CN206077819U - A kind of heat-conducting type circuit board - Google Patents
A kind of heat-conducting type circuit board Download PDFInfo
- Publication number
- CN206077819U CN206077819U CN201620847739.0U CN201620847739U CN206077819U CN 206077819 U CN206077819 U CN 206077819U CN 201620847739 U CN201620847739 U CN 201620847739U CN 206077819 U CN206077819 U CN 206077819U
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- CN
- China
- Prior art keywords
- heat
- conducting plate
- insulating barrier
- substrate
- circuit board
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
This utility model is related to a kind of heat-conducting type circuit board, including heat-conducting plate, substrate, insulating barrier, glue layer and copper foil layer；Substrate has been internally embedded heat-conducting plate, one or more first radiating ribs are provided with the top plane of heat-conducting plate, one or more second radiating ribs are provided with the lower, planar of heat-conducting plate, the first radiating ribs are identical with the quantity of the second radiating ribs and position is symmetrically set；The two ends of heat-conducting plate are each provided with a connection sheet, and through hole is provided with connection sheet；Insulating barrier is provided with above substrate, glue layer between substrate and insulating barrier, is provided with, copper foil layer above insulating barrier, is provided with.This utility model production method is simple, and radiating and insulation effect are good, and between each layer, bonding strength is high, and heat-conducting plate can be connected with external heat removal system, and heat radiation function is higher.
Description
Technical field
This utility model is related to printed-board technology field, more particularly to a kind of heat-conducting type circuit board.
Background technology
Currently, the KEY PRODUCTS of printed circuit board industry is heat-conduction circuit board, and the technology development of following heat-conduction circuit board becomes
Will definitely to high radiating, low thermal resistance, incorporate the function directions such as whole system installation and develop.In the competition of heat-conduction circuit board technology,
The competition in Technology will be mainly shown as, high performance-price ratio base can be more realized in the competition in substrate design structure technology, selection
Competition in the application technology of panel material.
In prior art, such as Patent No. 201520462141.5, the applying date is 2015.07.01《Circuit board thermal conductive is tied
Structure》, the utility model simple structure, effectively can save the electronics heat conduction energy complete heat conduction structure for circuit board precision-fit and
Maximum performance heat conduction discharges and control.But the utility model complex structure, radiating effect is not good enough, and manufacturing cost is high, awaits
Further improve.
Utility model content
In view of the above-mentioned state of the art, technical problem to be solved in the utility model is to provide a kind of structure letter
Single, radiating and insulation effect are good, the high heat-conducting type circuit board of bonding strength between each layer.
This utility model solve the technical scheme that adopted of above-mentioned technical problem for：A kind of heat-conducting type circuit board, including leading
Hot plate, substrate, insulating barrier, glue layer and copper foil layer, it is characterised in that：The substrate has been internally embedded heat-conducting plate, described to lead
At least provided with first radiating ribs in the top plane of hot plate, at least provided with one in the lower, planar of the heat-conducting plate
Second radiating ribs；The two ends of the heat-conducting plate are each provided with a connection sheet, are provided with through hole in the connection sheet；The base
Insulating barrier is provided with above plate, glue layer is provided between the substrate and insulating barrier, is provided with above the insulating barrier
Copper foil layer.
Further, material of the heat-conducting plate by thermal conductivity more than 200W/mK is made.
Further, first radiating ribs are identical with the quantity of the second radiating ribs and position is symmetrically set.
Compared with prior art, the utility model has the advantage of：This utility model production method is simple, radiates and insulate
Effect is good, and between each layer, bonding strength is high, and heat-conducting plate can be connected with external heat removal system, and heat radiation function is higher.
Description of the drawings
Fig. 1 is structure chart of the present utility model.
Specific embodiment
As shown in figure 1, a kind of heat-conducting type circuit board, including heat-conducting plate 1, substrate 2, insulating barrier 3, glue layer 4 and copper foil layer
5；Substrate 2 has been internally embedded heat-conducting plate 1, and material of the heat-conducting plate 1 by thermal conductivity more than 200W/mK make；Heat-conducting plate 1
One or more first radiating ribs 11 are provided with the plane of top, be provided with the lower, planar of heat-conducting plate 1 one or more the
Two radiating ribs 13, the first radiating ribs 11 are identical with the quantity of the second radiating ribs 13 and position is symmetrically set；The two of heat-conducting plate 1
End is each provided with a connection sheet 12, and through hole 14 is provided with connection sheet 12；The top of substrate 2 is provided with insulating barrier 3, substrate
Glue layer 4 is provided between 2 and insulating barrier 3, plays a part of connecting substrate 2 and insulating barrier 3；The top of insulating barrier 3 is provided with
Copper foil layer 5.
Finally it should be noted that：Above example only to illustrate the technical solution of the utility model, rather than a limitation；
Although being described in detail to this utility model with reference to the foregoing embodiments, it will be understood by those of skill in the art that its according to
So the technical scheme described in foregoing embodiments can be modified, or which part technical characteristic is replaced on an equal basis
Change；And these modifications or replacement, do not make the essence of appropriate technical solution depart from each embodiment technical scheme of this utility model
Spirit and scope.
Claims (3)
1. a kind of heat-conducting type circuit board, including heat-conducting plate, substrate, insulating barrier, glue layer and copper foil layer, it is characterised in that：It is described
Substrate has been internally embedded heat-conducting plate, at least provided with first radiating ribs in the top plane of the heat-conducting plate, described to lead
At least provided with second radiating ribs in the lower, planar of hot plate；The two ends of the heat-conducting plate are each provided with a connection sheet,
Through hole is provided with the connection sheet；Insulating barrier is provided with above the substrate, is arranged between the substrate and insulating barrier
There is glue layer, above the insulating barrier, be provided with copper foil layer.
2. a kind of heat-conducting type circuit board according to claim 1, it is characterised in that：The heat-conducting plate is more than by thermal conductivity
The material of 200W/mK is made.
3. a kind of heat-conducting type circuit board according to claim 1, it is characterised in that：First radiating ribs and the second radiating
The quantity of muscle is identical and position is symmetrically set.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620847739.0U CN206077819U (en) | 2016-08-08 | 2016-08-08 | A kind of heat-conducting type circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620847739.0U CN206077819U (en) | 2016-08-08 | 2016-08-08 | A kind of heat-conducting type circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206077819U true CN206077819U (en) | 2017-04-05 |
Family
ID=58425066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620847739.0U Expired - Fee Related CN206077819U (en) | 2016-08-08 | 2016-08-08 | A kind of heat-conducting type circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206077819U (en) |
-
2016
- 2016-08-08 CN CN201620847739.0U patent/CN206077819U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170405 Termination date: 20190808 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |