CN102286259A - Epoxy functionalized organosilicon conductive adhesive for light emitting diode (LED) - Google Patents
Epoxy functionalized organosilicon conductive adhesive for light emitting diode (LED) Download PDFInfo
- Publication number
- CN102286259A CN102286259A CN201110172354A CN201110172354A CN102286259A CN 102286259 A CN102286259 A CN 102286259A CN 201110172354 A CN201110172354 A CN 201110172354A CN 201110172354 A CN201110172354 A CN 201110172354A CN 102286259 A CN102286259 A CN 102286259A
- Authority
- CN
- China
- Prior art keywords
- epoxy
- silicone
- methylimidazole
- conductive adhesive
- cyanoethyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 30
- 239000000853 adhesive Substances 0.000 title claims abstract description 29
- 239000004593 Epoxy Substances 0.000 title claims abstract description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000003822 epoxy resin Substances 0.000 claims abstract description 8
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 8
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 6
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 6
- 239000011231 conductive filler Substances 0.000 claims abstract description 6
- 239000012744 reinforcing agent Substances 0.000 claims abstract description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 29
- 125000003700 epoxy group Chemical group 0.000 claims description 18
- 125000002723 alicyclic group Chemical group 0.000 claims description 9
- 229920002545 silicone oil Polymers 0.000 claims description 9
- -1 1-cyanoethyl-2-methylimidazole Triformate Chemical compound 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 6
- 229920003216 poly(methylphenylsiloxane) Polymers 0.000 claims description 6
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical group CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 5
- FBHPRUXJQNWTEW-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=CN1CC1=CC=CC=C1 FBHPRUXJQNWTEW-UHFFFAOYSA-N 0.000 claims description 3
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 claims description 3
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 claims description 3
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 claims description 3
- UIDDPPKZYZTEGS-UHFFFAOYSA-N 3-(2-ethyl-4-methylimidazol-1-yl)propanenitrile Chemical compound CCC1=NC(C)=CN1CCC#N UIDDPPKZYZTEGS-UHFFFAOYSA-N 0.000 claims description 3
- SESYNEDUKZDRJL-UHFFFAOYSA-N 3-(2-methylimidazol-1-yl)propanenitrile Chemical compound CC1=NC=CN1CCC#N SESYNEDUKZDRJL-UHFFFAOYSA-N 0.000 claims description 3
- BVYPJEBKDLFIDL-UHFFFAOYSA-N 3-(2-phenylimidazol-1-yl)propanenitrile Chemical compound N#CCCN1C=CN=C1C1=CC=CC=C1 BVYPJEBKDLFIDL-UHFFFAOYSA-N 0.000 claims description 3
- SZUPZARBRLCVCB-UHFFFAOYSA-N 3-(2-undecylimidazol-1-yl)propanenitrile Chemical compound CCCCCCCCCCCC1=NC=CN1CCC#N SZUPZARBRLCVCB-UHFFFAOYSA-N 0.000 claims description 3
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 claims description 3
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- VWSLLSXLURJCDF-UHFFFAOYSA-N 2-methyl-4,5-dihydro-1h-imidazole Chemical compound CC1=NCCN1 VWSLLSXLURJCDF-UHFFFAOYSA-N 0.000 claims description 2
- LTOKKZDSYQQAHL-UHFFFAOYSA-N trimethoxy-[4-(oxiran-2-yl)butyl]silane Chemical group CO[Si](OC)(OC)CCCCC1CO1 LTOKKZDSYQQAHL-UHFFFAOYSA-N 0.000 claims description 2
- VEJAUAWVOYNNHZ-UHFFFAOYSA-L 1-benzyl-3-dodecyl-2-methylimidazol-1-ium 1,3-dibenzyl-2-methylimidazol-1-ium dichloride Chemical compound CCCCCCCCCCCCN1C=C[N+](=C1C)CC2=CC=CC=C2.CC1=[N+](C=CN1CC2=CC=CC=C2)CC3=CC=CC=C3.[Cl-].[Cl-] VEJAUAWVOYNNHZ-UHFFFAOYSA-L 0.000 claims 1
- 238000005979 thermal decomposition reaction Methods 0.000 abstract description 2
- 230000006750 UV protection Effects 0.000 description 5
- 230000009477 glass transition Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- BPUIXAJWGWYVJH-UHFFFAOYSA-M 1,3-dibenzyl-2-methylimidazol-1-ium;chloride Chemical compound [Cl-].C1=C[N+](CC=2C=CC=CC=2)=C(C)N1CC1=CC=CC=C1 BPUIXAJWGWYVJH-UHFFFAOYSA-M 0.000 description 2
- PBODPHKDNYVCEJ-UHFFFAOYSA-M 1-benzyl-3-dodecyl-2-methylimidazol-1-ium;chloride Chemical compound [Cl-].CCCCCCCCCCCCN1C=C[N+](CC=2C=CC=CC=2)=C1C PBODPHKDNYVCEJ-UHFFFAOYSA-M 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-O 2-methyl-1h-imidazol-3-ium Chemical compound CC=1NC=C[NH+]=1 LXBGSDVWAMZHDD-UHFFFAOYSA-O 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
Abstract
Description
技术领域 technical field
本发明涉及LED有机硅导电胶粘剂，特别涉及一种环氧功能化有机硅导电胶粘剂。 The invention relates to an LED organic silicon conductive adhesive, in particular to an epoxy functionalized organic silicon conductive adhesive.
背景技术 Background technique
随着大功率LED的发展，客户对封装过程中使用的材料提出了越来越高的要求，新的材料不仅要满足客户生产的工艺要求，同时对材料的耐UV性能和耐热性提出了新的挑战。 With the development of high-power LEDs, customers have put forward higher and higher requirements for the materials used in the packaging process. New materials must not only meet the customer's production process requirements, but also put forward new requirements for the UV resistance and heat resistance of the materials. new challenge.
用于大功率LED芯片固定的导电胶粘剂直接影响最终产品的光学性能和可靠性，大功率LED对导电银胶的要求是高导电、高导热性能和高剪切强度。传统的环氧导电粘结剂粘接性能优异，但是环氧树脂基体往往不耐UV，在UV光和热的综合作用下，其易发生黄变从而影响LED发光寿命。因此不适合用于能发射紫外波长的LED和大功率LED，以及在户外使用。 The conductive adhesive used to fix high-power LED chips directly affects the optical performance and reliability of the final product. The requirements of high-power LEDs for conductive silver adhesives are high electrical conductivity, high thermal conductivity and high shear strength. The traditional epoxy conductive adhesive has excellent bonding performance, but the epoxy resin matrix is often not resistant to UV. Under the combined action of UV light and heat, it is prone to yellowing and affects the LED luminous life. Therefore, it is not suitable for LEDs and high-power LEDs that can emit ultraviolet wavelengths, and for outdoor use.
硅氧烷类胶粘剂所具有的硅氧的主链结构，结构式如下所示： The silicone main chain structure of silicone adhesives has the following structural formula:
具有较强的耐紫外性，因此适用于任何紫外关照场合。日本信越化学工业（信越シリコーン）的SMP-2800L，日本藤仓化成（藤倉化成）的单组分含溶剂有机硅导电胶（DOTITE的XA-819A和FX-730），便是此类产品。因为聚硅氧的主链的极性较小，所以上述所述的导电胶的粘接性较差，芯片推力偏小，室温小片推力<5 Kgf/die(2×2 mm)。 It has strong UV resistance, so it is suitable for any UV exposure occasions. Japan's Shin-Etsu Chemical Industry (Shin-Etsu シリコーン) SMP-2800L, and Japan's Fujikura Chemical (Fujikura Chemical) one-component solvent-containing silicone conductive adhesive (DOTITE's XA-819A and FX-730) are such products. Because the polarity of the main chain of polysiloxane is small, the above-mentioned conductive adhesive has poor adhesion, and the thrust of the chip is relatively small, and the thrust of the small chip at room temperature is <5 Kgf/die (2×2 mm).
综上所述，聚硅氧烷和环氧树脂各有优点，如何将两者的优势结合成为本发明需要解决的技术问题。两者的有机结合不仅可以保留聚硅氧烷树脂的耐高温性能和耐UV性能，而且可使产品具有良好的粘接性能。 To sum up, polysiloxane and epoxy resin have their own advantages, how to combine the advantages of the two becomes the technical problem to be solved in the present invention. The organic combination of the two can not only retain the high temperature resistance and UV resistance of polysiloxane resin, but also make the product have good adhesive performance.
发明内容 Contents of the invention
本发明的目的在于提供一种LED用环氧功能化有机硅导电胶粘剂，将聚硅氧烷和环氧树脂两者的优势结合，不仅可以保留聚硅氧烷树脂的耐高温性能和耐UV性能，而且可使产品具有良好的粘接性能。 The purpose of the present invention is to provide an epoxy-functional silicone conductive adhesive for LEDs, which combines the advantages of polysiloxane and epoxy resin, and can not only retain the high temperature resistance and UV resistance of polysiloxane resin , and can make the product have good adhesive properties.
本发明的LED用环氧功能化有机硅导电胶粘剂，包含具有以下重量份的组分： The epoxy functional silicone conductive adhesive for LED of the present invention comprises the following components by weight:
有机硅环氧树脂 10～20； Silicone epoxy resin 10～20;
有机硅固化剂 7～20； Silicone curing agent 7~20;
固化促进剂 0.1～0.5； Curing accelerator 0.1～0.5;
银粉导电填料 70～90； Silver powder conductive filler 70～90;
界面补强剂硅烷偶联剂 0.1～0.5。 Interface reinforcing agent silane coupling agent 0.1～0.5.
the
根据本发明，所述的有机硅环氧树脂为： According to the present invention, described silicone epoxy resin is:
a．端基为脂环环氧基团的硅油SiMAET a. Silicone oil SiMAET with alicyclic epoxy group terminated
， ,
其中，n=1-6； Among them, n=1-6;
b．端基为脂环环氧基团的甲基苯基硅油SiMPAET b. Methylphenyl silicone oil SiMPAET with alicyclic epoxy group terminal
其中，n=1-6； Among them, n=1-6;
c．侧基为脂环环氧基团的硅油SiMAE c. Silicone oil SiMAE with side groups of alicyclic epoxy groups
其中， n/m=1-6； Among them, n/m=1-6;
d．端基为环氧基团的甲基硅油SiMET d. Methyl silicone oil SiMET with epoxy group terminal
其中， n=1-6； Among them, n=1-6;
e．端基为环氧基团的甲基苯基硅油SiMPET e. Methylphenyl silicone oil SiMPET with epoxy group terminal
其中， n=1-6；或 where, n=1-6; or
f．侧基为环氧基团的硅油SiME f. Silicone oil SiME with epoxy groups as side groups
其中，n/m=1-6。 Wherein, n/m=1-6.
the
根据本发明，所述的有机硅固化剂选自以下组中的一种或两种以上： According to the present invention, the silicone curing agent is selected from one or more than two of the following groups:
SiMDH：
其中，n=1-6； Among them, n=1-6;
SiMPDH： SiMPDH:
其中，n=1-6。 Among them, n=1-6.
the
根据本发明，所述固化促进剂为2MZ：2-甲基咪唑、2E4MZ：2-乙基-4-甲基咪唑、2PZ：2-苯基咪唑、C11Z：2-十一烷基咪唑、C17Z：2-十七烷基咪唑、1B2MZ：1-苄基-2-甲基咪唑、SFZ：1-十二烷基-2-甲基-3-苄基咪唑氯化物、FFZ：1,3-二苄基-2-甲基咪唑氯化物、2MZL：2-甲基咪唑啉、2P4MZ：2-苯基-4-甲基咪唑、2MZ-CN：1-氰乙基-2-甲基咪唑、2PZ-CN：1-氰乙基-2-苯基咪唑、C11Z-CN：1-氰乙基-2-十一烷基咪唑、2E4MZ-CN：1-氰乙基-2-乙基-4-甲基咪唑、2MZ-CNS：1-氰乙基-2-甲基咪唑偏苯三甲酸盐、2PZ-CNS：1-氰乙基-2-苯基咪唑偏苯三甲酸盐、2E4MZ-CNS ：1-氰乙基-2-乙基-4-甲基咪唑偏苯三甲酸盐、C11Z-CNS：1-氰乙基-2-十一烷基咪唑偏苯三甲酸盐、2MZ-A：2,4-二氨基-6[2’-甲基咪唑-（1’）]乙基-S-三嗪中的一种或者多种混合物。 According to the present invention, the curing accelerator is 2MZ: 2-methylimidazole, 2E4MZ: 2-ethyl-4-methylimidazole, 2PZ: 2-phenylimidazole, C11Z: 2-undecylimidazole, C17Z : 2-heptadecylimidazole, 1B2MZ: 1-benzyl-2-methylimidazole, SFZ: 1-dodecyl-2-methyl-3-benzylimidazolium chloride, FFZ: 1,3- Dibenzyl-2-methylimidazolium chloride, 2MZL: 2-methylimidazolium, 2P4MZ: 2-phenyl-4-methylimidazole, 2MZ-CN: 1-cyanoethyl-2-methylimidazole, 2PZ-CN: 1-cyanoethyl-2-phenylimidazole, C11Z-CN: 1-cyanoethyl-2-undecylimidazole, 2E4MZ-CN: 1-cyanoethyl-2-ethyl-4 -Methylimidazole, 2MZ-CNS: 1-cyanoethyl-2-methylimidazole trimellitate, 2PZ-CNS: 1-cyanoethyl-2-phenylimidazole trimellitate, 2E4MZ-CNS : 1-cyanoethyl-2-ethyl-4-methylimidazole trimellitate, C11Z-CNS: 1-cyanoethyl-2-undecylimidazole trimellitate, 2MZ-A: One or more mixtures of 2,4-diamino-6[2'-methylimidazole-(1')]ethyl-S-triazine.
根据本发明，所述导电填料为颗粒D90（样品的累计粒度分布数达到90%时所对应的粒径）小于50微米的片状银粉、球状银粉、无定型银粉中的一种或者它们的混合物。 According to the present invention, the conductive filler is one of flake silver powder, spherical silver powder, and amorphous silver powder whose particle D90 (the corresponding particle size when the cumulative particle size distribution number of the sample reaches 90%) is less than 50 microns or a mixture thereof .
根据本发明，所述界面补强剂硅烷偶联剂为3-缩水甘油基丙基三甲氧基硅烷(dowcoring Z6040)。 According to the present invention, the interface reinforcing agent silane coupling agent is 3-glycidyl propyltrimethoxysilane (dowcoring Z6040).
具体实施方式 Detailed ways
以下结合具体实施例，对本发明做进一步说明。应理解，以下实施例仅用于说明本发明而非用于限制本发明的范围。 The present invention will be further described below in conjunction with specific embodiments. It should be understood that the following examples are only used to illustrate the present invention but not to limit the scope of the present invention.
the
如本文所用，SiMAET是指端基为脂环环氧基团的硅油，结构为： As used herein, SiMAET refers to a silicone oil with an alicyclic epoxy group at the end, and the structure is:
其中，n=1-6； Among them, n=1-6;
SiMPAET是指端基为脂环环氧基团的甲基苯基硅油，结构为： SiMPAET refers to the methyl phenyl silicone oil whose end group is alicyclic epoxy group, the structure is:
其中，n=1-6； Among them, n=1-6;
SiMAE是指侧基为脂环环氧基团的硅油，结构为： SiMAE refers to the silicone oil whose side group is alicyclic epoxy group, the structure is:
，其中， n/m=1-6； , where n/m=1-6;
SiMET是指端基为环氧基团的甲基硅油，结构为： SiMET refers to the methyl silicone oil whose end group is epoxy group, the structure is:
其中， n=1-6； Among them, n=1-6;
SiMPET是指端基为环氧基团的甲基苯基硅油，结构为： SiMPET refers to the methyl phenyl silicone oil whose end group is epoxy group, the structure is:
其中， n=1-6； Among them, n=1-6;
SiME是指侧基为环氧基团的硅油，结构为： SiME refers to the silicone oil whose side group is epoxy group, the structure is:
其中，n/m=1-6。 Wherein, n/m=1-6.
