CN102286259B - Epoxy functionalized organosilicon conductive adhesive for light emitting diode (LED) - Google Patents
Epoxy functionalized organosilicon conductive adhesive for light emitting diode (LED) Download PDFInfo
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- CN102286259B CN102286259B CN201110172354.0A CN201110172354A CN102286259B CN 102286259 B CN102286259 B CN 102286259B CN 201110172354 A CN201110172354 A CN 201110172354A CN 102286259 B CN102286259 B CN 102286259B
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- methylimidazole
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Abstract
The invention discloses an epoxy functionalized organosilicon conductive adhesive for an LED. The organosilicon conductive adhesive comprises 10 to 20 weight parts of organosilicon epoxy resin, 7 to 20 weight parts of organosilicon curing agent, 0.1 to 0.5 weight part of curing accelerator, 70 to 90 weight parts of silver powder conductive filler and 0.1 to 0.5 weight part of silane coupling agent serving as an interface reinforcing agent. The conductive adhesive can be stored at a low temperature for more than 6 months, and the viscosity is increased by 25 percent at room temperature for more than 48 hours. After the adhesive is cured, the thermal decomposition temperature (2 percent mass loss) is 300 DEG C, the small piece thrust at room temperature is 5Kgf/die(2*2mm), and the volume resistivity is less than or equal to 3.0*10<-4>W.cm; and the adhesive has high conductivity, heat resistance and ultraviolet (UV) resistance.
Description
Technical field
The present invention relates to LED organosilicon conductive adhesive stick, particularly a kind of epoxide function organosilicon conductive adhesive stick.
Background technology
Along with the development of great power LED, client has proposed more and more higher requirement to the material using in encapsulation process, and new material not only will meet the processing requirement that client produces, and resistance to UV performance and the thermotolerance of material has been proposed to new challenge simultaneously.
The optical property and the reliability that for the fixing electro-conductive adhesive of high-power LED chip, directly affect the finished product, great power LED is high conduction, high thermal conductivity and high shear strength to the requirement of conductive silver glue.Traditional epoxy conductive binding agent adhesiveproperties is excellent, but epoxy resin-base not resistance to UV often, and under the comprehensive action of UV light and heat, thereby easily there is xanthochromia and affect LED luminescent lifetime in it.Therefore be not suitable for launching LED and the great power LED of ultraviolet wavelength, and use out of doors.
The backbone structure of the silica that type siloxane tackiness agent has, structural formula is as follows:
There is stronger ultra-violet resistance, be therefore applicable to any ultraviolet and look after occasion.The SMP-2800L of Japan's SHIN-ETSU HANTOTAI's chemical industry (the シ リ コ ー of SHIN-ETSU HANTOTAI Application), Japanese Teng Cang changes into the single component of (rattan Warehouse changes into) containing solvent organosilicon conductive adhesive (XA-819A of DOTITE and FX-730), is this series products.Because the polarity of the main chain of poly-silica is less, so the cementability of conductive resin described above is poor, chip thrust is less than normal, room temperature small pieces thrust <5 Kgf/die (2 * 2 mm).
In sum, polysiloxane and epoxy resin respectively have advantage, how both advantages are combined into the technical issues that need to address of the present invention.Both combinations not only can retain resistance to elevated temperatures and the resistance to UV performance of polyorganosiloxane resin, and can make product have good adhesiveproperties.
Summary of the invention
The object of the present invention is to provide epoxide function organosilicon conductive adhesive stick for a kind of LED, by the advantage combination of polysiloxane and epoxy resin, not only can retain resistance to elevated temperatures and the resistance to UV performance of polyorganosiloxane resin, and can make product there is good adhesiveproperties.
Epoxide function organosilicon conductive adhesive stick for LED of the present invention, comprises the component with following weight part:
Organosilicon epoxy resin 10～20;
Organosilicon solidifying agent 7～20;
Curing catalyst 0.1～0.5;
Silver powder conductive filler material 70～90;
Interface strengthening agent silane coupling agent 0.1～0.5.
According to the present invention, described organosilicon epoxy resin is:
A. the silicone oil SiMAET that end group is alicyclic epoxy group
，
Wherein, n=1-6;
B. the methyl phenyl silicone oil SiMPAET that end group is alicyclic epoxy group
Wherein, n=1-6;
C. the silicone oil SiMAE that side group is alicyclic epoxy group
Wherein, n/m=1-6;
D. the methyl-silicone oil SiMET that end group is epoxide group
Wherein, n=1-6;
E. the methyl phenyl silicone oil SiMPET that end group is epoxide group
Wherein, n=1-6; Or
F. the silicone oil SiME that side group is epoxide group
Wherein, n/m=1-6.
According to the present invention, described organosilicon solidifying agent is selected from one or more in following group:
SiMDH：
，
Wherein, n=1-6;
SiMPDH：
Wherein, n=1-6.
According to the present invention, described curing catalyst is 2MZ:2-Methylimidazole, 2E4MZ:2-ethyl-4-methylimidazole, 2PZ:2-phenylimidazole, C11Z:2-undecyl imidazole, C17Z:2-heptadecyl imidazoles, 1B2MZ:1-benzyl-glyoxal ethyline, SFZ:1-dodecyl-2-methyl-3-benzyl imidazole muriate, FFZ:1,3-dibenzyl-glyoxal ethyline muriate, 2MZL:2-Methylimidazole quinoline, 2P4MZ:2-phenyl-4-methylimidazole, 2MZ-CN:1-1-cyanoethyl-2-methylimidazole, 2PZ-CN:1-cyanoethyl-2-phenylimidazole, C11Z-CN:1-cyanoethyl-2-undecyl imidazole, 2E4MZ-CN:1-cyanoethyl-2-ethyl-4-methylimidazole, 2MZ-CNS:1-1-cyanoethyl-2-methylimidazole trimellitic acid salt, 2PZ-CNS:1-cyanoethyl-2-phenylimidazole trimellitic acid salt, 2E4MZ-CNS: 1-cyanoethyl-2-ethyl-4-methylimidazole trimellitic acid salt, C11Z-CNS:1-cyanoethyl-2-undecyl imidazole trimellitic acid salt, 2MZ-A:2,4-diamino-6[2 '-Methylimidazole-(1 ')] one or more mixtures in ethyl-S-triazine.
According to the present invention, described conductive filler material is the cumulative particle sizes distribution number of particle D90(sample corresponding particle diameter while reaching 90%) be less than a kind of in the flake silver powder of 50 microns, spherical silver powder, unformed silver powder or their mixture.
According to the present invention, described interface strengthening agent silane coupling agent is 3-glycidyl propyl trimethoxy silicane (dowcoring Z6040).
Embodiment
Below in conjunction with specific embodiment, the present invention will be further described.Should be understood that following examples are only for the present invention is described but not for limiting the scope of the invention.
As used herein, SiMAET refers to that end group is the silicone oil of alicyclic epoxy group, and structure is:
?，
Wherein, n=1-6;
SiMPAET refers to that end group is the methyl phenyl silicone oil of alicyclic epoxy group, and structure is:
Wherein, n=1-6;
SiMAE refers to that side group is the silicone oil of alicyclic epoxy group, and structure is:
, wherein, n/m=1-6;
SiMET refers to that end group is the methyl-silicone oil of epoxide group, and structure is:
，
Wherein, n=1-6;
SiMPET refers to that end group is the methyl phenyl silicone oil of epoxide group, and structure is:
，
Wherein, n=1-6;
SiME refers to that side group is the silicone oil of epoxide group, and structure is:
Wherein, n/m=1-6.
As used herein, organosilicon solidifying agent comprises SiMDH, and structural formula is:
, wherein, n=1-6;
SiMPDH, structural formula is:
As used herein, the abbreviation of fixation accelerator and correspondence thereof is as follows:
2MZ:2-Methylimidazole, 2E4MZ:2-ethyl-4-methylimidazole, 2PZ:2-phenylimidazole, C11Z:2-undecyl imidazole, C17Z:2-heptadecyl imidazoles, 1B2MZ:1-benzyl-glyoxal ethyline, SFZ:1-dodecyl-2-methyl-3-benzyl imidazole muriate, FFZ:1,3-dibenzyl-glyoxal ethyline muriate, 2MZL:2-Methylimidazole quinoline, 2P4MZ:2-phenyl-4-methylimidazole, 2MZ-CN:1-1-cyanoethyl-2-methylimidazole, 2PZ-CN:1-cyanoethyl-2-phenylimidazole, C11Z-CN:1-cyanoethyl-2-undecyl imidazole, 2E4MZ-CN:1-cyanoethyl-2-ethyl-4-methylimidazole, 2MZ-CNS:1-1-cyanoethyl-2-methylimidazole trimellitic acid salt, 2PZ-CNS:1-cyanoethyl-2-phenylimidazole trimellitic acid salt, 2E4MZ-CNS: 1-cyanoethyl-2-ethyl-4-methylimidazole trimellitic acid salt, C11Z-CNS:1-cyanoethyl-2-undecyl imidazole trimellitic acid salt, 2MZ-A:2,4-diamino-6[2 '-Methylimidazole-(1 ')] one or more mixtures in ethyl-S-triazine.
In following examples, the D90 of silver powder conductive filler granule used is less than 50 microns, is a kind of in flake silver powder, spherical silver powder, unformed silver powder or their mixture.Interface used strengthening agent silane coupling agent is dowcoring Z6040.
embodiment 1
Epoxide function organosilicon conductive adhesive stick for the LED of the present embodiment, comprises the component with following weight part:
| SiMAET n=1 | 10 |
| SiMDH n=1 | 8.0 |
| 2E4MZ | 0.5 |
| Silver powder | 80 |
| Z6040 | 0.5 |
After tested, epoxide function organosilicon conductive adhesive for the LED of the present embodiment, specific refractory power is 1.43, and second-order transition temperature is 98 ℃, and 2 mm * 2 mm chip thrusts are 7.0 Kgf (25 ℃), and electric conductivity is 3.0 * 10
-4w.cm.
embodiment 2 ~ 6
The LED of embodiment 2 ~ 6 is as shown in table 1 by component (parts by weight) and the performance of epoxide function organosilicon conductive adhesive stick, specific refractory power is 1.45 ~ 1.50, second-order transition temperature is 104 ~ 132 ℃, 2 mm * 2 mm chip thrusts are 7.6 ~ 11.3 Kgf (25 ℃), and electric conductivity is 1.0 * 10
-4~ 3.0 * 10
-4w.cm.
embodiment 7 ~ 12
The LED of embodiment 7 ~ 12 is as shown in table 2 by component (parts by weight) and the performance of epoxide function organosilicon conductive adhesive stick, specific refractory power is 1.43, second-order transition temperature is 29 ~ 98 ℃, and 2 mm * 2 mm chip thrusts are 5.4 ~ 7 Kgf (25 ℃), and electric conductivity is 1.0 * 10
-4~ 3.0 * 10
-4w.cm.
The component of table 1 embodiment 2 ~ 6 and performance
The component of table 2 embodiment 7 ~ 12 and performance
The component of table 3 embodiment 13 ~ 18 and performance
The component of table 4 embodiment 19 ~ 24 and performance
embodiment 13 ~ 18
The LED of embodiment 13 ~ 18 is as shown in table 3 by component (parts by weight) and the performance of epoxide function organosilicon conductive adhesive stick, specific refractory power is 1.43, second-order transition temperature is 34 ~ 87 ℃, and 2 mm * 2 mm chip thrusts are 5.2 ~ 7.3 Kgf (25 ℃), and electric conductivity is 1.0 * 10
-4~ 3.0 * 10
-4w.cm.
embodiment 19 ~ 24
The LED of embodiment 19 ~ 24 is as shown in table 4 by component (parts by weight) and the performance of epoxide function organosilicon conductive adhesive stick, specific refractory power is 1.47 ~ 1.49, second-order transition temperature is 46 ~ 81 ℃, 2 mm * 2 mm chip thrusts are 5.1 ~ 7.9 Kgf (25 ℃), and electric conductivity is 1.0 * 10
-4~ 3.0 * 10
-4w.cm.
After tested, conductive resin of the present invention surpasses 6 months in the low tempertaure storage time simultaneously, and under room temperature, viscosity increases by 25% time over 48h.
Heat decomposition temperature after solidifying (2% quality is weightless) >300 ℃, room temperature small pieces thrust >5 Kgf/die (2 * 2 mm), volume specific resistance≤3.0 * 10-4Wcm, has excellent electroconductibility, thermotolerance and resistance to UV.
Claims (5)
1. an epoxide function organosilicon conductive adhesive stick for LED, is characterized in that, comprises the component with following weight part:
Described organosilicon solidifying agent is selected from one or more in following group:
2. epoxide function organosilicon conductive adhesive stick for LED according to claim 1, is characterized in that, described organosilicon epoxy resin is to be selected from one or more in following group:
A. the silicone oil that end group is alicyclic epoxy group, structure is
Wherein, n=1-6;
B. the methyl phenyl silicone oil that end group is alicyclic epoxy group, structure is
Wherein, n=1-6;
C. the methyl-silicone oil that end group is epoxide group, structure is
Wherein, n=1-6;
D. the methyl phenyl silicone oil that end group is epoxide group, structure is
Wherein, n=1-6.
