CN204067347U - A kind of riveted joint has the copper coin of ceramic bases - Google Patents
A kind of riveted joint has the copper coin of ceramic bases Download PDFInfo
- Publication number
- CN204067347U CN204067347U CN201420384946.8U CN201420384946U CN204067347U CN 204067347 U CN204067347 U CN 204067347U CN 201420384946 U CN201420384946 U CN 201420384946U CN 204067347 U CN204067347 U CN 204067347U
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- CN
- China
- Prior art keywords
- copper coin
- silver
- ceramic bases
- rivet
- riveted joint
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Abstract
The utility model discloses the copper coin that a kind of riveted joint has ceramic bases; comprise ceramic bases, copper coin, silver-colored rivet, conductive fiber, fibrous protective layer and mounting panel; described copper coin tiling on a ceramic substrate; and by puncher, in ceramic bases and copper coin, to get specification be spacing is the injecting hole of the grid silver rivet of 1.5cm; silver-colored solution is injected in described silver-colored rivet hole; described conductive fiber is uniformly coated on copper coin, and the bottom of described ceramic bases is packed with the composite plastic mounting panel of 0.5 cm thick.This riveted joint has the copper coin of ceramic bases, adopt the thermal source of silver-colored rivet transmission and copper coin Connection Element, the conductive coefficient of silver is high, heat trnasfer is fast, conductive fiber improves the conduction of the entirety of copper coin, antistatic and electromagnetic wave shielding performance, being provided with copper clad layers makes LED-baseplate or PCB substrate etc. to weld on a heat sink, can more rapidly by integrated LED, PCB heat source to radiator, improve radiating efficiency.
Description
Technical field
The utility model relates to copper material technical field, is specially the copper coin that a kind of riveted joint has ceramic bases.
Background technology
Covering copper ceramic substrate is use DCB(Direct Bond Copper) technology a kind of basic electronic material that Copper Foil direct sintering is made at ceramic surface, cover copper ceramic substrate and there is fabulous thermal cycle, dimensionally stable, good rigidly, thermal conductivity is high, reliability is high, cover the feature that copper face can etch various figure, and it is a kind of pollution-free, non-harmful green product, serviceability temperature is quite extensive, can from-55 DEG C ~ 850 DEG C, thermal coefficient of expansion is close to silicon, its application is very extensive: can be used for semiconductor cooler, electronic heater, high-power electric semiconductor module, power control circuit, power hybrid circuit, intelligent power assembly, high frequency switch power, solid-state relay, automotive electronics, space flight and aviation and military electronic assembly, solar cell panel assembly, telecommunication private branch exchange system, receiving system, the multinomial industrial electronic field such as laser, but ceramic substrate cannot be fixed on radiator in the mode of weld bonds, reduce radiating efficiency, when light fixture uses, the power of integrated type lamp cannot be promoted, for this reason, we propose the copper coin that a kind of riveted joint has ceramic bases.
Utility model content
The purpose of this utility model is to provide a kind of riveted joint to have the copper coin of ceramic bases, to solve the problem proposed in above-mentioned background technology.
For achieving the above object; the utility model provides following technical scheme: a kind of riveted joint has the copper coin of ceramic bases; comprise ceramic bases, copper coin, silver-colored rivet, conductive fiber, fibrous protective layer and mounting panel; described copper coin tiling on a ceramic substrate; and by puncher, in ceramic bases and copper coin, to get specification be spacing is the injecting hole of the grid silver rivet of 1.5CM; silver-colored solution is injected in described silver-colored rivet hole; described conductive fiber is uniformly coated on copper coin, and the bottom of described ceramic bases is packed with the composite plastic mounting panel of 0.5 cm thick.
Preferably, the diameter of described silver-colored rivet is 0.2MM, and is up and down 0.4MM crown with diameter.
Preferably, the thickness of described copper coin is 0.8MM-1.2MM.
Preferably, the thickness 0.2-0.3CM of described conductive fiber, and surface is coated with the fibrous protective layer of 200-250um.
Compared with prior art, the beneficial effects of the utility model are: this riveted joint has the copper coin of ceramic bases, adopt the thermal source of silver-colored rivet transmission and copper coin Connection Element, the conductive coefficient of silver is high, heat trnasfer is fast, and conductive fiber improves the conduction of the entirety of copper coin, antistatic and electromagnetic wave shielding performance, is provided with copper clad layers and LED substrate or PCB substrate etc. can be welded on a heat sink, can more rapidly by integrated LED, PCB heat source to radiator, improve radiating efficiency.
Accompanying drawing explanation
Fig. 1 is front view of the present utility model;
Fig. 2 is the vertical view of the utility model removing conductive fiber and fibrous protective layer.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
Refer to Fig. 1-2, the utility model provides a kind of technical scheme: a kind of riveted joint has the copper coin of ceramic bases, comprise ceramic bases 1, copper coin 2, silver rivet 3, conductive fiber 4, fibrous protective layer 5 and mounting panel 6, described copper coin 2 is laid in ceramic bases 1, and by puncher, in ceramic bases 1 and copper coin 2, to get specification be spacing is the injecting hole of the grid silver rivet 3 of 1.5CM, silver rivet 3 can as the conductor of conduction heat sources, in the process of punching, adopt upper and lower surface to punch simultaneously form the technique of through hole, silver-colored solution is injected in described silver-colored rivet 3 hole, the instrument injecting silver-colored solution is the pin hole injection plate distributing identical with the injecting hole with silver-colored rivet 3, the diameter of described silver-colored rivet 3 is 0.2MM, and be up and down 0.4MM crown with diameter, crown structure can be accomplished fixing between ceramic bases 1 and copper coin 2, the thickness of described copper coin 2 is 0.8MM-1.2MM, described conductive fiber 4 is uniformly coated on copper coin 2, the thickness 0.2-0.3CM of described conductive fiber 4, and surface is coated with the fibrous protective layer 5 of 200-250um, the bottom of described ceramic bases 1 is packed with the composite plastic mounting panel 6 of 0.5 cm thick, convenient and riveted joint has the copper coin installation on a heat sink of ceramic bases, conductive fiber 4 is interactions of hydroxyl by polyvinyl alcohol molecule and each metal ion species, the high conductivity vinal of copper sulphide nano ion is formed at fibrous inside, by carrying out compound to the metal particle of nano-scale, find to increase specific area and reduce interparticle distance to increase from the conductivity of product can be made, conducting pathway is there is at fibrous inside, bending, the effects such as friction are also difficult to its outside is sustained damage, therefore there is excellent durability, the advantage such as the high and conductivity of the degree of freedom of product is controlled, also antistatic and electromagnetic wave shielding can be prevented.
To those skilled in the art, obvious the utility model is not limited to the details of above-mentioned one exemplary embodiment, and when not deviating from spirit of the present utility model or essential characteristic, can realize the utility model in other specific forms.Therefore, no matter from which point, all should embodiment be regarded as exemplary, and be nonrestrictive, scope of the present utility model is limited by claims instead of above-mentioned explanation, and all changes be therefore intended in the implication of the equivalency by dropping on claim and scope are included in the utility model.Any Reference numeral in claim should be considered as the claim involved by limiting.
In addition, be to be understood that, although this specification is described according to execution mode, but not each execution mode only comprises an independently technical scheme, this narrating mode of specification is only for clarity sake, those skilled in the art should by specification integrally, and the technical scheme in each embodiment also through appropriately combined, can form other execution modes that it will be appreciated by those skilled in the art that.
Claims (4)
1. a riveted joint has the copper coin of ceramic bases; comprise ceramic bases, copper coin, silver-colored rivet, conductive fiber, fibrous protective layer and mounting panel; it is characterized in that: described copper coin tiling on a ceramic substrate; and by puncher, in ceramic bases and copper coin, to get specification be spacing is the injecting hole of the grid silver rivet of 1.5CM; silver-colored solution is injected in described silver-colored rivet hole; described conductive fiber is uniformly coated on copper coin, and the bottom of described ceramic bases is packed with the composite plastic mounting panel of 0.5 cm thick.
2. a kind of riveted joint according to claim 1 has the copper coin of ceramic bases, it is characterized in that: the diameter of described silver-colored rivet is 0.2MM, and is up and down 0.4MM crown with diameter.
3. a kind of riveted joint according to claim 1 has the copper coin of ceramic bases, it is characterized in that: the thickness of described copper coin is 0.8MM-1.2MM.
4. a kind of riveted joint according to claim 1 has the copper coin of ceramic bases, it is characterized in that: the thickness 0.2-0.3CM of described conductive fiber, and surface is coated with the fibrous protective layer of 200-250um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420384946.8U CN204067347U (en) | 2014-07-14 | 2014-07-14 | A kind of riveted joint has the copper coin of ceramic bases |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420384946.8U CN204067347U (en) | 2014-07-14 | 2014-07-14 | A kind of riveted joint has the copper coin of ceramic bases |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204067347U true CN204067347U (en) | 2014-12-31 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420384946.8U Expired - Fee Related CN204067347U (en) | 2014-07-14 | 2014-07-14 | A kind of riveted joint has the copper coin of ceramic bases |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204067347U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106847590A (en) * | 2017-04-14 | 2017-06-13 | 常州信息职业技术学院 | A kind of preparation method of film key switch and thin-film key panel |
| CN106847593A (en) * | 2017-04-14 | 2017-06-13 | 常州信息职业技术学院 | A kind of preparation method of weighing instrument film key switch and its antistatic backing |
| CN106876204A (en) * | 2017-04-14 | 2017-06-20 | 常州信息职业技术学院 | A kind of preparation method of mining instrument thin-film key switch and its screen layer |
-
2014
- 2014-07-14 CN CN201420384946.8U patent/CN204067347U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106847590A (en) * | 2017-04-14 | 2017-06-13 | 常州信息职业技术学院 | A kind of preparation method of film key switch and thin-film key panel |
| CN106847593A (en) * | 2017-04-14 | 2017-06-13 | 常州信息职业技术学院 | A kind of preparation method of weighing instrument film key switch and its antistatic backing |
| CN106876204A (en) * | 2017-04-14 | 2017-06-20 | 常州信息职业技术学院 | A kind of preparation method of mining instrument thin-film key switch and its screen layer |
| CN106847593B (en) * | 2017-04-14 | 2018-09-11 | 常州信息职业技术学院 | A kind of production method of weighing instrument film key switch and its antistatic backing |
| CN106847590B (en) * | 2017-04-14 | 2019-02-26 | 常州信息职业技术学院 | A kind of production method of film key switch and thin-film key panel |
| CN106876204B (en) * | 2017-04-14 | 2020-03-06 | 常州信息职业技术学院 | Mining instrument thin film key switch and manufacturing method of shielding layer thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170330 Address after: 335200 Honghu Industrial Park, Yujiang, Jiangxi, Yingtan Patentee after: Yujiang County Pioneer Industrial Co. Ltd. Address before: 335200 Yingtan County, Jiangxi, Honghu copper processing base of Yujiang Patentee before: JIANGXI YAFEIDA COPPER LIMITED COMPANY |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141231 Termination date: 20180714 |