KR102048809B1 - Surface mounted shield device foe shielding EMI - Google Patents

Abstract

Disclosed is a shield device which applies a spreadable thermoelectric element to a shield can for shielding electromagnetic waves to discharge heat provided from a heat generation source, mechanically and electrically couples a shield frame and a shield cover, and is suitable for a low height. The shield device comprises: a shield frame of a metal material whose upper and lower surfaces are opened; a shield cover of a metal material to mechanically couple and cover an upper opening of the frame; and a spreadable thermoelectric element of a putty or a paste form. The frame includes: a side wall of a rectangular ring shape having a through hole formed on a prescribed portion thereof; and a flange bent inwards from an upper end of the side wall. The cover includes: a flat base allowing the thermoelectric element to be affixed to an inner surface thereof; and a side wall bent from an edge of the base to be formed, and provided with embossing protruding inwards at a position thereof corresponding to the through hole of the side wall of the frame. A lower end of the side wall of the frame is soldered onto a circuit board. The embossing of the cover is inserted into the through hole of the frame to be mechanically coupled. The thermoelectric element is spread between the inner surface of the base of the cover and the heat generation source by the coupling to have a constant thickness.

Description

Surface mounted shield device foe shielding EMI

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a shield device for shielding electromagnetic waves, and in particular, by applying a spreadable thermoelectric element to a shield can for shielding electromagnetic waves, it is possible to discharge heat provided from a heat source, and the shield frame and shield cover are mechanically and electrically It relates to shield devices suitable for low heights combined.

As electronic devices and information communication devices are miniaturized and integrated, they are affected by heat, static electricity, and electromagnetic waves. For example, as an electronic component, a microprocessor generates a lot of heat and electromagnetic waves due to an increase in processing speed and a memory semiconductor increases in density as its capacity increases.

Metal shield cans are used to shield electromagnetic waves of electronic components or electronic component modules mounted on printed circuit boards. Looking at the manufacturing process, the metal shield cans are cut and bent using a metal sheet having a uniform thickness. After fabrication of the shielding, the electromagnetic wave is shielded by fixing on the printed circuit board on which the electronic component or the electronic component module desired to be shielded is located.

The application of such a metal shield can causes the release of heat generated from the electronic components or the electronic component modules inside the shield can, thereby forming a vent in a part of the shield can, and the air inside the metal shield can is caused by natural convection or by a fan. By moving through the vent in a forced circulation by the exhaust heat inside the shield can.

However, when a large amount of ventilation holes are formed in consideration of the emission of heat, there is a problem that it is difficult to shield the electromagnetic waves, and if there is less, there is a problem that the circulation of air is difficult.

According to the related art, an upper portion of a shield frame soldered to a heating element, for example, a circuit board on which a semiconductor chip is mounted, is opened, and an edge of the copper foil to which the solid-state thermoelectric element is attached is interposed with an electrically conductive adhesive tape. There is an electromagnetic shielding device in which heat generated in a semiconductor chip is transferred to a copper foil through a thermoelectric element by adhering to an upper edge and covering an opening.

However, according to this technique, since the solid-state thermoelectric element is difficult to spread by pressurization, it is difficult for the thermoelectric element to reliably contact the heating element, so that reliable and efficient heat transfer is difficult.

In addition, since it is difficult for the thermoelectric element to be reliably adhered to the heating element only by the adhesive force of the adhesive tape itself, it is difficult to reliably transfer heat from the heating element to the copper foil as a result.

In addition, since the adhesive tape adheres to the edge of the shield frame, it is easy to fall off at high temperature, high humidity, and low temperature, so that it is difficult to reliably bond, and the adhesive tape changes in adhesive force when it is used once and then used again. ) Is difficult and the thermal conductivity is poor, the heat conduction is bad.

In addition, the thickness of the adhesive tape is difficult to manufacture to a certain thickness or more, so the overall mechanical strength is weak, and even if pressurized by vacuum pick-up and place, it is difficult for the solid-state thermoelectric element to reliably contact the heating element. The disadvantage is that heat is difficult to be sufficiently transferred to the conductive tape through the thermoelectric element.

It is therefore an object of the present invention to provide a surface mount shield device suitable for low heights where the shield frame and shield cover are mechanically and electrically coupled.

Another object of the present invention is to provide a surface-mounted shield device capable of cooling and rapidly transferring heat generated from a heat generating source while excellent in electromagnetic shielding.

It is a further object of the present invention to provide a surface mount shield device which is reel taped and which is reliable and easy to mount by vacuum pick-up and thus a place.

It is another object of the present invention to provide a surface mount shield device which is mechanically coupled and which is easy to repair.

According to an aspect of the present invention, there is provided a surface mount type electromagnetic shield device comprising: a shield frame made of a metal material having an upper surface and a lower surface opened; A shield cover made of metal covering the upper opening of the frame and being mechanically coupled; And a thermoelectric element adhered to the inner surface of the cover by a self-adhesive force and provided with a spreadability, wherein the thermoelectric element has a viscosity to create the spreadability, spreads on the heat generating source with spreadability according to the viscosity, and covers the cover. When coupled to the frame, the thermoelectric element is spread by the spreadability on the surface of the heating source so that the thermoelectric element is in contact with the inner surface of the cover and the surface of the heating source, respectively.

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Preferably, the thermoelectric element may be interposed so as to have a uniform thickness between the cover and the heating source by spreading widely on the inner surface of the cover by a force for mechanically coupling the cover to the frame.

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Preferably, the mechanical strength of the frame is a large mechanical strength of the cover, the thermal conductivity of the frame may be lower than the thermal conductivity of the cover.

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According to another aspect of the present invention, there is provided a surface mount type electromagnetic shield device comprising: a shield frame made of a metal having an upper surface and a lower surface thereof opened; A shield cover made of metal covering the upper opening of the frame and being mechanically coupled; A first thermoelectric element adhered to the inner surface of the cover by self adhesive force and provided with a spreadability; And a second thermoelectric element adhered to an outer surface of the cover and having a higher viscosity than the first thermoelectric element and a poor spreadability, wherein the first thermoelectric element has a viscosity to make the spreadable property and the spreadability according to the viscosity. Spreading on a heating source, and when the cover is coupled to the frame, the first thermoelectric element is spread by the spreadability on the surface of the heating source so that the first thermoelectric element contacts the inner surface of the cover and the surface of the heating source, respectively It is interposed.

Preferably, the upper surface of the second thermoelectric element is in pressure contact with an opposing metal case, and the second thermoelectric element transfers heat from the cover to the metal case.

Preferably, at least one sorting hole is formed or marked at the base edge of the cover to sort the direction during reel taping and inspection, and the flange of the frame may block the sorting hole at the bottom.

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Preferably, the frame is reel taped and soldered by a vacuum pick-up and a place according thereto, and the cover is reel taped so that the thermoelectric element can be spread while being coupled to the frame by vacuum pick-up and a place accordingly.

According to the above configuration, the shielded structure is a closed structure suitable for a low height in which the shield frame and the shield cover are mechanically and electrically coupled, so that the shield device has good electromagnetic shielding effect, and a thermoelectric element having a spreadable property is adhered to the lower surface of the shield cover. The shield device is easy to dissipate heat generated from the exothermic source to the cooling source because the exothermic source can contact the exothermic source.

In addition, the reel taped frame with space for vacuum pick-up can be surface mounted reliably and economically, and the reflow soldering of the frame with the upper opening enables the inspection of the appearance of other parts without affecting the reflow soldering of other parts. can do.

In addition, the reel taped cover, which has a space for vacuum pickup, can be reliably and economically coupled to the frame by the pressure applied during surface mounting, and in particular, the frame and the cover are reliable by inserting the protrusions formed in the cover into the holes formed in the frame. Mechanically and electrically coupled.

In addition, the thermoelectric element having the spreadability is adhered to the lower surface of the cover, and then the cover is vacuum picked up and placed while applying force while spreading the thermoelectric element between the cover and the heat generating source to facilitate workability and uniform spreadability. have.

In addition, the shield frame provides mechanical strength to the shielding device by using a material having high mechanical strength, and the lower bottom portion of the shield frame is well soldered by solder cream, so that reflow soldering is easy, and the shield cover has good thermal conductivity. Copper or copper alloy is good thermal conductivity can transfer heat of the thermoelectric element well.

In addition, since the shield frame and the shield cover can be attached and detached by the pressure applied to the cover, the attachment and detachment are easy and thus the repair is also easy.

1 (a) and 1 (b) are a partially exploded perspective view and a bottom view respectively showing a shielding apparatus according to an embodiment of the present invention.
2 (a) and 2 (b) show before and after assembling the shield device of FIG. 1, respectively.
3 (a) and 3 (b) are partial exploded perspective and bottom views respectively showing a shielding apparatus according to another embodiment of the present invention.
4 (a) and 4 (b) show before and after assembling the shield device of FIG. 3, respectively.
5 is a perspective view showing a shield device according to another embodiment of the present invention.

Technical terms used in the present invention are merely used to describe specific embodiments, it should be noted that it is not intended to limit the present invention. In addition, the technical terms used in the present invention should be interpreted as meanings generally understood by those skilled in the art unless the present invention has a special meaning defined in the present invention, and is excessively comprehensive. It should not be interpreted in the sense of or in the sense of being excessively reduced. In addition, when a technical term used in the present invention is an incorrect technical term that does not accurately express the spirit of the present invention, it should be replaced with a technical term that can be properly understood by those skilled in the art. In addition, the general terms used in the present invention should be interpreted as defined in the dictionary or according to the context before and after, and should not be interpreted in an excessively reduced sense.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 (a) and 1 (b) are partially exploded perspective and bottom views respectively showing a shielding apparatus according to an embodiment of the present invention, Figures 2 (a) and 2 (b) is a shielding device of FIG. It shows before and after assembly.

The shield device 100 is mounted on the circuit board 10 to cover the electronic component or module 20 (hereinafter, referred to as a heat source) that generates heat, and emits heat generated from the heat source 20 and shields electromagnetic waves. Used.

The shield device 100 is a metal material that covers and mechanically couples the upper and lower surfaces of the shield frame 110 and the upper opening of the shield frame 120 where the upper and lower surfaces are open and the lower edge is soldered to the circuit board 10. Shield cover 120, and a thermoelectric element 130 adhered to an inner surface of the shield cover 120.

Here, the term “opening” refers to a heat source that is accommodated inside the shield frame 110, for example, an entrance that is open to an extent that allows the external inspection of the semiconductor chip 110.

<Shield frame 110>

The frame 110 may be formed by cutting and bending a metal sheet by pressing, or may be formed by deep drawing, and may be made of a solderable metal.

When the frame 110 is made of a sheet of copper or copper alloy, even if the plated nickel, which is inexpensive on the entire surface of the sheet but does not have good reflow soldering by solder cream, to prevent corrosion of the outer surface of the sheet, Reflow soldering with solder cream is possible because the copper or copper alloy sheet is exposed at the bottom of the sidewalls.

The frame 110 is formed in a rectangular ring shape and has a lower end sidewall 111 soldered to the circuit board 10 and a flange 112 having a constant width bent inward from an upper end of the sidewall.

Since the shield device 100 of the present invention is applied to a low height, the height of the side wall 111 of the frame 110 may correspond to about 0.3 mm to 3 mm.

A seating portion 124 having a wider width than the flange 112 is formed in the middle of each side wall to stably support the cover 120 while providing a pickup space for vacuum pickup. Unlike this embodiment, the seating portion 124 may be further formed at each corner.

A through hole 113 is formed in the middle portion of each sidewall 111 of the frame 110, and as will be described later, the emboss 123 of the cover 120 is detachably fitted. Naturally, a plurality of through holes 113 and a plurality of embosses 123 may be formed in order to increase the bonding force, and the same number is preferable for the balance between the side walls.

The size and shape of the through-hole 113 can be designed in various ways, as shown in Figure 1, when formed in a rectangle having a larger horizontal length and the same or similar length than the size of the emboss 123, emboss 123 When inserting into the through hole 113, to overcome the dimensional tolerances in the transverse direction so that the embossed 123 enters well into the through hole 113, and less shaking due to mechanical coupling in the longitudinal direction.

The thickness of the frame 110 and the cover 120 to be described later may be about 0.1 mm to 0.3 mm, the mechanical strength of the frame 110 is a large mechanical strength of the cover 120, the thermal conductivity of the heat of the cover 120 It may be lower than the conductivity.

The lower end of the frame 110 is not formed in a plane, irregularities are formed, for example, the protruding portion is soldered and the non-protruding portion is not soldered, and consequently, the protruding portion is not flat because the lower end of the frame 110 is bent. This soldering results in reliable soldering of the shield device.

<Shield cover 120>

The shield cover 120 is integrally formed with a flat base 121 and a side wall 122 having a predetermined height bent along the edge of the base 121 for the vacuum pickup.

The cover 120 may be made of copper, copper alloy, aluminum or aluminum alloy.

As shown in FIG. 1, the cover 120 is fitted to the outside to surround the frame 110, and for this purpose, a position corresponding to the through hole 113 of the frame 110 in the side wall 122 of the cover 120 is provided. The emboss 123 protrudes inward.

The base 121 of the cover 120 and the flange 111 of the shield frame 110 may be mechanically in direct contact with each other so that electromagnetic shielding and heat transfer may be performed reliably and efficiently. It is necessary to appropriately adjust the position at which the emboss 123 is formed with respect to the position at which the through hole 113 is formed.

The side wall 122 of the cover 120 may be separated at each corner. According to this structure, the cover 120 is centered on the separated portion of the corner when the cover 120 is fitted to surround the frame 110 by an external force. The side wall 122 of the 120 may open or contract to fit well to the outside of the side wall 112 of the frame 110.

One or more sorting holes may be formed or marked at the edge of the base 121 of the cover 120 to sort the direction during reel taping and inspection, and the sorting holes may be formed on the flange 111 of the frame 110. Because it is located, electromagnetic waves do not enter or exit through the screening hole.

<Thermoelectric element 130>

The thermoelectric element 130 is adhered to at least a portion of the inner surface of the base 121 of the cover 120 by the self-adhesive force of the thermoelectric element 130. The thermoelectric element 130 may be applied by dispensing or printing and is applied during the process. The amount and shape of the device 130 can be adjusted.

In this embodiment, the thermoelectric element 130 is applied to approximately the center portion of the base 121, the inner surface of the base 121 is not coated with the thermoelectric element 130 and inside the side wall 111 of the frame 110 The electromagnetic wave absorber for high frequency absorption may be attached.

1 (b) is applied in a hemispherical shape or a three-dimensional shape in which the central portion is slightly raised so that the cover 120 is pushed from the center portion to the edge while being subjected to a force when the cover 120 is fitted into the frame 110 and mechanically engaged. It can be made to have a uniform thickness without bubbles to form by pushing or push.

When the thermoelectric element 130 covers the upper surface of the heating source 20 much, it is natural that the heat of the heating source 20 is quickly and largely transferred to the cover 120 through the thermoelectric element 130. When too much is applied, the thermoelectric element 130 may spread from the top surface of the heat generating source 20 while spreading.

Therefore, the amount of the thermoelectric element 130 to be applied, considering the volume of space (hereinafter referred to as reference volume) formed between the heat generating source 20 and the inner surface of the base 121 of the cover 120 by the initial design Can be determined. For example, the thermoelectric element 130 may be evenly spread by external forces due to surface mounting and soldering to cover approximately 80% or more of the upper surface of the heat generating source 20 about the central portion of the heat generating source 20. It can be applied as.

As such, since the amount of the thermoelectric element 130 applied to the inner surface of the base 121 of the cover 120 may be determined in consideration of the reference volume, the structure of the shield device 100 may be simple and easy to manufacture.

The thermal element 130 may be any one of a thermally conductive powder such as alumina or a silicone rubber or acrylic resin having a self-adhesive force in which thermally conductive fibers are uniformly mixed. The thermal conductivity may be 1 W or more and may be electrical insulation.

The thermoelectric element 130 has viscosity and may be spread or flow by external force applied in the vertical direction or rotational force on a horizontal plane by flowability and spreadability according to viscosity. Here, the external force refers to the force that the base 121 of the cover 120 presses the heating source 20 during the process in which the cover 120 is mechanically coupled to the frame 110.

The thermal element 130 may be in a thermally conductive paste or a thermally conductive clay or a putty having a high viscosity, or in a thermally conductive paste having an intermediate viscosity.

Here, viscosity is a qualitative expression of the inherent cohesion (charging and sticking property of the material), ie the property of the fluid elements to stick together or the internal resistance of the fluid against fluid motion, and the viscosity (viscosity, Viscosity coefficient, viscosity rate) refers to a quantitative value indicating the degree of resistance to the fluid, and usually, the greater the viscosity of the fluid, the greater the viscosity and resistance.

'High viscosity' refers to a viscosity that is relatively larger than the commonly known 'toothpaste' as a medium viscosity, and does not flow when kept horizontally at room temperature while being discharged to a plane using a syringe. Maintaining the shape, but when pressed with a slight force in the up and down direction is defined to mean the degree of viscosity that can spread in various directions, including the horizontal direction.

'Medium viscosity' maintains a shape that flows very small when kept horizontally at room temperature while being discharged to a plane using a syringe, but is easily spread in various directions including the horizontal direction when pressed with a small force in the vertical direction The viscosity of is defined to mean approximately.

It is difficult to express the definition of 'high viscosity' in numbers, so the Dispensable Gap Filler (trade name Tputty 508) of the US Lair Tech. (Www.lairdtech.com) is an example of flow instead of viscosity. When the flow rate is 75cc taper tip, 0.125 "orifice, 40psi, it can be indicated as 50g / min.

In addition, the term 'medium viscosity' may be interpreted to mean a viscosity of about 1,500,000 cps or more and 'high viscosity' or less.

The thermoelectric element 130 has a high viscosity or a medium viscosity, and has flowability and spreadability (commonly referred to as flowability), and is then adhered to the shield frame 110 to which external force is applied. If it is not supported, it is not easily separated.

The thermoelectric element 130 may be self-adhesive to an object to be contacted by having flowability and self-adhesive force according to its own viscosity. In other words, the adhesive may have a sticky self adhesiveness due to the viscosity of the acrylic resin or the silicone rubber constituting the thermoelectric element 130.

Hereinafter, the process of assembling the shield apparatus 100 is demonstrated.

The shield frame 110 is placed on the solder cream 14 on the solder land 12 of the circuit board 10 by vacuum pick-up by a pick-up tool to surround the heat generating source 10. Solder with reflow.

When the reflow soldering is completed and the molten solder is cooled, the cover 120 is vacuum picked up and placed on the flange 111 of the frame 110 to press the cover 120 to cover the frame 110.

As the cover 120 is moved in the vertical direction by an external force, the cover 120 is elastically fitted into the through hole 113 of the frame 110 while the emboss 123 of the cover 120 is elastically fitted to the frame 110. ) Is combined.

In this process, since the thermoelectric element 130 coated on the inner surface of the base 121 of the cover 120 has a viscosity, the thermoelectric element 130 may have a viscosity, and thus the cover 120 may be coupled to the frame 110 with flowability and spreadability. It spreads by pressurizing contact with the heat generating source 20 by the force.

As illustrated in FIG. 2A, the cover 120 is framed in a state in which the first thermoelectric element 130 is attached to the shield frame 110 in a smaller area than the top surface of the heat generating source 20 in response to the heat generating source 20. By the force applied to couple to 110, as shown in Figure 2 (b), it can be seen that the thermoelectric element 130 has a uniform thickness while spreading in the horizontal direction as shown by the arrow.

In this case, the thermoelectric element 130 may spread to cover the heating source 20 and flow down to cover the substrate 10, or may be spread only to a part of the heating source 20.

As a result, the thermoelectric element 130 spreads and is interposed between the cover 120 and the heating source 20 to contact the cover 120 and the heating source 20, respectively, so that the heat generated from the heating source 20 is generated. Effectively and reliably delivered to the cover 120 through the 130.

As such, the heat generated from the heat generating source 20 may be directly transmitted to the shield cover 120 having good thermal conductivity through the thermoelectric element 130 to be released from the cover 120.

In addition, since the emboss 123 of the cover 120 is mechanically coupled to the through hole 113 of the frame 110, the frame 110 and the cover 120 are electrically connected to each other and mechanically sealed to shield the electromagnetic waves. Is enough.

In addition, the frame 110 and the cover 120 may be mechanically coupled by the emboss 123 and the through hole 113 to be detachable, and then repaired.

3 (a) and 3 (b) are partial exploded perspective and bottom views respectively showing a shielding apparatus according to another embodiment of the present invention, and FIGS. 4 (a) and 4 (b) respectively show the shielding apparatus of FIG. 3. It shows before and after assembly.

In this embodiment, only differences from the above-described embodiment will be described.

According to this embodiment, the shield cover 220 is designed to cover only the opening of the shield frame 210 and is composed of only a flat base 221 having a rectangular shape, and the emboss 223 is formed at the center of each side of the base 221. ) Is projected downward.

In addition, the flange 212 of the frame 210 is discontinuously formed, and the through hole 213 is formed at a position corresponding to the emboss 223 of the base 221 of the cover 220.

Accordingly, when the cover 220 is pressed and pressed from above, the emboss 223 of the cover 220 is fitted into the through hole 213 of the flange 212 of the frame 210 to be elastically coupled.

5 is a perspective view showing a shield device according to another embodiment of the present invention.

This embodiment shows a case where the shield device 100 of FIG. 1 is applied.

In the shield device 300, another thermoelectric element 230 is adhered to upper surfaces of the bases 121 and 221 of the shield covers 120 and 220.

The thermoelectric element 230 may be, for example, elastic and have no self-adhesive force on the upper surface, or may be picked up with a very small amount, and may have a self-adhesive force only on the lower surface, and thus have an upper surface of the bases 121 and 221 of the shield covers 120 and 220. It can stick to

In the shield device 300 according to this embodiment, the thermoelectric element 230 is in contact with a metal case for cooling, and heat generated from the heat generating source 20 is transferred to the base 121 of the thermoelectric element 130-shield covers 120 and 220. 221)-other thermoelectric element 230-can be quickly released through the metal case.

The thermoelectric element 230 may have a higher viscosity than the thermoelectric element 130 to be easily handled and processed, and may have a poor flowability because it is not important to spread.

The thermoelectric element 230 may be formed by casting and curing a liquid thermally conductive silicone rubber on a metal sheet, or by adhering on the bases 121 and 221 of the shield covers 120 and 220.

The shield device 100, 200, 300 of the present invention is easy to be applied to the shield device of relatively small dimensions used in smart phones, etc., where a lot of heat and electromagnetic waves are generated in a small area and the quantity is relatively high, in particular, the height is high compared to the width and width. Easy to apply to low shield devices.

The shield devices 100, 200, and 300 may be reel taped to a carrier and automatically mounted on a substrate by a surface mount facility (SMT equipment).

The foregoing will be apparent to those skilled in the art that modifications and variations may be made without departing from the essential features of the invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention but to describe the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of the present invention.

100, 200, 300: shield device
110, 210: shield frame
111: sidewall
112: flange
113: through hole
114: seating part
120, 220: shield cover
121: base
122: sidewall
123: emboss
130, 230: thermoelectric element

Claims (16)

An electromagnetic shielding device used to shield electromagnetic waves by wrapping a heating source mounted on a circuit board.
The shield device,
A shield frame made of metal having an upper surface and a lower surface opened;
A shield cover made of metal covering the upper opening of the frame and being mechanically coupled; And
It includes a thermoelectric element adhered to the inner surface of the cover by a self-adhesive force and has a spreadability,
The mechanical strength of the frame is greater the mechanical strength of the cover, the thermal conductivity of the frame is lower than the thermal conductivity of the cover,
The thermoelectric element has a viscosity that makes the spreadability, spreads on the heat generating source with spreadability according to the viscosity,
When the cover is coupled to the frame, the thermoelectric element is spread by the spreadability on the surface of the heat generating source so that the thermoelectric element is in contact with the inner surface of the cover and the surface of the heat generating source, respectively, interposed. Type shield device. delete delete In claim 1,
The thermoelectric element is a surface-mounted shield, characterized in that the cover is spread so as to have a uniform thickness between the cover and the heat generating source by a force for mechanically coupling the cover to the frame; Device. In claim 1,
One or more sorting holes are formed or marked on the base edge of the cover to select the direction during reel taping and inspection.
And a flange of the frame blocks the sorting hole at the bottom. delete delete delete delete delete An electromagnetic shielding device used to shield electromagnetic waves by wrapping a heating source mounted on a circuit board.
The shield device,
A shield frame made of metal having an upper surface and a lower surface opened;
A shield cover made of metal covering the upper opening of the frame and being mechanically coupled;
A first thermoelectric element adhered to the inner surface of the cover by self adhesive force and provided with a spreadability; And
A second thermoelectric element adhered to an outer surface of the cover and having a higher viscosity and a worse spreadability than the first thermoelectric element,
The first thermoelectric element has a viscosity that makes the spreadability, and spreads on the heat generating source with the spreadability according to the viscosity,
When the cover is coupled to the frame, the first thermoelectric element is spread by the spreadability on the surface of the heating source so that the first thermoelectric element is in contact with the inner surface of the cover and the surface of the heating source, respectively. Surface mount type shielding apparatus. In claim 11,
The top surface of the second thermoelectric element is a surface-mounted shield device, characterized in that there is no or very little self-adhesive force for the vacuum pickup. In claim 11,
And the upper surface of the second thermoelectric element is in pressure contact with an opposing metal case, and the second thermoelectric element transfers heat from the cover to the metal case.
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