CN204516534U - A kind of circuit protection plate type semiconductor components and parts - Google Patents
A kind of circuit protection plate type semiconductor components and parts Download PDFInfo
- Publication number
- CN204516534U CN204516534U CN201520226228.2U CN201520226228U CN204516534U CN 204516534 U CN204516534 U CN 204516534U CN 201520226228 U CN201520226228 U CN 201520226228U CN 204516534 U CN204516534 U CN 204516534U
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- pin
- encapsulated layer
- thermistor
- connecting portion
- resistance
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Abstract
The utility model discloses a kind of circuit protection plate type semiconductor components and parts; comprise piezo-resistance, thermistor, conducting copper film, the first pin, the second pin, the 3rd pin, encapsulated layer and heat radiation particle; the technical solution of the utility model more can be conducive to the heat radiation of inside chip; make protection threshold values numerical value more accurate; provide higher security performance; the components and parts of same volume can be applied to higher, the more powerful occasion of load voltage value, and it is more convenient to install and use.
Description
Technical field
The utility model relates to a kind of semiconductor components and devices, particularly relates to a kind of circuit protection plate type semiconductor components and parts.
Technical background
In conventional art; varistor (VSR) is a kind of over-voltage protection element be used alone; PTC thermistor (semistor) uses as the resettable fuse of Thermal protection, is also be used alone as over-current protection device.But when integrated circuit requires more and more miniaturized, a kind of have overvoltage, the synthesizing for circuit protection PTC thermistor and piezo-resistance the three-terminal semiconductor element encapsulated and start to be suggested of overcurrent simultaneously.At present, most of producer is all that varistor is connected with the mode of thermistor by closed assembly, then draw pin by encapsulated layer to form, its shortcoming is exactly the packed layer encapsulation of thermistor, intercepted by piezo-resistance again, the heat radiation of thermistor brings certain impact, and the current threshold causing protected circuit distance to start also some numerical value is protected with regard to pre-cooling; The pin of such semiconductor package existing is all centralized arrangement or adopts triangle manner to arrange, overall package structural volume is little, insulation safety coefficient between pin is not high, more be difficult to the voltage improving packaged chip, that voltage can improve, but in occupation of larger three-dimensional arrangement space.Repeatedly study under existing encapsulation technology, the thermistor of the high safety performance that volume is little and piezo-resistance synthesize the three-terminal semiconductor components and parts encapsulated accurately to be necessary to develop a kind of startup threshold values dispelling the heat good.
Summary of the invention
The utility model overcomes deficiency of the prior art, provides a kind of circuit protection plate type semiconductor components and parts.
In order to solve the problems of the technologies described above, the utility model is achieved through the following technical solutions: a kind of circuit protection plate type semiconductor components and parts, comprise piezo-resistance, thermistor, conducting copper film, first pin, second pin, 3rd pin, encapsulated layer and heat radiation particle, described first pin, second pin and the 3rd pin all have connecting portion and conductive part, described connecting portion and conductive part electrical connection, second end of described piezo-resistance is series at the first end of thermistor by conducting copper film, the described connecting portion of the first pin is electrically connected with the first end of piezo-resistance, the connecting portion of described second pin is electrically connected with conducting copper film, the described connecting portion of the 3rd pin is electrically connected with the second end of thermistor, described piezo-resistance and thermistor tiled arrangements, described piezo-resistance, thermistor, conducting copper film, first pin connection, second pin connection and the 3rd pin connection are all placed in encapsulated layer, described encapsulated layer presents flake, heat radiation particle is covered with on encapsulated layer surface, the conductive part of described second pin is drawn in the middle part of the base of laminar encapsulated layer, the conductive part of described first pin is drawn from the left middle side edge of laminar encapsulated layer, the conductive part of described 3rd pin is drawn in the middle part of the right edge of laminar encapsulated layer, the bottom of described encapsulated layer is connected with waveform insulation system, the conductive part of described second pin comprises support portion and weld part, described weld part is electrically connected on support portion, described support portion is electrically connected on connecting portion, described waveform insulation system covers the support portion of the second pin, make weld part outside exposed, described waveform insulation system and encapsulated layer all use same material to carry out overall package.
As preferably, the waveform that described waveform insulation system is connected to encapsulated layer is comparatively large, and the waveform being away from encapsulated layer reduces gradually.
As preferably, described encapsulated layer and waveform insulation system are epoxy resin.
Compared with prior art, the utility model has the advantages that: the structure of flat connection, make overall structure present sheet, the heat radiation particle having again encapsulated layer outer surface to be provided with assists heat radiation, the heat radiation being more conducive to inside chip made; Simultaneously, components and parts protection attribute after encapsulation is closer to the self attributes of thermistor, reduce encapsulating material to affect thermistor service behaviour, the protection threshold values error of circuit is reduced, numerical value is more accurate, the circuit protected can bear larger electric current, and not pre-cooling protection; Because the pin at two ends is in the outside of encapsulating structure, middle pin applied waveforms insulation system, creepage distance can be made to increase further, provide higher security performance to the components and parts after encapsulation, the components and parts after the encapsulation of same volume can be applied to higher, the more powerful occasion of load voltage value; Simultaneously the waveform insulation system of middle pin make to install and use more convenient.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model embodiment.
Embodiment
Below in conjunction with accompanying drawing and embodiment, the utility model is described in further detail.
As shown in Figure 1, a kind of circuit protection plate type semiconductor components and parts, comprise piezo-resistance 1, thermistor 2, conducting copper film 3, first pin 5, second pin 6, 3rd pin 7, encapsulated layer 4 and heat radiation particle 9, described first pin 5, second pin 6 and the 3rd pin 7 all have connecting portion and conductive part, described connecting portion and conductive part electrical connection, second end of described piezo-resistance 1 is series at the first end of thermistor 2 by conducting copper film 3, the connecting portion of described first pin 5 is electrically connected with the first end of piezo-resistance 1, the connecting portion of described second pin 6 is electrically connected with conducting copper film 3, the described connecting portion of the 3rd pin 7 is electrically connected with the second end of thermistor 2, described piezo-resistance 1 and thermistor 2 tiled arrangements, described piezo-resistance 1, thermistor 2, conducting copper film 3, the connecting portion of the first pin 5, connecting portion and the 3rd pin 7 connecting portion of the second pin 6 are all placed in encapsulated layer 4, described encapsulated layer 4 presents flake, heat radiation particle 9 is covered with on encapsulated layer 4 surface, the conductive part of described second pin 6 is drawn in the middle part of the base of laminar encapsulated layer, the conductive part of described first pin 5 is drawn from the left middle side edge of laminar encapsulated layer, the conductive part of described 3rd pin 7 is drawn in the middle part of the right edge of laminar encapsulated layer, the bottom of described encapsulated layer 4 is connected with waveform insulation system 8, the conductive part of described second pin 6 comprises support portion and weld part, described weld part is electrically connected on support portion, described support portion is electrically connected on connecting portion, described waveform insulation system 8 covers the support portion of the second pin 6, make weld part outside exposed, described waveform insulation system 8 all uses epoxy resin to carry out overall package with encapsulated layer 4, the waveform that described waveform insulation system 8 is connected to encapsulated layer 4 is larger, the waveform being away from encapsulated layer 4 reduces gradually.
When the utility model uses, due to piezo-resistance 1 and thermistor 2 tiled arrangements, make overall structure present sheet, the heat radiation particle 9 having again encapsulated layer 4 outer surface to be provided with assists heat radiation, makes whole encapsulating structure advantageously in heat radiation, simultaneously, components and parts after encapsulation reduce the impact of encapsulating structure on thermistor 2 service behaviour, and the protection threshold values error of circuit is reduced, and numerical value is more accurate, the circuit protected can bear larger electric current, and not pre-cooling protection; Because the first pin 5 and the 3rd pin 7 are in the middle part of the overall package structure left and right sides, second pin 6 uses waveform insulation system 8, creepage distance can be made to increase further, provide higher security performance to the components and parts after encapsulation, the components and parts after the encapsulation of same volume can be applied to higher, the more powerful occasion of load voltage value; Simultaneously the waveform insulation system 8 of the second pin 6 also allow of the present utility model install and use more convenient, only need by pin of the present utility model directly all reeve circuit board can reach the maximum serviceability of product.
Except the above embodiments, other execution modes do not stated also should within protection range of the present utility model.Specific embodiment as herein described is only to the explanation for example of the utility model spirit, the utility model person of ordinary skill in the field can make various amendment or supplements or adopt similar mode to substitute to described specific embodiment, but can't depart from spirit of the present utility model or surmount the scope that appended claims defines.Although be described through specific term herein, but do not get rid of the possibility using other terms, use these terms to be only used to describe and explain essence of the present utility model easily, the restriction that they are construed to any one additional is all contrary with the utility model spirit.
Claims (3)
1. circuit protection plate type semiconductor components and parts, it is characterized in that, comprise piezo-resistance, thermistor, conducting copper film, first pin, second pin, 3rd pin, encapsulated layer and heat radiation particle, described first pin, second pin and the 3rd pin all have connecting portion and conductive part, described connecting portion and conductive part electrical connection, second end of described piezo-resistance is series at the first end of thermistor by conducting copper film, the described connecting portion of the first pin is electrically connected with the first end of piezo-resistance, the connecting portion of described second pin is electrically connected with conducting copper film, the described connecting portion of the 3rd pin is electrically connected with the second end of thermistor, described piezo-resistance and thermistor tiled arrangements, described piezo-resistance, thermistor, conducting copper film, first pin connection, second pin connection and the 3rd pin connection are all placed in encapsulated layer, described encapsulated layer presents flake, heat radiation particle is covered with on encapsulated layer surface, the conductive part of described second pin is drawn in the middle part of the base of laminar encapsulated layer, the conductive part of described first pin is drawn from the left middle side edge of laminar encapsulated layer, the conductive part of described 3rd pin is drawn in the middle part of the right edge of laminar encapsulated layer, the bottom of described encapsulated layer is connected with waveform insulation system, the conductive part of described second pin comprises support portion and weld part, described weld part is electrically connected on support portion, described support portion is electrically connected on connecting portion, described waveform insulation system covers the support portion of the second pin, make weld part outside exposed, described waveform insulation system and encapsulated layer all use same material to carry out overall package.
2. a kind of circuit protection plate type semiconductor components and parts according to claim 1, is characterized in that, the waveform that described waveform insulation system is connected to encapsulated layer is comparatively large, and the waveform being away from encapsulated layer reduces gradually.
3. a kind of circuit protection plate type semiconductor components and parts according to claim 2, it is characterized in that, described encapsulated layer and waveform insulation system are epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520226228.2U CN204516534U (en) | 2015-04-15 | 2015-04-15 | A kind of circuit protection plate type semiconductor components and parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520226228.2U CN204516534U (en) | 2015-04-15 | 2015-04-15 | A kind of circuit protection plate type semiconductor components and parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204516534U true CN204516534U (en) | 2015-07-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520226228.2U Expired - Fee Related CN204516534U (en) | 2015-04-15 | 2015-04-15 | A kind of circuit protection plate type semiconductor components and parts |
Country Status (1)
| Country | Link |
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| CN (1) | CN204516534U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104779023A (en) * | 2015-04-15 | 2015-07-15 | 江苏晟芯微电子有限公司 | Flat-panel type semiconductor element device for circuit protection |
-
2015
- 2015-04-15 CN CN201520226228.2U patent/CN204516534U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104779023A (en) * | 2015-04-15 | 2015-07-15 | 江苏晟芯微电子有限公司 | Flat-panel type semiconductor element device for circuit protection |
| CN104779023B (en) * | 2015-04-15 | 2017-08-08 | 苏州聚达晟芯微电子有限公司 | A kind of circuit protection plate type semiconductor component |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160607 Address after: 215300 Jiangsu province north of the city of Yushan town of Kunshan city Hanpu Road No. 998, room 3 Patentee after: Suzhou Juda senchip Microelectronics Co. Ltd. Address before: 225500 hi tech innovation center, Jiangyan District, Taizhou, Jiangsu Patentee before: Jiangsu Senchip Microelectronics Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150729 Termination date: 20180415 |