CN206728484U - The radiating subassembly and electronic equipment of electronic equipment - Google Patents
The radiating subassembly and electronic equipment of electronic equipment Download PDFInfo
- Publication number
- CN206728484U CN206728484U CN201720513458.6U CN201720513458U CN206728484U CN 206728484 U CN206728484 U CN 206728484U CN 201720513458 U CN201720513458 U CN 201720513458U CN 206728484 U CN206728484 U CN 206728484U
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- China
- Prior art keywords
- heat
- layer
- conducting layer
- radiating subassembly
- thermal insulation
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000009413 insulation Methods 0.000 claims abstract description 49
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 17
- 229910002804 graphite Inorganic materials 0.000 claims description 16
- 239000010439 graphite Substances 0.000 claims description 16
- 239000000835 fiber Substances 0.000 claims description 3
- 239000005439 thermosphere Substances 0.000 claims description 3
- 239000011490 mineral wool Substances 0.000 claims description 2
- 229920006389 polyphenyl polymer Polymers 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000003776 cleavage reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000007770 graphite material Substances 0.000 description 2
- 239000011133 lead Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000007017 scission Effects 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 230000027950 fever generation Effects 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 210000004209 hair Anatomy 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides the radiating subassembly and electronic equipment of a kind of electronic equipment, wherein, radiating subassembly includes the first heat-conducting layer, heat caused by electronic equipment is conducted in the extended planar of the first heat-conducting layer；Thermal insulation layer, prevent thickness direction conduction of the heat along thermal insulation layer；And second heat-conducting layer, the heat through thermal insulation layer is conducted in the extended planar of the second heat-conducting layer；Wherein, thermal insulation layer is arranged between the first heat-conducting layer and second heat-conducting layer.The utility model radiating subassembly can realize Homogeneouslly-radiating.
Description
Technical field
Field of terminal technology is the utility model is related to, is set more particularly to the radiating subassembly and electronics of a kind of electronic equipment
It is standby.
Background technology
For electronic equipment in operation, its inner member can produce heat, such as the mobile terminal such as mobile phone, its chips
Caused heat is relatively large, and for whole mobile phone, the region heat where chip is more concentrated, and too high heat can be straight
Conduction is connect to mobile phone surface, the problem of causing mobile phone region to overheat, Consumer's Experience is poor.
Utility model content
The utility model provides the radiating subassembly of a kind of electronic equipment, and it includes the first heat-conducting layer, produces electronic equipment
Heat the first heat-conducting layer extended planar conduct；Thermal insulation layer, prevent thickness direction conduction of the heat along thermal insulation layer；And the
Two heat-conducting layers, the heat through thermal insulation layer is set to be conducted in the extended planar of the second heat-conducting layer；Wherein, thermal insulation layer is arranged on first and led
Between thermosphere and second heat-conducting layer.
The utility model also provides a kind of electronic equipment, and it includes above-mentioned radiating subassembly.
Brief description of the drawings
, below will be to needed for embodiment description in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
The accompanying drawing to be used is briefly described, it should be apparent that, drawings in the following description are only some realities of the present utility model
Example is applied, for those of ordinary skill in the art, on the premise of not paying creative work, can also be according to these accompanying drawings
Obtain other accompanying drawings.
Fig. 1 is the structural representation of the embodiment of radiating subassembly one of the utility model electronic equipment；
Fig. 2 is the structural representation of another embodiment of radiating subassembly of the utility model electronic equipment；
Fig. 3 is the structural representation of the embodiment of the utility model electronic equipment one.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describe.It is understood that specific embodiment described herein is only used for explaining the utility model, rather than
To restriction of the present utility model.It also should be noted that for the ease of description, illustrate only in accompanying drawing and the utility model
Related part rather than entire infrastructure.Based on the embodiment in the utility model, those of ordinary skill in the art are not making
The every other embodiment obtained under the premise of creative work, belong to the scope of the utility model protection.
The electronic equipment that the utility model embodiment is provided, including smart mobile phone, tablet personal computer, Intelligent worn device,
Digital audio ＆ video players, electronic reader, handheld game machine, computer etc..
Term " first " in the utility model, " second ", " the 3rd " are only used for describing purpose, and it is not intended that instruction
Or imply relative importance or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", " second ",
At least one this feature can be expressed or be implicitly included to the feature of " the 3rd ".In description of the present utility model, " multiples' "
It is meant that at least two, such as two, three etc., unless otherwise specifically defined.Own in the utility model embodiment
Directionality instruction (such as up, down, left, right, before and after ...) is only used for explaining each under a certain particular pose (as shown in drawings)
Relative position relation between part etc., if the particular pose changes, directionality instruction is also correspondingly therewith
Change.In addition, term " comprising " and " having " and their any deformations, it is intended that cover non-exclusive include.Such as wrap
Contain the step of process, method, system, product or the equipment of series of steps or unit is not limited to list or unit,
But the step of alternatively also including not listing or unit, or alternatively also include for these processes, method, product or set
Standby intrinsic other steps or unit.
Referenced herein " embodiment " is it is meant that the special characteristic, structure or the characteristic that describe can wrap in conjunction with the embodiments
It is contained at least one embodiment of the present utility model., which there is the phrase, in each position in the description to be each meant
Identical embodiment, nor the independent or alternative embodiment with other embodiments mutual exclusion.Those skilled in the art are explicit
Ground and implicitly understand, embodiment described herein can be combined with other embodiments.
Referring to Fig. 1, Fig. 1 is the structural representation of the embodiment of radiating subassembly one of the utility model electronic equipment.
The application of the present embodiment radiating subassembly in the electronic device, is arranged on electronic equipment internal, for producing electronic equipment
Raw even heat distributes.For example, for mobile phone, heat is larger caused by chip, therefore radiating subassembly is arranged on into chip
Between phone housing, and the area of plane of radiating subassembly is more than the area of chip, may be designed as agreeing with the size of phone housing,
Radiating subassembly can distribute even heat caused by chip so that the problem of being not in hot-spot on phone housing, user
Experience is preferable.
Specifically, radiating subassembly 100 includes the first heat-conducting layer 11, the heat-conducting layer 13 of thermal insulation layer 12 and second, thermal insulation layer 12
It is arranged between the first heat-conducting layer 11 and the second heat-conducting layer 13.
Wherein, the first heat-conducting layer 11 is used to make heat caused by electronic equipment pass in the extended planar of the first heat-conducting layer 11
Lead, i.e., heat caused by electronic equipment distributes via the first heat-conducting layer 11 first, and the first heat-conducting layer 11 conducts heat to entirely
Plane, realize that uniform plane radiates.In order that heat rapidly can scatter in plane, the first heat-conducting layer 11 is big by thermal conductivity factor
It is made in 1500W/m.K material.
Graphite material used by first heat-conducting layer 11 in the present embodiment, such as native graphite fin, nano combined stone
Ink film, graphene etc..Graphite is carbonaceous element crystalline mineral, and its crystallization screen work is hexagon layer structure, belongs to hexagonal crystal system,
Has complete stratiform cleavage, cleavage surface is weaker to van der Waals' force based on molecular link, therefore its native floatability is fine.Graphite
With advantages below：(1) heat-resisting quantity：The fusing point of graphite is 3850 ± 50 DEG C, and boiling point is 4250 DEG C, even if through superhigh temperature electric arc
Calcination, the loss very little of weight, thermal coefficient of expansion also very little, graphite intensity is improved and strengthened with temperature, at 2000 DEG C, graphite
Intensity doubles；(2) conduction, thermal conductivity are good：The electric conductivity of graphite is higher than general nonmetallic ore 100 times, and thermal conductivity exceedes
The metal materials such as steel, iron, lead, thermal conductivity factor are raised and reduced with temperature, or even at very high temperatures, graphite is into heat guard；
(3) lubricity is good：The greasy property of graphite depends on the size of graphite flakes, and scale is bigger, and coefficient of friction is smaller, greasy property
Better；(4) chemical stability：Graphite has good chemical stability at normal temperatures, can acidproof, alkaline-resisting and organic solvent-resistant corruption
Erosion；(5) plasticity：The good toughness of graphite, very thin thin slice can be ground into；(6) thermal shock resistance：Graphite can be through when using at normal temperatures
It will not be destroyed by the acute variation of firmly temperature, during temperature jump, the Volume Changes of graphite are little, will not crack.
Certainly, the first heat-conducting layer 11 can also use copper foil, aluminium alloy etc., and copper foil adds a certain proportion of other metals to beat by copper
System forms, and copper foil typically has two kinds of 90 paper tinsels and 88 paper tinsels, i.e. copper content is 90% and 88%.In a metal, the thermal conductivity of copper is best,
Its thermal conductivity factor is 401W/m.K；The thermal conductivity of aluminium is then only second to copper, and its thermal conductivity factor is 237W/m.K.
Thermal insulation layer 12 is used for the thickness direction conduction for preventing heat along thermal insulation layer 12 so that heat is tried one's best in vertical direction
It will not spread, therefore thermal insulation layer 12 selects heat-barrier material, i.e., the material of ultralow thermal conductivity.Thermal insulation layer 12 is by leading in the present embodiment
Material of the hot coefficient less than 0.05W/m.K is made.
Thermal insulation layer 12 can be fibrous reticular structure, and thermal insulation layer 12 is fibrous reticular structure, includes air, energy among it
Ultralow thermal conductivity is enough realized, that is, realizes the heat insulating function of thickness direction, fiber can be mineral wool, hair used by thermal insulation layer 12
Felt or polyphenyl fiber.Thermal insulation layer 12 can also be heat-insulated foam, and heat-insulated foam can not only reach heat-insulated effect, also be set in electronics
Certain cushioning effect is played during standby use.
Second heat-conducting layer 13 is then used to make the heat through thermal insulation layer 12 conduct in its extended planar, further realizes heat
Uniform plane diffusion.Conduction and the first heat-conducting layer 11 in second heat-conducting layer 13 to heat is basically identical, is to make its uniform
Conduct in whole plane, therefore the second heat-conducting layer 13 also selects the material for being more than 1500W/m.K by thermal conductivity factor in the present embodiment
Material is made.
Each layer realizes and is bonded that specifically, the first heat-conducting layer 11 wraps by gum hot pressing in the present embodiment radiating subassembly 100
The first gum layer 111 is included, the heat-conducting layer 11 of thermal insulation layer 12 and first is hot bonding by the first gum layer 111；Second heat-conducting layer 13
Including the second gum layer 131, the heat-conducting layer 13 of thermal insulation layer 12 and second is then hot bonding by the second gum layer 131.
Further, the first heat-conducting layer 11 and the second heat-conducting layer 13 use graphite material, the first heat conduction in the present embodiment
Layer 11 includes the first gum layer 111 and the first graphite flake layer 112, and the second heat-conducting layer 13 includes the second gum layer 131 and the second stone
Ink sheet layer 132.
Each layer can also be realized by glue spraying and is bonded in radiating subassembly 100, i.e. connecing in the first heat-conducting layer 11 and thermal insulation layer 12
Conjunction face sprays one layer of glue, the first heat-conducting layer 11 and thermal insulation layer 12 is then pressed, to realize the strong bond of the two.
The present embodiment radiating subassembly 100 be used for frivolous electronic equipment in, its thickness range control 0.09mm~
0.15mm, ensure to also ensure that the lightening of electronic equipment while radiating.For the thickness of 100 each layer of radiating subassembly,
Set according to demand.Such as first heat-conducting layer 11, the thickness range of the heat-conducting layer 13 of thermal insulation layer 12 and second can be 0.03mm
~0.05mm.
Each thickness degree can be also designed based on the function of each layer, because the heat very first time caused by electronic equipment need to be by
First heat-conducting layer 11 scatters, therefore the first heat-conducting layer 11 can be all thicker than the heat-conducting layer 13 of thermal insulation layer 12 and second, and the second heat conduction
Layer 13 is used to carry out further planar diffusion to the heat through thermal insulation layer 12, therefore can be arranged to the thickness of the second heat-conducting layer 13
It is minimum.For example, the thickness of the first heat-conducting layer 11 is arranged to 0.05mm in the present embodiment, the thickness of thermal insulation layer 12 is arranged to 0.04mm, the
The thickness of two heat-conducting layer 13 is arranged to 0.03mm.
Radiating subassembly of the present utility model realizes the uniform heat conduction of in-plane by heat-conducting layer, is realized by thermal insulation layer thick
It is heat-insulated on degree direction, it ensure that heat caused by part can uniformly scatter in the in-plane direction in electronic equipment, Bu Hui
Conducted on thickness direction, so as to solve the problems, such as hot-spot.
For the larger electronic equipment that generates heat, radiating subassembly may also include more heat-conducting layers and thermal insulation layer, wherein heat conduction
Layer and thermal insulation layer are arranged at intervals.As shown in Fig. 2 Fig. 2 is the knot of another embodiment of radiating subassembly of the utility model electronic equipment
Structure schematic diagram.The first heat-conducting layer 21 that the present embodiment radiating subassembly 200 includes stacking gradually, first thermal insulation layer 22, second are led
Thermosphere 23 and second thermal insulation layer 24.
The first heat-conducting layer 21 directly contacts pyrotoxin in the present embodiment, for making heat be conducted in its extended planar,
First thermal insulation layer 22 and second thermal insulation layer 24 are used to prevent heat from conducting in the thickness direction of thermal insulation layer, and the second heat-conducting layer 23 is then
For making the heat through thermal insulation layer be conducted in its extended planar.Heat-conducting layer and thermal insulation layer and above-described embodiment radiating subassembly 100
In function it is substantially similar, specifically repeat no more.
Referring to Fig. 3, Fig. 3 is the structural representation of the embodiment of the utility model electronic equipment one.The utility model electronics
Equipment can be the mobile terminals such as mobile phone, tablet personal computer, wearable device, be illustrated in the present embodiment by taking mobile phone as an example.Electronics
Equipment 300 is mobile phone 300, and mobile phone 300 includes radiating subassembly 31, the radiating subassembly 31 can using above-mentioned radiating subassembly 100 or
Radiating subassembly 200, concrete structure repeats no more, and radiating subassembly 31 can carry out Homogeneouslly-radiating to heat caused by mobile phone 300.
Further, housing 32, mainboard 33 and chip 34 are also included in mobile phone 300.
The chips 34 of mobile phone 300 are arranged on mainboard 33, and radiating subassembly 31, mainboard 33 and chip 34 are arranged at housing
In 32, and radiating subassembly 31 is arranged between chip 34 and housing 32, and the shape size of radiating subassembly 31 is set according to housing 32
Meter, its area is more big, can realize the radiating of more large area, therefore radiating subassembly 31 may be configured as being covered with the inside of the one of housing 32
Face.
Heat directly realizes uniform diffusion by radiating subassembly 31 caused by chip 34, due to heat-insulated in radiating subassembly 31
Layer effect, heat directly will not conduct in the thickness direction thereof, therefore heat will not be directly conducted to housing caused by chip 34
32, cause the region of the corresponding chip 34 of housing 32 situation of hot-spot occur.
Heat caused by the inside of mobile phone 300, in uniformly being scattered on in-plane, can avoid in the presence of radiating subassembly 31
The problem of local pyrexia, Consumer's Experience is preferable.
Embodiment of the present utility model is the foregoing is only, not thereby limits the scope of the claims of the present utility model, it is all
It is the equivalent structure or equivalent flow conversion made using the utility model specification and accompanying drawing content, or directly or indirectly uses
In other related technical areas, similarly it is included in scope of patent protection of the present utility model.
Claims (10)
1. the radiating subassembly of a kind of electronic equipment, it is characterised in that the radiating subassembly includes：
First heat-conducting layer, heat caused by the electronic equipment is set to be conducted in the extended planar of first heat-conducting layer；
Thermal insulation layer, prevent thickness direction conduction of the heat along the thermal insulation layer；And
Second heat-conducting layer, the heat through the thermal insulation layer is set to be conducted in the extended planar of second heat-conducting layer；
Wherein, the thermal insulation layer is arranged between first heat-conducting layer and second heat-conducting layer.
2. radiating subassembly according to claim 1, it is characterised in that the radiating subassembly thickness range be 0.09mm~
0.15mm。
3. radiating subassembly according to claim 2, it is characterised in that the thermal conductivity factor of first heat-conducting layer is more than
1500W/m.K, thickness range are 0.03mm~0.05mm.
4. radiating subassembly according to claim 3, it is characterised in that the thermal conductivity factor of second heat-conducting layer is more than
1500W/m.K, thickness range are 0.03mm~0.05mm.
5. radiating subassembly according to claim 1, it is characterised in that the radiating subassembly is arranged in the electronic equipment
Portion；First heat-conducting layer includes the first gum layer, and the thermal insulation layer passes through first gum layer with first heat-conducting layer
It is hot bonding；Second heat-conducting layer includes the second gum layer, and the thermal insulation layer passes through described second with second heat-conducting layer
Gum layer is hot bonding.
6. radiating subassembly according to claim 1, it is characterised in that first heat-conducting layer and second heat-conducting layer are equal
For graphite guide thermosphere.
7. radiating subassembly according to claim 1, it is characterised in that the thermal insulation layer is fibrous web-like thermal insulation layer.
8. radiating subassembly according to claim 7, it is characterised in that the thermal conductivity factor of the fibrous web-like thermal insulation layer is less than
0.05W/m.K, the fibrous web-like thermal insulation layer include mineral wool, felt or polyphenyl fiber.
9. radiating subassembly according to claim 1, it is characterised in that the radiating subassembly further comprises another heat-insulated
Layer, is arranged on the second heat-conducting layer side, second heat-conducting layer is between the thermal insulation layer and another thermal insulation layer.
10. a kind of electronic equipment, it is characterised in that the electronic equipment includes the radiating any one of claim 1-9
Component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720513458.6U CN206728484U (en) | 2017-05-10 | 2017-05-10 | The radiating subassembly and electronic equipment of electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720513458.6U CN206728484U (en) | 2017-05-10 | 2017-05-10 | The radiating subassembly and electronic equipment of electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206728484U true CN206728484U (en) | 2017-12-08 |
Family
ID=60510484
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720513458.6U Expired - Fee Related CN206728484U (en) | 2017-05-10 | 2017-05-10 | The radiating subassembly and electronic equipment of electronic equipment |
Country Status (1)
| Country | Link |
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| CN (1) | CN206728484U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107087378A (en) * | 2017-05-10 | 2017-08-22 | 广东欧珀移动通信有限公司 | The radiating subassembly and electronic equipment of electronic equipment |
-
2017
- 2017-05-10 CN CN201720513458.6U patent/CN206728484U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107087378A (en) * | 2017-05-10 | 2017-08-22 | 广东欧珀移动通信有限公司 | The radiating subassembly and electronic equipment of electronic equipment |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171208 |