CN102585743A - Conductive adhesive and preparation method thereof - Google Patents
Conductive adhesive and preparation method thereof Download PDFInfo
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- CN102585743A CN102585743A CN2011104387240A CN201110438724A CN102585743A CN 102585743 A CN102585743 A CN 102585743A CN 2011104387240 A CN2011104387240 A CN 2011104387240A CN 201110438724 A CN201110438724 A CN 201110438724A CN 102585743 A CN102585743 A CN 102585743A
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Abstract
The invention relates to a conductive adhesive and a preparation method thereof. The preparation method comprises the following specific steps of: 1) adding nano-silver powder into an aqueous solution of amino acid to obtain amino-acid-modified nano-silver powder to be ready for use; 2) mixing an epoxy resin with an epoxy diluent at room temperature; 3) adding a curing agent, a curing accelerator and a coupling agent into a mixture of the epoxy resin and the epoxy diluent prepared in the step 2), and mixing at room temperature to obtain a mixture; and 4) adding the amino-acid-modified nano-silver powder into a homogeneous mixture, and then adding micro-silver powder, and stirring at room temperature until the mixing is uniform to obtain the conductive adhesive. The conductive silver powder used in the invention can significantly reduce the silver powder content, so that the overall performance of the conductive adhesive is good.
Description
Technical field
The present invention relates to a kind of conductive resin and preparation method thereof, especially relate to conductive resin of a kind of low silver content and preparation method thereof.
Background technology
Conductive resin is the sizing agent that has certain conductivity after a kind of curing or the drying, and it is made up of matrix resin, conductive filler material and auxiliary agent etc. usually.Resin matrix mainly plays cohesive action, and filler is used for forming conductive path.Matrix resin is mainly heat cured epoxy resin, silicone resin, polyimide resin, resol, urethane, vinyl resin etc.; Conductive filler material can be powder and graphite of gold and silver, copper, aluminium, zinc, iron, nickel etc.
Present commercial conductive resin mostly uses silver powder as the filler with conduction and heat conductivility, and the major portion of its material cost also is a silver powder.But along with industry member is vigorous for the increasing demand of the precious metal of silver etc.; The silver powder price is soaring constantly always; Cause conductive resin shared cost in Electronic Packaging to rise significantly, become the problem that scientific circles and industry member all are concerned about very much so develop active demand that the conductive resin of one type of lower cost satisfies market.
At present, the cost that reduces conductive resin has two kinds of approach, and a kind of is that nickel or silver-plated copper, silver-plated nickel wait and replaces silver powder as conductive filler material with other base metals such as copper, but copper powder is oxidized to cupric oxide easily, and cupric oxide is non-conductive; Though the more difficult comparatively speaking oxidation of nickel powder, the processibility of nickel powder is bad, and the shape that is difficult for being processed into needs meets the demands; Plate precious metals such as silver or gold at copper powder and nickel powder surface; Though can effectively prevent oxidation; But be difficult to guarantee that copper powder or nickel powder surface all can both plate precious metal,, when steam gets into, will quicken copper powder or nickel powder oxidation as long as copper powder or nickel powder surface have some exposed.These shortcomings have all limited the application at conductive resin such as copper, nickel, silver-plated copper and silver-plated nickel.Another kind method is exactly to reduce the content of silver powder in conductive resin, and this method has attracted people's extensive attention owing to advantages such as safety are high, and over-all properties is better.
Summary of the invention
Technical problem to be solved by this invention provides conductive resin of a kind of low silver content and preparation method thereof, thereby reaches the purpose that reduces cost.
The technical scheme that the present invention solves the problems of the technologies described above is following:
A kind of conductive resin comprises each raw material of following weight percent: conduction silver powder 50%～70%, epoxy resin 10%～25%; Epoxide diluent 3%～10%, solidifying agent 8%～20%, curing catalyst 0.5%～2%; Amino acid 0.5～2%, coupling agent 0.5%～2%.
The invention has the beneficial effects as follows: the used conduction silver powder of the present invention can reduce silver powder content significantly, makes the conductive resin good combination property.
On the basis of technique scheme, the present invention can also do following improvement.
Further, said conduction silver powder is nano-silver powder and micro-silver powder.
Further, the particle size range of said nano-silver powder is 5 nanometers～100 nanometers, and preferred particle size range is 10 nanometers～20 nanometers, and the micro-silver powder particle size range is 0.5 micron～100 microns, and preferred particle size range is 1 micron～50 microns.
Adopt the beneficial effect of above-mentioned further scheme to be, it is little that nanometer silver has a particle diameter, and characteristics such as bigger specific surface area and active height are filled less nano-silver powder through tunnel effect, just can reach the seepage flow threshold value of conductive resin, make it have electroconductibility preferably.For this reason, the present invention with nano-silver powder with mix use with micro-silver powder, make conductive resin have better comprehensive performance.
Further, said epoxy resin is the one or any two or more mixture in Racemic glycidol ethers bisphenol A-type, bisphenol f type epoxy resin, ethylene oxidic ester epoxy resin, aliphatic epoxy resin, cycloaliphatic epoxy resin, acrylic modified epoxy resin or the modifying epoxy resin by organosilicon.
Further; Said epoxide diluent is 1; 4-butyleneglycol glycidyl ether, NSC 6366 glycidyl ether, 1; 6-hexanediol diglycidyl ether, Diethylene Glycol glycidyl ether, 1, the one or any two or more mixture in 4-cyclohexane diol glycidyl ether, TriMethylolPropane(TMP) glycidyl ether or the polyethyleneglycol diglycidylether.
Further, said solidifying agent is the one or any two or more mixture in THPA, methyl tetrahydro phthalic anhydride, HHPA, methyl hexahydrophthalic anhydride, methyl carbic anhydride or the dodecyl MALEIC ANHYDRIDE.
Further; Said curing catalyst is a benzyldimethylamine, 2; 4; The modifier of 6-three (dimethylamino methyl) phenol and modifier thereof, 2-ethyl-4-methylimidazole, cyanoethyl-2-ethyl-4-methylimidazole, benzyldimethylamine, Methylimidazole, 2-undecyl imidazole, 2-heptadecyl imidazoles, 2, the one or any two or more mixture in 4-diamino--6-(2-undecyl imidazole-1-ethyl)-S-triazine and verivate and the salt in its modifier.
Further, said amino acid is the one or any two or more mixture in L-Ala, l-arginine, aspartic acid, asparagine, halfcystine, Methionin, methionine(Met), phenylalanine(Phe), Serine, Threonine, tryptophane, tyrosine, Xie Ansuan, N.delta.-carbamylornithine, ornithine, taurine, γ-tyrosine or the Methionin.
Further; Said coupling agent is γ-An Bingjisanyiyangjiguiwan, γ-An Bingjisanjiayangjiguiwan, γ-(2; 3-epoxy third oxygen) propyl trimethoxy silicane, γ-methacryloxypropyl trimethoxy silane, N-(β-aminoethyl)-γ-An Bingjisanyiyangjiguiwan, the mixture of one or more in N-β-(aminoethyl)-γ-An Bingjisanjiayangjiguiwan, N-β-(aminoethyl)-γ-aminopropyl methyl dimethoxysilane, γ-aminopropyl methyl dimethoxysilane, γ-aminopropyl methyldiethoxysilane, the vinyltriethoxysilane.
Another technical scheme that the present invention solves the problems of the technologies described above is following: a kind of preparation method of conductive resin may further comprise the steps:
The nano-silver powder that 1) will conduct electricity in the silver powder joins in the amino acid whose aqueous solution, stirs, and then carries out centrifugal, washing, drying successively, obtains amino-acid modified nano-silver powder, and is subsequent use;
2) epoxy resin and epoxide diluent are at room temperature mixed, obtain the mixture of epoxy resin and epoxide diluent;
3) solidifying agent, curing catalyst and coupling agent are joined step 2) in the epoxy resin that makes and the mixture of epoxide diluent; And at room temperature mix, obtain mixture, then said mixture is put on the shredder; And at room temperature grind, thing is uniformly mixed;
4) the amino-acid modified nano-silver powder that obtains in the step 1) is joined in the uniform mixture that step 3) makes, add micro-silver powder again, and at room temperature stir,, promptly get said conductive resin to mixing;
Wherein, said conduction silver powder, epoxy resin; Epoxide diluent; Solidifying agent, curing catalyst, the weight percent of amino acid and coupling agent are 50%～70%: 10%～25%: 3%～10%: 8%～20%: 0.5%～2%: 0.5～2%: 0.5%～2%.
Further, in step 1), said stirring is under 40～100 ℃ temperature, stirs 6～48 hours, and temperature is 15～25 ℃ under the said drying.
Further, in step 2) in, the said blended time is 3～30 minutes.
Further, in step 3), the said blended time is 3～30 minutes, and the time of said grinding is 3～30 minutes.
The invention has the beneficial effects as follows, because it is nanometer silver has high-specific surface area, active big; Reunite easily; Cause it in epoxy resin-base, to be difficult to disperse, the present invention makes it be dispersed in the resin matrix preferably through through with amino acid nanometer silver being carried out surface-treated; Amino acid participation curable epoxide removes from the surface of nanometer silver during curing, makes nanoparticle have electroconductibility preferably.
Embodiment
Below principle of the present invention and characteristic are described, institute gives an actual example and only is used to explain the present invention, is not to be used to limit scope of the present invention.
Embodiment 1
At normal temperatures, respectively according to 1 specified each component of embodiment in the table 1, with bisphenol A type epoxy resin and 1; 4-butyleneglycol glycidyl ether mixes 3 minutes to even; Add methyl tetrahydro phthalic anhydride, 2-undecyl imidazole and γ-An Bingjisanyiyangjiguiwan then, mixing under the room temperature became uniform mixture in 15 minutes, after grinding through three-roller again; Add flake silver powder 1, low speed mixing can make conductive resin of the present invention in 30 minutes under the room temperature.
Embodiment 2
At normal temperatures, respectively according to 2 specified each component of embodiment in the table 1, bisphenol f type epoxy resin and NSC 6366 glycidyl ether are mixed 10 minutes to even; Add methyl hexahydrophthalic anhydride, 2-ethyl-4-methylimidazole and γ-(2 then; 3-epoxy third oxygen) propyl trimethoxy silicane, mixing under the room temperature became uniform mixture in 10 minutes, after grinding through three-roller again; Add flake silver powder 1 and flake silver powder 2, low speed mixing can make conductive resin of the present invention in 45 minutes under the room temperature.
Embodiment 3
At normal temperatures; Respectively according to 3 specified each component of embodiment in the table 1; Bisphenol A-type and bisphenol f type epoxy resin and polyethyleneglycol diglycidylether are mixed 20 minutes to evenly; Add methyl Na Dike phthalic anhydride, 2-undecyl imidazole and γ-methacryloxypropyl trimethoxy silane then, mixing under the room temperature became uniform mixture in 20 minutes, after grinding through three-roller again; Add nano-silver powder 1 and flake silver powder 1, low speed mixing can make conductive resin of the present invention in 45 minutes under the room temperature.
Embodiment 4
Formulate each component according to embodiment in the table 14, nano-silver powder is 40 ℃ of stirring and refluxing 6h in the aqueous solution of L-glutamic acid, and is centrifugal, prepares the nano-silver powder after the modification after the washing drying, subsequent use; At normal temperatures; Respectively according to 4 specified each component of embodiment in the table 1; Bisphenol A-type and bisphenol f type epoxy resin, NSC 6366 glycidyl ether and polyethyleneglycol diglycidylether are mixed 30 minutes to evenly, add methyl hexahydrophthalic anhydride, THPA, 2-ethyl-4-methylimidazole, γ-An Bingjisanyiyangjiguiwan and γ-(2,3-epoxy third oxygen) propyl trimethoxy silicane then; Mixing under the room temperature became uniform mixture in 30 minutes; After grinding through three-roller, add flake silver powder 2 and modified Nano silver powder, low speed mixing can make conductive resin of the present invention in 60 minutes under the room temperature again.
Embodiment 5
Formulate each component according to embodiment in the table 15, nano-silver powder is 100 ℃ of stirring and refluxing 48h in the aqueous solution of glycocoll, and is centrifugal, prepares the nano-silver powder after the modification after the washing drying, subsequent use; At normal temperatures; Respectively according to 5 specified each component of embodiment in the table 1, with bisphenol A-type and bisphenol f type epoxy resin, polyethyleneglycol diglycidylether and 1,4-cyclohexane diol glycidyl ether mixes 20 minutes to evenly; Add methyl tetrahydro phthalic anhydride, THPA, 2-undecyl imidazole, 2-ethyl-4-methylimidazole, γ-(2 then; 3-epoxy third oxygen) propyl trimethoxy silicane and hexanediamine ylmethyl Trimethoxy silane, mixing under the room temperature became uniform mixture in 10 minutes, after grinding 30 minutes through three-roller again; Add flake silver powder 2 and modified Nano silver powder, low speed mixing can make conductive resin of the present invention in 60 minutes under the room temperature.
Embodiment 6
Formulate each component according to embodiment in the table 16, nano-silver powder is 80 ℃ of stirring and refluxing 24h in the aqueous solution of Methionin, and is centrifugal, prepares the nano-silver powder after the modification after the washing drying, subsequent use; At normal temperatures; Respectively according to 6 specified each component of embodiment in the table 1; Bisphenol A-type and bisphenol f type epoxy resin and Diethylene Glycol glycidyl ether are mixed 20 minutes to evenly, add methyl tetrahydro phthalic anhydride, methyl hexahydrophthalic anhydride, 2-undecyl imidazole, 2-ethyl-4-methylimidazole and γ-(2,3-epoxy third oxygen) propyl trimethoxy silicane then; Mixing under the room temperature became uniform mixture in 10 minutes; After grinding 3 minutes through three-roller, add flake silver powder 2 and modified Nano silver powder, low speed mixing can make the conductive resin that the present invention is used in 60 minutes under the room temperature again.
Each embodiment component concentration of table 1
Remarks: 10 microns of flake silver powder 1 median sizes; Flake silver powder 2 median sizes are 20 microns,
Nano-silver powder 1 median size is 20 nanometers.
The conductive resin of the present invention that above each embodiment is obtained was placed 1 hour in condition of cure is 175 ℃ baking oven.The test of solidifying the thermal conductivity of back material is carried out according to ASTM C518 standard, and the test of electric conductivity is carried out according to the method for four-point probe.The test result of each embodiment is as shown in table 2.
The conductive resin thermal conductivity test result that each embodiment of table 2 obtains
Can find out that from table 2 the present invention has reduced cost through the conductive resin that the consumption that reduces silver powder prepares, and has kept having obtained the favorable conductive heat conductivility, can satisfy the application in semiconductor packages and light emitting diode field.
The above is merely preferred embodiment of the present invention, and is in order to restriction the present invention, not all within spirit of the present invention and principle, any modification of being done, is equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. a conductive resin is characterized in that, comprises each raw material of following weight percent: conduction silver powder 50%～70%; Epoxy resin 10%～25%, epoxide diluent 3%～10%, solidifying agent 8%～20%; Curing catalyst 0.5%～2%, amino acid 0.5～2%, coupling agent 0.5%～2%.
2. conductive resin according to claim 1 is characterized in that, said conduction silver powder is nano-silver powder and micro-silver powder.
3. conductive resin according to claim 2 is characterized in that, the particle diameter of said nano-silver powder is 5 nanometers～100 nanometers, and the particle diameter of said micro-silver powder is 0.5 micron～100 microns.
4. conductive resin according to claim 3 is characterized in that, the particle diameter of said nano-silver powder is 10 nanometers～20 nanometers, and the particle diameter of said micro-silver powder is 1 micron～50 microns.
5. conductive resin according to claim 1; It is characterized in that said epoxy resin is the one or any two or more mixture in Racemic glycidol ethers bisphenol A-type, bisphenol f type epoxy resin, ethylene oxidic ester epoxy resin, aliphatic epoxy resin, cycloaliphatic epoxy resin, acrylic modified epoxy resin or the modifying epoxy resin by organosilicon; Said epoxide diluent is 1; 4-butyleneglycol glycidyl ether, NSC 6366 glycidyl ether, 1; 6-hexanediol diglycidyl ether, Diethylene Glycol glycidyl ether, 1, the one or any two or more mixture in 4-cyclohexane diol glycidyl ether, TriMethylolPropane(TMP) glycidyl ether or the polyethyleneglycol diglycidylether.
6. conductive resin according to claim 1; It is characterized in that said solidifying agent is the one or any two or more mixture in THPA, methyl tetrahydro phthalic anhydride, HHPA, methyl hexahydrophthalic anhydride, methyl carbic anhydride or the dodecyl MALEIC ANHYDRIDE; Said curing catalyst is a benzyldimethylamine, 2; 4; The modifier of 6-three (dimethylamino methyl) phenol and modifier thereof, 2-ethyl-4-methylimidazole, cyanoethyl-2-ethyl-4-methylimidazole, benzyldimethylamine, Methylimidazole, 2-undecyl imidazole, 2-heptadecyl imidazoles, 2, the one or any two or more mixture in 4-diamino--6-(2-undecyl imidazole-1-ethyl)-S-triazine and verivate and the salt in its modifier.
7. conductive resin according to claim 1; It is characterized in that said amino acid is the one or any two or more mixture in L-Ala, l-arginine, aspartic acid, asparagine, halfcystine, Methionin, methionine(Met), phenylalanine(Phe), Serine, Threonine, tryptophane, tyrosine, Xie Ansuan, N.delta.-carbamylornithine, ornithine, taurine, γ-tyrosine or the Methionin.
8. conductive resin according to claim 1; It is characterized in that; Said coupling agent is γ-An Bingjisanyiyangjiguiwan, γ-An Bingjisanjiayangjiguiwan, γ-(2; 3-epoxy third oxygen) propyl trimethoxy silicane, γ-methacryloxypropyl trimethoxy silane, N-(β-aminoethyl)-γ-An Bingjisanyiyangjiguiwan, the mixture of one or more in N-β-(aminoethyl)-γ-An Bingjisanjiayangjiguiwan, N-β-(aminoethyl)-γ-aminopropyl methyl dimethoxysilane, γ-aminopropyl methyl dimethoxysilane, γ-aminopropyl methyldiethoxysilane, the vinyltriethoxysilane.
9. the preparation method of a conductive resin is characterized in that, may further comprise the steps:
The nano-silver powder that 1) will conduct electricity in the silver powder joins in the amino acid whose aqueous solution, stirs, and then carries out centrifugal, washing, drying successively, obtains amino-acid modified nano-silver powder, and is subsequent use;
2) epoxy resin and epoxide diluent are at room temperature mixed, obtain the mixture of epoxy resin and epoxide diluent;
3) solidifying agent, curing catalyst and coupling agent are joined step 2) in the epoxy resin that makes and the mixture of epoxide diluent; And at room temperature mix, obtain mixture, then said mixture is put on the shredder; And at room temperature grind, thing is uniformly mixed;
4) the amino-acid modified nano-silver powder that obtains in the step 1) is joined in the uniform mixture that step 3) makes, add micro-silver powder again, and at room temperature stir,, promptly get said conductive resin to mixing;
Wherein, said conduction silver powder, epoxy resin, epoxide diluent, solidifying agent, curing catalyst, the weight percent of amino acid and coupling agent are 50%～70%:10%～25%:3%～10%:8%～20%:0.5%～2%:0.5～2%:0.5%～2%.
10. preparation method according to claim 9 is characterized in that, in step 1), said stirring is 40～100
oUnder the temperature of C, stirred 6～48 hours, temperature is 15～25 under the said drying
oC; In step 2) in, the said blended time is 3～30 minutes; In step 3), the said blended time is 3～30 minutes, and the time of said grinding is 3～30 minutes.
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| CN103725237A (en) * | 2013-12-10 | 2014-04-16 | 江苏瑞德新能源科技有限公司 | Conductive adhesive and preparation method thereof |
| CN103834322A (en) * | 2014-03-04 | 2014-06-04 | 华进半导体封装先导技术研发中心有限公司 | Conductive adhesive and preparation method thereof |
| CN103881611A (en) * | 2014-03-10 | 2014-06-25 | 苏州捷德瑞精密机械有限公司 | Normal temperature conductive adhesive and preparation method thereof |
| CN104987672A (en) * | 2015-07-24 | 2015-10-21 | 济南大学 | Conductive slurry for solar cell encapsulation, preparation method therefor and application thereof |
| US20160118155A1 (en) * | 2013-06-27 | 2016-04-28 | Toray Industries, Inc. | Conductive paste, method of producing conductive pattern, and touch panel |
| WO2016087613A1 (en) * | 2014-12-04 | 2016-06-09 | Nanogap Sub Nm Powder, S.A. | Conductive adhesive composition |
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| CN108034394A (en) * | 2017-12-15 | 2018-05-15 | 东莞市达瑞电子股份有限公司 | A kind of high dispersive type nano silver epoxy conductive adhesive and preparation method thereof |
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| CN108735338A (en) * | 2018-05-18 | 2018-11-02 | 郦璋 | A kind of preparation method of epoxy resin silver powder composite conducting silver paste |
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| CN110066633A (en) * | 2018-01-23 | 2019-07-30 | 中国科学院理化技术研究所 | A kind of preparation method of low silver content conducting resinl |
| CN111432965A (en) * | 2017-12-15 | 2020-07-17 | 同和电子科技有限公司 | Spherical silver powder and method for producing same |
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| CN111518501A (en) * | 2020-05-26 | 2020-08-11 | 中国电子科技集团公司第三十八研究所 | Preparation method of novel conductive silver adhesive with high thermal conductivity and conductive silver adhesive |
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| US20160118155A1 (en) * | 2013-06-27 | 2016-04-28 | Toray Industries, Inc. | Conductive paste, method of producing conductive pattern, and touch panel |
| CN103725237B (en) * | 2013-12-10 | 2015-01-07 | 江苏瑞德新能源科技有限公司 | Conductive adhesive and preparation method thereof |
| CN103725237A (en) * | 2013-12-10 | 2014-04-16 | 江苏瑞德新能源科技有限公司 | Conductive adhesive and preparation method thereof |
| CN103834322A (en) * | 2014-03-04 | 2014-06-04 | 华进半导体封装先导技术研发中心有限公司 | Conductive adhesive and preparation method thereof |
| CN103881611A (en) * | 2014-03-10 | 2014-06-25 | 苏州捷德瑞精密机械有限公司 | Normal temperature conductive adhesive and preparation method thereof |
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| US11697863B2 (en) * | 2017-12-15 | 2023-07-11 | Dowa Electronics Materials Co., Ltd. | Spherical silver powder and method for producing same |
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| CN108276929B (en) * | 2018-01-15 | 2019-11-08 | 安徽工业大学 | A kind of selfreparing epoxy elargol containing graphene |
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| CN108822782A (en) * | 2018-05-02 | 2018-11-16 | 苏州耐思特塑胶有限公司 | A kind of conductive adhesive of good mechanical performance |
| CN108735338A (en) * | 2018-05-18 | 2018-11-02 | 郦璋 | A kind of preparation method of epoxy resin silver powder composite conducting silver paste |
| CN109401271A (en) * | 2018-10-12 | 2019-03-01 | 江门宇度科技有限责任公司 | A kind of antistatic, conductivity improver and preparation method thereof |
| CN111440591A (en) * | 2019-01-16 | 2020-07-24 | 北京氦舶科技有限责任公司 | Organosilicon conductive adhesive and preparation method thereof |
| CN111518501A (en) * | 2020-05-26 | 2020-08-11 | 中国电子科技集团公司第三十八研究所 | Preparation method of novel conductive silver adhesive with high thermal conductivity and conductive silver adhesive |
| CN111518501B (en) * | 2020-05-26 | 2022-04-15 | 中国电子科技集团公司第三十八研究所 | Preparation method of conductive silver adhesive with high thermal conductivity and conductive silver adhesive |
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