CN206042644U - Radiator heat conduction clay presser utensil and integrated circuit board heat radiation structure - Google Patents
Radiator heat conduction clay presser utensil and integrated circuit board heat radiation structure Download PDFInfo
- Publication number
- CN206042644U CN206042644U CN201620952595.5U CN201620952595U CN206042644U CN 206042644 U CN206042644 U CN 206042644U CN 201620952595 U CN201620952595 U CN 201620952595U CN 206042644 U CN206042644 U CN 206042644U
- Authority
- CN
- China
- Prior art keywords
- radiator
- clay
- briquetting
- mould
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
Abstract
The utility model discloses a radiator heat conduction clay presser utensil and integrated circuit board heat radiation structure, an integrated circuit board only set up a radiator, and the heat -conducting glue clod that adopts the suppression realizes on the integrated circuit board gap of each electronic component and radiator and pack, and this heat conduction clay presser utensil includes the frame, the frame is improved level and has been placed the clay mould, the last plane of clay mould is equipped with the radiator location structure who is used for placing the clay cavity of clay and is used for realizing the radiator location, the frame is equipped with the briquetting that compresses tightly the radiator on the clay mould and drives the briquetting lift drive that the briquetting goes up and down in the top of clay mould. The utility model discloses an integrated circuit board heat radiation structure can solve because the heat guiding element that each electronic component's high difference was brought sets up a difficult problem, and the heat conduction clay presser who corresponds utensil can satisfy clay thickness and shape requirement, guarantees the heat conduction clay and suppresses the quality.
Description
Technical field
The utility model is related to board heat dissipation technology, and in particular to the compacting of board radiator structure and radiator heat conducting gum mud
Instrument.
Background technology
In prior art, what is installed between board and radiator is heat conductive pad, commonly uses heat conductive pad installation method, is to adopt bullet
Property heat conductive pad after producer's cross cutting, heat conductive pad is placed on to be needed on radiating element, using screw or spring catch by radiator
Fix on circuit boards, it is to guarantee radiator and be kept being in close contact by elastic conducting heat pad by radiating element and usual every
Individual heat dissipation element is required for installing a radiator, and a board is accomplished by installing multiple radiators.
Although the fixing means of screw is simple, but if need multiple heat dissipation elements to contact radiating with a radiator simultaneously
When, often due to each element heights are different, the heat conductive pad of different-thickness need to be chosen, once and there is no a heat conductive pad of proper height,
Cause board to deform often due to pressure is inconsistent, or secondary machine carried out by the plane to radiator, solve by
The circuit board problem on deformation caused by the difference of heat conductive pad pressure.Although spring catch fixed heat sink can be adjusted using spring force
Whole radiator height, but as each compressed height of spring difference can cause radiator deflection, so as to cause radiator, heat conductive pad and
Heat dissipation element can not be in close contact impact radiating, and due to there is fit clearance between resilient key and louvre, cause the installation side
Method is not suitable for used in vibration environment, can produce larger noise.
Utility model content
Technical problem to be solved in the utility model is just to provide a kind of radiator heat conducting gum mud operated pressing tool and board
Radiator structure, by designing board radiator structure, allows the electronic component on a board to share a radiator and is dissipated
Heat, meanwhile, by special heat-conducting daub operated pressing tool, a compacting difficult problem for radiator heat conducting gum mud is solved, improve heat-conducting daub
Compacting efficiency, it is ensured that compacting quality.
For solving above-mentioned technical problem, the utility model is adopted the following technical scheme that：A kind of radiator heat conducting gum mud compacting
Instrument, including frame, the upper plane that horizontal positioned has clay mould, the clay mould in the frame is provided with for placing glue
The clay cavity of mud and the radiator location structure for realizing radiator positioning, the frame are provided with above clay mould
Radiator is pressed on into the briquetting on clay mould and the briquetting lifting drive of briquetting lifting is driven.
Preferably, the radiator location structure is the radiator location hole for being arranged at plane on clay mould, described to dissipate
Hot device is provided with the self-clinching standoff fixed with board, and the self-clinching standoff is inserted in radiator location hole.
Preferably, the briquetting lifting drive include fixing with briquetting and drive briquetting lifting briquetting slide block and
The guide rail that guiding briquetting slide block is slided up and down, the briquetting slide block are connected with toggle.
Preferably, the frame is provided with the briquetting guide rod that guiding briquetting is slided up and down.
Preferably, the frame includes the base plate of bottom, and the clay mould is removably mounted on base plate.
Preferably, the bottom of the clay mould is provided with several mould location holes, and the base plate is provided with correspondence insertion
Mould location hole is so as to realizing location guide that clay mould is positioned on base plate.
Preferably, the surface of the clay mould is provided with teflon coatings or PET release liners.
In addition, the utility model additionally provides a kind of board radiator structure, including board and a corresponding radiator, institute
State board and be provided with multiple electronic components for needing radiating, corresponding each electronic component of the radiator is respectively equipped with heat-conducting daub
Block, realizes the gap filling of board and radiator respectively by corresponding heat-conducting glue clod between each electronic component and radiator.
Further, the height of each electronic component is different.
Further, the fixation between the board and radiator is realized by the self-clinching standoff of screw locking radiator.
The technical solution adopted in the utility model, a board only arrange a radiator, using the heat-conducting daub of compacting
Block realizes the gap filling of each electronic component and radiator on board, can solve the height different band due to each electronic component
The heat conducting element for coming arranges a difficult problem, therefore also simplify radiator structure.Due to using heat-conducting daub as heat dissipation element and radiating
Heat-conducting medium between device, heat-conducting daub have good thermal conduction characteristic, and pyroconductivity is 8W/mk, with super soft spy
Property, any thickness is compressible to, can be kept with the reaction force of very little after certain thickness is suppressed, it is to avoid reaction force
It is excessive to cause board to deform.
In addition, less for the optional species of heat-conducting daub thickness, and generally require from clay thickness reduction to appointed thickness
Larger pressure, so as to cause the clay to be difficult the technical barrier applied, the utility model adopts special radiator heat conducting gum mud
Operated pressing tool, heat-conducting daub is positioned in the clay cavity of clay mould, briquetting is caused by the driving of lifting drive
Pump, when briquetting is located at bottom, briquetting is pressed on radiator on clay mould, by the tool of clay cavity
Body is designed, and clay can be suppressed on a heat sink and be reached required thickness, to meet as the height of electronic component is different,
The different difficult problem of caused heat-conducting glue clod thickness.And when briquetting is located at the top, can be by the radiator for suppressing and heat conduction
Clay takes out, and is easy to subsequent installation.Therefore, clay compacting is in hgher efficiency, and can meet clay thickness and shape need, protects
Card heat-conducting daub compacting quality.
Description of the drawings
With reference to the accompanying drawings and detailed description the utility model is further described：
Fig. 1 is structural representation of the present utility model；
Fig. 2 is structural representation of the utility model in the case where clay mould state is not placed；
Positive structure schematics of the Fig. 3 for clay mould；
Structure schematic diagrams of the Fig. 4 for clay mould
Structural representations of the Fig. 5 for the radiator back side.
Specific embodiment
As depicted in figs. 1 and 2, a kind of radiator heat conducting gum mud operated pressing tool, including frame 1, in the frame 1, level is put
Clay mould 2 is equipped with, the upper plane of the clay mould is provided with the radiator location structure for realizing the positioning of radiator 3, institute
State frame 1 be provided with above clay mould by radiator 3 be pressed on the briquetting 4 on clay mould and drive briquetting lifting
Briquetting lifting drive.
As shown in figure 3, the upper plane of the clay mould is provided with the clay cavity 21 for placing clay.Clay cavity pair
Answer the electronic component-sized on board, be highly designed to be pressed into corresponding heat-conducting glue clod, therefore, clay cavity 21
Position, quantity, depth and area can be adjusted as needed, will for meeting heat-conducting glue clod different-thickness and shape
Ask, heat-conducting daub is positioned in the clay cavity 21 of clay mould, pressure is applied to radiator 3 by briquetting 4 then, is suppressed
Heat-conducting glue clod realizes the gap filling of board and radiator, can keep radiator and heat dissipation element intimate surface contact, and
Set up the heat transfer path of high-efficient low thermal resistance.
As shown in figure 4, the bottom of the clay mould is provided with several mould location holes 23, frame include base plate and with bottom
The vertical supporting plate of plate.As shown in Fig. 2 the base plate is provided with correspondence insertion mould location hole 23 existing so as to realize clay mould
The location guide 11 positioned on base plate.After in the insertion mould of location guide 11 location hole 23, achievable clay mould 2 is on base plate
Positioning, so as to be capable of achieving the versatility of operated pressing tool, be capable of achieving the clay thickness to different demands by changing clay mould 2
And the compacting of shape.
As shown in figure 3, the radiator location structure is the radiator location hole 22 for being arranged at plane on clay mould, such as
Shown in Fig. 5, the radiator 3 is provided with the self-clinching standoff 31 fixed with board, and it is fixed that the self-clinching standoff 31 is inserted into radiator
In the hole 22 of position.Self-clinching standoff 31 is used for ensureing radiator on circuit boards highly consistent, it is to avoid coupling mechanism force causes greatly board to become
Shape, while self-clinching standoff 32 is inserted in radiator location hole 22, for guaranteeing the reliable location between radiator and clay mould.
As in compacting, change in shape is larger, and heat-conducting daub is contacted simultaneously with clay mould and radiator, in order that heat-conducting glue
Mud is brought into close contact on a heat sink, rather than on clay mould, clay die surface (including in clay cavity) need to be using not viscous material
Material teflon coatings, or extra increase PET release liners, it is ensured that heat-conducting daub is less with the cohesive force of clay mould, it is ensured that pressure
Glue mud can be effectively peeled off from clay mould.
As shown in figure 1, the briquetting lifting drive includes fixing and driving the briquetting slide block that briquetting is lifted with briquetting 4
6 and the guiding guide rail 7 that slides up and down of briquetting slide block, the briquetting slide block is connected with toggle.Wherein, guide rail is fixed
On supporting plate, using cylindric guide pin bushing, briquetting slide block 6 is cylindric to guide rail, sliding in cylindric guide pin bushing in the present embodiment
It is dynamic.The frame is provided with the briquetting guide rod 5 that guiding briquetting is slided up and down, and supporting plate is fixedly arranged above upper mounted plate in base plate,
Briquetting guide rod is cylindrical bar, and upper end is fixed on upper mounted plate, and lower end is fixed with base plate.Toggle includes 8 He of connecting rod
Crank 9, with the swing of crank 9, connecting rod drives briquetting slide block 6 and briquetting 4, and spacing in the straight line of guide rail 7 and briquetting guide rod 5
Under pump, when briquetting is located at the top, the radiator for suppressing and heat-conducting daub can be taken out, be easy to follow-up peace
Dress.It is first to coat the technical scheme that on a heat sink, then presses and scrapes relative to heat-conducting daub, it is not only less efficient and thick
Degree and uniformity are wayward.The radiator heat conducting gum mud operated pressing tool that the utility model is adopted, clay compacting are in hgher efficiency, can
To meet clay thickness and shape need, it is ensured that heat-conducting daub suppresses quality, required thickness is capable of achieving using General purpose jig
It is and shape, and simple to operate.
The utility model additionally provides a kind of board radiator structure, including board and a corresponding radiator, the plate
Multiple electronic components for needing radiating are arranged with, corresponding each electronic component of the radiator is respectively equipped with heat-conducting glue clod, respectively
Realize the gap filling of board and radiator between electronic component and radiator respectively by corresponding heat-conducting glue clod.Heat-conducting glue
Mud is a kind of using Heat Conduction Material and binding material as material of main part, using heat-conducting daub as between heat dissipation element and radiator
Heat-conducting medium, heat-conducting daub has good thermal conduction characteristic, and pyroconductivity is 8W/mk, with super soft characteristic, can press
Any thickness is reduced to, can be kept with the reaction force of very little after certain thickness is suppressed, it is to avoid reaction force is excessive to lead
Cause board deformation.Therefore, heat-conducting daub is provided between board and radiator, for increasing heat transfer area, setting up efficiently low
The heat transfer path of thermal resistance.
Wherein, the height of each electronic component is different, it is also possible to identical, in height not simultaneously as radiator can be passed through
Heat-conducting daub operated pressing tool once suppresses the different heat-conducting glue clod of multiple thickness to meet multiple electronic components and radiator
Connection, therefore can more embody the advantage of the radiator structure and radiator heat conducting gum mud operated pressing tool.
In addition, the fixation between the board and radiator is realized by the self-clinching standoff of screw locking radiator.Pass through
Heat-conducting daub can be suppressed on a heat sink and reach required thickness by above-mentioned operated pressing tool.
Claims (10)
1. a kind of radiator heat conducting gum mud operated pressing tool, it is characterised in that：Including frame, in the frame, horizontal positioned has clay
Mould, the upper plane of the clay mould are provided with the clay cavity for placing clay and the radiating for realizing radiator positioning
Device location structure, the frame are provided with briquetting and the drive being pressed on radiator on clay mould above clay mould
The briquetting lifting drive of briquetting lifting.
2. a kind of radiator heat conducting gum mud operated pressing tool according to claim 1, it is characterised in that：The radiator positioning
Structure is the radiator location hole for being arranged at plane on clay mould, and the radiator is provided with the spiral shell that presses fixed with board
Post, the self-clinching standoff are inserted in radiator location hole.
3. a kind of radiator heat conducting gum mud operated pressing tool according to claim 1, it is characterised in that：The briquetting lifting is driven
Dynamic device includes the guide rail that the briquetting slide block for being fixed and being driven briquetting lifting with briquetting and guiding briquetting slide block are slided up and down, institute
State briquetting slide block and be connected with toggle.
4. a kind of radiator heat conducting gum mud operated pressing tool according to claim 1, it is characterised in that：The frame is provided with
The briquetting guide rod that guiding briquetting is slided up and down.
5. a kind of radiator heat conducting gum mud operated pressing tool according to Claims 1-4 any one, it is characterised in that：Institute
Stating frame includes the base plate of bottom, and the clay mould is removably mounted on base plate.
6. a kind of radiator heat conducting gum mud operated pressing tool according to claim 5, it is characterised in that：The clay mould
Bottom is provided with several mould location holes, and the base plate is provided with correspondence insertion mould location hole so as to realize clay mould the bottom of at
The location guide positioned on plate.
7. a kind of radiator heat conducting gum mud operated pressing tool according to claim 1, it is characterised in that：The clay mould
Surface is provided with teflon coatings or PET release liners.
8. a kind of board radiator structure, including board and a corresponding radiator, the board is provided with and multiple needs radiating
Electronic component, it is characterised in that：Radiator correspondence each electronic component is respectively equipped with heat-conducting glue clod, each electronic component and
Realize the gap filling of board and radiator between radiator respectively by corresponding heat-conducting glue clod.
9. a kind of board radiator structure according to claim 8, it is characterised in that：The height of each electronic component is different.
10. a kind of board radiator structure according to claim 8, it is characterised in that：Between the board and radiator
The fixed self-clinching standoff by screw locking radiator is realized.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620952595.5U CN206042644U (en) | 2016-08-26 | 2016-08-26 | Radiator heat conduction clay presser utensil and integrated circuit board heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620952595.5U CN206042644U (en) | 2016-08-26 | 2016-08-26 | Radiator heat conduction clay presser utensil and integrated circuit board heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206042644U true CN206042644U (en) | 2017-03-22 |
Family
ID=58304281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620952595.5U Withdrawn - After Issue CN206042644U (en) | 2016-08-26 | 2016-08-26 | Radiator heat conduction clay presser utensil and integrated circuit board heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206042644U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106231874A (en) * | 2016-08-26 | 2016-12-14 | 浙江众合科技股份有限公司 | A kind of radiator heat conducting gum mud operated pressing tool and board radiator structure |
| CN108135116A (en) * | 2018-01-26 | 2018-06-08 | 杭州迪普科技股份有限公司 | Radiator structure localization method and electronic equipment |
-
2016
- 2016-08-26 CN CN201620952595.5U patent/CN206042644U/en not_active Withdrawn - After Issue
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106231874A (en) * | 2016-08-26 | 2016-12-14 | 浙江众合科技股份有限公司 | A kind of radiator heat conducting gum mud operated pressing tool and board radiator structure |
| CN106231874B (en) * | 2016-08-26 | 2018-07-13 | 浙江众合科技股份有限公司 | A kind of radiator heat conducting gum mud operated pressing tool and board radiator structure |
| CN108135116A (en) * | 2018-01-26 | 2018-06-08 | 杭州迪普科技股份有限公司 | Radiator structure localization method and electronic equipment |
| CN108135116B (en) * | 2018-01-26 | 2020-10-09 | 杭州迪普科技股份有限公司 | Heat dissipation structure positioning method and electronic equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106231874B (en) | A kind of radiator heat conducting gum mud operated pressing tool and board radiator structure | |
| US20100024667A1 (en) | Pressure-heating apparatus and method | |
| US8526184B2 (en) | Devices having a thermal interface and methods of forming the same | |
| CN206042644U (en) | Radiator heat conduction clay presser utensil and integrated circuit board heat radiation structure | |
| JP2016100512A (en) | Cooling device | |
| CN205926871U (en) | Electronic heat sink soldering lug riveting set of impressing | |
| CN211210305U (en) | Heat dissipation type DCDC voltage converter | |
| CN211403364U (en) | Heat dissipation device for electrical equipment | |
| CN112180237B (en) | Pressing plate heat dissipation structure of test fixture | |
| CN211005682U (en) | Electroplating device for production and processing of computer radiating fins | |
| CN211604927U (en) | Heat-resistant capacitor | |
| CN201138907Y (en) | Housing of electronic device | |
| CN220043759U (en) | Combined printed circuit board | |
| CN210648013U (en) | High-efficient punching device of fin | |
| CN215006532U (en) | Computer machine case heat abstractor with water-cooling function | |
| CN210639546U (en) | Energy-saving and environment-friendly computer device | |
| CN114713727B (en) | Riveting tool and processing equipment | |
| CN210073788U (en) | Radiator silicone grease printing and assembling integrated device | |
| CN210123729U (en) | Radiator fixing device | |
| CN218783930U (en) | Multi-chip integrated circuit packaging structure | |
| CN210579445U (en) | PCBA's heat radiation structure | |
| CN210959276U (en) | Circuit board mounting bracket convenient to dismouting is radiating | |
| CN207070447U (en) | The attachment structure of fin | |
| CN213818635U (en) | Long service life's household electrical appliances controller's circuit board | |
| CN214557271U (en) | Mould embryonic plate in middle of type lid is with porous convenient to installation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20170322 Effective date of abandoning: 20180713 |
|
| AV01 | Patent right actively abandoned |