CN103613992A - Conductive ink for printing - Google Patents

Conductive ink for printing Download PDF

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Publication number
CN103613992A
CN103613992A CN201310586816.2A CN201310586816A CN103613992A CN 103613992 A CN103613992 A CN 103613992A CN 201310586816 A CN201310586816 A CN 201310586816A CN 103613992 A CN103613992 A CN 103613992A
Authority
CN
China
Prior art keywords
parts
conductive ink
printing
conductive inks
silver powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310586816.2A
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Chinese (zh)
Inventor
何勇
钱建平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZHANGJIAGANG RENFA CHEMICAL INDUSTRY MATERIAL Co Ltd
Original Assignee
ZHANGJIAGANG RENFA CHEMICAL INDUSTRY MATERIAL Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZHANGJIAGANG RENFA CHEMICAL INDUSTRY MATERIAL Co Ltd filed Critical ZHANGJIAGANG RENFA CHEMICAL INDUSTRY MATERIAL Co Ltd
Priority to CN201310586816.2A priority Critical patent/CN103613992A/en
Publication of CN103613992A publication Critical patent/CN103613992A/en
Pending legal-status Critical Current

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  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Conductive Materials (AREA)

Abstract

The invention discloses conductive ink for printing. The conductive ink is prepared from the following substances in parts by weight: 20-30 parts of bisphenol A glycidyl ether epoxy resin, 4-5 parts of epoxy curing agent, 1-3 parts of nanometer silver powder, 4-6 parts of nanometer copper powder, 5-10 parts of malonic acid, 40-50 parts of tetrahydrofuran and 3-7 parts of polyethylene glycol. The conductive ink for printing disclosed by the invention is friendly to the environment, and good in conductivity, and especially has good binding force on difficult-to-print glass, metal and plastic films. According to the conductive ink, the epoxy curing agent is optimized. The conductive ink has the advantages that the conductive ink can be cured with epoxy resin at normal temperature, and is fire-retardant and non-toxic, and the cured product is high in strength and stability. Compared with the prior art, the conductive ink has significant progress. The electrical conductivity of the ink is improved by adopting the nanometer copper powder and the nanometer silver powder.

Description

A kind of printing electrically conductive ink
Technical field
The invention belongs to technical field of ink, be specifically related to a kind of printing electrically conductive ink.
Background technology
Traditional etch printing method need adopt ammonia alkali class etching solution corrosion sheet material, and etching solution contaminative is larger, and the water expending during rinsing sheet material is more.The whole world is more and more higher for the cry of " low-carbon (LC) " now, promotes the use of printing conductive inks and replaces engraving method, and it is imperative that " green " prints conducting wire.Avoid the use of volatile organic solvent, development environment close friend's printing will inevitably attract increasing sight with electrically conductive ink.And possess the electrically conductive ink of different specific conductivity fillers, and in conduction high polymer, add conductive filler material, prior development direction that the research that promotes ink conductivity becomes printing-ink.
Summary of the invention
Technical problem to be solved by this invention is: provide that a kind of strong adhesion, resistance are little, the printing conductive inks of good stability.
For solving the problems of the technologies described above, the technical solution used in the present invention is: a kind of printing conductive inks, is comprised of the material of following mass fraction: 20~30 parts of dihydroxyphenyl propane glycidyl ether based epoxy resins, 4~5 parts of epoxy hardeners, 1~3 part of nano-silver powder, 4~6 parts of copper nanoparticles, 5~10 parts of propanedioic acid, 40~50 parts of tetrahydrofuran (THF)s, 3~7 parts of polyoxyethylene glycol.
Described copper nanoparticle particle diameter is 3~8nm.
Described nano-silver powder particle diameter is 2~5nm.
Described epoxy hardener is the T31 type epoxy hardener that Jinan Yi Sheng company limited produces.
The number-average molecular weight of described polyoxyethylene glycol is 300~500.
Beneficial effect of the present invention: printing conductive inks environmental friendliness of the present invention, good conductivity, especially has good bonding force to glass, metal, plastics film difficult and brush.The present invention is preferred epoxy hardener, its advantage is can be at normal temperatures and epoxy resin cure, difficult combustion, nontoxic, and its cured article intensity and stability are high, have significant progress with existing public technology.The present invention has adopted copper nanoparticle and nano-silver powder, has improved the conductivity of ink.
Embodiment
Embodiment 1
Dihydroxyphenyl propane glycidyl ether based epoxy resin 20g is dissolved in 40g tetrahydrofuran (THF), and nano-silver powder 1g, copper nanoparticle 5g, propanedioic acid 6g, polyoxyethylene glycol 4g, epoxy hardener 4g are heating and curing in 30~40 ℃ of water-baths.Gained ink resistivity is 0.033~0.043 Ω cm.
Embodiment 2
Dihydroxyphenyl propane glycidyl ether based epoxy resin 30g is dissolved in 45g tetrahydrofuran (THF), and nano-silver powder 2g, copper nanoparticle 5g, propanedioic acid 8g, polyoxyethylene glycol 6g, epoxy hardener 4g are heating and curing in 30~40 ℃ of water-baths.Gained ink resistivity is 0.036~0.048 Ω cm.

Claims (5)

1. a printing conductive inks, is comprised of the material of following mass fraction: 20~30 parts of dihydroxyphenyl propane glycidyl ether based epoxy resins, 4~5 parts of epoxy hardeners, 1~3 part of nano-silver powder, 4~6 parts of copper nanoparticles, 5~10 parts of propanedioic acid, 40~50 parts of tetrahydrofuran (THF)s, 3~7 parts of polyoxyethylene glycol.
2. a kind of printing conductive inks according to claim 1, is characterized in that: described copper nanoparticle particle diameter is 3~8nm.
3. a kind of printing conductive inks according to claim 1, is characterized in that: described nano-silver powder particle diameter is 2~5nm.
4. a kind of printing conductive inks according to claim 1, is characterized in that: described epoxy hardener is T31 type epoxy hardener.
5. according to a kind of printing conductive inks described in claim 1 to 4 any one, it is characterized in that: the number-average molecular weight of described polyoxyethylene glycol is 300~500.
CN201310586816.2A 2013-11-20 2013-11-20 Conductive ink for printing Pending CN103613992A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310586816.2A CN103613992A (en) 2013-11-20 2013-11-20 Conductive ink for printing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310586816.2A CN103613992A (en) 2013-11-20 2013-11-20 Conductive ink for printing

Publications (1)

Publication Number Publication Date
CN103613992A true CN103613992A (en) 2014-03-05

Family

ID=50164713

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310586816.2A Pending CN103613992A (en) 2013-11-20 2013-11-20 Conductive ink for printing

Country Status (1)

Country Link
CN (1) CN103613992A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104974554A (en) * 2015-06-27 2015-10-14 铜陵铜基粉体科技有限公司 Spherical copper powder used as electrically conductive ink filling material, and preparation method thereof
CN105153793A (en) * 2015-07-06 2015-12-16 深圳市容大感光科技股份有限公司 Resin composition ink, use thereof and circuit board using the same
CN106519793A (en) * 2016-11-24 2017-03-22 无锡奔牛生物科技有限公司 Nano-particle-size ink
CN108587327A (en) * 2018-07-20 2018-09-28 张家港市六福新材料科技有限公司 A kind of electrically conductive ink and preparation method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1813654A1 (en) * 2006-01-30 2007-08-01 Yung-Shu Yang Radiation curable conductive ink and manufacturing method for using the same
CN101735691A (en) * 2010-01-07 2010-06-16 同济大学 High-performance water-based epoxy ink and preparation method thereof
CN102453374A (en) * 2010-10-14 2012-05-16 株式会社东芝 Metal nanoparticle dispersion
CN102527621A (en) * 2011-12-27 2012-07-04 浙江科创新材料科技有限公司 Preparation method for haze-adjustable flexible transparent conductive film

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1813654A1 (en) * 2006-01-30 2007-08-01 Yung-Shu Yang Radiation curable conductive ink and manufacturing method for using the same
CN101735691A (en) * 2010-01-07 2010-06-16 同济大学 High-performance water-based epoxy ink and preparation method thereof
CN102453374A (en) * 2010-10-14 2012-05-16 株式会社东芝 Metal nanoparticle dispersion
CN102527621A (en) * 2011-12-27 2012-07-04 浙江科创新材料科技有限公司 Preparation method for haze-adjustable flexible transparent conductive film

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104974554A (en) * 2015-06-27 2015-10-14 铜陵铜基粉体科技有限公司 Spherical copper powder used as electrically conductive ink filling material, and preparation method thereof
CN105153793A (en) * 2015-07-06 2015-12-16 深圳市容大感光科技股份有限公司 Resin composition ink, use thereof and circuit board using the same
CN106519793A (en) * 2016-11-24 2017-03-22 无锡奔牛生物科技有限公司 Nano-particle-size ink
CN108587327A (en) * 2018-07-20 2018-09-28 张家港市六福新材料科技有限公司 A kind of electrically conductive ink and preparation method thereof

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Application publication date: 20140305