CN205266006U

CN205266006U - Multi -layer PCB board

Info

Publication number: CN205266006U
Application number: CN201521041157.5U
Authority: CN
Inventors: 林能文; 李伟东; 杨带平; 黄增江; 廖宏芳; 谢军里; 洪阳; 林晓红; 丘远洪; 冯加玲; 李柳琴
Original assignee: GUANFENG ELECTRONIC SCIENCE AND TECH (MEIZHOU) Co Ltd
Current assignee: Guangdong crown Polytron Technologies Inc
Priority date: 2015-12-15
Filing date: 2015-12-15
Publication date: 2016-05-25
Anticipated expiration: 2025-12-15

Abstract

The utility model provides a multi -layer PCB board, includes the base plate, periphery and four side covers of PCB board have the metal shroud plate, there is the circuit layer above the base plate, there is insulating heat transfer layer below the base plate no. One, there is the metal substrate below the insulating heat transfer layer, the metal shroud plate with metal substrate zonulae occludens, laminating mutually, the metal shroud plate with the metal substrate joinable is to the metal casing of electronic product. There are louvre and circuit through -hole on the PCB board, there is insulating heat transfer layer in the circuit through -hole no. Two, no. Two insulating heat transfer layer goes up porose internal electric circuit layer, the circuit through -hole with no. Three equal insulating heat transfer layer all around of the department of meeting of metal substrate. The utility model discloses heat conduction is good, and antistatic effect is strong to the cutting is not had the fracture, is not stuck up the limit problem, and simple process saves metal substrate, practices thrift the cost.

Description

A kind of multi-layer PCB board

Technical field

The utility model relates to pcb board, in particular to a kind of multi-layer PCB board.

Background technology

Present pcb board is required of efficiently, precision, most advanced and sophisticated, and this just makes the distance between the components and parts on PCB reduce, and the sensitivity of electronic devices and components rises. The components and parts of pcb board can produce each other in the course of the work static and also have the problem of generating heat simultaneously. More and more less in electronic product inner space, topology layout is more and more tightr, the electronic product heat that pcb board produces in the time of work cannot be distributed preferably, easily cause pcb board at high temperature to work for a long time, cause the temperature rise of pcb board cannot meet corresponding standard value, affect the reliability of its work, finally shorten the service life of whole electronic product.

Static for circuit board be damage very large. Exceeding it uses voltage and current can cause the breakdown or internal connection line of components and parts to occur adhesion. Except the infringement for components and parts on circuit board, maximum infringement is exactly that high-pressure electrostatic easily produces electrostatic field, and electrostatic field is easy to adsorb the materials such as dust, these materials will conduct electricity after having absorbed airborne moisture, and this will cause circuit board short circuit. If circuit board itself is with high voltage, high electric current, short circuit will form high temperature so, makes the scolding tin on circuit board occur melting, and forms more large-area short circuit, and final high temperature can cause circuit board to burn. Meticulousr and frequent instruments with high voltage and high current for some, the harm of static is also very large.

Application number is 201320199457.0, Granted publication day is on October 15th, 2013, the utility model patent that name is called " a kind of pcb board " discloses a kind of pcb board, comprise substrate, described substrate is overrided to form by polylith sheet sheet material, each described sheet sheet material surrounding side is also provided with a metal level, and described metal level is connected with the copper sheet district of described line layer. Pcb board provided by the utility model, in side, surrounding is provided with metal level, and this metal level is connected with the copper plated area in line layer on pcb board, the surrounding of the sheet sheet material of the every one deck of pcb board is wrapped up by metal level, and this metal level has expanded the area of dissipation of pcb board, and can contact with metalwork is installed, thereby faster the heat of PCB is transmitted on installed part and be distributed, make pcb board heat conducting quicker; Simultaneously; this metal level is connected with copper plated area; to playing certain protective effect with the line areas of line layer; pcb board and the contact area that metalwork is installed are increased; thereby increase the contact area of pcb board; therefore; improve the anti-ESD ability of pcb board; but this pcb board has just plated layer of copper in four sides of plate, the content of copper is few; heat-conducting effect is limited; and the anti-EDS ability that the copper of side plays can only realize by being connected on metal shell, and because copper facing amount is few, so static conducting power is very limited.

And the good metal-based circuit board of heat conduction, aluminium base has sawing sheet and point panel edges is easy to crack, alice, and the beer plate of post-production and gong plate are prone to the situation of layering, complex manufacturing technology, high in cost of production problem.

So, need exploitation a kind of, technique is simple, and cost is low and have good heat conductivility and a pcb board of antistatic property.

Utility model content

In order to solve traditional pcb board poor thermal conductivity, the problem that antistatic effect is poor, the utility model provides a kind of multi-layer PCB board.

A kind of multi-layer PCB board, comprise substrate, the periphery of described pcb board and four side covers have metal skin plates, above described substrate, there is circuit layer, have thermal insulation layer No. one below described substrate, have metal substrate below a described thermal insulation layer, on described pcb board, there are louvre and circuit through hole, in described circuit through hole, there is No. two thermal insulation layer, porose interior circuit layer on described No. two thermal insulation layers, the joint of described circuit through hole and described metal substrate has thermal insulation layer No. three.

More excellent, described metal skin plates is closely connected with described metal substrate, laminating mutually, and described metal skin plates and described metal substrate can be connected on the metal shell of electronic product.

More excellent, a described thermal insulation layer, described No. two thermal insulation layers and described No. three thermal insulation layers comprise insulating heat-conductive resin or heat conductive silica gel.

More excellent, described metal substrate can be made up of copper, aluminium or iron.

Hence one can see that, the utility model heat conduction is good, antistatic effect is strong, by thermal insulation layer connection substrate and metal substrate are set, the heat of substrate is transmitted on metal substrate, is closely connected with metal substrate by metal skin plates is set, mutually laminating parcel pcb board, make pcb board heat radiation faster, and improve its antistatic effect.

Brief description of the drawings

In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skill in the art, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.

Fig. 1 is cutaway view of the present utility model;

Fig. 2 is structural representation of the present utility model.

Detailed description of the invention

Below in conjunction with the accompanying drawing in the utility model, the technical scheme in the utility model is clearly and completely described, obviously, described is only the utility model part embodiment, instead of whole embodiment. Based on the embodiment in the utility model, the every other embodiment that those of ordinary skill in the art obtain under the prerequisite of not making creative work, belongs to the scope that the utility model is protected.

As Fig. 1, shown in 2, a kind of multi-layer PCB board, comprise substrate 6, the periphery of pcb board and four side covers have metal skin plates 1, substrate 6 has circuit layer 3 above, substrate 6 has No. one thermal insulation layer 7 below, No. one thermal insulation layer 7 has metal substrate 8 below, metal substrate 8 can be by copper, aluminium or iron composition, metal substrate 8 is closely connected with metal skin plates 1, laminating mutually, metal skin plates 1 and metal substrate 8 can be connected on the metal shell of electronic product, on pcb board, there are louvre 2 and circuit through hole, in circuit through hole, there is thermal insulation layer 5 No. two, porose interior circuit layer 4 on No. two thermal insulation layers 5, the surrounding of the joint of circuit through hole and metal substrate 8 has thermal insulation layer 9 No. three, a thermal insulation layer 7, No. two thermal insulation layers 5 and No. three thermal insulation layers 9 comprise insulating heat-conductive resin or heat conductive silica gel.

Operation principle of the present utility model, the synthetic large plate of the general multiple plates of pcb board is processed, while dividing plate, the plate of metal substrate 8 is faced up and cut, can avoid the marginicidal problem of metal substrate 8, the metal skin plates 1 after well cutting, size being harmonious is inserted in pcb board, with tin etc., the pin of electronic devices and components is welded in the hole of circuit through hole on circuit layer 4, after installing, can be used for the encapsulation of next step electronic product, if the shell of electronic product is metal shell, can metal skin plates and metal substrate be connected on the metal shell of electronic product according to the suitable position of design alternative, then by metal shell ground connection, make static be transferred to ground, make electronic product form a good earthing effect, thereby improve the antistatic effect of electronic product complete machine, if the shell of electronic product is non-conductive, because metal skin plates and metal substrate are arranged on the surrounding of circuit board, when the static on components and parts is crossed when strong, static will be discharged in metal skin plates, electrostatic dispersion in metal skin plates is to metal substrate, static is disperseed more, in the time that air humidity is slightly high, can import in air, also the circuit of pcb board has been played to very large protective effect. in long-term work process, pcb board temperature raises, and these heats can be transferred on the metal substrate 8 of heat conductivility excellence by the good thermal insulation layer 7 of heat conduction, metal substrate 8 and metal skin plates 1 are combined closely, so heat dispersibles in metal skin plates, realize more large-area heat radiation, rapid heat dissipation, the louvre 2 on pcb board has also strengthened heat dispersion.

Known by above description, the utility model heat conduction is good, and antistatic effect is strong, by thermal insulation layer connection substrate and metal substrate are set, the heat of substrate is transmitted on metal substrate, is closely connected with metal substrate by metal skin plates is set, mutually laminating parcel pcb board, make pcb board heat radiation faster, and improve its antistatic effect, and cutting nothing ftractures, alice problem, technique is simple, save metal base, cost-saving.

Above content is in conjunction with concrete preferred embodiment further detailed description of the utility model, can not assert that concrete enforcement of the present utility model is confined to these explanations. For the utility model person of an ordinary skill in the technical field, without departing from the concept of the premise utility, can also do some simple deduction or replace, all should be considered as belonging to protection domain of the present utility model.

Claims

1. a multi-layer PCB board, comprise substrate, it is characterized in that, the periphery of described pcb board and four side covers have metal skin plates, above described substrate, there is circuit layer, below described substrate, there is thermal insulation layer No. one, below a described thermal insulation layer, there is metal substrate, on described pcb board, there are louvre and circuit through hole, in described circuit through hole, there is No. two thermal insulation layer, porose interior circuit layer on described No. two thermal insulation layers, the joint of described circuit through hole and described metal substrate has thermal insulation layer No. three.

2. a kind of multi-layer PCB board according to claim 1, is characterized in that, described metal skin plates is closely connected with described metal substrate, laminating mutually, and described metal skin plates and described metal substrate can be connected on the metal shell of electronic product.

3. a kind of multi-layer PCB board according to claim 1, is characterized in that, a described thermal insulation layer, described No. two thermal insulation layers and described No. three thermal insulation layers comprise insulating heat-conductive resin or heat conductive silica gel.

4. a kind of multi-layer PCB board according to claim 1, is characterized in that, described metal substrate can be made up of copper, aluminium or iron.