CN206179611U - Quick fin formula multilayer piezo -resistor - Google Patents
Quick fin formula multilayer piezo -resistor Download PDFInfo
- Publication number
- CN206179611U CN206179611U CN201621093885.5U CN201621093885U CN206179611U CN 206179611 U CN206179611 U CN 206179611U CN 201621093885 U CN201621093885 U CN 201621093885U CN 206179611 U CN206179611 U CN 206179611U
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- Prior art keywords
- layer
- quick
- heat radiating
- protective layer
- piezo
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
Quick fin formula multilayer piezo -resistor includes by interior and outer basement of arranging in proper order, inner electrode, the piezo -resistor body, termination electrode, protective layer, a serial communication port, the termination electrode lateral surface is inlayed there is the heat -conducting metal piece, the protective layer is by interior and include heat -sink shell, heat dissipation layer and insulating layer outward, there is the louvre on the insulating layer, the heat -conducting metal piece is curved curved, protective layer integrated into one piece, the inner electrode is multilayer spraying silver paste layer, the piezo -resistor body is the pressure -sensitive membrane thick liquids layer that hinders of multilayer spraying, the termination electrode is multilayer spraying silver paste layer, the basement is lamellar ceramic substrate. The utility model discloses a quick fin formula multilayer piezo -resistor has a quick heat dissipation, makes the resistance stabilization energy stabilize for more time at operating temperature, voltage, current range, and resistive characteristics such as can be reliable and stable, longe -lived, firm durable can extensively be arranged in products such as electron, electrical apparatus.
Description
Technical field
This utility model is related to chip multilayer varistor, and in particular to a kind of quick heat radiating chip multilayer varistor.
Background technology
Varistor is a kind of excellent quasiconductor function electronic devices and components, is widely used in voltage stabilizing element and overvoltage protection
Element.Varistor general at present carries out blocking protection by stream, overvoltage, excess temperature etc., but is held by excessively stream, overvoltage, excess temperature etc.
Varistor damage is easily caused, short life, unstable properties and unexcellent even result in resistance and relevant device damage, to answering
Cause huge infringement with the relevant device of pressure-sensitive electronics, small resistor may give the production of large-scale equipment, use, maintenance,
Upgrading etc. brings tremendous influence, therefore, life-span and the performance for improving resistance itself is very crucial.
Utility model content
To solve the defect of above-mentioned prior art, this utility model provides a kind of quick heat radiating chip multilayer varistor,
With rapid heat dissipation, reliable and stable, life-span length, it is easy to use the advantages of.
This utility model provide quick heat radiating chip multilayer varistor technical scheme be：Quick heat radiating chip multilayer pressure
Quick resistance, including the substrate being arranged in order from inside to outside, interior electrode, varistor body, termination electrode, protective layer；The termination electrode
Lateral surface is inlaid with thermal conductive metal plate, and the protective layer includes from inside to outside heat-sink shell, heat dissipating layer and insulating barrier, the insulating barrier
On have louvre.
More excellent, the protective layer is integrally formed.
More excellent, the interior electrode is that multilamellar sprays silver slurry layer.
More excellent, the varistor body is the pressure-sensitive resistance film pulp layer of multilamellar spraying.
More excellent, the termination electrode is that multilamellar sprays silver slurry layer.
More excellent, the substrate is laminar ceramic bases.
More excellent, the thermal conductive metal plate is bending.
The advantage of utility model is：The heat-sink shell of thermal conductive metal plate and protective layer, heat dissipating layer, louvre, can quickly dissipate
Heat, the thermal conductive metal plate of bending can increase heat conduction and heat radiation area, enable resistance stabilization stable in operating temperature, electricity for more time
Pressure, current range, resistive performance is reliable and stable, life-span length；And protective layer is integrally formed, resistance is more firm durable.
Description of the drawings
Fig. 1 is structural representation of the present utility model；
Wherein：1. the protective layer 51. of 3. varistor of electrode, 4. termination electrode 5. in substrate 2.
The louvre of 6. thermal conductive metal plate of heat-sink shell 52. heat dissipating layer, 52. insulating barrier 7..
Specific embodiment
Below in conjunction with the accompanying drawings the utility model is described in further detail.
As shown in figure 1, quick heat radiating chip multilayer varistor, including the substrate 1, interior electrode that are arranged in order from inside to outside
2nd, varistor body 3, termination electrode 4, protective layer 5；The termination electrode lateral surface is inlaid with thermal conductive metal plate 6, the protective layer by
It is interior and outward include heat-sink shell 51, heat dissipating layer 52 and insulating barrier 53, have louvre 7 on the insulating barrier.
The protective layer 5 is integrally formed；The interior electrode 2 is that multilamellar sprays silver slurry layer；The varistor body 3 is multilamellar
The pressure-sensitive resistance film pulp layer of spraying；The termination electrode 4 is that multilamellar sprays silver slurry layer；The substrate 1 is laminar ceramic bases.It is described
Thermal conductive metal plate 6 is curved shape.
Slurry is coated on substrate surface and dry and hard, one layer of pulp layer of such repeated multiple times rear high temperature sintering formation.Pulp layer
At least two-layer.Pulp layer is formed by conductive material, inorganic bond and the uniform mixed sintering of organic binding material three, also may be used
Formed with conductive material, inorganic bond, the uniform mixed sintering of organic binding material with adding firming agent again.
Above-described embodiment only to illustrate technology design of the present utility model and feature, its object is to allow and be familiar with this field skill
The personage of art will appreciate that content of the present utility model and is carried out, and can not limit protection model of the present utility model with this
Enclose, all equivalence changes made according to this utility model spirit or modification effect are similar, all should cover in this utility model
Protection domain in.
Claims (7)
1. quick heat radiating chip multilayer varistor, including the substrate being arranged in order from inside to outside, interior electrode, varistor body,
Termination electrode, protective layer；Characterized in that, the termination electrode lateral surface is inlaid with thermal conductive metal plate, the protective layer is from inside to outside
Including heat-sink shell, heat dissipating layer and insulating barrier, there is louvre on the insulating barrier.
2. quick heat radiating chip multilayer varistor as claimed in claim 1, it is characterised in that the thermal conductive metal plate is curved
It is curved.
3. quick heat radiating chip multilayer varistor as claimed in claim 1, it is characterised in that the protective layer one into
Type.
4. quick heat radiating chip multilayer varistor as claimed in claim 1, it is characterised in that the interior electrode is multilamellar spray
Apply silver slurry layer.
5. quick heat radiating chip multilayer varistor as claimed in claim 1, it is characterised in that the varistor body is many
The pressure-sensitive resistance film pulp layer of layer spraying.
6. quick heat radiating chip multilayer varistor as claimed in claim 1, it is characterised in that the termination electrode is multilamellar spray
Apply silver slurry layer.
7. quick heat radiating chip multilayer varistor as claimed in claim 1, it is characterised in that the substrate is flake pottery
Porcelain substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621093885.5U CN206179611U (en) | 2016-09-30 | 2016-09-30 | Quick fin formula multilayer piezo -resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621093885.5U CN206179611U (en) | 2016-09-30 | 2016-09-30 | Quick fin formula multilayer piezo -resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206179611U true CN206179611U (en) | 2017-05-17 |
Family
ID=58678310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621093885.5U Expired - Fee Related CN206179611U (en) | 2016-09-30 | 2016-09-30 | Quick fin formula multilayer piezo -resistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206179611U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115083705A (en) * | 2022-06-21 | 2022-09-20 | 深圳可雷可科技股份有限公司 | Silicon carbide nonlinear resistor for de-excitation of generator |
-
2016
- 2016-09-30 CN CN201621093885.5U patent/CN206179611U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115083705A (en) * | 2022-06-21 | 2022-09-20 | 深圳可雷可科技股份有限公司 | Silicon carbide nonlinear resistor for de-excitation of generator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170517 Termination date: 20190930 |