CN207183252U - Triode - Google Patents
Triode Download PDFInfo
- Publication number
- CN207183252U CN207183252U CN201721136251.8U CN201721136251U CN207183252U CN 207183252 U CN207183252 U CN 207183252U CN 201721136251 U CN201721136251 U CN 201721136251U CN 207183252 U CN207183252 U CN 207183252U
- Authority
- CN
- China
- Prior art keywords
- basic unit
- layer
- triode
- heat dissipating
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model discloses a kind of triode, including heat dissipating layer, basic unit, packaging body, chip and pin, the basic unit is on heat dissipating layer, the chip is in basic unit, the packaging body is located in basic unit and wraps up the chip, the pin is located at the plane bearing of trend of basic unit, in addition to ceramic layer, and the ceramic layer is located between heat dissipating layer and basic unit.Triode provided by the utility model, thermal diffusivity is good, service life length, and stability is strong.
Description
Technical field
Semiconductor components and devices technical field is the utility model is related to, specifically, is related to a kind of triode.
Background technology
Triode is that one kind is formed by semi-conducting material by processing and manufacturing, as other semiconductor devices, triode
A kind of and component more sensitive to temperature.In actual motion, triode chip can generate heat, if caused heat nothing
Method discharges in time, it will burns triode.
Metal fin is mostly provided with existing triode to improve heat-sinking capability, due to large power triode or switch
During the work such as triode, triode is burnt in easily breakdown, it is therefore necessary to which, plus insulating barrier, existing insulating barrier is generally rubber
Layer, heat-conducting effect are poor.Meanwhile the easy aging of rubber layer is damaged, there is electric leakage hidden danger.
Utility model content
The purpose of this utility model is to provide a kind of triode, and thermal diffusivity is good, service life length, and stability is strong.
Technical scheme is used by triode disclosed in the utility model：A kind of triode, including heat dissipating layer, basic unit,
Packaging body, chip and pin, the basic unit is on heat dissipating layer, and for the chip in basic unit, the packaging body is located at basic unit
Go up and wrap up the chip, the pin is located at the plane bearing of trend of basic unit, in addition to ceramic layer, and the ceramic layer is located at scattered
Between thermosphere and basic unit.
Preferably, the heat dissipating layer marginal portion is in ripple struction.
Preferably, the surface ceramii layer product is more than basic unit and is less than heat dissipating layer.
Preferably, the radiating layer material is copper or aluminium.
Preferably, the ceramic layer is fixed on basic unit and heat dissipating layer by viscose glue.
The beneficial effect of triode disclosed in the utility model is：1. ceramic layer is set between basic unit and heat dissipating layer, relatively
In the rubber layer of prior art, heat conductivility is more preferable, and service life is grown, and stability is strong.2. radiating layer surface sets ripple struction,
Heat exchange area is added, improves radiating effect.
Brief description of the drawings
Fig. 1 is the structural representation of the utility model triode.
Embodiment
The utility model is further elaborated and illustrated with reference to specific embodiment and Figure of description：It refer to figure
1, a kind of triode, including heat dissipating layer 5, the ceramic layer 1 above the heat dissipating layer 5, the base above the ceramic layer 1
Layer 2, the chip 3 above the basic unit 2, above the basic unit 2 and wrap up the packaging body of the chip 3 and located at base
The pin 4 of 2 plane bearing of trend of layer.
The heat dissipating layer 5 is metal level, generally aluminium or copper, and described one end of heat dissipating layer 5 is planar structure 51, and the other end is
Ripple struction 52, ripple struction 52 can be continuous triangle ripples, or alternate sine bellows, ripple struction 52 increase
Area of dissipation, be advantageous to improve radiating effect.
The ceramic layer 1 is fixed on by viscose glue in the planar structure of heat dissipating layer 5, and the viscose glue is high temperature resistant viscose glue, this
Embodiment uses special epoxide-resin glue, and the length dimension of ceramic layer 1 and width dimensions are respectively less than the heat dissipating layer 5, institute
State basic unit 2 and the upper surface of ceramic layer 1 is fixed on by viscose glue, the length dimension and width dimensions of the basic unit 2 are respectively less than the pottery
Enamel coating 2, to ensure more preferably insulation effect, the thickness of ceramic layer 2 can be adjusted according to actual operation requirements, due to ceramics
Layer heat transfer property is weaker than metal, and its thickness of general control is no more than 200um, to ensure preferable heat transfer property.
The packaging body is used to seal the chip, and its material is epoxy resin, and the chip 3 includes emitter stage, base stage
And colelctor electrode, the emitter stage, base stage and colelctor electrode correspond to a pin respectively.
Finally it should be noted that above example is only illustrating the technical solution of the utility model, rather than to this reality
With the limitation of novel protected scope, although being explained with reference to preferred embodiment to the utility model, this area it is general
It is logical it will be appreciated by the skilled person that can be modified to the technical solution of the utility model or equivalent substitution, without departing from this
The spirit and scope of utility model technical scheme.
Claims (5)
1. a kind of triode, including heat dissipating layer, basic unit, packaging body, chip and pin, the basic unit is described on heat dissipating layer
Chip is in basic unit, and the packaging body is in basic unit and wraps up the chip, and the pin extends located at the plane of basic unit
Direction, it is characterised in that be also located at including ceramic layer, the ceramic layer between heat dissipating layer and basic unit.
2. triode as claimed in claim 1, it is characterised in that the heat dissipating layer marginal portion is in ripple struction.
3. triode as claimed in claim 1, it is characterised in that the surface ceramii layer product is more than basic unit and is less than radiating
Layer.
4. triode as claimed in claim 1, it is characterised in that the radiating layer material is copper or aluminium.
5. triode as claimed in claim 1, it is characterised in that the ceramic layer is fixed on basic unit and radiating by viscose glue
Layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721136251.8U CN207183252U (en) | 2017-09-06 | 2017-09-06 | Triode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721136251.8U CN207183252U (en) | 2017-09-06 | 2017-09-06 | Triode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207183252U true CN207183252U (en) | 2018-04-03 |
Family
ID=61742963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721136251.8U Expired - Fee Related CN207183252U (en) | 2017-09-06 | 2017-09-06 | Triode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207183252U (en) |
-
2017
- 2017-09-06 CN CN201721136251.8U patent/CN207183252U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180403 Termination date: 20200906 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |