CN205648335U

CN205648335U - Cloud stick shield assembly

Info

Publication number: CN205648335U
Application number: CN201620263428.XU
Authority: CN
Inventors: 马年云; 王会
Original assignee: Shenzhen Meibeike Technology Co Ltd
Current assignee: Shenzhen Meibeike Technology Co Ltd
Priority date: 2016-03-31
Filing date: 2016-03-31
Publication date: 2016-10-12
Anticipated expiration: 2026-03-31

Abstract

The utility model provides a cloud stick shield assembly, including setting up in cloud stick shell internal energy shielding electromagnetic radiation's shield cover, the shield cover includes the last shield cover of compriseing the metal covering and lower shield cover, the shield cover is inside to set up the PCB board, and the shield cover inboard is provided with carries out radiating heat abstractor and right to the produced heat of part on the PCB board heat conduction is to the conduction reflux unit in the shield cover outside, the conduction reflux unit supplies PCB board and cloud stick shell to carry out earth current return. Implement the technical scheme of the utility model beneficial effect be effectively to promote the ability of cloud stick mainboard heat -sinking capability and the produced radiation of shielding mainboard during operation.

Description

Cloud rod screening arrangement

Technical field

This utility model is applied to cloud rod screening arrangement.

Background technology

A kind of cloud rod with family's cloud storage function, one of which form is to have the metal shell of tubular, such as China Patent CN 204948597 U discloses the heat abstractor of a kind of domestic intelligent equipment with cylindrical case, and described equipment includes Cylindrical case, includes fixed support, fixed support, supports the mainboard being mounted with CPU, described CPU is provided with heat radiation dress in shell Put, it is characterised in that heat abstractor include and inner surface of outer cover be in close contact shell thermal conductive surface, arrange in device some for The radiating groove of heat radiation, the face relative with thermal conductive surface arranges CPU radiating surface, and the both sides, side of described heat abstractor also set up and support Fixing fixing hole and the fixing position of bone.But the shell mechanism of this shape, by current frame mode in terms of heat radiation and radioprotective side Face is less desirable.

Summary of the invention

Cloud rod is less desirable in terms of heat radiation and in terms of radioprotective by current frame mode, Given this problem, it is necessary to Consider that a kind of preferably frame mode solves PCB heat radiation and radioprotective problem, improving product working life and performance, save internal Space, simplifies mounted inside.The heat radiation of cloud rod and the screening arrangement with above-mentioned advantage have a following technical characteristic:

Cloud rod screening arrangement, including shielding the radome of electromagnetic radiation in being arranged at cloud stick housing, described radome bag Including the upper radome being made up of metal cap and lower radome, arrange pcb board inside described radome, it is right to be provided with inside radome On pcb board, the produced heat of part carries out the heat abstractor dispelled the heat and the conduction backflow conducted described heat to radome Device；Described conduction reflux carries out ground connection backflow for pcb board and cloud stick housing.

Described pcb board is inserted in radome, and lower radome 80 passes through screw with upper radome after pushing down pcb board additionally one side Fixing.

Described heat abstractor includes the heat conductive silica gel being fitted in cpu chip and fits tightly with heat conductive silica gel and be arranged on The cpu chip thermal conductive surface of upper radome, described heat abstractor also includes the heat conductive silica gel of DDR chip and is arranged on lower radome On DDR chip thermal conductive surface.

Described conduction reflux, connects on pcb board including being arranged on upper radome and the ground plane of lower radome and arranging Ground copper sheet, described grounding copper skin includes being arranged on the double-edged upper ground connection copper sheet of pcb board and lower ground connection copper sheet.

Implement the technical solution of the utility model to provide the benefit that, can effectively promote cloud rod mainboard heat-sinking capability and shielding The ability of produced radiation during main board work.

Accompanying drawing explanation

Fig. 1 is the decomposition texture schematic diagram of cloud rod screening arrangement of the present utility model.

