CN108513495B - A kind of board radiator heat conducting gum mud pressure setting - Google Patents
A kind of board radiator heat conducting gum mud pressure setting Download PDFInfo
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- CN108513495B CN108513495B CN201810175542.0A CN201810175542A CN108513495B CN 108513495 B CN108513495 B CN 108513495B CN 201810175542 A CN201810175542 A CN 201810175542A CN 108513495 B CN108513495 B CN 108513495B
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- China
- Prior art keywords
- radiator
- clay
- briquetting
- board
- heat
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B1/00—Presses, using a press ram, characterised by the features of the drive therefor, pressure being transmitted directly, or through simple thrust or tension members only, to the press ram or platen
- B30B1/26—Presses, using a press ram, characterised by the features of the drive therefor, pressure being transmitted directly, or through simple thrust or tension members only, to the press ram or platen by cams, eccentrics, or cranks
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of board radiator heat conducting gum mud pressure settings, a radiator is only arranged in one board, the gap filling of each electronic component and radiator on board is realized using the heat-conducting glue clod of compacting, the heat-conducting daub pressure setting includes rack, being horizontally arranged in the rack has clay mold, the upper plane of the clay mold is equipped with the clay cavity for placing clay and the radiator location structure for realizing radiator positioning, the rack is equipped with the briquetting being pressed on radiator on clay mold and the briquetting lifting drive for driving briquetting lifting in the top of clay mold.The present invention can satisfy clay thickness and shape need, guarantee that heat-conducting daub suppresses quality.
Description
Present patent application is invention and created name " a kind of radiator heat conducting gum mud operated pressing tool and board heat dissipation knot
The divisional application of structure ", the applying date of original application are on August 26th, 2016, and application No. is 2016107294931.
Technical field
The present invention relates to board heat dissipation technologys, and in particular to the presser of board radiator structure and radiator heat conducting gum mud
Tool.
Background technique
In the prior art, what is installed between board and radiator is heat conductive pad, commonly uses heat conductive pad installation method, is using bullet
After producer is die cut, heat conductive pad is placed on to be needed on radiating element property heat conductive pad, using screw or spring catch by radiator
It fixes on circuit boards, to ensure that radiator keeps being in close contact with by radiating element by elastic conducting heat pad, and also it is usual every
As soon as a heat dissipation element requires installation radiator, a board needs to install multiple radiators.
Although the fixing means of screw is simple, but if multiple heat dissipation elements is needed to contact heat dissipation with a radiator simultaneously
When, often due to each element heights are different, the heat conductive pad of different-thickness need to be chosen, and the once not no heat conductive pad of proper height,
Cause board to deform often due to pressure is inconsistent, or secondary machine carried out by plane to radiator, come solve by
The circuit board problem on deformation caused by heat conductive pad pressure is distinguished.Although spring catch fixed heat sink can use spring force to adjust
Whole radiator height, but since each compressed height of spring difference will lead to radiator deflection, so as to cause radiator, heat conductive pad and
Heat dissipation element cannot be in close contact influence heat dissipation, and since there are fit clearances between resilient key and heat release hole, lead to the installation side
Method is not suitable for using in vibration environment, can generate biggish noise.
Summary of the invention
The technical problem to be solved by the invention is to provide a kind of board radiator heat conducting gum mud pressure setting, solve to dissipate
The compacting problem of hot device heat-conducting daub improves the compacting efficiency of heat-conducting daub, guarantees compacting quality.
In order to solve the above technical problems, the present invention adopts the following technical scheme: a kind of board radiator heat conducting gum mud is suppressed
Device, board radiator correspond to each electronic component and are respectively equipped with heat-conducting glue clod, between each electronic component and radiator respectively
The gap filling of board and radiator is realized by corresponding heat-conducting glue clod, it is characterised in that: the device includes rack, described
Being horizontally arranged in rack has clay mold, and the upper plane of the clay mold is equipped with for placing the clay cavity of clay and being used for
Realize the radiator location structure of radiator positioning, the rack is equipped in the top of clay mold radiator being pressed on clay
Briquetting on mold and the briquetting lifting drive for driving briquetting lifting, the briquetting lifting drive include and briquetting
It fixes and the briquetting sliding block for driving briquetting to go up and down and the guide rail for guiding briquetting sliding block to slide up and down, the briquetting sliding block is connected with
The surface of crank link mechanism, the clay mold is equipped with teflon coatings or PET release paper.
Preferably, the radiator location structure is the radiator location hole for being set to plane on clay mold, described to dissipate
Hot device is equipped with the self-clinching standoff fixed with board, and the self-clinching standoff is inserted into radiator location hole.
Preferably, the rack is equipped with the briquetting guide rod that guidance briquetting slides up and down.
Preferably, the rack includes the bottom plate of bottom, and the clay mold is removably mounted on bottom plate.
Preferably, the bottom of the clay mold is equipped with several mold location holes, and the bottom plate is equipped with corresponding insertion
Mold location hole is to realize the location guide that clay mold positions on bottom plate.
A radiator is only arranged in the technical solution adopted by the present invention, a board, real using the heat-conducting glue clod of compacting
The gap filling of each electronic component and radiator, can solve the height difference bring due to each electronic component on existing board
Problem is arranged in heat conducting element, therefore also simplifies radiator structure.Due to using heat-conducting daub as heat dissipation element and radiator it
Between heat-conducting medium, heat-conducting daub have good thermal conduction characteristic, pyroconductivity 8W/mk, with super softness characteristic, can
Be compressed to any thickness, after suppressing certain thickness can very little reaction force keep, avoid reaction force excessive
Board is caused to deform.
In addition, it is less for the optional type of heat-conducting daub thickness, and generally required from clay thickness reduction to specified thickness
Larger pressure, the technical problem of application is difficult so as to cause the clay, and the present invention is suppressed using dedicated radiator heat conducting gum mud
Heat-conducting daub is placed in the clay cavity of clay mold by tool, by the driving of lifting drive so that above and below briquetting
It moves back and forth, when briquetting is located at bottom, radiator is pressed on clay mold by briquetting, passes through specifically setting for clay cavity
Required thickness can be suppressed on a heat sink and be reached to clay by meter, to meet since the height of electronic component is different, cause
The different problem of heat-conducting glue clod thickness.And when briquetting is located at the top, it can be by the radiator suppressed and heat-conducting daub
It takes out, is convenient for subsequent installation.Therefore, clay compacting is more efficient, and can satisfy clay thickness and shape need, guarantees to lead
Hot glue mud suppresses quality.
Detailed description of the invention
Present invention will be further described below with reference to the accompanying drawings and specific embodiments:
Fig. 1 is the structural diagram of the present invention；
Fig. 2 is structural schematic diagram of the present invention in the case where not placing clay mold state；
Fig. 3 is the positive structure schematic of clay mold；
Fig. 4 is the structure schematic diagram of clay mold
Fig. 5 is the structural schematic diagram at the radiator back side.
Specific embodiment
As depicted in figs. 1 and 2, a kind of radiator heat conducting gum mud operated pressing tool, including rack 1, level is put in the rack 1
It is equipped with clay mold 2, the upper plane of the clay mold is equipped with the radiator location structure positioned for realizing radiator 3, institute
Rack 1 is stated in the top of clay mold equipped with the briquetting 4 and drive briquetting lifting radiator 3 being pressed on clay mold
Briquetting lifting drive.
As shown in figure 3, the upper plane of the clay mold is equipped with the clay cavity 21 for placing clay.Clay cavity pair
It answers the electronic component-sized on board, be highly designed to be pressed into corresponding heat-conducting glue clod, therefore, clay cavity 21
Position, quantity, depth and area can be adjusted as needed, be wanted for meeting heat-conducting glue clod different-thickness and shape
It asks, heat-conducting daub is placed in the clay cavity 21 of clay mold, is then applied pressure to radiator 3 by briquetting 4, is suppressed
Heat-conducting glue clod realizes the gap filling of board and radiator, can keep radiator and heat dissipation element intimate surface contact, and
Establish the heat transfer path of high-efficient low thermal resistance.
As shown in figure 4, the bottom of the clay mold be equipped with several mold location holes 23, rack include bottom plate and with bottom
The vertical supporting plate of plate.As shown in Fig. 2, the bottom plate is equipped with corresponding insertion mold location hole 23 to realize that clay mold exists
The location guide 11 positioned on bottom plate.Clay mold 2 can be achieved on bottom plate in location guide 11 after being inserted into mold location hole 23
Positioning can realize the clay thickness to different demands by replacing clay mold 2 so that the versatility of operated pressing tool can be realized
And the compacting of shape.
As shown in figure 3, the radiator location structure is the radiator location hole 22 for being set to plane on clay mold, such as
Shown in Fig. 5, the radiator 3 is equipped with the self-clinching standoff 31 fixed with board, and it is fixed that the self-clinching standoff 31 is inserted into radiator
In the hole 22 of position.Self-clinching standoff 31 avoids coupling mechanism force from causing board to become greatly for guaranteeing that the height of radiator on circuit boards is consistent
Shape, while self-clinching standoff 32 is inserted into radiator location hole 22, for ensuring the reliable location between radiator and clay mold.
Since in compacting, change in shape is larger, and heat-conducting daub contacts simultaneously with clay mold and radiator, in order to enable heat-conducting glue
Mud fits closely on a heat sink, rather than on clay mold, clay die surface (including in clay cavity) need to be using not viscous material
Expect teflon coatings, or additional increase PET release paper, it is ensured that the cohesive force of heat-conducting daub and clay mold is smaller, guarantees pressure
Glue mud can be effectively peeled off from clay mold.
As shown in Figure 1, the briquetting lifting drive includes briquetting sliding block that is fixed with briquetting 4 and driving briquetting to go up and down
6 and the guide rail 7 that slides up and down of guidance briquetting sliding block, the briquetting sliding block be connected with crank link mechanism.Wherein, guide rail is fixed
On supporting plate, the cylindric guide sleeve of guide rail use in the present embodiment, briquetting sliding block 6 is cylindric, the cunning in cylindric guide sleeve
It is dynamic.The rack is equipped with the briquetting guide rod 5 that guidance briquetting slides up and down, and supporting plate is fixedly arranged above upper mounted plate in bottom plate,
Briquetting guide rod is cylindrical bar, and upper end is fixed on upper mounted plate, and lower end is fixed with bottom plate.Crank link mechanism includes 8 He of connecting rod
Crank 9, with the swing of crank 9, connecting rod drives briquetting sliding block 6 and briquetting 4, and limits in the straight line of guide rail 7 and briquetting guide rod 5
Under pump, when briquetting is located at the top, the radiator suppressed and heat-conducting daub can be taken out, be convenient for subsequent peace
Dress.It is first to coat the technical solution on a heat sink, then pressed and scraped relative to heat-conducting daub, not only efficiency is lower, and thick
Degree and uniformity are not easy to control.The radiator heat conducting gum mud operated pressing tool that the present invention uses, clay suppress more efficient, Ke Yiman
Sufficient clay thickness and shape need are guaranteed that heat-conducting daub suppresses quality, required thickness and shape can be realized using General purpose jig
Shape, and it is easy to operate.
The present invention also provides a kind of board radiator structures, including board and a corresponding radiator, the board to set
There are multiple electronic components for needing to radiate, the radiator corresponds to each electronic component and is respectively equipped with heat-conducting glue clod, each electronics
Realize the gap filling of board and radiator between element and radiator by corresponding heat-conducting glue clod respectively.Heat-conducting daub is
One kind is using Heat Conduction Material and binding material as material of main part, using heat-conducting daub as leading between heat dissipation element and radiator
Thermal medium, heat-conducting daub have good thermal conduction characteristic, pyroconductivity 8W/mk, and the characteristic with super softness is compressible to
Any thickness, after suppressing certain thickness can very little reaction force keep, avoid reaction force is excessive from leading to plate
Card deformation.Therefore, heat-conducting daub is equipped between board and radiator, for increasing heat transfer area, establishing high-efficient low thermal resistance
Heat transfer path.
Wherein, the height of each electronic component is different, can also be identical, highly not simultaneously as can pass through radiator
Heat-conducting daub operated pressing tool suppresses the different heat-conducting glue clod of multiple thickness once to meet multiple electronic components and radiator
Connection, therefore can more embody the radiator structure and the advantages of radiator heat conducting gum mud operated pressing tool.
In addition, the fixation between the board and radiator is realized by the self-clinching standoff of screw locking radiator.Pass through
Heat-conducting daub can be suppressed on a heat sink and reach required thickness by above-mentioned operated pressing tool.
Claims (5)
1. a kind of board radiator heat conducting gum mud pressure setting, board radiator correspond to each electronic component and are respectively equipped with heat-conducting glue
Clod is realized each electronic component on board by corresponding heat-conducting glue clod respectively between each electronic component and radiator and is dissipated
The gap filling of hot device, it is characterised in that: the device includes rack, and being horizontally arranged in the rack has clay mold, the glue
The upper plane of mud mould tool is equipped with the clay cavity for placing clay and the radiator location structure for realizing radiator positioning,
The rack is equipped with the briquetting being pressed on radiator on clay mold in the top of clay mold and drives briquetting lifting
Briquetting lifting drive, the briquetting lifting drive include fix and drive with briquetting briquetting lifting briquetting sliding block with
And the guide rail that guidance briquetting sliding block slides up and down, the briquetting sliding block are connected with crank link mechanism, the table of the clay mold
Face is equipped with teflon coatings or PET release paper.
2. a kind of board radiator heat conducting gum mud pressure setting according to claim 1, it is characterised in that: the radiator
Location structure is the radiator location hole for being set to plane on clay mold, and the radiator is equipped with to press with what board was fixed
Stud, the self-clinching standoff are inserted into radiator location hole.
3. a kind of board radiator heat conducting gum mud pressure setting according to claim 1, it is characterised in that: in the rack
The briquetting guide rod slided up and down equipped with guidance briquetting.
4. existing according to claim 1 to a kind of board radiator heat conducting gum mud pressure setting, feature described in 3 any one
In: the rack includes the bottom plate of bottom, and the clay mold is removably mounted on bottom plate.
5. a kind of board radiator heat conducting gum mud pressure setting according to claim 4, it is characterised in that: the clay mould
The bottom of tool is equipped with several mold location holes, and the bottom plate is equipped with corresponding insertion mold location hole to realize clay mold
The location guide positioned on bottom plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810175542.0A CN108513495B (en) | 2016-08-26 | 2016-08-26 | A kind of board radiator heat conducting gum mud pressure setting |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810175542.0A CN108513495B (en) | 2016-08-26 | 2016-08-26 | A kind of board radiator heat conducting gum mud pressure setting |
| CN201610729493.1A CN106231874B (en) | 2016-08-26 | 2016-08-26 | A kind of radiator heat conducting gum mud operated pressing tool and board radiator structure |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610729493.1A Division CN106231874B (en) | 2016-08-26 | 2016-08-26 | A kind of radiator heat conducting gum mud operated pressing tool and board radiator structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108513495A CN108513495A (en) | 2018-09-07 |
| CN108513495B true CN108513495B (en) | 2019-07-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810175542.0A Active CN108513495B (en) | 2016-08-26 | 2016-08-26 | A kind of board radiator heat conducting gum mud pressure setting |
| CN201610729493.1A Active CN106231874B (en) | 2016-08-26 | 2016-08-26 | A kind of radiator heat conducting gum mud operated pressing tool and board radiator structure |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201610729493.1A Active CN106231874B (en) | 2016-08-26 | 2016-08-26 | A kind of radiator heat conducting gum mud operated pressing tool and board radiator structure |
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| CN (2) | CN108513495B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106793692A (en) * | 2016-12-21 | 2017-05-31 | 天津七二通信广播股份有限公司 | A kind of heat conduction mud loads frock and application method |
| CN106686880A (en) * | 2016-12-30 | 2017-05-17 | 株洲中车时代电气股份有限公司 | Onboard electronic part device for rail transit |
| CN108772697A (en) * | 2018-07-27 | 2018-11-09 | 惠州市银宝山新实业有限公司 | Automobile adjustment seat knob assembling device |
| TWI795815B (en) * | 2021-06-18 | 2023-03-11 | 亞旭電腦股份有限公司 | Method for assembling heat dissipation device and heat dissipation device |
| CN113708331B (en) * | 2021-07-27 | 2022-11-22 | 河钢股份有限公司承德分公司 | Explosion-proof clay shaping device |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN108513495A (en) | 2018-09-07 |
| CN106231874B (en) | 2018-07-13 |
| CN106231874A (en) | 2016-12-14 |
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