3. epoxide function organosilicon conductive adhesive stick for LED according to claim 1, it is characterized in that, described curing catalyst is glyoxal ethyline, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-undecyl imidazole, 2-heptadecyl imidazoles, 1 benzyl 2 methyl imidazole, 1-dodecyl-2-methyl-3-benzyl imidazole muriate, 1, 3-dibenzyl-glyoxal ethyline muriate, glyoxal ethyline quinoline, 2-phenyl-4-methylimidazole, 1-1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecyl imidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-1-cyanoethyl-2-methylimidazole trimellitic acid salt, 1-cyanoethyl-2-phenylimidazole trimellitic acid salt, 1-cyanoethyl-2-ethyl-4-methylimidazole trimellitic acid salt, one or more mixtures in 1-cyanoethyl-2-undecyl imidazole trimellitic acid salt.
4. epoxide function organosilicon conductive adhesive stick for LED according to claim 1, it is characterized in that, described conductive filler material is that particle D90 is less than a kind of in the flake silver powder of 50 microns, spherical silver powder, unformed silver powder or their mixture, and described D90 refers to corresponding particle diameter when the cumulative particle sizes distribution number of sample reaches 90%.
5. epoxide function organosilicon conductive adhesive stick for LED according to claim 1, is characterized in that, described interface strengthening agent silane coupling agent is 3-glycidyl propyl trimethoxy silicane.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110172354.0A CN102286259B (en) | 2011-06-24 | 2011-06-24 | Epoxy functionalized organosilicon conductive adhesive for light emitting diode (LED) |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110172354.0A CN102286259B (en) | 2011-06-24 | 2011-06-24 | Epoxy functionalized organosilicon conductive adhesive for light emitting diode (LED) |
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| CN102286259B true CN102286259B (en) | 2014-04-02 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP5321723B1 (en) * | 2012-10-29 | 2013-10-23 | 横浜ゴム株式会社 | Conductive composition and solar battery cell |
| TWI468415B (en) * | 2013-06-13 | 2015-01-11 | Daxin Materials Corp | Siloxane dianhydride, polymer, liquid crystal alignment agent, liquid crystal alignment film, and liquid crystal display device |
| KR102164171B1 (en) * | 2019-04-26 | 2020-10-13 | (주)엘프스 | self-assembled conductive bonding paste for mini LED chip bonding, mini LED chip-circuit board bondig module comprising the same and manufacturing method thereof |
| CN111454672A (en) * | 2020-05-25 | 2020-07-28 | 湖北航泰科技有限公司 | Adhesive film for bonding rubber material and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101302413A (en) * | 2008-07-01 | 2008-11-12 | 上海上大瑞沪微系统集成技术有限公司 | High temperature resistant epoxide resin conductive adhesive |
| CN101613585A (en) * | 2009-07-29 | 2009-12-30 | 肖方一 | A kind of epoxy copper adhesive and its production and application |
| CN101851478A (en) * | 2010-04-29 | 2010-10-06 | 黄文迎 | Rapid-curing conductive adhesive composition and method for preparing same |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101302413A (en) * | 2008-07-01 | 2008-11-12 | 上海上大瑞沪微系统集成技术有限公司 | High temperature resistant epoxide resin conductive adhesive |
| CN101613585A (en) * | 2009-07-29 | 2009-12-30 | 肖方一 | A kind of epoxy copper adhesive and its production and application |
| CN101851478A (en) * | 2010-04-29 | 2010-10-06 | 黄文迎 | Rapid-curing conductive adhesive composition and method for preparing same |
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Denomination of invention: Epoxy functional silicone conductive adhesive for LED Effective date of registration: 20221215 Granted publication date: 20140402 Pledgee: Zhongguancun Technology Leasing Co.,Ltd. Pledgor: BONOTEC ELECTRONIC MATERIALS Co.,Ltd. Registration number: Y2022980027722 |
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Application publication date: 20111221 Assignee: Zhongguancun Technology Leasing Co.,Ltd. Assignor: BONOTEC ELECTRONIC MATERIALS Co.,Ltd. Contract record no.: X2022980027719 Denomination of invention: Epoxy functional silicone conductive adhesive for LED Granted publication date: 20140402 License type: Exclusive License Record date: 20221222 |