如本文所用，有机硅固化剂包括SiMDH，结构式为： As used herein, silicone curing agents include SiMDH, which has the structural formula:
SiMPDH，结构式为： SiMPDH, the structural formula is:
如本文所用，固定促进剂及其对应的缩写如下： As used herein, immobilization promoters and their corresponding abbreviations are as follows:
2MZ：2-甲基咪唑、2E4MZ：2-乙基-4-甲基咪唑、2PZ：2-苯基咪唑、C11Z：2-十一烷基咪唑、C17Z：2-十七烷基咪唑、1B2MZ：1-苄基-2-甲基咪唑、SFZ：1-十二烷基-2-甲基-3-苄基咪唑氯化物、FFZ：1,3-二苄基-2-甲基咪唑氯化物、2MZL：2-甲基咪唑啉、2P4MZ：2-苯基-4-甲基咪唑、2MZ-CN：1-氰乙基-2-甲基咪唑、2PZ-CN：1-氰乙基-2-苯基咪唑、C11Z-CN：1-氰乙基-2-十一烷基咪唑、2E4MZ-CN：1-氰乙基-2-乙基-4-甲基咪唑、2MZ-CNS：1-氰乙基-2-甲基咪唑偏苯三甲酸盐、2PZ-CNS：1-氰乙基-2-苯基咪唑偏苯三甲酸盐、2E4MZ-CNS ：1-氰乙基-2-乙基-4-甲基咪唑偏苯三甲酸盐、C11Z-CNS：1-氰乙基-2-十一烷基咪唑偏苯三甲酸盐、2MZ-A：2,4-二氨基-6[2’-甲基咪唑-（1’）]乙基-S-三嗪中的一种或者多种混合物。 2MZ: 2-methylimidazole, 2E4MZ: 2-ethyl-4-methylimidazole, 2PZ: 2-phenylimidazole, C11Z: 2-undecylimidazole, C17Z: 2-heptadecylimidazole, 1B2MZ : 1-benzyl-2-methylimidazole, SFZ: 1-dodecyl-2-methyl-3-benzylimidazolium chloride, FFZ: 1,3-dibenzyl-2-methylimidazolium chloride Compound, 2MZL: 2-methylimidazoline, 2P4MZ: 2-phenyl-4-methylimidazole, 2MZ-CN: 1-cyanoethyl-2-methylimidazole, 2PZ-CN: 1-cyanoethyl- 2-Phenylimidazole, C11Z-CN: 1-cyanoethyl-2-undecylimidazole, 2E4MZ-CN: 1-cyanoethyl-2-ethyl-4-methylimidazole, 2MZ-CNS: 1 -Cyanoethyl-2-methylimidazole trimellitate, 2PZ-CNS: 1-cyanoethyl-2-phenylimidazole trimellitate, 2E4MZ-CNS: 1-cyanoethyl-2-ethyl Base-4-methylimidazole trimellitate, C11Z-CNS: 1-cyanoethyl-2-undecylimidazole trimellitate, 2MZ-A: 2,4-diamino-6[2 One or more mixtures of '-methylimidazole-(1')]ethyl-S-triazine.
在以下实施例中，所用银粉导电填料颗粒的D90小于50微米，为片状银粉、球状银粉、无定型银粉中的一种或者它们的混合物。所用界面补强剂硅烷偶联剂为dowcoring Z6040。 In the following embodiments, the D90 of the silver powder conductive filler particles used is less than 50 microns, and is one of flake silver powder, spherical silver powder, amorphous silver powder or a mixture thereof. The interface reinforcing agent silane coupling agent used is dowcoring Z6040.
