CN104403620A - Tough high strength epoxy resin potting material and preparation method and application thereof - Google Patents
Tough high strength epoxy resin potting material and preparation method and application thereof Download PDFInfo
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- CN104403620A CN104403620A CN201410637905.XA CN201410637905A CN104403620A CN 104403620 A CN104403620 A CN 104403620A CN 201410637905 A CN201410637905 A CN 201410637905A CN 104403620 A CN104403620 A CN 104403620A
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Abstract
The invention discloses a tough high strength epoxy resin potting material and a preparation method and application thereof, and belongs to the technical field of potting. The tough high strength epoxy resin potting material is prepared by compounding epoxy resin, hexanediamine, polysulfide rubber and glycidyl ether, the raw materials are easy to obtain, and the tough high strength epoxy resin potting material can be used in large scale for potting sophisticated electronic devices, and can effectively solve the problems of rubber layer cracking at high and low temperature, device damages, signal drift and the like. The preparation method of the tough high strength epoxy resin potting material has the advantages of simple operation, easy control, and suitability for industrialized popularization and application. The tough high strength epoxy resin potting material is used for potting electronic components, avoids damage and pulling destruction caused by excessive curing stress in the potting process of the electronic components, and has no cracks in high and low temperature change process, the electronic components and lead wires have no damage, and electrical signals do not drift.
Description
Technical field
The present invention relates to potting compound technical field, be specifically related to a kind of toughness high-strength epoxide resin encapsulation material and its preparation method and application.
Background technology
Room temperature curing epoxy potting compound, due to its good mechanical property, thermostability and cohesiveness, is widely used in the bonding of electronic devices and components, embedding, encapsulation, serves vital role to the fixing, moistureproof, anticorrosion, false proof etc. of electronic devices and components.But due to further developing of electronic technology, its encapsulation requires also more and more higher, except fixing, moistureproof, false proof etc. acting on, also requires the performances such as high temperature resistant.
But the rigidity of epoxy resin is large, easily pulls electronic devices and components and lead-in wire, and high-low temperature resistant poor impact toughness, glue-line is easy to crack, and the poor dimensional stability caused of expanding with heat and contract with cold during high/low temperature, causes electrical signal easily to drift about.By physics or chemical process in prior art, what realize epoxy resin is toughness reinforcing, but intensity reduces.Therefore, research and develop a kind of epoxide resin encapsulation material, improve high temperature performance, avoid damaging because solidification internal stress is excessive, drawing bad product, electronic devices and components embedding field is significant.
Summary of the invention
In order to overcome the defect of prior art, an object of the present invention is to provide a kind of high/low temperature to change the good toughness high-strength epoxide resin encapsulation material of the dimensional stabilizing that expands with heat and contract with cold.
Two of object of the present invention is the preparation method providing a kind of toughness high-strength epoxide resin encapsulation material.
Meanwhile, the present invention is also to provide the application of a kind of toughness high-strength epoxide resin encapsulation material in pot electronics components and parts.
To achieve these goals, the technical solution used in the present invention is as follows:
A kind of toughness high-strength epoxide resin encapsulation material, is made up of the component of following mass fraction: epoxy resin 95 ~ 105 parts, hexanediamine 14 ~ 16 parts, thiorubber 18 ~ 22 parts, glycidyl ether 9 ~ 11 parts.
Described epoxy resin is E-51 epoxy resin.
Described thiorubber is liquid polysulphide rubber T
l1201.
Described glycidyl ether is PY-30 glycidyl ether.
The preparation method of above-mentioned toughness high-strength epoxide resin encapsulation material, concrete operation step is as follows:
1) take epoxy resin, thiorubber and glycidyl ether in proportion, and three is mixed, put into baking oven and heat, obtain sizing material A;
2) under room temperature, in sizing material A, add hexanediamine in proportion, stir, place under vacuum condition, obtain epoxide resin encapsulation material.
Step 1) described in Heating temperature be 55 ~ 65 DEG C, soaking time is 45 ~ 60min.
Step 2) described in vacuum condition under time of placing be 3 ~ 5min.
The application of above-mentioned toughness high-strength epoxide resin encapsulation material in pot electronics components and parts, treating the non-embedding position coating lubricating grease of pot electronics components and parts mould, potting compound is poured in the mould treating pot electronics components and parts, form removal after self-vulcanizing, must treat pot electronics components and parts embedding blob of viscose.
Described embedding blob of viscose room temperature can carry out turnery processing after placing.
The time of described self-vulcanizing is for being no less than 24h.
The time that described room temperature is placed is for being no less than 72h.
Above-mentioned toughness high-strength epoxide resin encapsulation material can be used for filling up embedding regio defect, and concrete grammar is: by rejected region supplementary irrigation epoxide resin encapsulation material, and removes expectation, at room temperature solidifies more than 24h.
Toughness high-strength epoxide resin encapsulation material of the present invention, by epoxy resin, hexanediamine, many sulphur rubbers, glycidyl ether is composite makes, and the active phase reaches 1h, good fluidity, is easy to potting operation, is applicable to the embedding of miniature precision complicated shape.Wherein add glycidyl ether as reactive plasticizer, increase the snappiness of polymer segment, avoid solidification internal stress excessive cause damage, draw bad product.And the present invention specifically limits each constituent mass number, make to act synergistically between each component, make potting compound realize self-vulcanizing 48h and can reach suitable strength, after solidification, there is high hardness and intensity, and improve the high temperature performance of potting compound, through low temperature-60 DEG C, the temperature shock that high temperature is 70 DEG C three circulation, potting compound flawless, electronic devices and components and lead-in wire not damaged phenomenon, electrical signal drifts about.Therefore, the raw material of toughness high-strength epoxide resin encapsulation material of the present invention is easy to get, in enormous quantities for the embedding of accurate complex electronics, the problems such as high/low temperature lower glue layer cracking, device damage, signal drift can be efficiently solved, there is great economic and social benefit.
The preparation method of toughness high-strength epoxide resin encapsulation material of the present invention, easy and simple to handle, process is easy to control, and is suitable for industrial application.
Toughness high-strength epoxide resin encapsulation material of the present invention is used for pot electronics components and parts, the damage avoiding electronic devices and components in potting process causing because solidification internal stress is excessive and draw bad, and in high/low temperature change procedure, potting compound flawless, electronic devices and components and lead-in wire not damaged phenomenon, electrical signal does not drift about.
Accompanying drawing explanation
Fig. 1 is epoxide resin encapsulation material embedding schema of the present invention.
Embodiment
Below in conjunction with specific embodiment, the present invention is described in further detail, but does not form any limitation of the invention.
Embodiment 1
The present embodiment toughness high-strength epoxide resin encapsulation material, is made up of the component of following mass fraction: E-51 epoxy resin 100 parts, hexanediamine 15 parts, T
l1210 liquid polysulphide rubbers 20 parts, PY-30 glycidyl ether 10 parts.
Wherein E-51 epoxy resin is purchased from Shanghai Resin Factory Co., Ltd.; T
l1210 liquid polysulphide rubbers are purchased from chemical plant, Jinxi; PY-30 glycidyl ether is purchased from Zhong Hao Chenguang Research Institute of Chemical Industry company limited.
The preparation method of the present embodiment toughness high-strength epoxide resin encapsulation material is:
1) E-51 epoxy resin, PY-30 glycidyl ether, T is taken in proportion
l1210 liquid polysulphide rubbers, stir, and then put into 62 DEG C, baking oven and keep about 50min, obtained sizing material A;
2) sizing material A taking-up is cooled to room temperature, adds hexanediamine in proportion, stir, under vacuum condition, place 5min, obtain toughness high-strength epoxide resin encapsulation material.
Toughness high-strength epoxide resin encapsulation material prepared by the present embodiment is for embedding Target Seeker Gyro, concrete grammar is: apply one deck lubricating grease at the non-embedding position of Target Seeker Gyro mould, potting compound is poured in the mould of Target Seeker Gyro, form removal after cured at room temperature 24h, ambient temperatare puts the laggard row turnery processing of 72h.
The performance test results: after the solidification of the present embodiment toughness high-strength epoxide resin encapsulation material, hardness is 81 ~ 82S.D, shearing resistance average is 28MPa, through low temperature-60 DEG C, the temperature shock that high temperature is 70 DEG C three circulation, potting compound flawless, electronic devices and components and lead-in wire not damaged phenomenon, electrical signal drifts about.
Embodiment 2
The present embodiment toughness high-strength epoxide resin encapsulation material, is made up of the component of following mass fraction: E-51 epoxy resin 95 parts, hexanediamine 14 parts, T
l1210 liquid polysulphide rubbers 18 parts, PY-30 glycidyl ether 9 parts.
Wherein E-51 epoxy resin is purchased from Shanghai Resin Factory Co., Ltd.; T
l1210 liquid polysulphide rubbers are purchased from chemical plant, Jinxi; PY-30 glycidyl ether is purchased from Zhong Hao Chenguang Research Institute of Chemical Industry company limited.
The preparation method of the present embodiment toughness high-strength epoxide resin encapsulation material is:
1) E-51 epoxy resin, PY-30 glycidyl ether, T is taken in proportion
l1210 liquid polysulphide rubbers, stir, and then put into 55 DEG C, baking oven and keep about 60min, obtained sizing material A;
2) sizing material A taking-up is cooled to room temperature, adds hexanediamine in proportion, stir, under vacuum condition, place 3min, obtain toughness high-strength epoxide resin encapsulation material.
Toughness high-strength epoxide resin encapsulation material prepared by the present embodiment is for embedding lithium cell circuit controller, concrete grammar is: apply one deck lubricating grease at the non-embedding position of lithium cell circuit controller mould, potting compound is poured in the mould of lithium cell circuit controller, form removal after cured at room temperature 26h, ambient temperatare puts the laggard row turnery processing of 72h.
The performance test results: after the solidification of the present embodiment toughness high-strength epoxide resin encapsulation material, hardness is 81 ~ 83S.D, shearing resistance average is 28.5MPa, through low temperature-60 DEG C, the temperature shock that high temperature is 70 DEG C three circulation, potting compound flawless, electronic devices and components and lead-in wire not damaged phenomenon, electrical signal drifts about.
Embodiment 3
The present embodiment toughness high-strength epoxide resin encapsulation material, is made up of the component of following mass fraction: E-51 epoxy resin 105 parts, hexanediamine 16 parts, T
l1210 liquid polysulphide rubbers 22 parts, PY-30 glycidyl ether 11 parts.
Wherein E-51 epoxy resin is purchased from Shanghai Resin Factory Co., Ltd.; T
l1210 liquid polysulphide rubbers are purchased from chemical plant, Jinxi; PY-30 glycidyl ether is purchased from Zhong Hao Chenguang Research Institute of Chemical Industry company limited.
The preparation method of the present embodiment toughness high-strength epoxide resin encapsulation material is:
1) E-51 epoxy resin, PY-30 glycidyl ether, T is taken in proportion
l1210 liquid polysulphide rubbers, stir, and then put into 65 DEG C, baking oven and keep about 45min, obtained sizing material A;
2) sizing material A taking-up is cooled to room temperature, adds hexanediamine, stir, under vacuum condition, place 4min, obtain toughness high-strength epoxide resin encapsulation material.
Toughness high-strength epoxide resin encapsulation material prepared by the present embodiment is for embedding satellite navigation system receiving antenna circuit, concrete grammar is: apply one deck lubricating grease at the non-embedding position of satellite navigation system receiving antenna circuit die, potting compound is poured in the mould of satellite navigation system receiving antenna circuit, form removal after cured at room temperature 24h, ambient temperatare puts the laggard row turnery processing of 74h.
The performance test results: after the solidification of the present embodiment toughness high-strength epoxide resin encapsulation material, hardness is 81 ~ 83S.D, shearing resistance average is 28.1MPa, through low temperature-60 DEG C, the temperature shock that high temperature is 70 DEG C three circulation, potting compound flawless, electronic devices and components and lead-in wire not damaged phenomenon, electrical signal drifts about.
Claims (9)
1. a toughness high-strength epoxide resin encapsulation material, is characterized in that, is made up of the component of following mass fraction: epoxy resin 95 ~ 105 parts, hexanediamine 14 ~ 16 parts, thiorubber 18 ~ 22 parts, glycidyl ether 9 ~ 11 parts.
2. toughness high-strength epoxide resin encapsulation material as claimed in claim 1, it is characterized in that, described epoxy resin is E-51 epoxy resin.
3. toughness high-strength epoxide resin encapsulation material as claimed in claim 1, it is characterized in that, described thiorubber is liquid polysulphide rubber TL1201.
4. toughness high-strength epoxide resin encapsulation material as claimed in claim 1, it is characterized in that, described glycidyl ether is PY-30 glycidyl ether.
5. a preparation method for toughness high-strength epoxide resin encapsulation material as claimed in claim 1, it is characterized in that, concrete operation step is as follows:
1) take epoxy resin, thiorubber and glycidyl ether in proportion, and three mixed, heating, obtains sizing material A;
2) under room temperature, in sizing material A, add hexanediamine in proportion, stir, place under vacuum condition, obtain epoxide resin encapsulation material.
6. the preparation method of toughness high-strength epoxide resin encapsulation material as claimed in claim 5, is characterized in that, step 1) described in Heating temperature be 55 ~ 65 DEG C, soaking time is 45 ~ 60min.
7. the preparation method of toughness high-strength epoxide resin encapsulation material as claimed in claim 5, is characterized in that, step 2) described in vacuum condition under time of placing be 3 ~ 5min.
8. the application of a toughness high-strength epoxide resin encapsulation material as claimed in claim 1 in pot electronics components and parts.
9. the application of toughness high-strength epoxide resin encapsulation material in pot electronics components and parts as claimed in claim 8, it is characterized in that, treating to pour into the non-embedding position coating lubricating grease of pot electronics components and parts mould potting compound in the mould treating pot electronics components and parts, form removal after self-vulcanizing.
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| CN201410637905.XA CN104403620B (en) | 2014-11-12 | 2014-11-12 | A kind of toughness high-strength epoxide resin encapsulation material and its preparation method and application |
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| CN201410637905.XA CN104403620B (en) | 2014-11-12 | 2014-11-12 | A kind of toughness high-strength epoxide resin encapsulation material and its preparation method and application |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112391139A (en) * | 2020-11-10 | 2021-02-23 | 中国船舶重工集团公司第七0七研究所 | Pouring sealant for potting stator of limited-angle motor and potting method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102994031A (en) * | 2012-10-31 | 2013-03-27 | 安徽东方金河精密机械制造有限公司 | Epoxy adhesive |
| CN103694936A (en) * | 2013-11-14 | 2014-04-02 | 昆山珍实复合材料有限公司 | Epoxy resin pouring sealant and preparation method thereof |
-
2014
- 2014-11-12 CN CN201410637905.XA patent/CN104403620B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102994031A (en) * | 2012-10-31 | 2013-03-27 | 安徽东方金河精密机械制造有限公司 | Epoxy adhesive |
| CN103694936A (en) * | 2013-11-14 | 2014-04-02 | 昆山珍实复合材料有限公司 | Epoxy resin pouring sealant and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112391139A (en) * | 2020-11-10 | 2021-02-23 | 中国船舶重工集团公司第七0七研究所 | Pouring sealant for potting stator of limited-angle motor and potting method |
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| CN104403620B (en) | 2016-05-25 |
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