CN112662338A - Low Young modulus conductive adhesive capable of repairing microelectronic assembly and preparation method thereof - Google Patents
Low Young modulus conductive adhesive capable of repairing microelectronic assembly and preparation method thereof Download PDFInfo
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Abstract
A conductive adhesive with low Young modulus capable of repairing microelectronic assembly and a preparation method thereof are disclosed, wherein the conductive adhesive comprises a component A and a component B; the component A comprises 10 to 40 percent of bisphenol A type epoxy resin; 0 to 2 percent of phenoxy resin; the diluent is 2 to 20 percent; 60% -80% of silver flake powder; the diluent can be any one or more of ethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether and dipropylene glycol butyl ether; the component B comprises 15 to 40 percent of curing agent; 60% -85% of silver flake powder; the curing agent consists of aminoethyl piperazine, triethanolamine, polyether amine D230, polyether amine D400 and polyether amine D2000 in a certain weight ratio; the particle size of the silver flake powder is 15-30 um. Solves the problems of high brittleness and high hardness, irremovable repair after bonding, poor electrical property and the like of the prior conductive adhesive. The adhesive is widely applied to the bonding material for circuit connection of electronic components.
Description
Technical Field
The invention belongs to the field of electronic components, particularly relates to the field of electronic paste, and further relates to the field of conductive adhesive for circuit bonding.
Background
In the manufacturing materials of electronic components, the conductive adhesive is widely applied to the microelectronic assembly industry due to the characteristics of good electrical conductivity, mechanical property, thermal conductivity, corrosion resistance and the like. However, the brittleness and hardness of the conventional conductive adhesive limit the application of the conductive adhesive to some precise microelectronic assembly materials, such as the chip bonding with mismatched thermal expansion coefficient, and the stress release caused by the external temperature change damages the chip. In order to solve the problem, a conductive adhesive with a low young's modulus needs to be designed so that the conductive adhesive can buffer the stress released by the chip due to temperature change in use.
The invention aims to provide the conductive adhesive with high flexibility and low Young modulus, which can absorb the stress released by materials due to the change of external temperature and effectively protect the bonded materials from being damaged; meanwhile, the conductive adhesive has good conductivity, adhesiveness and repairability, the conductive adhesive which is completely cured can be easily removed when being heated to 100 ℃, and components can be detached and repaired after being adhered, so that the adhered components can be repeatedly utilized, and the requirements of scrapping, cost saving and the like are met.
In view of the above, the present invention is particularly proposed.
Disclosure of Invention
The purpose of the invention is: solves the problems of high brittleness and high hardness, irremovable repair after bonding, poor electrical property and the like of the prior conductive adhesive.
The overall concept of the invention is as follows:
firstly, reducing Young modulus of conductive adhesive, improving flexibility of conductive adhesive and the like
In order to meet the requirement of required flexibility, the key points are the material and the dosage of the curing agent in the conductive adhesive, and the functions and the dosages of the main curing agent are as follows:
aminoethyl piperazine: the aminoethylpiperazine serving as a curing accelerator in the component has higher curing speed, and the aminoethylpiperazine serving as the accelerator is added to improve the curing speed of the conductive adhesive because the polyether amine long-chain curing agent has lower curing speed. The specific dosage is determined according to the proportion of the resin dosage and other curing agents, and the dosage is 1 to 15 percent under general conditions.
Triethanolamine: as the curing accelerator in the component, the curing speed is slower than that of the aminoethyl piperazine, and a small amount of triethanolamine can be used in combination with the aminoethyl piperazine to realize the set curing speed. The specific dosage is determined according to the proportion of the resin dosage and other curing agents, and the dosage is 5 to 15 percent under general conditions.
Polyether amine D230: and the curing speed is faster than that of other polyether amine curing agents with higher molecular weight while certain flexibility is achieved. The specific dosage is determined according to the proportion of the resin dosage and other curing agents, and the dosage is 0 to 25 percent under general conditions.
Polyether amine D400: the polyether amine D230 has the same effect and better flexibility than the polyether amine D230. The specific dosage is determined according to the dosage of the resin and the proportion of other curing agents. Generally, the dosage is 0-25%,
polyether amine D2000: mainly used as a flexibility regulator, when the flexibility of the conductive adhesive is not required, the use amount of D2000 can be increased to increase the flexibility of the system. The specific dosage is determined according to the dosage of the resin and the proportion of other curing agents. Generally, the dosage is 0-25%,
the polyether amine curing agent plays a decisive role in improving the flexibility of the conductive adhesive.
Second, the non-removable and non-repairable aspects after bonding
Repairability performance is increased. The glass transition temperature of the cured resin is utilized, and the glass state of the cured resin is converted into an elastomer by heating, so that the conductive adhesive and the component are peeled.
Thirdly, improving the conductivity of the adhesive property
The silver flake powder mainly plays a role in conducting electricity in the conductive adhesive, and the conductivity is enhanced by adopting a method of increasing the flake diameter of the flake silver flake powder.
Preparation of conductive adhesive slurry
Respectively preparing conductive adhesive body slurry, namely a conductive adhesive A component (hereinafter referred to as A component), and conductive adhesive curing agent slurry, namely a conductive adhesive B component (hereinafter referred to as B component).
(1) The component A comprises:
bisphenol A type epoxy resin is mainly used as the resin, is type E-51, is viscous liquid, is often used for preparing conductive adhesive, and mainly plays a role in bonding after being cured.
The phenoxy resin mainly has toughening effect.
The diluent can be any one or more of polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether and dipropylene glycol butyl ether.
The silver powder is flake powder.
(2) The component B comprises:
the curing agent is composed of aminoethyl piperazine, triethanolamine, polyether amine D230, polyether amine D400 and polyether amine D2000 according to a certain weight ratio.
The silver powder is flake powder.
(3) When in use, the component A and the component B are mixed according to a certain weight ratio for use, and the required conductive adhesive can be obtained.
Therefore, the invention provides a low Young modulus conductive adhesive capable of repairing microelectronic assembly, which comprises the following raw materials in percentage by weight:
the composition comprises a component A and a component B, wherein the weight ratio of the raw materials of the two components is as follows:
the component A comprises:
15 to 30 percent of bisphenol A type epoxy resin;
0 to 2 percent of phenoxy resin;
the diluent is 2 to 20 percent;
the silver flake powder accounts for 60-80 percent.
The bisphenol A type epoxy resin is type E-51, the epoxy value is 0.51, and the epoxy equivalent is 184-190.
The diluent is polypropylene glycol diglycidyl ether, the viscosity of the diluent is 30-70 mPa.S, the epoxy value of the diluent is 0.28-0.36, and the epoxy equivalent weight of the diluent is 278-357.
The diluent can be any one or more of ethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether and dipropylene glycol butyl ether.
The particle size of the silver flake powder is 15-30 um.
The component B comprises:
20 to 35 percent of curing agent;
the silver flake powder accounts for 60-80 percent.
The curing agent comprises the following components in percentage by weight: 1-15% of aminoethylpiperazine, 5-15% of triethanolamine, 0-25% of polyetheramine D230, 0-25% of polyetheramine D400 and 0-25% of polyetheramine D2000.
When in use, the component A and the component B are mixed according to the set weight ratio.
The invention provides a preparation method of a low Young modulus conductive adhesive capable of repairing microelectronic assembly, which comprises the following steps:
(1) preparing materials;
(2) weighing: weighing the raw materials of the conductive adhesive according to the proportion;
(3) preparing an organic carrier: preparing phenoxy resin and bisphenol A epoxy resin according to a set weight ratio, heating to a certain temperature until the phenoxy resin is completely dissolved, wherein the mixed substance is generally called an organic carrier;
(4) preparing a conductive adhesive component A: the organic carrier, dipropylene glycol butyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, silver flake powder and the like are prepared according to the set weight percentage.
(5) Preparing a conductive adhesive B component: the preparation method comprises the following steps of preparing aminoethyl piperazine, triethanolamine, polyether amine D400, polyether amine D2000, silver flake powder and the like according to the set weight percentage.
(6) Preparation of A component or B component:
premixing: and (3) preparing the conductive adhesive of the component A or the component B according to the weight percentage, and premixing the conductive adhesive by using a mortar until the silver flake powder is completely mixed into the resin, wherein no obvious powdery silver flake powder exists.
Rolling: and rolling the premixed slurry on a three-roll mill until the fineness is less than 10 um.
Sieving: and (3) screening the component A by using a 250-mesh screen to filter silver bright pieces and impurities existing in the conductive adhesive.
(7) Packaging and marking: packaging and marking A, B conductive adhesive separately;
(8) and (3) storage: preserving at normal temperature for one year;
(9) use of: packaging A, B conductive adhesive and marking, mixing at a weight ratio of 1:1, stirring uniformly, smearing on the substrate to be bonded, and curing at 125 deg.C/2 h or 150 deg.C/1 h.
And (3) test results:
and shearing the LTCC substrate into 2x2mm, adhering the LTCC substrate on an aluminum substrate by using the low Young modulus conductive adhesive, curing at 125 ℃, 2 hours or 150 ℃ for 1 hour, and detecting the performances of the LTCC substrate such as normal temperature shearing force, the bulk resistivity, the Young modulus and the like.
And (3) testing the conductive adhesive after curing: volume resistivity of (1-4) x10-4Omega cm; the normal temperature shearing force is (2.0-4.0) kg; elongation at break of (10-35)%, Young's modulus of (4-8) x10-4Gpa。
The prior conductive adhesive for microelectronic assembly has various performance parameters: volume resistivity of (3-5) x10-4Omega cm; the normal temperature shearing force is (1.5-3.5) kg; the elongation at break is (0-10)%, and the Young modulus is (5-10) x10-3Gpa。
The conductive adhesive has excellent performance, meets the common requirements of microelectronic assembly, has certain flexibility, and can be used for bonding materials with unmatched thermal expansion coefficients.
The conductive adhesive cured on the aluminum substrate is placed on a hot plate to be heated, and the cured conductive adhesive can be easily removed when the temperature reaches 100 ℃, so that the conductive adhesive has excellent repairability.
In conclusion, the invention has the following advantages:
the invention has good conductivity, and is suitable for high-precision microelectronic assembly;
the invention has excellent adhesive property, does not corrode base material and chip, and is suitable for high-precision microelectronic assembly.
The conductive adhesive has excellent heat-conducting property, and because a large amount of silver flake powder is filled, a good heat-conducting path is formed inside the conductive adhesive, so that the conductive adhesive has good heat-conducting property, is favorable for heat dissipation of materials, and is suitable for high-precision microelectronic assembly;
the material has lower Young modulus, has good flexibility in a certain temperature range, and can fully absorb the stress released by the material with mismatched thermal expansion coefficient due to temperature change;
the invention has good repairability, and when the cured conductive adhesive is reheated to 100 ℃, the conductive adhesive can be easily removed, so that the bonded material can be recycled.
The conductive adhesive is widely applied to electronic components, in particular to a bonding material for circuit connection of surface-mounted electronic components.
Detailed Description
In order to better explain the invention, the main content of the invention is further illustrated below with reference to specific examples, but the content of the invention is not limited to the following examples, and the specific preparation process is as follows:
example 1:
the preferable dosage of each component of the curing agent in the conductive adhesive is as follows:
1% -10% of aminoethylpiperazine;
5% -10% of triethanolamine;
5% -25% of the polyether amine D230;
the polyether amine D400 is 5-25%;
the polyether amine D2000 is 5-25%. Can this be done here as an implementation case? I am an A/B component glue, and all the components are not written on in the case.
Example 2:
(1) preparing an organic carrier:
the phenoxy resin and the bisphenol A epoxy resin are prepared according to the weight ratio of 1:16, and the mixture is heated to 120 ℃ until the phenoxy resin is completely dissolved, and the mixed mixture is called as an organic carrier.
(2) A, B component preparation:
the component A comprises the following components in percentage by weight:
23.4% of organic carrier;
dipropylene glycol butyl ether 0.35%;
1.05% of polyethylene glycol diglycidyl ether;
1.4% of polypropylene glycol diglycidyl ether;
the silver flake powder is 73.8 percent.
The component B comprises the following components in percentage by weight:
2% of aminoethylpiperazine;
8 percent of triethanolamine;
the polyether amine D400 is 3%;
14% of polyetheramine D2000;
the silver flake powder is 75 percent.
(3) A, B component preparation:
premixing: the component A or the component B is prepared according to the weight percentage, and is premixed by a mortar until the silver flake powder is completely mixed into the resin, and no obvious powdery silver flake powder exists.
Rolling: and rolling the premixed slurry on a three-roll mill until the fineness is less than 10 um.
Sieving: and (3) screening the component A by using a 250-mesh screen to filter silver bright pieces and impurities existing in the conductive adhesive.
(4) Assembly test
A, B components are prepared and mixed according to the weight ratio of 1:1, the LTCC substrate is cut into 2x2mm, the LTCC substrate is pasted on an aluminum substrate by conductive adhesive, the LTCC substrate is cured under the conditions of 125 ℃, 2h or 150 ℃ and 1h, and the properties of the LTCC substrate, such as normal temperature shearing force, bulk resistivity, Young modulus and the like, are detected.
The test results of the product are as follows:
and (3) testing the conductive adhesive after curing: bulk resistivity of 1.94x10-4Omega cm; the normal temperature shearing force is 3.08 kg; elongation at break 32.25%, Young's modulus 7.6x10-4Gpa. The conductive adhesive has excellent performance and conforms to microelectronic assemblyThe adhesive has common requirements and certain flexibility, and can be used for bonding materials with mismatched coefficients of thermal expansion. The conductive adhesive cured on the aluminum substrate is placed on a hot plate to be heated, and the cured conductive adhesive can be easily removed when the temperature reaches 100 ℃, so that the conductive adhesive has excellent repairability.
Example 3
(1) Preparing an organic carrier:
the phenoxy resin and the bisphenol A epoxy resin are prepared according to the weight ratio of 1:16, and the mixture is heated to 120 ℃ until the phenoxy resin is completely dissolved, and the mixed mixture is called as an organic carrier.
(2) A, B component preparation:
the component A comprises the following components in percentage by weight:
25.6% of organic carrier;
2.8% of polypropylene glycol diglycidyl ether;
71.6 percent of silver flake powder;
the component B comprises the following components in percentage by weight:
2% of aminoethylpiperazine;
8 percent of triethanolamine;
the content of polyetheramine D400 is 16 percent;
the silver flake powder is 74 percent.
(3) A, B component preparation:
premixing: the component A or the component B is prepared according to the weight percentage, and is premixed by a mortar until the silver flake powder is completely mixed into the resin, and no obvious powdery silver flake powder exists.
Rolling: and rolling the premixed slurry on a three-roll mill until the fineness is less than 10 um.
Sieving: and (3) screening the component A by using a 250-mesh screen to filter silver bright pieces and impurities existing in the conductive adhesive.
(4) Assembly test
A, B components are prepared and mixed according to the weight ratio of 1:1, the LTCC substrate is cut into 2x2mm, the LTCC substrate is pasted on an aluminum substrate by conductive adhesive, the LTCC substrate is cured under the conditions of 125 ℃, 2h or 150 ℃ and 1h, and the properties of the LTCC substrate, such as normal temperature shearing force, bulk resistivity, Young modulus and the like, are detected.
And (3) test results:
and (3) testing the conductive adhesive after curing: bulk resistivity of 1.58x10-4(Ω · cm); the normal temperature shearing force is 2.14 (kg); elongation at break of 28.75%, Young's modulus of 6.8x10-4Gpa. The conductive adhesive has excellent performance, meets the common requirements of microelectronic assembly, has certain flexibility, and can be used for bonding materials with unmatched thermal expansion coefficients. The conductive adhesive cured on the aluminum substrate is placed on a hot plate to be heated, and the cured conductive adhesive can be easily removed when the temperature reaches 100 ℃, so that the conductive adhesive has excellent repairability.
Example 4
(1) Preparing an organic carrier:
the phenoxy resin and the bisphenol A epoxy resin are prepared according to the weight ratio of 1:16, and the mixture is heated to 120 ℃ until the phenoxy resin is completely dissolved, and the mixed mixture is called as an organic carrier.
(2) A, B component preparation:
the component A comprises the following components in percentage by weight:
18% of organic carrier;
9% of polypropylene glycol diglycidyl ether;
the silver flake powder is 73 percent.
The component B comprises the following components in percentage by weight:
5% of aminoethylpiperazine;
8 percent of triethanolamine;
polyetheramine D230 was 12%;
the silver flake powder is 75 percent.
(3) A, B component preparation:
premixing: the component A or the component B is prepared according to the weight percentage, and is premixed by a mortar until the silver flake powder is completely mixed into the resin, and no obvious powdery silver flake powder exists.
Rolling: and rolling the premixed slurry on a three-roll mill until the fineness is less than 10 um.
Sieving: and (3) screening the component A by using a 250-mesh screen to filter silver bright pieces and impurities existing in the conductive adhesive.
(4) Assembly test
A, B components are prepared and mixed according to the weight ratio of 1:1, the LTCC substrate is cut into 2x2mm, the LTCC substrate is pasted on an aluminum substrate by conductive adhesive, the LTCC substrate is cured under the conditions of 125 ℃, 2h or 150 ℃ and 1h, and the properties of the LTCC substrate, such as normal temperature shearing force, bulk resistivity, Young modulus and the like, are detected.
And (3) test results:
and (3) testing the conductive adhesive after curing: bulk resistivity of 2.26x10-4(Ω · cm); the normal temperature shearing force is 2.83 (kg); elongation at break 32.75%, Young's modulus 4.5x10-4Gpa. The conductive adhesive has excellent performance, meets the common requirements of microelectronic assembly, has certain flexibility, and can be used for bonding materials with unmatched thermal expansion coefficients. The conductive adhesive cured on the aluminum substrate is placed on a hot plate to be heated, and the cured conductive adhesive can be easily removed when the temperature reaches 100 ℃, so that the conductive adhesive has excellent repairability.
Finally, it should be noted that: although the present invention has been described in detail with reference to the above embodiments, it should be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the spirit and scope of the invention.
Claims (10)
1. The low Young modulus conductive adhesive capable of repairing microelectronic assembly is characterized by comprising the following raw materials in percentage by weight: is divided into a component A and a component B;
the component A comprises: 10-40% of bisphenol A type epoxy resin, 0-2% of phenoxy resin and 2-20% of diluent; 60% -80% of silver flake powder;
the diluent can be any one or more of polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether and dipropylene glycol butyl ether;
mixing the phenoxy resin and the bisphenol A epoxy resin according to a set weight ratio, and heating until the phenoxy resin is completely dissolved to form an organic carrier;
the component B comprises: 15 to 40 percent of curing agent and 60 to 85 percent of silver flake powder;
the curing agent is composed of aminoethyl piperazine, triethanolamine, polyetheramine D230, polyetheramine D400 and polyetheramine D2000 according to a certain weight ratio;
the particle size of the silver flake powder is 10-40 um.
2. The low young's modulus conductive adhesive capable of repairing a microelectronic assembly as claimed in claim 1, wherein: the bisphenol A type epoxy resin is type E-51, the epoxy value of the bisphenol A type epoxy resin is 0.51, and the epoxy equivalent is 184-190.
3. The low young's modulus conductive adhesive capable of repairing a microelectronic assembly as claimed in claim 1, wherein: the diluent is polypropylene glycol diglycidyl ether, the viscosity of the diluent is 30-70 mPa.S, the epoxy value is 0.28-0.36, and the epoxy equivalent weight is 278-357.
4. The low young's modulus conductive adhesive capable of repairing a microelectronic assembly as claimed in claim 1, wherein the curing agent comprises, by weight: 1-15% of aminoethylpiperazine, 5-15% of triethanolamine, 0-25% of polyetheramine D230, 0-25% of polyetheramine D400 and 0-25% of polyetheramine D2000.
5. The low young's modulus conductive adhesive capable of repairing a microelectronic assembly as claimed in claim 4, wherein: 1-10% of aminoethylpiperazine, 5-10% of triethanolamine, 5-25% of polyetheramine D230, 5-25% of polyetheramine D400 and 5-25% of polyetheramine D2000.
6. The low young's modulus conductive adhesive capable of repairing a microelectronic assembly as claimed in claim 1, wherein:
the component A comprises the following components in percentage by weight: 23.4% of organic carrier, 0.35% of dipropylene glycol butyl ether, 1.05% of polyethylene glycol diglycidyl ether, 1.4% of polypropylene glycol diglycidyl ether and 73.8% of silver flake powder;
the component B comprises the following components in percentage by weight: 2% of aminoethylpiperazine, 8% of triethanolamine, 3% of polyetheramine D400, 14% of polyetheramine D2000 and 75% of silver flake powder.
7. The low young's modulus conductive adhesive capable of repairing a microelectronic assembly as claimed in claim 1, wherein:
the component A comprises the following components in percentage by weight: 25.6% of organic carrier, 2.8% of polypropylene glycol diglycidyl ether and 71.6% of silver flake powder;
the component B comprises the following components in percentage by weight: 2% of aminoethylpiperazine, 16% of triethanolamine, 8% of polyetheramine D400 and 74% of silver flake powder.
8. The low young's modulus conductive adhesive capable of repairing a microelectronic assembly as claimed in claim 1, wherein:
the component A comprises the following components in percentage by weight: 18% of organic carrier, 9% of polypropylene glycol diglycidyl ether and 73% of silver flake powder;
the component B comprises the following components in percentage by weight: 5% of aminoethylpiperazine, 12% of triethanolamine, 8% of polyetheramine D230 and 75% of silver flake powder.
9. The method of claim 1, wherein the method comprises the steps of:
(1) preparing materials;
(2) weighing: weighing the raw materials of the conductive adhesive according to the proportion;
(3) preparing an organic carrier: preparing phenoxy resin and bisphenol A epoxy resin according to a set weight ratio, heating to a certain temperature until the phenoxy resin is completely dissolved, wherein the mixed substance is generally called an organic carrier;
(4) preparing a conductive adhesive component A: the organic carrier, dipropylene glycol butyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, silver flake powder and the like are prepared according to the set weight percentage.
(5) Preparing a conductive adhesive B component: the preparation method comprises the following steps of preparing aminoethyl piperazine, triethanolamine, polyether amine D400, polyether amine D2000, silver flake powder and the like according to the set weight percentage.
(6) Preparation of A component or B component:
premixing: and (3) preparing the conductive adhesive of the component A or the component B according to the weight percentage, and premixing the conductive adhesive by using a mortar until the silver flake powder is completely mixed into the resin until no obvious powdery silver flake powder exists.
Rolling: and rolling the premixed slurry on a three-roll mill until the fineness is less than 10 um.
Sieving: and (3) screening the component A by using a 250-mesh screen to filter silver bright pieces and impurities existing in the conductive adhesive.
10. The method of claim 9, wherein the conductive paste with low young's modulus is capable of repairing microelectronic assembly, and comprises: the organic carrier is prepared by mixing phenoxy resin and bisphenol A epoxy resin according to the weight ratio of 1:16 and heating until the phenoxy resin is completely dissolved; when the component A and the component B are used, the component A and the component B are mixed according to the weight ratio of 1:1, are uniformly stirred, are coated on a substrate to be bonded and are cured under the condition of 125 ℃/2h or 150 ℃/1 h.
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| CN202011508153.9A CN112662338A (en) | 2020-12-18 | 2020-12-18 | Low Young modulus conductive adhesive capable of repairing microelectronic assembly and preparation method thereof |
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| CN202011508153.9A CN112662338A (en) | 2020-12-18 | 2020-12-18 | Low Young modulus conductive adhesive capable of repairing microelectronic assembly and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102408856A (en) * | 2011-08-09 | 2012-04-11 | 烟台德邦电子材料有限公司 | Conductive adhesive for LED (light emitting diode) packaging and preparation method thereof |
| CN102634313A (en) * | 2012-04-23 | 2012-08-15 | 广州市白云化工实业有限公司 | Epoxy conductive resin applicable to binding of LED (light-emitting diode) chips, and preparation method thereof |
| CN102634312A (en) * | 2012-03-27 | 2012-08-15 | 烟台德邦电子材料有限公司 | Silvering powder conductive adhesive for LED packaging and production method thereof |
| CN105062394A (en) * | 2015-08-10 | 2015-11-18 | 苏州科淼新材料有限公司 | Epoxy conductive adhesive and preparation method therefor |
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2020
- 2020-12-18 CN CN202011508153.9A patent/CN112662338A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102408856A (en) * | 2011-08-09 | 2012-04-11 | 烟台德邦电子材料有限公司 | Conductive adhesive for LED (light emitting diode) packaging and preparation method thereof |
| CN102634312A (en) * | 2012-03-27 | 2012-08-15 | 烟台德邦电子材料有限公司 | Silvering powder conductive adhesive for LED packaging and production method thereof |
| CN102634313A (en) * | 2012-04-23 | 2012-08-15 | 广州市白云化工实业有限公司 | Epoxy conductive resin applicable to binding of LED (light-emitting diode) chips, and preparation method thereof |
| CN105062394A (en) * | 2015-08-10 | 2015-11-18 | 苏州科淼新材料有限公司 | Epoxy conductive adhesive and preparation method therefor |
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Application publication date: 20210416 |