实施例1Example 1
本实施例的LED用环氧功能化有机硅导电胶粘剂，包含具有以下重量份的组分： The epoxy-functionalized silicone conductive adhesive for LEDs of this embodiment comprises components with the following parts by weight:
经测试，本实施例的LED用环氧功能化有机硅导电胶，折射率为1.43，玻璃化转变温度为98℃，2 mm × 2 mm芯片推力为7.0 Kgf (25℃)，导电率为3.0 × 10-4W.cm。 After testing, the epoxy functional silicone conductive adhesive for LEDs in this embodiment has a refractive index of 1.43, a glass transition temperature of 98°C, a 2 mm × 2 mm chip thrust of 7.0 Kgf (25°C), and a conductivity of 3.0 × 10 -4 W.cm.
实施例 2~6Embodiment 2~6
实施例2~6的LED用环氧功能化有机硅导电胶粘剂的组分（重量份数）及性能如表1所示，折射率为1.45~1.50，玻璃化转变温度为104~132℃，2 mm × 2 mm芯片推力为7.6~11.3 Kgf (25℃)，导电率为1.0× 10-4~3.0 × 10-4W.cm。 The components (parts by weight) and properties of the epoxy-functionalized silicone conductive adhesives for LEDs in Examples 2-6 are shown in Table 1. The refractive index is 1.45-1.50, and the glass transition temperature is 104-132°C. The thrust of mm × 2 mm chip is 7.6~11.3 Kgf (25℃), and the conductivity is 1.0×10 -4 ~3.0×10 -4 W.cm.
实施例7~12Embodiment 7~12
实施例7~12的LED用环氧功能化有机硅导电胶粘剂的组分（重量份数）及性能如表2所示，折射率为1.43，玻璃化转变温度为29~98℃，2 mm × 2 mm芯片推力为5.4~7 Kgf (25℃)，导电率为1.0× 10-4~3.0 × 10-4W.cm。 The components (parts by weight) and properties of the epoxy-functionalized silicone conductive adhesives for LEDs in Examples 7-12 are shown in Table 2. The refractive index is 1.43, the glass transition temperature is 29-98°C, 2 mm × The thrust of a 2 mm chip is 5.4~7 Kgf (25℃), and the conductivity is 1.0×10 -4 ~3.0×10 -4 W.cm.
表1 实施例2~6的组分及性能 Table 1 Components and properties of Examples 2 to 6
表2 实施例7~12的组分及性能 Components and performance of table 2 embodiment 7～12
表3 实施例13~18的组分及性能 Table 3 Components and properties of Examples 13 to 18
表4 实施例19~24的组分及性能 Table 4 Components and properties of Examples 19 to 24
实施例13~18Example 13~18
实施例13~18的LED用环氧功能化有机硅导电胶粘剂的组分（重量份数）及性能如表3所示，折射率为1.43，玻璃化转变温度为34~87℃，2 mm × 2 mm芯片推力为5.2~7.3 Kgf (25℃)，导电率为1.0× 10-4~3.0 × 10-4W.cm。 The components (parts by weight) and properties of the epoxy-functionalized silicone conductive adhesives for LEDs in Examples 13-18 are shown in Table 3. The refractive index is 1.43, the glass transition temperature is 34-87°C, 2 mm × The thrust of a 2 mm chip is 5.2~7.3 Kgf (25℃), and the conductivity is 1.0×10 -4 ~3.0×10 -4 W.cm.
实施例19~24Example 19~24
实施例19~24的LED用环氧功能化有机硅导电胶粘剂的组分（重量份数）及性能如表4所示，折射率为1.47~1.49，玻璃化转变温度为46~81℃，2 mm × 2 mm芯片推力为5.1~7.9 Kgf (25℃)，导电率为1.0× 10-4~3.0 × 10-4W.cm。 The components (parts by weight) and properties of the epoxy-functionalized silicone conductive adhesives for LEDs in Examples 19-24 are shown in Table 4, the refractive index is 1.47-1.49, the glass transition temperature is 46-81°C, 2 The thrust of mm × 2 mm chip is 5.1~7.9 Kgf (25℃), and the conductivity is 1.0×10 -4 ~3.0×10 -4 W.cm.
同时经测试，本发明的导电胶在低温贮存时间超过6个月，室温下粘度增加25%时间超过48h。 At the same time, it is tested that the conductive adhesive of the present invention has been stored at low temperature for more than 6 months, and the viscosity at room temperature has increased by 25% for more than 48 hours.
固化后热分解温度（2%质量失重）>300℃，室温小片推力>5 Kgf/die(2×2 mm)，体积电阻率≤3.0 × 10-4W·cm，具有优异的导电性、耐热性和耐UV性。 After curing, the thermal decomposition temperature (2% weight loss) >300°C, small chip thrust at room temperature >5 Kgf/die (2×2 mm), volume resistivity ≤3.0 × 10-4W cm, with excellent electrical conductivity and heat resistance and UV resistance.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110172354.0A CN102286259B (en) | 2011-06-24 | 2011-06-24 | Epoxy functionalized organosilicon conductive adhesive for light emitting diode (LED) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110172354.0A CN102286259B (en) | 2011-06-24 | 2011-06-24 | Epoxy functionalized organosilicon conductive adhesive for light emitting diode (LED) |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102286259A true CN102286259A (en) | 2011-12-21 |
| CN102286259B CN102286259B (en) | 2014-04-02 |
Family
ID=45333024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110172354.0A Active CN102286259B (en) | 2011-06-24 | 2011-06-24 | Epoxy functionalized organosilicon conductive adhesive for light emitting diode (LED) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102286259B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015000983A (en) * | 2013-06-13 | 2015-01-05 | 達興材料股▲ふん▼有限公司Ｄａｘｉｎ Ｍａｔｅｒｉａｌｓ Ｃｏｒｐｏｒａｔｉｏｎ | Siloxane dianhydride, polymer, liquid crystal alignment agent, liquid crystal alignment film, and liquid crystal display element |
| CN104736641A (en) * | 2012-10-29 | 2015-06-24 | 横滨橡胶株式会社 | Conductive composition and solar cell |
| CN111454672A (en) * | 2020-05-25 | 2020-07-28 | 湖北航泰科技有限公司 | Adhesive film for bonding rubber material and preparation method thereof |
| KR102164171B1 (en) * | 2019-04-26 | 2020-10-13 | (주)엘프스 | self-assembled conductive bonding paste for mini LED chip bonding, mini LED chip-circuit board bondig module comprising the same and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101302413A (en) * | 2008-07-01 | 2008-11-12 | 上海上大瑞沪微系统集成技术有限公司 | High temperature resistant epoxide resin conductive adhesive |
| CN101613585A (en) * | 2009-07-29 | 2009-12-30 | 肖方一 | A kind of epoxy copper adhesive and its production and application |
| CN101851478A (en) * | 2010-04-29 | 2010-10-06 | 黄文迎 | Rapid-curing conductive adhesive composition and method for preparing same |
-
2011
- 2011-06-24 CN CN201110172354.0A patent/CN102286259B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101302413A (en) * | 2008-07-01 | 2008-11-12 | 上海上大瑞沪微系统集成技术有限公司 | High temperature resistant epoxide resin conductive adhesive |
| CN101613585A (en) * | 2009-07-29 | 2009-12-30 | 肖方一 | A kind of epoxy copper adhesive and its production and application |
| CN101851478A (en) * | 2010-04-29 | 2010-10-06 | 黄文迎 | Rapid-curing conductive adhesive composition and method for preparing same |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104736641A (en) * | 2012-10-29 | 2015-06-24 | 横滨橡胶株式会社 | Conductive composition and solar cell |
| JP2015000983A (en) * | 2013-06-13 | 2015-01-05 | 達興材料股▲ふん▼有限公司Ｄａｘｉｎ Ｍａｔｅｒｉａｌｓ Ｃｏｒｐｏｒａｔｉｏｎ | Siloxane dianhydride, polymer, liquid crystal alignment agent, liquid crystal alignment film, and liquid crystal display element |
| KR102164171B1 (en) * | 2019-04-26 | 2020-10-13 | (주)엘프스 | self-assembled conductive bonding paste for mini LED chip bonding, mini LED chip-circuit board bondig module comprising the same and manufacturing method thereof |
| CN111454672A (en) * | 2020-05-25 | 2020-07-28 | 湖北航泰科技有限公司 | Adhesive film for bonding rubber material and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102286259B (en) | 2014-04-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102174306B (en) | Conductive adhesive for LED (light emitting diode) packaging and preparation method of conductive adhesive | |
| JP6675155B2 (en) | Die attach paste for semiconductor and semiconductor device | |
| CN104293229B (en) | Conductive adhesive and preparation method thereof | |
| JP6190653B2 (en) | Conductive resin composition and semiconductor device | |
| CN102408856A (en) | Conductive adhesive for LED packaging and preparation method thereof | |
| WO2017080040A1 (en) | Damp-heat-resistant and highly reliable conductive silver epoxy adhesive, method for preparing same, and application thereof | |
| CN102013281A (en) | Conductive silver adhesive for high-power LED | |
| CN102286259B (en) | Epoxy functionalized organosilicon conductive adhesive for light emitting diode (LED) | |
| US11133445B2 (en) | Resin composition for circuit board, and metal-base circuit board in which same is used | |
| CN105315675A (en) | Ultraviolet light-curing composition | |
| KR20150031235A (en) | Curable resin composition, resin composition, resin sheet formed by using said curable resin composition and resin composition, and hardener for said curable resin composition and resin composition | |
| CN102898972A (en) | Preparation method of tackifier for addition type silicone pouring sealant | |
| JP2012229317A (en) | Transparent thermoconductive composition | |
| CN108913047B (en) | Conductive solid crystal bonding glue solution, high-heat-conductivity conductive adhesive film and preparation method thereof | |
| WO2021142752A1 (en) | Organic silicon resin conductive adhesive, and preparation method therefor and application thereof | |
| CN102391811B (en) | Bismaleimide-epoxy conductive adhesive with high adhesive strength for light emitting diode (LED) | |
| CN102516501A (en) | Photo-curing material for manufacturing light-emitting diode (LED) lens | |
| CN103074021B (en) | Organosilicon bimaleimide-epoxy conductive adhesive for LED | |
| CN102286261B (en) | Epoxy functional organic silicon conductive adhesive for amino curing system for light emitting diode (LED) | |
| CN103074030B (en) | Organosilicon bismaleimide conductive adhesive for LED | |
| TWI580750B (en) | A heat-hardened conductive silicon oxide composition, a conductive adhesive composed of the composition, a conductive viscous material composed of the composition, an optical semiconductor device having a hardened material of the adhered material | |
| CN104559884B (en) | A kind of polymeric adhesion material | |
| JP2012229316A (en) | Transparent thermoconductive composition | |
| WO2021142750A1 (en) | Modified epoxy acrylic resin conductive adhesive, preparation method therefor and use thereof | |
| CN101503608B (en) | A kind of novolac epoxy resin system conductive adhesive and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Epoxy functional silicone conductive adhesive for LED Effective date of registration: 20221215 Granted publication date: 20140402 Pledgee: Zhongguancun Technology Leasing Co.,Ltd. Pledgor: BONOTEC ELECTRONIC MATERIALS Co.,Ltd. Registration number: Y2022980027722 |
|
| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20111221 Assignee: Zhongguancun Technology Leasing Co.,Ltd. Assignor: BONOTEC ELECTRONIC MATERIALS Co.,Ltd. Contract record no.: X2022980027719 Denomination of invention: Epoxy functional silicone conductive adhesive for LED Granted publication date: 20140402 License type: Exclusive License Record date: 20221222 |
|
| EE01 | Entry into force of recordation of patent licensing contract | ||
| EC01 | Cancellation of recordation of patent licensing contract |
Assignee: Zhongguancun Technology Leasing Co.,Ltd. Assignor: BONOTEC ELECTRONIC MATERIALS Co.,Ltd. Contract record no.: X2022980027719 Date of cancellation: 20250102 |
|
| EC01 | Cancellation of recordation of patent licensing contract | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20140402 Pledgee: Zhongguancun Technology Leasing Co.,Ltd. Pledgor: BONOTEC ELECTRONIC MATERIALS Co.,Ltd. Registration number: Y2022980027722 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |