CN209562934U - Filling holes with resin metal-based circuit board - Google Patents
Filling holes with resin metal-based circuit board Download PDFInfo
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- CN209562934U CN209562934U CN201821753904.1U CN201821753904U CN209562934U CN 209562934 U CN209562934 U CN 209562934U CN 201821753904 U CN201821753904 U CN 201821753904U CN 209562934 U CN209562934 U CN 209562934U
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Abstract
The utility model discloses a kind of filling holes with resin metal-based circuit boards, it includes substrate, resistance, triode, electromagnetic coil, insert row, ceramic disc capacitor, radiating groove, data line interface, multiple resistance are all fixed on substrate, multiple triodes are all fixed on the side on substrate and being located at resistance, electromagnetic coil is fixed on substrate and is located at below resistance, insert row is fixed on the side on substrate and being located at triode, ceramic disc capacitor is fixed on substrate, radiating groove is fixed on substrate and positioned at the upper surface of ceramic disc capacitor, data line interface is fixed on the side on substrate and being located at ceramic disc capacitor.The utility model can be equipped with resin via layer on circuit boards, improve the service life of product.
Description
Technical field
The utility model relates to a kind of circuit boards, more particularly to a kind of filling holes with resin metal-based circuit board.
Background technique
With the development of society, the mankind are also more and more to the utilization of circuit board.Circuit board uses thick copper mostly at present
At so wanting aperture on it, etching is relatively difficult, and structural instability, and expensive, the service life is short.
Summary of the invention
The technical problem to be solved by the utility model is to provide a kind of filling holes with resin metal-based circuit boards, in circuit board
It is equipped with resin via layer, overcome the deficiencies in the prior art improves the service life of product.
The utility model is to solve above-mentioned technical problem by following technical proposals: a kind of filling holes with resin Metal Substrate electricity
Road plate comprising substrate, resistance, triode, electromagnetic coil, insert row, ceramic disc capacitor, radiating groove, data line interface, multiple resistance are all
It is fixed on substrate, multiple triodes are all fixed on the side on substrate and being located at resistance, and electromagnetic coil is fixed on substrate and position
Below resistance, insert row is fixed on the side on substrate and being located at triode, and ceramic disc capacitor is fixed on substrate, and radiating groove is solid
The upper surface of be scheduled on substrate and be located at ceramic disc capacitor, data line interface is fixed on the side on substrate and being located at ceramic disc capacitor；Base
Plate includes external resin layer, inner resin layer, and inner resin layer is bonded in below external resin layer；External resin layer includes connecing
One end of ground line layer, alumina ceramic layer, signal circuit layer, earthing circuit layer is connected with alumina ceramic layer, signal line
Layer is located at below alumina ceramic layer；Inner resin layer includes waterproof layer, resin via layer, linear low density polyethylene layer,
One end of waterproof layer is connected with resin via layer, and linear low density polyethylene layer is located at below resin via layer.
Preferably, the substrate is equipped with screw hole.
Preferably, the triode is equipped with conducting wire.
Preferably, the resistance both ends are equipped with iron wire.
Preferably, the data line interface is equipped with metal coating circle.
The positive effect of the utility model is: the utility model can be equipped with resin via layer on circuit boards,
And resin is provided in hole, overcome the deficiencies in the prior art can effectively solve traditional electric plating of whole board bring such as table copper too
It is thick, etching is difficult to control, because base copper it is blocked up caused by line build-out deficiency problem, the stability for improving product also reduces into
This, improves the service life of product.
Detailed description of the invention
Fig. 1 is the general structure schematic diagram of the utility model.
Fig. 2 is the schematic diagram of substrate structure of the utility model.
Fig. 3 is the external resin schematic diagram of a layer structure of the utility model.
Fig. 4 is the internal resin schematic diagram of a layer structure of the utility model.
Specific embodiment
The utility model preferred embodiment is provided, with reference to the accompanying drawing the technical solution of the utility model is described in detail.
As shown in Figures 1 to 4, the utility model filling holes with resin metal-based circuit board include substrate 1, resistance 2, triode 3,
Electromagnetic coil 4, insert row 5, ceramic disc capacitor 6, radiating groove 7, data line interface 8, multiple resistance 2 are all fixed on substrate 1, multiple three poles
Pipe 3 is all fixed on substrate 1 and is located at the side of resistance 2, and electromagnetic coil 4 is fixed on substrate 1 and below resistance 2, insert row 5
The side of triode 3 is fixed on substrate 1 and is located at, ceramic disc capacitor 6 is fixed on substrate 1, and radiating groove 7 is fixed on substrate 1
The upper surface of and be located at ceramic disc capacitor 6, data line interface 8 is fixed on substrate 1 and positioned at the side of ceramic disc capacitor 6；Substrate 1 includes
External resin layer 9, inner resin layer 10, inner resin layer 10 are bonded in below external resin layer 9；External resin layer 9 includes
Earthing circuit layer 11, alumina ceramic layer 12, signal circuit layer 13, one end and 12 phase of alumina ceramic layer of earthing circuit layer 11
Even, signal circuit layer 13 is located at below alumina ceramic layer 12；Inner resin layer 10 includes waterproof layer 14, resin via layer
15, one end of linear low density polyethylene layer 16, waterproof layer 14 is connected with resin via layer 15, linear low density polyethylene layer 16
Below resin via layer 15.
Substrate 1 is equipped with screw hole, improves circuit board installation accuracy, while keeping circuit board stronger.
Triode 3 is equipped with conducting wire, for connecting the electrical network copper film of component's feet.
2 both ends of resistance are equipped with iron wire, can reinforce fixing.
Data line interface 8 is equipped with metal coating circle, can protect the safety of user.
Inner resin layer 10 can be bonded in below external resin layer 9 by glue, in this way raising fastness.
The working principle of the utility model is as follows: the utility model filling holes with resin metal-based circuit board structure is simple, designs
Rationally, it is multiple that substrate, resistance, triode, electromagnetic coil, insert row, ceramic disc capacitor, radiating groove and data line interface etc. be which is provided with
Part can be equipped with resin via layer on circuit boards, resin is provided in hole, can overcome the deficiencies in the prior art,
There is provided it is a kind of can effectively solve traditional electric plating of whole board bring as table copper is too thick, etching it is difficult to control, because base copper it is blocked up caused by
The problems such as line build-out is insufficient, resistance are wound on using resistive conductor without on alkaline heat resisting porcelain part, and outside adds heat-resisting, moisture-proof and corrosion resistant
The material protection of erosion is fixed and wire resistor body is put into rectangular porcelain frame, with special noninflammability thermal cement filling sealing
At, can effectively achieve the effect that in this way insulation, it is heat-resisting, improve product stability.Triode is a kind of control electric current
Its effect of semiconductor devices is small-signal to be zoomed into the biggish electric signal of range value, also serves as noncontacting switch, electromagnetic coil
It is that can reinforce the connection relationship between each element, insert row is for pacifying circuit board for making subelement generate electromagnetic force
In operation element, internal information can be fed back, ceramic disc capacitor, which is used, coats one layer of gold in ceramic surface
Belong to film, then can make circuit board high pressure resistant in this way as capacitor made of electrode after high temperature sintering and make performance more
Add stabilization.Radiating groove is used to distribute the heat of internal generation, prevents electronic component from burning out, improves the service life of part.Data line
Interface provides electric energy for connecting external power supply device for the operation of whole circuit board.Alumina ceramic layer is one kind to aoxidize
Material based on aluminium, aluminium oxide ceramics have preferable conductibility, mechanical strength and heat-resisting quantity.Earthing circuit layer and signal wire
Road floor is respectively equipped with ground path and signal line, and earthing circuit layer and signal circuit layer make circuit board exist in the same layer
Strong antijamming capability when being interfered by high-frequency signal.Waterproof layer is made of neoprene film, has extremely strong waterproof effect
Fruit, can greatly protection circuit plate element not by the damage of water, improve safety.Resin via layer is by resinous coat
Be covered on through-hole, be able to solve as table copper is too thick, etching is difficult to control, because base copper it is blocked up caused by line build-out is insufficient asks
Topic, linear low density polyethylene layer is mixed and processed good sanitation performance using polyethylene and comprehensive mechanics is physical
Can, it can be good at the damage for preventing oxygen to part, improve the service life of part.
In conclusion the utility model can be equipped with resin via layer on circuit boards, and resin is provided in hole, gram
Take the deficiencies in the prior art, can effectively solve traditional electric plating of whole board bring such as table copper it is too thick, etching it is difficult to control, because of base copper mistake
The problem of the deficiency of line build-out caused by thickness, the stability for improving product also reduce cost.
Particular embodiments described above, the technical issues of to the solution of the utility model, technical scheme and beneficial effects
It has been further described, it should be understood that the foregoing is merely specific embodiment of the utility model, not
For limiting the utility model, within the spirit and principle of the utility model, any modification for being made, changes equivalent replacement
Into etc., it should be included within the scope of protection of this utility model.
Claims (5)
1. a kind of filling holes with resin metal-based circuit board, which is characterized in that it include substrate, resistance, triode, electromagnetic coil, insert row,
Ceramic disc capacitor, radiating groove, data line interface, multiple resistance are all fixed on substrate, multiple triodes be all fixed on substrate and
Positioned at the side of resistance, electromagnetic coil is fixed on substrate and is located at below resistance, and insert row is fixed on substrate and is located at three poles
The upper surface of the side of pipe, ceramic disc capacitor are fixed on substrate, and radiating groove is fixed on substrate and is located at ceramic disc capacitor, and data line connects
Mouth is fixed on the side on substrate and being located at ceramic disc capacitor；Substrate includes external resin layer, inner resin layer, and inner resin layer is viscous
It closes below external resin layer；External resin layer includes earthing circuit layer, alumina ceramic layer, signal circuit layer, ground line
One end of road floor is connected with alumina ceramic layer, and signal circuit layer is located at below alumina ceramic layer；Inner resin layer includes
One end of waterproof layer, resin via layer, linear low density polyethylene layer, waterproof layer is connected with resin via layer, linea low density
Polyethylene layer is located at below resin via layer.
2. filling holes with resin metal-based circuit board as described in claim 1, which is characterized in that the substrate is equipped with screw hole.
3. filling holes with resin metal-based circuit board as described in claim 1, which is characterized in that the triode is equipped with conducting wire.
4. filling holes with resin metal-based circuit board as described in claim 1, which is characterized in that the resistance both ends are equipped with iron wire.
5. filling holes with resin metal-based circuit board as described in claim 1, which is characterized in that the data line interface is equipped with gold
Belong to guard circle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821753904.1U CN209562934U (en) | 2018-10-29 | 2018-10-29 | Filling holes with resin metal-based circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821753904.1U CN209562934U (en) | 2018-10-29 | 2018-10-29 | Filling holes with resin metal-based circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209562934U true CN209562934U (en) | 2019-10-29 |
Family
ID=68299185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821753904.1U Active CN209562934U (en) | 2018-10-29 | 2018-10-29 | Filling holes with resin metal-based circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209562934U (en) |
-
2018
- 2018-10-29 CN CN201821753904.1U patent/CN209562934U/en active Active
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