CN101302413A - High temperature resistant epoxide resin conductive adhesive - Google Patents
High temperature resistant epoxide resin conductive adhesive Download PDFInfo
- Publication number
- CN101302413A CN101302413A CNA2008100400348A CN200810040034A CN101302413A CN 101302413 A CN101302413 A CN 101302413A CN A2008100400348 A CNA2008100400348 A CN A2008100400348A CN 200810040034 A CN200810040034 A CN 200810040034A CN 101302413 A CN101302413 A CN 101302413A
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- high temperature
- temperature resistant
- conductive adhesive
- epoxide resin
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Abstract
The invention discloses high-temperature resistant epoxy resin conductive adhesives, which are characterized by comprising the following compositions by weight portion: 10 to 25 portions of modified epoxy resins, 0.05 to 0.5 portions of organosilicon coupling agent, 0.1 to 2 portions of imidazole curing agent, 60 to 80 portions of micron silver powder, 0.05 to 5 portions of nano silver particles and 0 to 5 portions of carbon nanotube. The modified epoxy resins simultaneously use a proper amount of coupling agent to replace epoxy resins which are generally adopted in the market, thereby the high-temperature resistance of the adhesives is greatly improved; due to addition of the micro silver powder and the nano silver particles or the carbon nanotube, the conductivity of the adhesives is greatly improved; and due to addition of the electricity and heat conducting carbon nanotube, the electroconductibility and the thermal conductivility of the adhesives are improved.
Description
Technical field
The present invention relates to a kind of high temperature resistant epoxide resin conductive adhesive, belong to the conductive resin technical field.Be used for electrical equipment and Electronic Packaging process and need to connect the place of circuit, with sticking generation weldering.
Background technology
Conductive adhesive is the sizing agent kind that is fit to the electronic industry development, and it is used for the place that electrical equipment and Electronic Packaging need to connect circuit, with sticking generation weldering.Conductive adhesive is made up of electroconductive stuffing, solvent and additive.Present many electronic components begin microminiaturization, and use some materials that are difficult to weld and the not high macromolecular material of thermotolerance, if adopt traditional welding process, very easily damage components and parts, and accurate miniature welding is also difficult with control, can cause not prison welding to lean on, the components and parts distortion makes degradation.Along with the functionalization of electron device in recent years, microminiaturization, make to the requirement of the thermotolerance of electron device and thermal diffusivity further strict harsh.Seeking better, heat-resisting reasonable material becomes necessary.The present invention is exactly not high in the market conductive resin thermotolerance, can not satisfy the requirement of resistance toheat is invented.Of the present invention is that so have special outstanding high temperature resistance, high temperature resistant degree can arrive more than 200 ℃ owing to introduce resistant to elevated temperatures group in the macromolecular chain.
Summary of the invention
The purpose of this invention is to provide a kind of high temperature resistant epoxide resin conductive adhesive,, utilize different fillers to reach excellent conducting performance simultaneously to solve present conductive adhesive in problem not high aspect the resistance toheat.
For achieving the above object, the present invention adopts following technical proposals:
A kind of high temperature resistant epoxide resin conductive adhesive is characterized in that the composition of this conductive resin is counted with weight fraction:
10～25 parts of modified epoxies
0.05～0.5 part of silicone based coupling agent
0.1～2 part of imidazole curing agent
60～80 parts of micro-silver powders (main stuffing)
0.05～5 part of nano-Ag particles (conductive applications)
0～5 part of CNT (carbon nano-tube) (conduction is held concurrently with the heat conduction purposes)
Described modified epoxy is a kind of in modifying epoxy resin by organosilicon, organic titanium modified epoxy and the organic boron modified epoxy.
Described silicone based coupling agent is a kind of in vinyl silanes, aminosilane, the epoxy radicals silicone hydride organic coupling agent.
Described imidazole curing agent is a kind of in glyoxal ethyline, 2-ethyl-4-methylimidazole, 2-phenylimidazole and the 2-undecane imidazoles.
The diameter of section of described CNT (carbon nano-tube) is 5～100 nanometers.
The invention has the advantages that and select high temperature material, mix different electroconductive stuffings, not only greatly improved the thermotolerance problem of conductive adhesive, and improved the conduction or the heat conductivility of conductive adhesive as base material.Conductive resin has made full use of the resistance toheat of special high temperature-resistant Resins, epoxy, has improved the thermotolerance and the high-temperature stability of conductive resin.Utilize the conduction and the thermal conductivity of micro-silver powder excellence, be aided with the synergy of nano-Ag particles or CNT (carbon nano-tube), improved the conductivity or the heat conductivility of jelly, also improved the high-temperature behavior of glue simultaneously.
Description of drawings
The typical dsc figure of Fig. 1 conductive resin of the present invention (DSC)
The typical dynamic mechanical analysis figure of Fig. 2 conductive resin of the present invention (DMA)
Embodiment
After now specific embodiments of the invention being described in.
Embodiment 1
In the present embodiment, the gross weight of high temperature resistant epoxide resin conductive adhesive is 10g, and its composition is counted with weight fraction:
25 parts of modified epoxies
0.2 part of silicone based coupling agent
1 part of imidazole curing agent
70 parts of micro-silver powders
5 parts of nano-Ag particles
Mix more than inciting somebody to action, solidified 30 minutes at 150 ℃ then.Recording its Tg is 200 ℃, and resistivity is 4 * 10
-5Europe centimetre.
Embodiment 2
In the present embodiment, the gross weight of high temperature resistant epoxide resin conductive adhesive is 10g, and its composition is counted with weight fraction:
25 parts of modified epoxies
0.3 part of silicone based coupling agent
1.5 parts of imidazole curing agents
75 parts of micro-silver powders
5 parts of nano-Ag particles
2.5 parts of CNT (carbon nano-tube)
Wherein the diameter of section of CNT (carbon nano-tube) is 30 nanometers, mixes more than inciting somebody to action, and solidifies 30 minutes at 150 ℃ then.Can obtain meeting the conductive resin of requirement of the present invention.
Embodiment 3
In the present embodiment, the gross weight of high temperature resistant epoxide resin conductive adhesive is 10g, and its composition is counted with weight fraction:
20 parts of modified epoxies
0.15 part of silicone based coupling agent
1 part of imidazole curing agent
60 parts of micro-silver powders
3 parts of nano-Ag particles
3 parts of CNT (carbon nano-tube)
Wherein the diameter of section of CNT (carbon nano-tube) is 30 nanometers, mixes more than inciting somebody to action, and solidifies 30 minutes at 150 ℃ then.Can obtain meeting the conductive resin of requirement of the present invention.
Claims (5)
1. high temperature resistant epoxide resin conductive adhesive is characterized in that the composition of this conductive resin is counted with weight fraction:
10～25 parts of modified epoxies
0.05～0.5 part of silicone based coupling agent
0.1～2 part of imidazole curing agent
60～80 parts of micro-silver powders
0.05～5 part of nano-Ag particles
0～5 part of CNT (carbon nano-tube).
2. high temperature resistant epoxide resin conductive adhesive as claimed in claim 1 is characterized in that described modified epoxy is a kind of in modifying epoxy resin by organosilicon, organic titanium modified epoxy and the organic boron modified epoxy.
3. high temperature resistant epoxide resin conductive adhesive as claimed in claim 1 is characterized in that described silicone based coupling agent is a kind of in vinyl silanes, aminosilane, the epoxy radicals silicone hydride organic coupling agent.
4. high temperature resistant epoxide resin conductive adhesive as claimed in claim 1 is characterized in that described imidazole curing agent is a kind of in glyoxal ethyline, 2-ethyl-4 monomethyl imidazoles, 2-phenylimidazole and the 2-undecane imidazoles.
5. high temperature resistant epoxide resin conductive adhesive as claimed in claim 1, the diameter of section that it is characterized in that described CNT (carbon nano-tube) is 5～100 nanometers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100400348A CN101302413A (en) | 2008-07-01 | 2008-07-01 | High temperature resistant epoxide resin conductive adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100400348A CN101302413A (en) | 2008-07-01 | 2008-07-01 | High temperature resistant epoxide resin conductive adhesive |
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| CN101302413A true CN101302413A (en) | 2008-11-12 |
Family
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Family Applications (1)
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| CNA2008100400348A Pending CN101302413A (en) | 2008-07-01 | 2008-07-01 | High temperature resistant epoxide resin conductive adhesive |
Country Status (1)
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Cited By (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101805574A (en) * | 2010-03-11 | 2010-08-18 | 复旦大学 | Sintered type conductive adhesive adopting silver filling with surfaces subjected to activating treatment and preparation method thereof |
| CN101864262A (en) * | 2009-11-03 | 2010-10-20 | 上海上大瑞沪微系统集成技术有限公司 | Flexible conductive adhesive |
| WO2011009984A1 (en) | 2009-07-21 | 2011-01-27 | Cupa Innovación, S.L.U. | Resin with high heat transfer |
| CN102250448A (en) * | 2011-05-19 | 2011-11-23 | 天津大学 | Epoxy resin/carbon nanotube high-strength lightweight composite material, and preparation method thereof |
| CN102286261A (en) * | 2011-07-14 | 2011-12-21 | 上海景涵实业有限公司 | Epoxy functional organic silicon conductive adhesive for amino curing system for light emitting diode (LED) |
| CN102286259A (en) * | 2011-06-24 | 2011-12-21 | 上海本诺电子材料有限公司 | Epoxy functionalized organosilicon conductive adhesive for light emitting diode (LED) |
| CN102391807A (en) * | 2011-07-06 | 2012-03-28 | 上海上大瑞沪微系统集成技术有限公司 | Preparation method of rapidly solidified anisotropic conductive adhesive |
| CN102391811A (en) * | 2011-09-23 | 2012-03-28 | 上海景涵实业有限公司 | Bismaleimide-epoxy conductive adhesive with high adhesive strength for light emitting diode (LED) |
| CN102408856A (en) * | 2011-08-09 | 2012-04-11 | 烟台德邦电子材料有限公司 | Conductive adhesive for LED (light emitting diode) packaging and preparation method thereof |
| CN102408858A (en) * | 2011-10-24 | 2012-04-11 | 上海大学 | Stable type conductive adhesive and preparation method thereof |
| CN101402838B (en) * | 2008-11-28 | 2012-11-14 | 东莞市中实焊锡有限公司 | Silver staining palladium alloy microsphere conductive adhesive and method of producing the same |
| CN103059767A (en) * | 2013-01-15 | 2013-04-24 | 宁波晶鑫电子材料有限公司 | Conductive silver paste with high-temperature resistance and low sheet resistance and preparation method of conductive silver paste |
| CN103242775A (en) * | 2013-05-16 | 2013-08-14 | 长春永固科技有限公司 | Acrylic ester modified epoxy resin conductive chip adhesive |
| CN103666319A (en) * | 2013-12-11 | 2014-03-26 | 青岛海洋新材料科技有限公司 | Marine climate resistant epoxy conductive adhesive composition |
| CN103820055A (en) * | 2013-12-11 | 2014-05-28 | 青岛海洋新材料科技有限公司 | Conductive adhesive for ocean engineering |
| CN105778841A (en) * | 2014-12-18 | 2016-07-20 | 上海宝银电子材料有限公司 | Conductive silver adhesive for notebook keyboard and preparation method thereof |
