CN203884067U - Multilayer printed circuit board (PCB) with novel insulation structure - Google Patents
Multilayer printed circuit board (PCB) with novel insulation structure Download PDFInfo
- Publication number
- CN203884067U CN203884067U CN201420205221.8U CN201420205221U CN203884067U CN 203884067 U CN203884067 U CN 203884067U CN 201420205221 U CN201420205221 U CN 201420205221U CN 203884067 U CN203884067 U CN 203884067U
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- multilayer printed
- line layers
- multilayer pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000009413 insulation Methods 0.000 title claims abstract description 14
- 230000005855 radiation Effects 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 13
- 230000004888 barrier function Effects 0.000 claims description 8
- 239000006185 dispersion Substances 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model discloses a multilayer PCB with a novel insulation structure, belonging to the technical field of multilayer PCB. The multilayer PCB comprises more than two line layers, and an insulation layer is arranged between every two adjacent line layers. The multilayer PCB is characterized in that the insulation layer includes a radiating cavity structure which is enclosed by insulating panels, a radiating cavity is filled with a radiating material, and the height of the radiating cavity ranges from 0.08mm to 0.12mm. According to the multilayer PCB of the utility model, heat generated during work of the line layers can be taken away to the air by the radiating cavity and the radiating material therein, the radiating cavity can ensure different portions of the line layers are capable of heat radiation, and thus, the temperature of the line layers can be comprehensively reduced, chips and other materials on the line layers are avoided from overheat, and the heat radiation performance of the multilayer PCB is improved.
Description
Technical field
The utility model relates to a kind of multilayer printed circuit board, particularly a kind of multilayer printed circuit board with New Insulation Structure.
Background technology
Current multilayer printed circuit board can produce a large amount of heats in circuit running, make multilayer printed circuit board produce overheated situation, this situation not only affects the normal operation of wiring board or causes the corrupted of wiring board, overheatedly also can cause the generation that causes in the thermal expansion degree varies of encapsulation material and multiaspect board substrate, the directly electric connection intensity between impact components and multiaspect wiring board, and the performance that makes the product based on multilayer printed circuit board is subject to great impact by this situation.
Utility model content
The purpose of this utility model is to overcome the shortcoming existing in prior art with not enough, and a kind of multilayer printed circuit board with New Insulation Structure is provided.
The purpose of this utility model is achieved through the following technical solutions: a kind of multilayer printed circuit board with New Insulation Structure, comprise two-layer above line layer, between adjacent lines layer, be provided with insulating barrier, described insulating barrier has insulation board and encloses the heat radiation inner-cavity structure of putting, and in described heat radiation inner chamber, is filled with heat sink material.The heat that described multilayer printed circuit board produces in the time of work goes in being dispersed into air by described heat sink material, and because heat radiation inner chamber is distributed in whole insulating barrier, each position that has ensured line layer all has heat sinking function, therefore temperature that can overall reduction line layer, avoid line layer overheated, improved the heat dispersion of wiring board.
The height of described heat radiation inner chamber is 0.08mm～0.12mm.
The utility model has following advantage and effect with respect to prior art:
The dissipation of heat producing when heat sink material in heat radiation inner chamber and chamber thereof that multilayer printed circuit board of the present utility model is provided with can be worked line layer is in air, and heat radiation inner chamber can ensure that each position of line layer all has this heat sinking function, therefore temperature that can overall reduction line layer, avoid chip and other material on line layer overheated, improve the useful life of heat dispersion with the multilayer printed circuit board of multilayer printed circuit board (compared with the multilayer printed circuit board of multilayer printed circuit board of the present utility model and the inner-cavity structure that do not dispel the heat, increase useful life more than 1.5 times).
Brief description of the drawings
Fig. 1 is the structural representation of the utility model multilayer printed circuit board embodiment.
Embodiment
Below in conjunction with embodiment and accompanying drawing, the utility model is described in further detail, but execution mode of the present utility model is not limited to this.
Embodiment
As shown in Figure 1, the utility model provides a kind of multilayer printed circuit board with New Insulation Structure, comprise two-layer above line layer 2, between adjacent lines layer 2, be provided with insulating barrier 1, described insulating barrier 1 has insulation board 11 and encloses heat radiation inner chamber 12 structures of putting, and in described heat radiation inner chamber 12, is filled with heat sink material 13.The heat that described multilayer printed circuit board produces in the time of work goes in being dispersed into air by described heat sink material 13, and because heat radiation inner chamber 12 is distributed in whole insulating barrier 1, each position that has ensured line layer 2 all has heat sinking function, therefore temperature that can overall reduction line layer 2, avoid line layer 2 overheated, improved the heat dispersion of wiring board.
The height of described heat radiation inner chamber 12 is 0.08mm～0.12mm.
The dissipation of heat producing when heat sink material in heat radiation inner chamber and chamber thereof that multilayer printed circuit board of the present utility model is provided with can be worked line layer is in air, and heat radiation inner chamber can ensure that each position of line layer all has this heat sinking function, therefore temperature that can overall reduction line layer, avoid chip and other material on line layer overheated, improved the heat dispersion of multilayer printed circuit board and the physical life of multilayer printed circuit board; Result of study shows, compared with the multilayer printed circuit board of multilayer printed circuit board of the present utility model and the inner-cavity structure that do not dispel the heat, physical life increases more than 1.5 times.
Above-described embodiment is preferably execution mode of the utility model; but execution mode of the present utility model is not restricted to the described embodiments; other any do not deviate from change, the modification done under Spirit Essence of the present utility model and principle, substitutes, combination, simplify; all should be equivalent substitute mode, within being included in protection range of the present utility model.
Claims (2)
1. one kind has the multilayer printed circuit board of New Insulation Structure, comprise two-layer above line layer, between adjacent lines layer, be provided with insulating barrier, it is characterized in that: described insulating barrier has insulation board and encloses the heat radiation inner-cavity structure of putting, and in described heat radiation inner chamber, is filled with heat sink material.
2. the multilayer printed circuit board with New Insulation Structure according to claim 1, is characterized in that: the height of described heat radiation inner chamber is 0.08mm～0.12mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420205221.8U CN203884067U (en) | 2014-04-25 | 2014-04-25 | Multilayer printed circuit board (PCB) with novel insulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420205221.8U CN203884067U (en) | 2014-04-25 | 2014-04-25 | Multilayer printed circuit board (PCB) with novel insulation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203884067U true CN203884067U (en) | 2014-10-15 |
Family
ID=51684524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420205221.8U Expired - Fee Related CN203884067U (en) | 2014-04-25 | 2014-04-25 | Multilayer printed circuit board (PCB) with novel insulation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203884067U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108012412A (en) * | 2017-12-25 | 2018-05-08 | 珠海快捷中祺电子科技有限公司 | A kind of multilayer insulation radiating circuit plate |
-
2014
- 2014-04-25 CN CN201420205221.8U patent/CN203884067U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108012412A (en) * | 2017-12-25 | 2018-05-08 | 珠海快捷中祺电子科技有限公司 | A kind of multilayer insulation radiating circuit plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141015 |