JP2007201291A - Regeneration method of solar cell module and solar cell module - Google Patents

Abstract

【Task】
Provided is a method for effectively regenerating a solar cell module whose output characteristics have deteriorated due to long-term use.
[Solution]
The connection electrode 1 formed on the substrate 5, the lead wire 2 for supplying power to the connection electrode 1, or taking out the power from the connection electrode 1, and the connection electrode 1 and the lead wire 2, and both And a first solder 3 electrically connected to the solar cell module, wherein at least part of the first solder 3 having an oxide film 4 formed on a surface thereof is regenerated. A solder melting step for melting under a temperature condition lower than the melting point of the oxide film 4 and an oxide film dividing step for dividing the oxide film 4 by thermally expanding the first solder 3 in the solder melting step are configured.
[Selection] Figure 2

Description

  The present invention relates to a method for regenerating a solar cell module and a solar cell module.

  In recent years, attention has been paid to new energy technology using natural energy as global environmental problems and energy conservation have increased. As one of them, there is a high interest in systems using solar energy, and in particular, the spread of solar power generation systems to houses has been accelerated.

  Moreover, since the electric power generated by the solar power generation system can be sold to an electric power company by the power sale system, a solar cell system that can supply the initial output for a long period of time is desired.

  However, since the solar cell module used in the photovoltaic power generation system is often installed outdoors such as a roof of a house, there are various types of solar cell modules depending on the usage environment, that is, daily temperature cycle change, rain, humidity, etc. There is a problem that there is a risk of deterioration.

To deal with such a problem, by fixing the connection member and the light receiving surface side bus bar portion using a predetermined reinforcing member at the manufacturing stage of the solar cell module, the problem is solved by improving the adhesive strength thereof. (For example, refer to Patent Document 1).
JP 2000-31518 A

  However, even with the above-described solar cell module, it has been difficult to maintain the output of the original solar cell module when used for a long period of time.

  For example, as shown in FIG. 5, even if the connecting member 102 and the bus bar portion 101 are fixed by the reinforcing member 106 in the connecting portion of the solar cell module, the connecting member 102 and the bus bar portion 101 It is conceivable that the bus bar portion 101 and the connection member 102 are peeled off due to the difference in the thermal expansion coefficient (see FIG. 4), thereby reducing the output of the solar cell module.

  Under such circumstances, attention has been focused on how to regenerate a solar cell module whose output characteristics have deteriorated due to use, but an effective method that satisfies this requirement has not yet been proposed.

  An object of the present invention is to provide a method for effectively regenerating a solar cell module whose output characteristics have deteriorated due to long-term use.

  The method for regenerating a solar cell module according to claim 1 of the present invention includes a connection electrode formed on a substrate, a lead wire that supplies power to the connection electrode, or extracts power from the connection electrode, A method for regenerating a solar cell module comprising a first solder disposed between the connection electrode and the lead wire and electrically connecting both, wherein an oxide film is formed on the surface A solder melting step of melting at least a part of the first solder that is performed under a temperature condition lower than the melting point of the oxide film, and thermally expanding the first solder in the solder melting step to divide the oxide film And an oxide film dividing step to be performed.

  Moreover, the regeneration method of the solar cell module according to claim 2 according to the present invention is the regeneration method of the solar cell module according to claim 1, wherein a liquid second solder is added to the oxide film. , Including a solidifying solder addition step.

  Moreover, the reproduction | regeneration method of the solar cell module of Claim 3 which concerns on this invention is a reproduction | regeneration method of the solar cell module of Claim 1 or Claim 2, Comprising: The said lead wire and the said connection electrode are the said. The method includes a step of providing a solid bypass member that is electrically connected by the first solder.

  Moreover, the regeneration method of the solar cell module according to claim 4 of the present invention is the regeneration method of the solar cell module according to claim 3, wherein the bypass member includes a conductive material.

  Moreover, the regeneration method of the solar cell module according to claim 5 according to the present invention is the regeneration method of the solar cell module according to claim 3 or 4, wherein the bypass member constitutes the lead wire. The component which does.

  Moreover, the regeneration method of the solar cell module according to claim 6 according to the present invention is the regeneration method of the solar cell module according to any one of claims 3 to 5, wherein the bypass member includes: It comprises at least one of copper and silver.

  Moreover, the regeneration method of the solar cell module according to claim 7 according to the present invention is the regeneration method of the solar cell module according to any one of claims 2 to 6, wherein the second solder Is a flux-containing solder.

  Moreover, the regeneration method of the solar cell module according to claim 8 according to the present invention is the regeneration method of the solar cell module according to any one of claims 1 to 7, wherein the solder melting step includes In this state, the flux is supplied to the first solder.

  The solar cell module according to claim 9 according to the present invention includes a connection electrode formed on a substrate, a lead wire that supplies power to the connection electrode or extracts power from the connection electrode, and the connection electrode And a first solder that is electrically connected between the lead wires, and has an oxide film inside the first solder. To do.

  The method for regenerating a solar cell module according to the present invention includes a solder melting step of melting at least a part of the first solder having an oxide film formed on a surface under a temperature condition lower than the melting point of the oxide film, and the solder And the oxide film dividing step of dividing the oxide film by thermally expanding the first solder in the melting step, so that the oxide film in the solid state is at least as a result of the thermal expansion accompanying the melting of the first solder. Part is divided. In particular, an oxide film interposed between the first solder and the connection electrode (or the lead wire) is greatly deteriorated over time because it is greatly affected by the temperature cycle during use, and is preferentially divided. As a result of dividing the oxide film in this way, the lead wire and the connection electrode are directly conducted through the first solder having a relatively small electric resistance, so that the output characteristics of the solar cell module are improved.

  In addition, it is preferable to include a solder addition step of adding and solidifying liquid second solder to the oxide film, whereby the volume shrinkage of the second solder acts as a tensile stress on the oxide film, and the oxide film Enables more reliable division.

  Preferably, the method further includes a step of providing a solid bypass member that electrically connects the lead wire and the connection electrode with the first solder, thereby improving the bonding strength between the lead wire and the connection electrode. be able to. In particular, the bypass member preferably includes a conductive material such as copper or silver, and this allows the junction between the bypass member and the lead wire (or connection electrode) to function as a conduction path. Further, if the bypass member includes a component constituting the lead wire, it is possible to reduce a change in conductivity between them.

  The second solder is preferably a flux-containing solder, which makes it possible to suppress the formation of an oxide film on the surface of the second solder.

  Moreover, it is preferable to perform the said solder melting process in the state which supplied the flux to the said 1st solder, and can thereby accelerate the thermal expansion of the 1st solder.

  The solar cell module according to the present invention includes a connection electrode formed on a substrate, a lead wire that supplies power to the connection electrode or extracts power from the connection electrode, and the connection electrode and the lead wire. A solar cell module including a first solder disposed between and electrically connecting the two, and having an oxide film inside the first solder, the influence of outside air Thus, even when the formation of the oxide film proceeds from the surface of the first solder, the progress is partially hindered by the oxide film existing inside beforehand, and as a result, the electrical resistance of the part is kept low. It becomes possible.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

≪Solar cell module before regeneration≫
First, the configuration of the solar cell module and the manufacturing method thereof before applying the regeneration method of the present invention will be described.

  FIG. 1 is a front view of a solar cell string constituting the above-described solar cell module as viewed from the light receiving surface side.

  As shown in FIG. 1, a connection electrode 1 is formed on a substrate 5, and the connection electrode 1 and the lead wire 2 are electrically connected by a first solder interposed therebetween. Although this solar cell string is formed by laminating a front cover and a light-receiving surface side sealing member, it is placed on the light-receiving surface side sealing member, and a back surface side sealing member and a back cover are further provided on the solar cell string. After sequentially stacking, a frame and a terminal box are attached to form a solar cell module.

  Each element which comprises the said solar cell module is demonstrated in detail below.

  Glass, polycarbonate resin, or the like is used as the front cover. As the glass plate, white plate glass, tempered glass, double tempered glass, heat ray reflective glass and the like are used, but generally white plate tempered glass having a thickness of about 3 mm to 5 mm is used. On the other hand, when a substrate made of a synthetic resin such as polycarbonate resin is used, a substrate having a thickness of about 5 mm is often used.

  The substrate 5 is made of a single crystal silicon or polycrystalline silicon substrate having a thickness of about 0.3 to 0.4 mm and a size of about 150 mm square, for example. Inside the substrate 5 is formed a PN junction (not shown) in which a P layer containing a large amount of P-type impurities such as boron and an N layer containing a large amount of N-type impurities such as phosphorus are in contact. The substrate 5 is not limited to the silicon crystal system, and various types such as amorphous silicon, a polycrystalline thin film, and a large number of minute spherical silicons arranged can be used.

  The connection electrode 1 is formed by screen-printing a silver paste or the like on the light receiving surface and non-light receiving surface side of the PN-bonded substrate 5. Further, the surface of the connection electrode 1 may be covered with the first solder over almost the entire surface in order to protect it and make it easy to attach the lead wire 2. The first solder is not limited to eutectic solder composed of tin and lead, and lead-free solder that does not substantially contain lead can be used.

  The lead wire 2 has a thickness of about 0.1 to 1.0 mm, and the width thereof is equal to or less than the width of the connection electrode 1 so as not to make a shadow on the light receiving surface of the substrate 5 by the lead wire 2 itself. To do. Furthermore, it is preferable that the length of the lead wire 2 is a length that can be connected across the connection electrodes 1 of the adjacent substrates 5. For example, when a polycrystalline silicon substrate having a side length of 150 mm is used, the lead wire 2 has a width of about 1 to 3 mm and a length of about 280 to 320 mm.

  The material of the lead wire 2 is made of a highly conductive metal material such as silver, copper, aluminum, or iron. In consideration of the conductivity and the ease of coating with the first solder, the copper foil It is preferable to use a material. Moreover, it is preferable that the lead wire 2 is covered with the first solder on the entire surface so that the first soldering is easy to the connection electrode 1 formed on the substrate 5. This is done by dipping a copper foil or the like into the first solder bath or by solder plating to cover the first solder of about 20 to 70 microns on one side. For the lead wire for leading the electric power from the substrate 5 to the outside, a copper foil coated with a first solder having a thickness of about 0.1 to 1.0 mm and a width of about 5 to 15 mm is used.

  The light-receiving surface side sealing material and the back surface side sealing material are made of an ethylene-vinyl acetate copolymer (hereinafter abbreviated as EVA) or polyvinyl butyral (hereinafter abbreviated as PVB). What was shape | molded into the sheet form about 0.2-1 mm thick by the extruder which has is used. These are heated and pressed under reduced pressure by a laminating apparatus, so that they are softened and fused to be integrated with other members. The EVA or PVB may be colored white or the like by containing titanium oxide, pigment, or the like. However, in the light-receiving surface side sealing material in the solar cell module to which the regeneration method of the present invention is applied, it is a substrate when colored. 5 is transparent because the amount of light incident on 5 is reduced and the power generation efficiency is reduced. Moreover, EVA or PVB used for the back surface side sealing material may be transparent, or may be colored white or the like by containing titanium oxide or a pigment in accordance with the surrounding installation environment where the solar cell module is installed.

  The back cover is made of a weather-resistant fluorine-based resin sheet sandwiching aluminum foil so as not to transmit moisture, a polyethylene terephthalate (PET) sheet deposited with alumina or silica, and may be transparent or white. Or may be used by coloring it in black or the like.

  And the light-receiving surface side sealing material and solar cell string (refer FIG. 1) are further laminated | stacked on the front cover in order, and also the back surface side sealing material and the back cover 5 are laminated | stacked on it. Each of these members are laminated, set in a laminator, and heated at a temperature of 100 ° C. to 200 ° C. for about 15 to 60 minutes while being pressurized under a reduced pressure of 50 to 150 Pa. And the back side sealing material are melted and then cross-linked and integrated.

  The terminal box is attached to the back side of the solar cell module using an adhesive or the like in order to connect the electrical output from the substrate 5 to an external circuit. As an example of this terminal box, a modified polyphenylene ether resin (modified PPE resin) or the like is formed in black in consideration of light resistance against ultraviolet rays. Further, the terminal box is divided into a main body part and a lid part for facilitating soldering work after the attachment, and the lid part is fixed to the main body part by fitting or screwing. The size of the terminal box may be determined optimally depending on the size of the solar cell module to be attached. As an example, the size of the side box is about 5 to 15 cm and the thickness is about 1 to 5 cm.

  The frame body is used to secure mechanical strength and weather resistance necessary for the solar cell module, and to connect and fix the frame and the solar cell panel when the solar cell module is installed outdoors. The frame is formed of aluminum or resin in consideration of the strength and cost required for the solar cell module. When it is made of aluminum, it is made by extruding aluminum, and an alumite treatment or clear coating is applied to the surface.

≪Regeneration of solar cell module≫
Hereinafter, a method for regenerating such a solar cell module will be described in detail with reference to the accompanying drawings.

[First embodiment]
FIG. 2 is a cross-sectional view showing a method for regenerating a solar cell module according to the first embodiment of the present invention, in particular, a partially enlarged view showing a connection state of lead wires and connection electrodes. 2A shows a state before the solder melting step, and FIG. 2B shows a state after the solder melting step and the oxide film dividing step.

  FIG. 3 is a cross-sectional view showing a method for regenerating a solar cell module according to the present invention, in particular, a view showing the positional relationship between the first solder and the oxide film. The connection electrode 1 and the lead wire 2 are connected to the first The positional relationship shown in FIGS. 3A to 3C is configured depending on how the solder 3 is used for solder connection.

(1) Back cover peeling process After removing the frame and terminal box of the solar cell module, the back surface side of the solar cell module is placed on the upper side so that a rectangle with a side of about 20 to 50 cm is formed in advance. Then, cut the back cover with a cutter knife.

  Then, it is heated for about 5 to 15 minutes in a heating furnace heated to about 100 to 180 ° C.

  Then, for each rectangular unit with cuts, only the back cover is sandwiched with tweezers, peeled about 1 to 3 cm from the inside to the outside, the peeled portion is grasped by hand, and the back cover is peeled off.

(2) Connection site confirmation step The connection site between the lead wire 2 and the connection electrode 1 is confirmed by the surface unevenness of the back side sealing material, the distance from the end of the solar cell module, etc., and formed above the connection site. The back-side sealing material that is present is removed over a predetermined area with a cutter knife or the like, and the connection portion between the lead wire 2 and the connection electrode 1 is exposed.

(3) Solder melting step For the first solder 3 having the oxide film 4 on the surface, the soldering iron tip is heated to a temperature lower than the melting point of the oxide film 4 (preferably 300 ° C. to 500 ° C.). Then, the first solder 3 is melted by pressing it against the first solder 3.

The melting point of eutectic solder, which is a general solder, is 183 ° C., and even when lead-free solder is used, it is 200 ° C. to 230 ° C. On the other hand, the oxide film 4 formed on the solder surface is mainly composed of SnO ₂ in which tin and oxygen are bonded, and its melting point is 1127 ° C. Therefore, even when the first solder 3 is heated and melted to be in a liquid state, the oxide film 4 exists as a solid.

  The first solder 3 can be melted in a non-contact and direct manner by irradiating the solar cell module with a laser.

(4) Oxide Film Dividing Step In the above-described solder melting step, at least a part of the oxide film 4 in the solid state is divided by the thermal expansion accompanying the melting of the first solder 3. In particular, the oxide film 4 interposed between the first solder 3 and the connection electrode 1 (or the lead wire 2) is greatly deteriorated with age and is preferentially divided. easy. As a result of the division of the oxide film 4 as described above, the lead wire 2 and the connection electrode 1 are directly conducted through the first solder 3 having a relatively low electrical resistance, so that the output characteristics of the solar cell module are improved. Become.

  In addition, below, the part where the influence by the temperature cycle at the time of use is large is demonstrated in order about the case of Fig.3 (a)-(c).

  First, in the case of FIG. 3 (a) and FIG. 3 (b), the lead wire 2 and the connection electrode 1 are repeatedly expanded and contracted, so that the space between the first solder 3 and the connection electrode 1 (lead wire 2). Tensile / compressive stress is repeatedly applied to the oxide film 4 interposed therebetween. As a result, stress concentrates on the oxide film 4 on the connection electrode 1, and the oxide film 4 becomes fatigued and easily deteriorates. Even in the case of FIG. 3 (c), as the lead wire 2 and the connection electrode 1 are thermally expanded / contracted, there is no tension between the oxide film 4 on the lead wire 2 side and the oxide film 4 on the connection electrode 1 side. Since compressive stress is applied, the oxide film 4 is easily fatigued and deteriorated.

(5) Sealing step In the above-described position confirmation step, a predetermined region of the back surface side sealing material removed by the cutter knife and a back surface side sealing material of the same size are laminated on the connection site, for example, conventionally known The connection site is sealed again by adding sealing conditions (such as crosslinking by heating).

  The solar cell module is regenerated through the above steps.

[Second Embodiment]
Next, a method for regenerating a solar cell module according to the second embodiment of the present invention will be described. In the following, the same contents as those of the first embodiment described above will not be described, and different parts will be described in detail.

  After going through the steps described in the above (1) and (2), the steps described below are performed.

(3) Solder addition step Liquid second solder is added to the oxide film 4 formed on the surface of the first solder 3 and solidified. Specifically, the prepared second solder is melted by pressing with a soldering iron having a tip temperature of 300 ° C. to 500 ° C., and this is applied to the oxide film 4 formed on the surface of the first solder. After the addition, it was cooled and solidified.

  Thus, the oxide film 4 can be divided by applying tensile stress to the oxide film 4 due to volume shrinkage when the liquid second solder is solidified. In addition to the above effects, for example, even when the oxide film 4 formed on the surface of the first solder 3 is partially peeled from the connection electrode 1, the liquid second solder is added to the oxide film 4. As a result, the second solder can be supplied to the peeled portion, and the electrical reliability is improved. Further, the mechanical strength between the lead wire 2 and the connection electrode 1 can be increased.

  For the second solder, it is preferable to use a flux-containing solder, which makes it possible to suppress the formation of an oxide film on the surface of the second solder. That is, if the second solder is a flux-containing solder, the flux component is supplied to the second solder by the flux oxidation-reduction reaction, so that the formation of the oxide film 4 on the second solder is suppressed. it can. As a result, heat conduction in the solder melting step can be efficiently performed, and thus the first solder 3 can be further thermally expanded. Then, the oxide film 4 existing between the first solder 3 and the second solder can be more easily divided.

  Note that the melting point of general eutectic solder is 183 ° C., and even lead-free solder has a melting point of 200 ° C. to 230 ° C., so that the melting point of the first solder 3 is higher than the melting point of the first solder 3 by the solder melting step described later. If heating is performed under a temperature condition (300 ° C. to 500 ° C.) below the melting point of the oxide film 4, the second solder can be simultaneously melted by the heat conduction.

  In addition, the second solder is added by adding an appropriate amount of a solid second solder in advance to the oxide film 4 formed on the surface of the first solder 3 with a linear solder or the like. By pressing the soldering iron against the solder 3 (and the oxide film 4), the first solder 3 and the second solder can be simultaneously melted. If it does in this way, a solder addition process and the following solder melting process can be performed collectively.

  Even if the solder adding step is performed after the oxide film dividing step, the above-described effects can be obtained.

(3 ′) Solder melting step For the first solder 3 having the oxide film 4 on the surface, the temperature of the soldering iron tip is equal to or higher than the melting point of the first solder 3 and lower than the melting point of the oxide film 4. The first solder 3 is melted by heating under conditions (300 ° C. to 500 ° C.) and pressing it against the first solder 3.

(4 ′) Oxide Film Dividing Step In addition to the stress associated with the thermal expansion of the first solder 3 in the solder melting step, the oxide film 4 is divided by the tensile stress generated in the solder adding step to enter the inside of the first solder 3. Can be moved. As a result of the division of the oxide film 4 as described above, the lead wire 2 and the connection electrode 1 are directly conducted through the first solder 3 having a relatively small electrical resistance, so that the output characteristics of the solar cell module are improved. Become.

≪Solar cell module≫
The solar cell module according to the present invention includes a connection electrode 1 formed on a substrate 5, a lead wire 2 that supplies power to the connection electrode 1 or extracts power from the connection electrode 1, and the connection electrode 1 and the lead wire. And a first solder 3 that is electrically connected to each other, and has an oxide film 4 inside the first solder 3.

  In addition, what is necessary is just to use the thing similar to what was mentioned above for each component in the said solar cell module, and the manufacturing method applies the above-mentioned regeneration method of a solar cell module, and divides | segments the oxide film 4 first. Needless to say, the first solder 3 containing the oxide film 4 in advance may be used.

  By adopting such a configuration, even when the formation of the oxide film 4 proceeds from the surface of the first solder 3 due to the influence of the outside air, the progress is partially caused by the oxide film 4 present in the interior in advance. As a result, the electrical resistance of the part can be kept low.

  Existence of the oxide film 4 may be confirmed by X-ray analysis of the cross section of the first solder 3 using a conventionally known EPMA (Electron Probe Micro Analysis) apparatus. Here, having an oxide film inside the first solder means that a part of the predetermined oxide film does not constitute the solder surface.

  Note that the method for regenerating a solar cell module and the solar cell module according to the present invention are not limited to the above-described embodiment, and various applications are possible.

  For example, it is preferable to include a step of providing a solid bypass member in which the lead wire 2 and the connection electrode 1 are electrically connected by the first solder 3, thereby increasing the bonding strength between the lead wire 2 and the connection electrode 1. Can be improved. As the bypass member, a resin plate, a metal plate, or the like may be attached by soldering or an adhesive. Even when the lead wire 2 and the connection electrode 1 are subjected to stress that peels from the first solder 3 due to the difference in thermal expansion coefficient between the lead wire 2 and the connection electrode 1 due to the daily temperature cycle, The above-described stress can be relieved by elastic deformation of the solid bypass member, and as a result, the lead wire 2 and the connection electrode 1 are peeled off from the first solder 3 by the stress applied to the first solder 3. Can be suppressed. Moreover, a sufficient connection area can be ensured by the presence of the bypass member, the series resistance component of the solar cell module can be reduced, and the power generation efficiency of the solar cell module can be stabilized and improved.

  In particular, the bypass member preferably includes a conductive material such as copper, silver, or aluminum, which allows the junction between the bypass member and the lead wire (or connection electrode) to function as a conduction path. A material having good solder wettability, for example, a material containing at least one of copper and silver or having improved solder wettability by plating copper or silver on the surface of an aluminum foil is preferably used. Further, if the bypass member includes a component constituting the lead wire, it is possible to reduce the change in conductivity between the two.

  Further, the solder melting step is preferably performed in a state in which the flux is supplied to the first solder, which can promote the thermal expansion of the first solder.

It is the front view which looked at the solar cell string which comprises the solar cell module before applying the reproduction | regenerating method of this invention from the light-receiving surface side. It is sectional drawing which shows the regeneration method of the solar cell module which concerns on 1st embodiment of this invention, especially the elements on larger scale which show the connection state of a lead wire and a connection electrode. (A) shows a state before the solder melting step, and (b) shows a state after the solder melting step and the oxide film dividing step. It is sectional drawing which shows the reproduction | regenerating method of the solar cell module which concerns on this invention, and is a figure which shows the positional relationship of a 1st solder and an oxide film especially. (A) First covering the lead wire with the first solder, and connecting the both without soldering the connection electrode, (b) covering the connection electrode with the first solder in advance When the lead wire is not covered with the first solder and both are connected by soldering, (c) is the case where both the lead wire and the connection electrode are previously covered with the first solder and both are connected by soldering. This shows the case. In a conventional solar cell module, it is sectional drawing which shows a mode that a bus-bar part and a connection part goods expand / contract according to a daily temperature cycle. It is sectional drawing which shows the connection part of the conventional solar cell module.

Explanation of symbols

1: Connection electrode 2: Lead wire 3: First solder 4: Oxide film 5: Substrate

Claims (9)

A connection electrode formed on the substrate, a lead wire that supplies power to the connection electrode, or that extracts power from the connection electrode, and is disposed between the connection electrode and the lead wire. A method for regenerating a solar cell module comprising: a first solder connected to
A solder melting step of melting at least a part of the first solder having an oxide film formed on a surface under a temperature condition lower than the melting point of the oxide film;
A method of regenerating a solar cell module, comprising: an oxide film dividing step of thermally expanding the first solder in the solder melting step to divide the oxide film. The method for regenerating a solar cell module according to claim 1, further comprising a solder addition step of adding and solidifying liquid second solder to the oxide film. The method for regenerating a solar cell module according to claim 1, comprising a step of providing a solid bypass member that electrically connects the lead wire and the connection electrode by the first solder. The method for regenerating a solar cell module according to claim 3, wherein the bypass member includes a conductive material. The method for regenerating a solar cell module according to claim 3 or 4, wherein the bypass member includes a component constituting the lead wire. The method for regenerating a solar cell module according to any one of claims 3 to 5, wherein the bypass member includes at least one of copper and silver. The method for regenerating a solar cell module according to any one of claims 2 to 6, wherein the second solder is a flux-containing solder. The method for regenerating a solar cell module according to any one of claims 1 to 7, wherein the solder melting step is performed in a state in which a flux is supplied to the first solder. A connection electrode formed on the substrate, a lead wire that supplies power to the connection electrode, or that extracts power from the connection electrode, and is disposed between the connection electrode and the lead wire. A first solder connected to the solar cell module,
A solar cell module having an oxide film inside the first solder.

Images