CN208402209U - Heat sinking circuit board and appliance controller - Google Patents
Heat sinking circuit board and appliance controller Download PDFInfo
- Publication number
- CN208402209U CN208402209U CN201821160422.5U CN201821160422U CN208402209U CN 208402209 U CN208402209 U CN 208402209U CN 201821160422 U CN201821160422 U CN 201821160422U CN 208402209 U CN208402209 U CN 208402209U
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- Prior art keywords
- circuit board
- oxide
- type metal
- semiconductor
- patch type
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Abstract
The utility model relates to a kind of heat sinking circuit board and appliance controllers, comprising: circuit board is welded with several patch type metal-oxide-semiconductors thereon, and the side patch of patch type metal-oxide-semiconductor is on circuit boards；Thermal insulation layer is arranged on patch type metal-oxide-semiconductor far from circuit board side.The utility model has many advantages, such as structure simple, good heat dissipation effect, small in size.
Description
Technical field
The utility model relates to a kind of technology of field of circuit boards, specifically a kind of heat sinking circuit board and electric appliance
Controller.
Background technique
General control circuit generallys use direct insertion metal-oxide-semiconductor, and in metal-oxide-semiconductor negligible amounts, it is with cost advantage.But mesh
The functional structure even more complex of preceding electronic device, power requirement is also big, and multiple metal-oxide-semiconductors need to be arranged on circuit boards, use at this time
The problems such as in-line structure will bring heat dissipation difficult.As shown in Figure 1, multiple direct insertion metal-oxide-semiconductors 6 weld on the circuit card 1 vertically,
There are biggish limitation, such radiator structure is difficult to meet the need of heat dissipation for the setting position of metal-oxide-semiconductor and heat radiation structure design
It asks, and vertical structure occupies a large amount of space, is unfavorable for complete machine space utilization.In addition it needs to pass through screw in above-mentioned design
Cooling fin 4, thermal insulation layer 3 and direct insertion metal-oxide-semiconductor 6 are fixed together, when a large amount of screw needs locking to consume production
Between, it is unfavorable for the promotion of production efficiency.
Utility model content
The utility model In view of the above shortcomings of the prior art, proposes a kind of heat sinking circuit board and electric appliance control
Device processed has many advantages, such as that structure is simple, good heat dissipation effect is small in size.
The utility model is achieved through the following technical solutions:
The utility model relates to a kind of heat sinking circuit boards, comprising:
Circuit board is welded with several patch type metal-oxide-semiconductors thereon, and the side patch of patch type metal-oxide-semiconductor is on circuit boards；
Thermal insulation layer is arranged on patch type metal-oxide-semiconductor far from circuit board side.
Preferably, the patch type metal-oxide-semiconductor array is arranged on circuit boards.
Preferably, the thermal insulation layer is an integral structure, whole patch type metal-oxide-semiconductor on covering board.
Heat dissipating layer, the heat dissipating layer, thermal insulation layer and circuit are equipped with far from circuit board side on the thermal insulation layer
Plate is threaded fixation.
As needed, the heat dissipating layer can be product casing, can also be internal set heat radiation fin.
The patch type metal-oxide-semiconductor can be obtained by the direct insertion metal-oxide-semiconductor shaping to existing model, can also be used newly-designed
Model.
The utility model relates to a kind of appliance controllers, including heat sinking circuit board as described above.
Technical effect
Compared with prior art, the utility model realizes stacked structure design, heat dissipation using patch type metal-oxide-semiconductor
Area is big, rapid heat dissipation, realizes the thin type of product, can be used in the fields such as dust collection equipment, electric tool；And circuit board,
Thermal insulation layer and heat dissipating layer, which lead to too small amount of screw, reliably to be fitted together, without passing through screw individually to patch type
Metal-oxide-semiconductor and circuit board are fixed, and simplify technique, improve production efficiency.
Detailed description of the invention
Fig. 1 is prior art construction schematic diagram；
Fig. 2 a is the overall structure diagram of embodiment 1；
Fig. 2 b is the detonation configuration figure of embodiment 1；
Fig. 3 a is the overall structure diagram of embodiment 2；
Fig. 3 b is the detonation configuration figure of embodiment 2；
Fig. 4 is patch type metal-oxide-semiconductor structural schematic diagram；
In figure: circuit board 1, patch type metal-oxide-semiconductor 2, thermal insulation layer 3, cooling fin 4, shell 5, direct insertion metal-oxide-semiconductor 6.
Specific embodiment
The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
Embodiment 1
As shown in Figure 2 a and 2 b, the present embodiment includes:
Circuit board 1 is welded with several patch type metal-oxide-semiconductors 2 thereon, and the side patch of patch type metal-oxide-semiconductor 2 is on the circuit card 1；
Thermal insulation layer 3 is arranged on patch type metal-oxide-semiconductor 2 far from 1 side of circuit board.
2 array of the patch type metal-oxide-semiconductor setting is on the circuit card 1.
The thermal insulation layer 3 is an integral structure, whole patch type metal-oxide-semiconductor 2 on covering board 1.
Cooling fin 4, the cooling fin 4,3 and of thermal insulation layer are equipped with far from 1 side of circuit board on the thermal insulation layer 3
Circuit board 1 is threaded fixation.
As shown in figure 4, the patch type metal-oxide-semiconductor 2 in the present embodiment is obtained by the direct insertion metal-oxide-semiconductor shaping to existing model
It arrives, concrete model TO-220.
Embodiment 2
As shown in Figure 3a and Figure 3b shows, the present embodiment difference from example 1 is that, with product casing 5 substitute radiate
Piece 4 radiates, and simplifies product structure, reduces production cost.
It is emphasized that: the above is only the preferred embodiment of the present utility model, not appoints to the utility model
What formal limitation, any simple modification made by the above technical examples according to the technical essence of the present invention, etc.
With variation and modification, it is still within the scope of the technical solutions of the present invention.
Claims (6)
1. a kind of heat sinking circuit board characterized by comprising
Circuit board is welded with several patch type metal-oxide-semiconductors thereon, and the side patch of patch type metal-oxide-semiconductor is on circuit boards；
Thermal insulation layer is arranged on patch type metal-oxide-semiconductor far from circuit board side.
2. heat sinking circuit board according to claim 1, characterized in that the patch type metal-oxide-semiconductor array is arranged in circuit
On plate.
3. heat sinking circuit board according to claim 1, characterized in that the thermal insulation layer is an integral structure, and is covered
Whole patch type metal-oxide-semiconductor on lid circuit board.
4. heat sinking circuit board according to claim 3, characterized in that far from circuit board side on the thermal insulation layer
Equipped with heat dissipating layer, the heat dissipating layer, thermal insulation layer and circuit board are threaded fixation.
5. heat sinking circuit board according to claim 4, characterized in that the heat dissipating layer is product casing or built-in heat dissipation
Piece.
6. a kind of appliance controller, which is characterized in that including heat sinking circuit board described in any of the above-described claim.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821160422.5U CN208402209U (en) | 2018-07-20 | 2018-07-20 | Heat sinking circuit board and appliance controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821160422.5U CN208402209U (en) | 2018-07-20 | 2018-07-20 | Heat sinking circuit board and appliance controller |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208402209U true CN208402209U (en) | 2019-01-18 |
Family
ID=65128863
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821160422.5U Active CN208402209U (en) | 2018-07-20 | 2018-07-20 | Heat sinking circuit board and appliance controller |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208402209U (en) |
-
2018
- 2018-07-20 CN CN201821160422.5U patent/CN208402209U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |