| CN103468194B CN103468194B (en) | 2015-05-13 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103865461A (en) * | 2014-04-08 | 2014-06-18 | 株洲时代新材料科技股份有限公司 | Adhesive |
| CN116694275A (en) * | 2023-04-26 | 2023-09-05 | 湖北三选科技有限公司 | Liquid epoxy plastic package material and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1908108A (en) * | 2005-08-05 | 2007-02-07 | 比亚迪股份有限公司 | Encapsulating material and method for making same |
| CN102161871A (en) * | 2011-03-09 | 2011-08-24 | 烟台德邦电子材料有限公司 | Heat-conductive insulated adhesive tape for large-power light-emitting diode (LED) and preparation method thereof |
| CN103102857A (en) * | 2012-11-29 | 2013-05-15 | 广州市尤特新材料有限公司 | High-temperature resistant adhesive for glass and preparation method thereof |
-
2013
- 2013-09-17 CN CN201310426529.5A patent/CN103468194B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1908108A (en) * | 2005-08-05 | 2007-02-07 | 比亚迪股份有限公司 | Encapsulating material and method for making same |
| CN102161871A (en) * | 2011-03-09 | 2011-08-24 | 烟台德邦电子材料有限公司 | Heat-conductive insulated adhesive tape for large-power light-emitting diode (LED) and preparation method thereof |
| CN103102857A (en) * | 2012-11-29 | 2013-05-15 | 广州市尤特新材料有限公司 | High-temperature resistant adhesive for glass and preparation method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103865461A (en) * | 2014-04-08 | 2014-06-18 | 株洲时代新材料科技股份有限公司 | Adhesive |
| CN116694275A (en) * | 2023-04-26 | 2023-09-05 | 湖北三选科技有限公司 | Liquid epoxy plastic package material and preparation method thereof |
| CN116694275B (en) * | 2023-04-26 | 2024-03-08 | 湖北三选科技有限公司 | Liquid epoxy plastic package material and preparation method thereof |
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| CN103468194B (en) | 2015-05-13 |
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Address after: 510000 Yonghe Economic Zone, Guangzhou economic and Technological Development Zone, Guangzhou, Guangdong Patentee after: GUANGZHOU POCHELY NEW MATERIAL TECHNOLOGY CO., LTD. Address before: 510000 Yonghe Economic Zone, Guangzhou economic and Technological Development Zone, Guangzhou, Guangdong Patentee before: Guangzhou Juhe Electronic Materials Co., Ltd. |