CN102634312A - Silvering powder conductive adhesive for LED packaging and production method thereof - Google Patents
Silvering powder conductive adhesive for LED packaging and production method thereof Download PDFInfo
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- CN102634312A CN102634312A CN2012100841309A CN201210084130A CN102634312A CN 102634312 A CN102634312 A CN 102634312A CN 2012100841309 A CN2012100841309 A CN 2012100841309A CN 201210084130 A CN201210084130 A CN 201210084130A CN 102634312 A CN102634312 A CN 102634312A
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Abstract
The invention relates to silvering powder conductive adhesive for LED packaging and a production method thereof. The silvering powder conductive adhesive for LED packaging comprises, in weight percentage, 75-90% of silvering powder, 4-12% of epoxy resin, 3-10% of epoxy thinner, and 3-7% of additive. The production method includes: firstly, mixing the epoxy resin and the epoxy thinner at room temperature for 3-30 minutes; secondly, adding the additive in the mixture obtained in the step 1, and mixing at the room temperature for 3-30 minutes; thirdly, adding the slivering powder in the mixture obtained in the step 2, and vacuum-mixing at the room temperature to obtain the silvering powder conductive adhesive. The silvering powder conductive adhesive is simple in preparation and low in cost, and has fine and stable electric conductivity and thermal conductivity.
Description
Technical field
The present invention relates to a kind of silver-plated powder conductive resin and preparation method thereof, particularly be used for silver-plated powder conductive resin of LED encapsulation and preparation method thereof.
Background technology
Compare with conventional light source, LED illumination has that tangible volume is little, energy-saving and environmental protection, advantage such as durable, has obtained in recent years promoting fast and using widely.The LED illumination is field development in future trend such as interior lighting, Landscape Lighting, car lighting.
The led chip encapsulation technology is one of core technology of LED device manufacturing.In the led chip packaging process, generally adopt conductive resin that chip and base material are bondd with fixed chip, and realize that conduction connects and the effect of distribute heat.Traditional conductive resin mostly uses silver powder as the conductive and heat-conductive filler, and the height of conductive resin cost depends primarily on silver powder.But along with industry member vigorous day by day to precious metal demands such as silver, the price of silver powder is soaring constantly always, causes conventional conductive glue cost proportion in the led chip packaging process obviously to rise.Though domestic some novel conductive glue products that occurred at present use silver powder as filler basically, cost control is also not obvious.
Summary of the invention
Silver-plated powder conductive resin that is used for the LED encapsulation that technical problem to be solved by this invention provides that a kind of cost is low, conduction and heat conductivility are excellent and preparation method thereof.
The technical scheme that the present invention solves the problems of the technologies described above is following: silver-plated powder conductive resin of a kind of LED of being used for encapsulation and preparation method thereof comprises following components in weight percentage content: silver-plated powder 75～90%, epoxy resin 4～12%, epoxide diluent 3～10%, additive 3～7%.
The invention has the beneficial effects as follows: silver-plated powder is the powdered material that one type of surface is coated with layer of metal silver; Cost is starkly lower than the fine silver powder; And the silver-plated powder conductive resin preparation of the present invention is simple; Can be through between the low-cost silver-plated conductive powder that changes different model in the conductive resin reasonably combined, realize good, stable conductivity and heat conductivility.
On the basis of technique scheme, the present invention can also do following improvement.
Further, said silver-plated powder comprises any one or a few the mixing in silver-plated copper powder, silver-plated nickel powder or the silvered aluminum powder; Said epoxy resin comprises any one or a few the mixing in bisphenol A epoxide resin, bisphenol F epoxy resin, acrylic modified epoxy resin, the modifying epoxy resin by organosilicon; Said additive comprises solidifying agent, curing catalyst and coupling agent, and its weight ratio is: 2～3: 0.5～2: 0.5～2.
Further, said silver-plated powder is the mixing of sheet, dendroid, spherical or above-mentioned random shape, and particle size range is 0.3～100 μ m.
Further; Said epoxide diluent is 1; 4-butyleneglycol glycidyl ether, NSC 6366 glycidyl ether, 1; 6-hexanediol diglycidyl ether, Diethylene Glycol glycidyl ether, 1, the mixing of any one or a few in 4-cyclohexane diol glycidyl ether, TriMethylolPropane(TMP) glycidyl ether, the polyethyleneglycol diglycidylether.
Further, said solidifying agent is any one or a few the mixing in Dyhard RU 100, MDA, diaminodiphenyl oxide, the diaminodiphenylsulfone(DDS).
Further; Said curing catalyst is 2-undecyl imidazole, 2-heptadecyl imidazoles; 2-ethyl-4-methylimidazole; 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-phenyl-4,5-dihydroxyl Methylimidazole, 2-phenyl-4-methyl-5-hydroxymethyl imidazoles, 2, the mixing of any one or a few in 4-diamino--6-(2-undecyl imidazole-1-ethyl)-S-triazine.
Further; Said coupling agent is the 3-aminopropyl trimethoxysilane, 3-aminopropyl triethoxysilane, 3-methacryloxypropyl trimethoxy silane; 3-aminopropyl ortho-siliformic acid; 3-(3-amino-benzene oxygen) propyl trimethoxy silicane, N-(2-amine ethyl)-3-amine propyl group trimethoxy silane, hexanediamine ylmethyl Trimethoxy silane; The amino undecyl Trimethoxy silane of N-(2-aminoethyl)-11-, the mixing of any one or a few in N-aminoethyl-3-aminopropyl methyl dimethoxysilane.
Another technical scheme that the present invention solves the problems of the technologies described above is following:
A kind of preparation method who is used for the silver-plated powder conductive resin of LED encapsulation may further comprise the steps:
1) epoxy resin and epoxide diluent were mixed 3 minutes～30 minutes;
2) additive is joined in the mixture that step 1) makes, mixed 3～30 minutes;
3) silver-plated powder is added step 2 respectively) in the mixture that makes, apply vacuum and mix.
Further, can also may further comprise the steps: before adding silver-plated powder, on three-roll grinder, grind.
Adopt the beneficial effect of above-mentioned further scheme to be: can make the mixture exquisiteness that is uniformly dispersed, avoid because the solid material particle is not easy to disperse the dispersion that causes inhomogeneous.
Further, above-mentioned steps is at room temperature carried out.
Embodiment
Below principle of the present invention and characteristic are described, institute gives an actual example and only is used to explain the present invention, is not to be used to limit scope of the present invention.
Prepare silver-plated powder conductive resin according to following steps then:
1) epoxy resin and epoxide diluent were at room temperature mixed 10 minutes;
Wherein, said epoxy resin accounts for 4～12% of prescription gross weight, and said epoxide diluent accounts for 3～10% of prescription gross weight;
2) additive is joined in the mixture that step 1) makes, mixed 10 minutes under the room temperature;
Wherein, said additive comprises the solidifying agent that accounts for prescription gross weight 2～3%, curing catalyst and the coupling agent that accounts for prescription gross weight 0.5～2%.
3) with step 2) mixture that makes becomes fine and smooth uniform mixture under room temperature, grinding on the three-roll grinder;
4) silver-plated powder is added respectively in the mixture that step 3) makes, under room temperature, apply vacuum and mixed 30 minutes, promptly obtain said silver-plated powder conductive resin;
Wherein, said silver-plated powder accounts for 75～90% of prescription gross weight, and particle size range is 0.3～100 μ m, and preferred particle size range is 0.5～50 μ m, and the scope that is more preferably is 1.0～25 μ m.
According to the preparation process of the silver-plated powder conductive resin of above-mentioned preparation, further describe the present invention according to following examples 1 to 6 recipe ingredient (weight percent %).
Table 1 embodiment 1 to 6 recipe ingredient % (weight percent)
Performance test
The silver-plated powder conductive resin of the foregoing description gained was placed 1 hour in condition of cure is 175 ℃ baking oven, carried out thermal conductivity and electric conductivity performance test then.Wherein, the test of thermal conductivity is carried out according to the ASTMC518 standard, and the test of electric conductivity is carried out according to ASTM D257 standard.
Table 2 silver-plated powder conductive resin thermal conductivity and electric conductivity The performance test results
Can find out from silver-plated powder conductive resin test result: the conductivity of silver-plated powder conductive resin and heat conductivility mainly are to contact the path of setting up good electric current and hot-fluid through the multiple spot between the silver-plated powder of the conduction the cured glue body to realize; Silver-plated powder conductive resin favorable conductive and heat conductivility can realize through the optimization proportion design of conductive powder, in the time of can satisfying the led chip encapsulation fully to the performance requriements of conductive resin.
The above is merely preferred embodiment of the present invention, and is in order to restriction the present invention, not all within spirit of the present invention and principle, any modification of being done, is equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. a silver-plated powder conductive resin that is used for LED encapsulation is characterized in that, comprises following components in weight percentage content: silver-plated powder 75～90%, epoxy resin 4～12%, epoxide diluent 3～10%, additive 3～7%.
2. the silver-plated powder conductive resin that is used for LED encapsulation according to claim 1 is characterized in that, said silver-plated powder comprises any one or a few the mixing in silver-plated copper powder, silver-plated nickel powder or the silvered aluminum powder; Said epoxy resin comprises any one or a few the mixing in bisphenol A epoxide resin, bisphenol F epoxy resin, acrylic modified epoxy resin, the modifying epoxy resin by organosilicon; Said additive comprises solidifying agent, curing catalyst and coupling agent, and its weight ratio is: 2～3: 0.5～2: 0.5～2.
3. the silver-plated powder conductive resin that is used for LED encapsulation according to claim 1 and 2 is characterized in that, said silver-plated powder is the mixing of sheet, dendroid, spherical or above-mentioned random shape, and particle size range is 0.3～100 μ m.
4. the silver-plated powder conductive resin that is used for the LED encapsulation according to claim 1; It is characterized in that; Said epoxide diluent is 1; 4-butyleneglycol glycidyl ether, NSC 6366 glycidyl ether, 1,6-hexanediol diglycidyl ether, Diethylene Glycol glycidyl ether, 1, the mixing of any one or a few in 4-cyclohexane diol glycidyl ether, TriMethylolPropane(TMP) glycidyl ether, the polyethyleneglycol diglycidylether.
5. the silver-plated powder conductive resin that is used for LED encapsulation according to claim 2 is characterized in that, said solidifying agent is any one or a few the mixing in Dyhard RU 100, MDA, diaminodiphenyl oxide, the diaminodiphenylsulfone(DDS).
6. the silver-plated powder conductive resin that is used for the LED encapsulation according to claim 2; It is characterized in that; Said curing catalyst is 2-undecyl imidazole, 2-heptadecyl imidazoles, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-phenyl-4; 5-dihydroxyl Methylimidazole, 2-phenyl-4-methyl-5-hydroxymethyl imidazoles, 2, the mixing of any one or a few in 4-diamino--6-(2-undecyl imidazole-1-ethyl)-S-triazine.
7. the silver-plated powder conductive resin that is used for the LED encapsulation according to claim 2 is characterized in that said coupling agent is the 3-aminopropyl trimethoxysilane; The 3-aminopropyl triethoxysilane; The 3-methacryloxypropyl trimethoxy silane, 3-aminopropyl ortho-siliformic acid, 3-(3-amino-benzene oxygen) propyl trimethoxy silicane; N-(2-amine ethyl)-3-amine propyl group trimethoxy silane; Hexanediamine ylmethyl Trimethoxy silane, the amino undecyl Trimethoxy silane of N-(2-aminoethyl)-11-, the mixing of any one or a few in N-aminoethyl-3-aminopropyl methyl dimethoxysilane.
8. a preparation method who is used for the silver-plated powder conductive resin of LED encapsulation is characterized in that, may further comprise the steps:
1) epoxy resin and epoxide diluent were mixed 3～30 minutes;
2) additive is joined in the mixture that step 1) makes, mixed 3～30 minutes;
3) silver-plated powder is added step 2) in the mixture that makes, apply vacuum and mix.
9. the preparation method who is used for the silver-plated powder conductive resin of LED encapsulation according to claim 8 is characterized in that, can also may further comprise the steps: before adding silver-plated powder, on three-roll grinder, grind.
10. according to Claim 8 to the 9 described preparing methods that are used for the silver-plated powder conductive resin of LED encapsulation, it is characterized in that said step is at room temperature carried out.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012100841309A CN102634312A (en) | 2012-03-27 | 2012-03-27 | Silvering powder conductive adhesive for LED packaging and production method thereof |
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| CN2012100841309A CN102634312A (en) | 2012-03-27 | 2012-03-27 | Silvering powder conductive adhesive for LED packaging and production method thereof |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103433502A (en) * | 2013-08-13 | 2013-12-11 | 胡敏刚 | High-dispersing silver powder and preparation method thereof |
| CN103881308A (en) * | 2014-04-08 | 2014-06-25 | 安捷利（番禺）电子实业有限公司 | Plugging material with high thermal conductivity and preparation method of plugging material |
| US20150344749A1 (en) * | 2012-12-27 | 2015-12-03 | Tanaka Kikinzoku Kogyo K.K. | Thermally-conductive, electrically-conductive adhesive composition |
| CN105936740A (en) * | 2016-06-21 | 2016-09-14 | 秦廷廷 | Hydrophobic and antibacterial modified epoxy resin adhesive for encapsulating chips of LED plant growth lamps |
| CN106459718A (en) * | 2014-05-29 | 2017-02-22 | 田中贵金属工业株式会社 | Thermoconductive electroconductive adhesive composition |
| CN108264879A (en) * | 2018-03-09 | 2018-07-10 | 太原氦舶新材料有限责任公司 | A kind of low-temperature fast-curing two-component conducting resinl |
| CN108410388A (en) * | 2018-03-09 | 2018-08-17 | 太原氦舶新材料有限责任公司 | A kind of room temperature curing conducting resinl |
| CN108949040A (en) * | 2018-07-23 | 2018-12-07 | 原晋波 | A kind of high intensity LED encapsulation adhesive and preparation method thereof |
| CN111518501A (en) * | 2020-05-26 | 2020-08-11 | 中国电子科技集团公司第三十八研究所 | Preparation method of novel conductive silver adhesive with high thermal conductivity and conductive silver adhesive |
| CN112662338A (en) * | 2020-12-18 | 2021-04-16 | 中国振华集团云科电子有限公司 | Low Young modulus conductive adhesive capable of repairing microelectronic assembly and preparation method thereof |
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| CN102174306A (en) * | 2011-01-26 | 2011-09-07 | 烟台德邦电子材料有限公司 | Conductive adhesive for LED (light emitting diode) packaging and preparation method of conductive adhesive |
| CN102408856A (en) * | 2011-08-09 | 2012-04-11 | 烟台德邦电子材料有限公司 | Conductive adhesive for LED (light emitting diode) packaging and preparation method thereof |
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| CN102015884A (en) * | 2008-04-21 | 2011-04-13 | 三键株式会社 | Conductive resin composition |
| CN102174306A (en) * | 2011-01-26 | 2011-09-07 | 烟台德邦电子材料有限公司 | Conductive adhesive for LED (light emitting diode) packaging and preparation method of conductive adhesive |
| CN102408856A (en) * | 2011-08-09 | 2012-04-11 | 烟台德邦电子材料有限公司 | Conductive adhesive for LED (light emitting diode) packaging and preparation method thereof |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150344749A1 (en) * | 2012-12-27 | 2015-12-03 | Tanaka Kikinzoku Kogyo K.K. | Thermally-conductive, electrically-conductive adhesive composition |
| CN103433502A (en) * | 2013-08-13 | 2013-12-11 | 胡敏刚 | High-dispersing silver powder and preparation method thereof |
| CN103881308A (en) * | 2014-04-08 | 2014-06-25 | 安捷利（番禺）电子实业有限公司 | Plugging material with high thermal conductivity and preparation method of plugging material |
| KR101923796B1 (en) * | 2014-05-29 | 2018-11-29 | 다나카 기킨조쿠 고교 가부시키가이샤 | Thermoconductive electroconductive adhesive composition |
| CN106459718A (en) * | 2014-05-29 | 2017-02-22 | 田中贵金属工业株式会社 | Thermoconductive electroconductive adhesive composition |
| EP3150680A4 (en) * | 2014-05-29 | 2018-01-24 | Tanaka Kikinzoku Kogyo K.K. | Thermoconductive electroconductive adhesive composition |
| US10633564B2 (en) | 2014-05-29 | 2020-04-28 | Tanaka Kikinzoku Kogyo K.K. | Thermally and electrically conductive adhesive composition |
| CN105936740A (en) * | 2016-06-21 | 2016-09-14 | 秦廷廷 | Hydrophobic and antibacterial modified epoxy resin adhesive for encapsulating chips of LED plant growth lamps |
| CN108264879A (en) * | 2018-03-09 | 2018-07-10 | 太原氦舶新材料有限责任公司 | A kind of low-temperature fast-curing two-component conducting resinl |
| CN108410388A (en) * | 2018-03-09 | 2018-08-17 | 太原氦舶新材料有限责任公司 | A kind of room temperature curing conducting resinl |
| CN108949040A (en) * | 2018-07-23 | 2018-12-07 | 原晋波 | A kind of high intensity LED encapsulation adhesive and preparation method thereof |
| CN111518501A (en) * | 2020-05-26 | 2020-08-11 | 中国电子科技集团公司第三十八研究所 | Preparation method of novel conductive silver adhesive with high thermal conductivity and conductive silver adhesive |
| CN111518501B (en) * | 2020-05-26 | 2022-04-15 | 中国电子科技集团公司第三十八研究所 | Preparation method of conductive silver adhesive with high thermal conductivity and conductive silver adhesive |
| CN112662338A (en) * | 2020-12-18 | 2021-04-16 | 中国振华集团云科电子有限公司 | Low Young modulus conductive adhesive capable of repairing microelectronic assembly and preparation method thereof |
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Owner name: DARBOND TECHNOLOGY CO., LTD., YANTAI Free format text: FORMER OWNER: YANTAI DARBOND ELECTRONICS MATERIALS CO., LTD. Effective date: 20120718 |
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