| CN106047259A (en) * | 2016-08-18 | 2016-10-26 | 覃树强 | Heat-resistant electric-conductive glue and preparation method thereof |
| CN106928867A (en) * | 2017-03-28 | 2017-07-07 | 镓特半导体科技（上海）有限公司 | A kind of carbon nanotube conducting glue and its preparation method and application |
| CN107393626A (en) * | 2017-06-27 | 2017-11-24 | 西安工程大学 | A kind of hot method powdery electric slurry and preparation method thereof |
| CN109777335A (en) * | 2019-01-18 | 2019-05-21 | 昆明贵金属研究所 | A kind of carbon nano-tube modified method for preparing high heat-conductivity conducting glue of nano silver |
| CN109929235A (en) * | 2019-03-03 | 2019-06-25 | 姜丽丽 | A kind of electric-conductivity heat-conductivity high carbon nano-complex and preparation method thereof |
| CN110776849A (en) * | 2019-10-23 | 2020-02-11 | 烟台德邦科技有限公司 | Double-component high/low temperature resistant conductive adhesive and preparation method thereof |
| CN111171757A (en) * | 2020-02-26 | 2020-05-19 | 广州市白云化工实业有限公司 | Modified carbon nanotube, epoxy conductive adhesive and preparation method thereof |
| CN112606156A (en) * | 2020-12-10 | 2021-04-06 | 安徽环瑞电热器材有限公司 | Electric heat tracing wood floor and manufacturing method thereof |
| CN113322023A (en) * | 2021-05-28 | 2021-08-31 | 陕西科技大学 | Epoxy resin conductive adhesive based on organic silicon modification and preparation method thereof |
| CN116130143A (en) * | 2022-12-30 | 2023-05-16 | 上海席亚高分子材料有限公司 | High-temperature-resistant elastic conductive silver paste and preparation method thereof |
-
2008
- 2008-07-01 CN CNA2008100400348A patent/CN101302413A/en active Pending
Cited By (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101402838B (en) * | 2008-11-28 | 2012-11-14 | 东莞市中实焊锡有限公司 | Silver staining palladium alloy microsphere conductive adhesive and method of producing the same |
| WO2011009984A1 (en) | 2009-07-21 | 2011-01-27 | Cupa Innovación, S.L.U. | Resin with high heat transfer |
| CN101864262A (en) * | 2009-11-03 | 2010-10-20 | 上海上大瑞沪微系统集成技术有限公司 | Flexible conductive adhesive |
| CN101805574A (en) * | 2010-03-11 | 2010-08-18 | 复旦大学 | Sintered type conductive adhesive adopting silver filling with surfaces subjected to activating treatment and preparation method thereof |
| CN102250448A (en) * | 2011-05-19 | 2011-11-23 | 天津大学 | Epoxy resin/carbon nanotube high-strength lightweight composite material, and preparation method thereof |
| CN102250448B (en) * | 2011-05-19 | 2013-04-24 | 天津大学 | Epoxy resin/carbon nanotube high-strength lightweight composite material, and preparation method thereof |
| CN102286259B (en) * | 2011-06-24 | 2014-04-02 | 上海本诺电子材料有限公司 | Epoxy functionalized organosilicon conductive adhesive for light emitting diode (LED) |
| CN102286259A (en) * | 2011-06-24 | 2011-12-21 | 上海本诺电子材料有限公司 | Epoxy functionalized organosilicon conductive adhesive for light emitting diode (LED) |
| CN102391807A (en) * | 2011-07-06 | 2012-03-28 | 上海上大瑞沪微系统集成技术有限公司 | Preparation method of rapidly solidified anisotropic conductive adhesive |
| CN102286261A (en) * | 2011-07-14 | 2011-12-21 | 上海景涵实业有限公司 | Epoxy functional organic silicon conductive adhesive for amino curing system for light emitting diode (LED) |
| CN102286261B (en) * | 2011-07-14 | 2014-07-09 | 上海本诺电子材料有限公司 | Epoxy functional organic silicon conductive adhesive for amino curing system for light emitting diode (LED) |
| CN102408856A (en) * | 2011-08-09 | 2012-04-11 | 烟台德邦电子材料有限公司 | Conductive adhesive for LED (light emitting diode) packaging and preparation method thereof |