Fig. 2 is the schematic diagram of Fig. 1 another angle of decomposition texture.

Drawing reference numeral illustrates:

Radome on 10

20 cpu chips

Ground connection copper sheet on 30 PCB

40 times Shielding Case grounding faces

50 CPU heat conductive silica gels

60 DDR heat conductive silica gels

70 DDR thermal conductive surfaces

80 times radomes

90 DDR chips

Ground connection copper sheet under 100 PCB

110 CPU thermal conductive surfaces

Shielding Case grounding face on 120.

Detailed description of the invention

Below in conjunction with accompanying drawing, embodiments of the invention are described in detail, but the present invention can be defined by the claims Implement with the multitude of different ways covered.

As depicted in figs. 1 and 2, cloud rod screening arrangement, including the shielding that can shield electromagnetic radiation in being arranged at cloud stick housing Cover, described radome includes the upper radome that is made up of metal cap and lower radome, arranges pcb board inside described radome, screen Cover and be provided with heat abstractor that heat produced to part on pcb board dispel the heat inside cover and to the conduction of described heat to shielding Conduction reflux outside cover；Described conduction reflux carries out ground connection backflow for pcb board and cloud stick housing.

As depicted in figs. 1 and 2, the operation principle of cloud rod screening arrangement is: CPU heat conductive silica gel 50 is affixed on PCBA cpu chip 20 positions;DDR heat conductive silica gel 60 is affixed on PCBA DDR 90 position;PCBA is inserted in upper radome 10, lower radome by direction 80 push down PCBA additionally one side by direction after fix with upper radome lock screw, make the ground plane 120 and PCBA of radome 10 Upper ground connection copper sheet 30 contact；The ground plane 40 of lower radome 80 contacts with the lower ground connection copper sheet 100 of PCBA；CPU is made to lead Hot silica gel 50 and CPU thermal conductive surface 110 thermal contact conductance of upper radome 10；The DDR making DDR heat conductive silica gel 60 and lower radome 80 leads Hot side 90 thermal contact conductance, upper and lower Shielding Case grounding face is refluxed while shielding electromagnetic radiation in conduction skin-deep with PCBA grounding copper, When also can be worked by PCBA CPU and DDR, produced heat carries out dispersion heat radiation, improving product working life and performance, saves Inner space, simplifies mounted inside.

These are only the preferred embodiments of the present invention, be not limited to the present invention, for those skilled in the art For Yuan, the present invention can have various modifications and variations.All within the spirit and principles in the present invention, any amendment of being made, Equivalent, improvement etc., should be included within the scope of the present invention.

Claims

1. cloud rod screening arrangement, it is characterised in that the radome of electromagnetic radiation can be shielded in including being arranged at cloud stick housing, described Radome includes the upper radome that is made up of metal cap and lower radome, arranges pcb board, inside radome inside described radome Be provided with heat abstractor that heat produced to part on pcb board dispel the heat and to described heat conduction to radome outside Conduction reflux；Described conduction reflux carries out ground connection backflow for pcb board and cloud stick housing.

Cloud rod screening arrangement the most according to claim 1, it is characterised in that described pcb board is inserted in radome, lower shielding Cover (80) is screwed with upper radome after pushing down pcb board additionally one side.

Cloud rod screening arrangement the most according to claim 1, it is characterised in that described heat abstractor includes being fitted in CPU core The heat conductive silica gel of sheet and fit tightly and be arranged on the cpu chip thermal conductive surface of upper radome with heat conductive silica gel, described heat abstractor The heat conductive silica gel also including DDR chip and the DDR chip thermal conductive surface being arranged on lower radome.

Cloud rod screening arrangement the most according to claim 1, it is characterised in that described conduction reflux, including being arranged on Upper radome and the ground plane of lower radome and arrange ground connection copper sheet on pcb board, described grounding copper skin includes just being arranged on pcb board The upper ground connection copper sheet on anti-two sides and lower ground connection copper sheet.