CN107087378A - The radiating subassembly and electronic equipment of electronic equipment - Google Patents
The radiating subassembly and electronic equipment of electronic equipment Download PDFInfo
- Publication number
- CN107087378A CN107087378A CN201710324168.1A CN201710324168A CN107087378A CN 107087378 A CN107087378 A CN 107087378A CN 201710324168 A CN201710324168 A CN 201710324168A CN 107087378 A CN107087378 A CN 107087378A
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- China
- Prior art keywords
- heat
- layer
- conducting layer
- radiating subassembly
- thermal insulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009413 insulation Methods 0.000 claims abstract description 49
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 17
- 229910002804 graphite Inorganic materials 0.000 claims description 16
- 239000010439 graphite Substances 0.000 claims description 16
- 239000000835 fiber Substances 0.000 claims description 3
- 239000011490 mineral wool Substances 0.000 claims description 2
- 229920006389 polyphenyl polymer Polymers 0.000 claims description 2
- 239000005439 thermosphere Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 239000011133 lead Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000003776 cleavage reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000007770 graphite material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000007017 scission Effects 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 230000027950 fever generation Effects 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 210000004209 hair Anatomy 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides the radiating subassembly of a kind of electronic equipment and electronic equipment, wherein, radiating subassembly includes the first heat-conducting layer, the heat that electronic equipment is produced is conducted in the extended planar of the first heat-conducting layer；Thermal insulation layer, prevents thickness direction conduction of the heat along thermal insulation layer；And second heat-conducting layer, the heat through thermal insulation layer is conducted in the extended planar of the second heat-conducting layer；Wherein, thermal insulation layer is arranged between the first heat-conducting layer and second heat-conducting layer.Radiating subassembly of the present invention can realize Homogeneouslly-radiating.
Description
Technical field
The present invention relates to the radiating subassembly and electronic equipment of field of terminal technology, more particularly to a kind of electronic equipment.
Background technology
Electronic equipment is in operation, and its inner member can produce heat, the mobile terminal such as mobile phone, its chips
The heat of generation is relatively large, for whole mobile phone, and the region heat where chip is more concentrated, and too high heat can be straight
Conduction is connect to mobile phone surface, causes the problem of mobile phone region is overheated, Consumer's Experience is poor.
The content of the invention
The present invention provides the radiating subassembly of a kind of electronic equipment, and it includes the first heat-conducting layer, the heat for producing electronic equipment
The extended planar measured in the first heat-conducting layer is conducted；Thermal insulation layer, prevents thickness direction conduction of the heat along thermal insulation layer；And second lead
Thermosphere, makes the heat through thermal insulation layer be conducted in the extended planar of the second heat-conducting layer；Wherein, thermal insulation layer is arranged on the first heat-conducting layer
Between second heat-conducting layer.
The present invention also provides a kind of electronic equipment, and it includes above-mentioned radiating subassembly.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, makes required in being described below to embodiment
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for
For those of ordinary skill in the art, on the premise of not paying creative work, other can also be obtained according to these accompanying drawings
Accompanying drawing.
Fig. 1 is the structural representation of the embodiment of radiating subassembly one of electronic equipment of the present invention；
Fig. 2 is the structural representation of another embodiment of radiating subassembly of electronic equipment of the present invention；
Fig. 3 is the structural representation of the embodiment of electronic equipment one of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described.It is understood that specific embodiment described herein is only used for explaining the present invention, rather than to the limit of the present invention
It is fixed.It also should be noted that, it illustrate only part related to the present invention for the ease of description, in accompanying drawing and not all knot
Structure.Based on the embodiment in the present invention, what those of ordinary skill in the art were obtained under the premise of creative work is not made
Every other embodiment, belongs to the scope of protection of the invention.
The electronic equipment that the embodiment of the present invention is provided, including smart mobile phone, tablet personal computer, Intelligent worn device, numeral
Audio/video player, electronic reader, handheld game machine, computer etc..
Term " first " in the present invention, " second ", " the 3rd " are only used for describing purpose, and it is not intended that indicating or dark
Show relative importance or the implicit quantity for indicating indicated technical characteristic.Thus, " first ", " second ", " are defined
At least one this feature can be expressed or be implicitly included to three " feature.In description of the invention, " multiple " be meant that to
It is few two, such as two, three etc., unless otherwise specifically defined.The directional instruction of institute is (all in the embodiment of the present invention
Such as up, down, left, right, before and after ...) it is only used for explaining the phase under a certain particular pose (as shown in drawings) between each part
To position relationship etc., if the particular pose changes, directionality indicates also correspondingly therewith to change.In addition, art
Language " comprising " and " having " and their any deformations, it is intended that covering is non-exclusive to be included.For example contain a series of steps
The step of process, method, system, product or the equipment of rapid or unit are not limited to list or unit, but alternatively also
The step of including not listing or unit, or alternatively also include for intrinsic other of these processes, method, product or equipment
Step or unit.
Referenced herein " embodiment " is it is meant that the special characteristic, structure or the characteristic that describe can be wrapped in conjunction with the embodiments
In at least one embodiment of the present invention.Each position in the description occur the phrase might not each mean it is identical
Embodiment, nor the independent or alternative embodiment with other embodiments mutual exclusion.Those skilled in the art explicitly and
Implicitly understand, embodiment described herein can be combined with other embodiments.
Referring to Fig. 1, Fig. 1 is the structural representation of the embodiment of radiating subassembly one of electronic equipment of the present invention.
The application of the present embodiment radiating subassembly in the electronic device, is arranged on electronic equipment internal, for producing electronic equipment
Raw even heat is distributed.For example, for mobile phone, the heat that chip is produced is larger, therefore radiating subassembly is arranged on into chip
Between phone housing, and area of the area of plane more than chip of radiating subassembly, it may be designed as agreeing with the size of phone housing,
Radiating subassembly can distribute the even heat that chip is produced so that the problem of being not in hot-spot on phone housing, user
Experience is preferable.
Specifically, radiating subassembly 100 includes the first heat-conducting layer 11, the heat-conducting layer 13 of thermal insulation layer 12 and second, thermal insulation layer 12
It is arranged between the first heat-conducting layer 11 and the second heat-conducting layer 13.
Wherein, the heat that the first heat-conducting layer 11 is used to produce electronic equipment is passed in the extended planar of the first heat-conducting layer 11
Lead, i.e., the heat that electronic equipment is produced is distributed via the first heat-conducting layer 11 first, and the first heat-conducting layer 11 is conducted heat to entirely
Plane, realizes that uniform plane radiates.In order that heat rapidly can scatter in plane, the first heat-conducting layer 11 is big by thermal conductivity factor
It is made in 1500W/m.K material.
The graphite material that the first heat-conducting layer 11 is used in the present embodiment, such as native graphite fin, nano combined stone
Ink film, graphene etc..Graphite is carbonaceous element crystalline mineral, and its crystallization screen work is hexagon layer structure, belongs to hexagonal crystal system,
The complete stratiform cleavage of tool, cleavage surface is weaker to van der Waals' force based on molecular link, therefore its native floatability is fine.Graphite
With advantages below：(1) heat-resisting quantity：The fusing point of graphite is 3850 ± 50 DEG C, and boiling point is 4250 DEG C, even if through superhigh temperature electric arc
Calcination, the loss very little of weight, thermal coefficient of expansion also very little, graphite intensity is improved and strengthened with temperature, at 2000 DEG C, graphite
Intensity is doubled；(2) conductive, thermal conductivity is good：The electric conductivity of graphite is higher than general nonmetallic ore 100 times, and thermal conductivity exceedes
The metal materials such as steel, iron, lead, thermal conductivity factor is raised and reduced with temperature, or even at very high temperatures, and graphite is into heat guard；
(3) lubricity is good：The greasy property of graphite depends on the size of graphite flakes, and scale is bigger, and coefficient of friction is smaller, greasy property
Better；(4) chemical stability：Graphite has good chemical stability at normal temperatures, can acidproof, alkaline-resisting and organic solvent-resistant corruption
Erosion；(5) plasticity：The good toughness of graphite, can be ground into very thin thin slice；(6) thermal shock resistance：Graphite can be through when using at normal temperatures
It will not be destroyed by the acute variation of firmly temperature, during temperature jump, the Volume Changes of graphite less, will not be cracked.
Certainly, the first heat-conducting layer 11 can also be using copper foil, aluminium alloy etc., and copper foil adds a certain proportion of other metals to beat by copper
System is formed, and copper foil typically has two kinds of 90 paper tinsels and 88 paper tinsels, i.e. copper content to be 90% and 88%.In a metal, the thermal conductivity of copper is best,
Its thermal conductivity factor is 401W/m.K；The thermal conductivity of aluminium is then only second to copper, and its thermal conductivity factor is 237W/m.K.
Thermal insulation layer 12 is used for the thickness direction conduction for preventing heat along thermal insulation layer 12 so that heat is tried one's best in vertical direction
It will not spread, therefore thermal insulation layer 12 selects heat-barrier material, i.e., the material of ultralow thermal conductivity.Thermal insulation layer 12 is by leading in the present embodiment
The material that hot coefficient is less than 0.05W/m.K is made.
Thermal insulation layer 12 can be fibrous reticular structure, and thermal insulation layer 12 is fibrous reticular structure, includes air, energy in the middle of it
Ultralow thermal conductivity is enough realized, that is, realizes the heat insulating function of thickness direction, the fiber that thermal insulation layer 12 is used can be mineral wool, hair
Felt or polyphenyl fiber.Thermal insulation layer 12 can also be heat-insulated foam, and heat-insulated foam can not only reach heat-insulated effect, also be set in electronics
Certain cushioning effect is played during standby use.
Second heat-conducting layer 13 is then used to make the heat through thermal insulation layer 12 conduct in its extended planar, further realizes heat
Uniform plane diffusion.Conduction and the first heat-conducting layer 11 in second heat-conducting layer 13 to heat is basically identical, is to make its uniform
Conduct in whole plane, therefore the second heat-conducting layer 13 also selects to be more than 1500W/m.K material by thermal conductivity factor in the present embodiment
Material is made.
Each layer realizes and is bonded that specifically, the first heat-conducting layer 11 is wrapped by gum hot pressing in the present embodiment radiating subassembly 100
The first gum layer 111 is included, the heat-conducting layer 11 of thermal insulation layer 12 and first is hot bonding by the first gum layer 111；Second heat-conducting layer 13
Including the second gum layer 131, the heat-conducting layer 13 of thermal insulation layer 12 and second is then hot bonding by the second gum layer 131.
Further, the first heat-conducting layer 11 and the second heat-conducting layer 13 use graphite material, the first heat conduction in the present embodiment
Layer 11 includes the first gum layer 111 and the first graphite flake layer 112, and the second heat-conducting layer 13 includes the second gum layer 131 and the second stone
Ink sheet layer 132.
Each layer can also be realized by glue spraying and is bonded in radiating subassembly 100, i.e. connecing in the first heat-conducting layer 11 and thermal insulation layer 12
Conjunction face sprays one layer of glue, the first heat-conducting layer 11 and thermal insulation layer 12 is then pressed, to realize the strong bond of the two.
The present embodiment radiating subassembly 100 be used for frivolous electronic equipment in, its thickness range control 0.09mm~
0.15mm, it is ensured that the lightening of electronic equipment is also ensure that while radiating.For the thickness of each layer of radiating subassembly 100,
Set according to demand.Such as the first heat-conducting layer 11, the thickness range of the heat-conducting layer 13 of thermal insulation layer 12 and second can be 0.03mm
~0.05mm.
Each thickness degree can be also designed based on the function of each layer, because the heat very first time that electronic equipment is produced need to be by
First heat-conducting layer 11 scatters, therefore the first heat-conducting layer 11 can be all thicker than the heat-conducting layer 13 of thermal insulation layer 12 and second, and the second heat conduction
Layer 13 is used to carry out further planar diffusion to the heat through thermal insulation layer 12, therefore can be set to the thickness of the second heat-conducting layer 13
It is minimum.For example, the thickness of the first heat-conducting layer 11 is set to 0.05mm in the present embodiment, the thickness of thermal insulation layer 12 is set to 0.04mm, the
The thickness of two heat-conducting layer 13 is set to 0.03mm.
The radiating subassembly of the present invention realizes the uniform heat conduction of in-plane by heat-conducting layer, and thickness side is realized by thermal insulation layer
Upward is heat-insulated, it is ensured that the heat locally produced in electronic equipment can uniformly scatter in the in-plane direction, will not be in thickness
Conducted on direction, so that the problem of solving hot-spot.
For the larger electronic equipment that generates heat, radiating subassembly may also include more heat-conducting layers and thermal insulation layer, wherein heat conduction
Layer and thermal insulation layer are arranged at intervals.As shown in Fig. 2 the structure that Fig. 2 is another embodiment of radiating subassembly of electronic equipment of the present invention is shown
It is intended to.The present embodiment radiating subassembly 200 includes the first heat-conducting layer 21, first thermal insulation layer 22, the second heat-conducting layer stacked gradually
23 and second thermal insulation layer 24.
The first heat-conducting layer 21 directly contacts pyrotoxin in the present embodiment, for making heat be conducted in its extended planar,
First thermal insulation layer 22 and second thermal insulation layer 24 are used to prevent heat from conducting in the thickness direction of thermal insulation layer, and the second heat-conducting layer 23 is then
For making the heat through thermal insulation layer be conducted in its extended planar.Heat-conducting layer and thermal insulation layer and above-described embodiment radiating subassembly 100
In function it is substantially similar, specifically repeat no more.
Referring to Fig. 3, Fig. 3 is the structural representation of the embodiment of electronic equipment one of the present invention.Electronic equipment of the present invention can be with
It is to be illustrated by taking mobile phone as an example in the mobile terminals such as mobile phone, tablet personal computer, wearable device, the present embodiment.Electronic equipment 300 is
Mobile phone 300, mobile phone 300 includes radiating subassembly 31, and the radiating subassembly 31 can use above-mentioned radiating subassembly 100 or radiating subassembly
200, concrete structure is repeated no more, and radiating subassembly 31 can carry out Homogeneouslly-radiating to the heat that mobile phone 300 is produced.
Further, housing 32, mainboard 33 and chip 34 are also included in mobile phone 300.
The chips 34 of mobile phone 300 are arranged on mainboard 33, and radiating subassembly 31, mainboard 33 and chip 34 are arranged at housing
In 32, and radiating subassembly 31 is arranged between chip 34 and housing 32, and the shape size of radiating subassembly 31 is set according to housing 32
Meter, its area is more big, can realize the radiating of more large area, therefore radiating subassembly 31 may be configured as being covered with an inner side of housing 32
Face.
The heat that chip 34 is produced directly realizes uniform diffusion by radiating subassembly 31, due to heat-insulated in radiating subassembly 31
Layer effect, heat directly will not conduct in the thickness direction thereof, therefore the heat that chip 34 is produced will not be directly conducted to housing
32, cause the region of the correspondence chip 34 of housing 32 situation of hot-spot occur.
The heat that the inside of mobile phone 300 is produced can be in the presence of radiating subassembly 31, in uniformly being scattered on in-plane, it is to avoid
The problem of local pyrexia, Consumer's Experience is preferable.
Embodiments of the present invention are the foregoing is only, are not intended to limit the scope of the invention, it is every to utilize this
Equivalent structure or equivalent flow conversion that description of the invention and accompanying drawing content are made, or directly or indirectly it is used in other correlations
Technical field, is included within the scope of the present invention.
Claims (10)
1. the radiating subassembly of a kind of electronic equipment, it is characterised in that the radiating subassembly includes：
First heat-conducting layer, makes the heat that the electronic equipment is produced be conducted in the extended planar of first heat-conducting layer；
Thermal insulation layer, prevents thickness direction conduction of the heat along the thermal insulation layer；And
Second heat-conducting layer, makes the heat through the thermal insulation layer be conducted in the extended planar of second heat-conducting layer；
Wherein, the thermal insulation layer is arranged between first heat-conducting layer and second heat-conducting layer.
2. radiating subassembly according to claim 1, it is characterised in that the radiating subassembly thickness range be 0.09mm~
0.15mm。
3. radiating subassembly according to claim 2, it is characterised in that the thermal conductivity factor of first heat-conducting layer is more than
1500W/m.K, thickness range is 0.03mm~0.05mm.
4. radiating subassembly according to claim 3, it is characterised in that the thermal conductivity factor of second heat-conducting layer is more than
1500W/m.K, thickness range is 0.03mm~0.05mm.
5. radiating subassembly according to claim 1, it is characterised in that the radiating subassembly is arranged in the electronic equipment
Portion；First heat-conducting layer includes the first gum layer, and the thermal insulation layer passes through first gum layer with first heat-conducting layer
It is hot bonding；Second heat-conducting layer includes the second gum layer, and the thermal insulation layer passes through described second with second heat-conducting layer
Gum layer is hot bonding.
6. radiating subassembly according to claim 1, it is characterised in that first heat-conducting layer and second heat-conducting layer are equal
For graphite guide thermosphere.
7. radiating subassembly according to claim 1, it is characterised in that the thermal insulation layer is fibrous web-like thermal insulation layer.
8. radiating subassembly according to claim 7, it is characterised in that the thermal conductivity factor of the fibrous web-like thermal insulation layer is less than
0.05W/m.K, the fibrous web-like thermal insulation layer includes mineral wool, felt or polyphenyl fiber.
9. radiating subassembly according to claim 1, it is characterised in that the radiating subassembly further comprises another heat-insulated
Layer, is arranged on the second heat-conducting layer side, and second heat-conducting layer is located between the thermal insulation layer and another thermal insulation layer.
10. a kind of electronic equipment, it is characterised in that the electronic equipment includes the radiating any one of claim 1-9
Component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710324168.1A CN107087378A (en) | 2017-05-10 | 2017-05-10 | The radiating subassembly and electronic equipment of electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710324168.1A CN107087378A (en) | 2017-05-10 | 2017-05-10 | The radiating subassembly and electronic equipment of electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107087378A true CN107087378A (en) | 2017-08-22 |
Family
ID=59613019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710324168.1A Pending CN107087378A (en) | 2017-05-10 | 2017-05-10 | The radiating subassembly and electronic equipment of electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107087378A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109599917A (en) * | 2019-01-04 | 2019-04-09 | 福建南平南孚电池有限公司 | Wireless charging device |
| WO2021031613A1 (en) * | 2019-08-16 | 2021-02-25 | 昆山国显光电有限公司 | Flexible display screen and flexible display apparatus |
| WO2024092973A1 (en) * | 2022-10-31 | 2024-05-10 | 华为技术有限公司 | Heat transfer apparatus and electronic device |
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| CN103025122A (en) * | 2011-09-23 | 2013-04-03 | 联想(北京)有限公司 | Electronic device |
| CN104470324A (en) * | 2013-09-17 | 2015-03-25 | 松下电器产业株式会社 | Composite sheet |
| US20160120068A1 (en) * | 2013-05-13 | 2016-04-28 | 3M Innovative Properties Company | Heat spreading tape |
| CN106105412A (en) * | 2014-03-20 | 2016-11-09 | 高通股份有限公司 | Multi-layer heat radiator for electronic equipment |
| CN206728484U (en) * | 2017-05-10 | 2017-12-08 | 广东欧珀移动通信有限公司 | The radiating subassembly and electronic equipment of electronic equipment |
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2017
- 2017-05-10 CN CN201710324168.1A patent/CN107087378A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103025122A (en) * | 2011-09-23 | 2013-04-03 | 联想(北京)有限公司 | Electronic device |
| US20160120068A1 (en) * | 2013-05-13 | 2016-04-28 | 3M Innovative Properties Company | Heat spreading tape |
| CN104470324A (en) * | 2013-09-17 | 2015-03-25 | 松下电器产业株式会社 | Composite sheet |
| CN106105412A (en) * | 2014-03-20 | 2016-11-09 | 高通股份有限公司 | Multi-layer heat radiator for electronic equipment |
| CN206728484U (en) * | 2017-05-10 | 2017-12-08 | 广东欧珀移动通信有限公司 | The radiating subassembly and electronic equipment of electronic equipment |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109599917A (en) * | 2019-01-04 | 2019-04-09 | 福建南平南孚电池有限公司 | Wireless charging device |
| CN109599917B (en) * | 2019-01-04 | 2024-06-07 | 福建南平南孚电池有限公司 | Wireless charging device |
| WO2021031613A1 (en) * | 2019-08-16 | 2021-02-25 | 昆山国显光电有限公司 | Flexible display screen and flexible display apparatus |
| US11882679B2 (en) | 2019-08-16 | 2024-01-23 | Kunshan Go-Visionox Opto-Electronics Co., Ltd. | Flexible display screen and flexible display apparatus |
| WO2024092973A1 (en) * | 2022-10-31 | 2024-05-10 | 华为技术有限公司 | Heat transfer apparatus and electronic device |
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Application publication date: 20170822 |
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