| CN102391811B (en) * | 2011-09-23 | 2014-04-02 | 上海本诺电子材料有限公司 | Bismaleimide-epoxy conductive adhesive with high adhesive strength for light emitting diode (LED) |
| CN102391811A (en) * | 2011-09-23 | 2012-03-28 | 上海景涵实业有限公司 | Bismaleimide-epoxy conductive adhesive with high adhesive strength for light emitting diode (LED) |
| CN102408858A (en) * | 2011-10-24 | 2012-04-11 | 上海大学 | Stable type conductive adhesive and preparation method thereof |
| CN103059767A (en) * | 2013-01-15 | 2013-04-24 | 宁波晶鑫电子材料有限公司 | Conductive silver paste with high-temperature resistance and low sheet resistance and preparation method of conductive silver paste |
| CN103059767B (en) * | 2013-01-15 | 2015-06-17 | 宁波晶鑫电子材料有限公司 | Conductive silver paste with high-temperature resistance and low sheet resistance and preparation method of conductive silver paste |
| CN103242775A (en) * | 2013-05-16 | 2013-08-14 | 长春永固科技有限公司 | Acrylic ester modified epoxy resin conductive chip adhesive |
| CN103242775B (en) * | 2013-05-16 | 2015-06-10 | 长春永固科技有限公司 | Acrylic ester modified epoxy resin conductive chip adhesive |
| CN103666319A (en) * | 2013-12-11 | 2014-03-26 | 青岛海洋新材料科技有限公司 | Marine climate resistant epoxy conductive adhesive composition |
| CN103820055A (en) * | 2013-12-11 | 2014-05-28 | 青岛海洋新材料科技有限公司 | Conductive adhesive for ocean engineering |
| CN103666319B (en) * | 2013-12-11 | 2016-04-06 | 青岛海洋新材料科技有限公司 | A kind of epoxy conductive adhesive composition of marine climate resistant |
| CN105778841A (en) * | 2014-12-18 | 2016-07-20 | 上海宝银电子材料有限公司 | Conductive silver adhesive for notebook keyboard and preparation method thereof |
| CN106047259A (en) * | 2016-08-18 | 2016-10-26 | 覃树强 | Heat-resistant electric-conductive glue and preparation method thereof |
| CN106928867A (en) * | 2017-03-28 | 2017-07-07 | 镓特半导体科技（上海）有限公司 | A kind of carbon nanotube conducting glue and its preparation method and application |
| CN107393626A (en) * | 2017-06-27 | 2017-11-24 | 西安工程大学 | A kind of hot method powdery electric slurry and preparation method thereof |
| CN109777335A (en) * | 2019-01-18 | 2019-05-21 | 昆明贵金属研究所 | A kind of carbon nano-tube modified method for preparing high heat-conductivity conducting glue of nano silver |
| CN109929235A (en) * | 2019-03-03 | 2019-06-25 | 姜丽丽 | A kind of electric-conductivity heat-conductivity high carbon nano-complex and preparation method thereof |
| CN110776849A (en) * | 2019-10-23 | 2020-02-11 | 烟台德邦科技有限公司 | Double-component high/low temperature resistant conductive adhesive and preparation method thereof |
| CN111171757A (en) * | 2020-02-26 | 2020-05-19 | 广州市白云化工实业有限公司 | Modified carbon nanotube, epoxy conductive adhesive and preparation method thereof |
| CN111171757B (en) * | 2020-02-26 | 2021-07-27 | 广州市白云化工实业有限公司 | Modified carbon nanotube, epoxy conductive adhesive and preparation method thereof |
| CN112606156A (en) * | 2020-12-10 | 2021-04-06 | 安徽环瑞电热器材有限公司 | Electric heat tracing wood floor and manufacturing method thereof |
| CN113322023A (en) * | 2021-05-28 | 2021-08-31 | 陕西科技大学 | Epoxy resin conductive adhesive based on organic silicon modification and preparation method thereof |
| CN116130143A (en) * | 2022-12-30 | 2023-05-16 | 上海席亚高分子材料有限公司 | High-temperature-resistant elastic conductive silver paste and preparation method thereof |
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Application publication date: 20081112 |