CN110602871A - Graphene heat-conducting PCB and preparation method thereof - Google Patents
Graphene heat-conducting PCB and preparation method thereof Download PDFInfo
- Publication number
- CN110602871A CN110602871A CN201910869482.7A CN201910869482A CN110602871A CN 110602871 A CN110602871 A CN 110602871A CN 201910869482 A CN201910869482 A CN 201910869482A CN 110602871 A CN110602871 A CN 110602871A
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- graphene
- graphene sheet
- inner core
- core plate
- pcb
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Abstract
The invention provides a graphene heat-conducting PCB which comprises a plurality of graphene sheets and an inner core plate which are stacked in a staggered mode, wherein a prepreg is arranged between each graphene sheet and the inner core plate, and one side, away from the inner core plate, of the graphene sheet on the outermost layer is bonded with a copper foil through a heat-conducting glue. The preparation method comprises the following steps: etching and browning the inner core plate; cutting the graphene sheet, and drilling; pressing the drilled graphene sheet and the browned inner core plate, inserting a prepreg between the graphene sheet and the inner core plate, and bonding the graphene sheet on the outermost layer with a copper foil through a heat-conducting adhesive; and drilling a via hole on the laminated PCB, wherein the via hole and the through hole on the graphene sheet have the same hole position, and then carrying out copper-deposition electroplating on the via hole to ensure that the inner layer core plates which need to be interconnected are mutually communicated. According to the graphene heat conduction PCB provided by the invention, the graphene is pressed between the core plates of all layers, so that the heat dissipation performance of the PCB is improved; the graphene sheet layer, the core plate and the via hole are kept in an insulating state, and circuit signal transmission is not influenced.
Description
Technical Field
The invention relates to a graphene heat-conducting PCB and a preparation method thereof, and belongs to the technical field of PCB manufacturing.
Background
The PCB is one of the main components of electronic products, and a large number of heat-generating electronic components are mounted on the PCB, so that it is becoming an increasingly important issue to improve the heat dissipation performance of the PCB. Graphene has good thermal conductivity, but at present, graphene is rarely applied to a multilayer PCB; graphene has good thermal conductivity and good electrical conductivity, and insulation between graphene and via holes needs to be considered when graphene is pressed between the printed circuit board and the PCB. Patent CN201721851976 discloses a high-heat-dissipation graphene circuit board, which sequentially comprises a first circuit layer, a first insulating layer, a graphene layer, a second insulating layer and a second circuit layer, wherein a through hole is arranged to penetrate through the first insulating layer, the graphene layer and the second insulating layer, the through hole is filled with an insulating and heat-conducting material, and then a through hole is formed in the through hole; graphene and via holes are isolated by insulating materials, but this structure is cumbersome to operate and is not suitable for multilayer PCB boards.
Disclosure of Invention
The purpose is as follows: in order to overcome the defects in the prior art, the invention provides a graphene heat-conducting PCB and a preparation method thereof.
The technical scheme is as follows: in order to solve the technical problems, the technical scheme adopted by the invention is as follows:
the utility model provides a graphite alkene heat conduction PCB, includes multilayer crisscross superimposed graphite alkene piece and inlayer core, be equipped with the prepreg between graphite alkene piece and the inlayer core, the one side that the inlayer core was kept away from to outermost graphite alkene piece bonds through heat-conducting glue and copper foil.
A preparation method of a graphene heat conduction PCB specifically comprises the following steps:
(1) preparing an inner-layer core plate: pre-treating, film pasting, exposing, developing and etching the copper-clad plate to form an inner core plate with a circuit pattern etched on the surface, and performing brown oxidation treatment on the inner core plate;
(2) preparation of graphene sheets: cutting the graphene sheet to make the size of the graphene sheet consistent with that of the inner core plate; firstly, drilling a positioning hole on a graphene sheet, and then drilling a plurality of through holes on the graphene sheet;
(3) preparing a graphene heat-conducting PCB: overlapping and pressing the drilled graphene sheet and the browned inner core plate in a staggered manner, and inserting a prepreg between the graphene sheet and the inner core plate for insulation; one side, far away from the inner core plate, of the graphene sheet on the outermost layer is bonded with the copper foil through heat-conducting glue;
drilling a via hole on the laminated PCB, wherein the via hole and the through hole on the graphene sheet have the same hole position, and the aperture of the via hole is smaller than that of the through hole; and then carrying out copper deposition electroplating on the via hole, and uniformly plating copper on the hole wall to ensure that the inner layer core plates which need to be interconnected are mutually communicated.
Further, mechanical drilling is adopted for drilling holes in the graphene sheets, and during mechanical drilling, the graphene sheets are protected in a mode that the resin substrates and the graphene sheets are stacked in a staggered mode.
Furthermore, the holes are drilled in the graphene sheet by laser drilling, and during laser drilling, the graphene sheet is directly drilled without adding a resin substrate protective layer.
Furthermore, when the graphene sheet is drilled, the upper surface and the lower surface of the graphene sheet are pasted with protective films.
Furthermore, after the graphene sheet is drilled, the protective film needs to be removed, and then the graphene sheet is pressed with the inner core plate.
Has the advantages that: according to the graphene heat conduction PCB provided by the invention, the graphene sheets are laminated between core plates of all layers of the PCB, so that the heat dissipation performance of the PCB is improved; a prepreg is arranged between the graphene and the core plate, a through hole is formed in the graphene layer, the aperture of the through hole is larger than that of the through hole, so that the graphene layer, the core plate and the through hole are kept in an insulating state, and signal transmission of a PCB circuit is not influenced. The preparation method of the graphene heat-conducting PCB is simple and feasible in process, low in cost and high in efficiency.
Drawings
Fig. 1 is a schematic structural diagram of a graphene thermal conductive PCB provided in the present invention;
FIG. 2 is a schematic diagram of an inner core plate after a circuit is etched;
FIG. 3 is a schematic view of the browned inner core sheet;
FIG. 4 is a schematic illustration of mechanical drilling of a graphene sheet;
fig. 5 is a schematic illustration of laser drilling of a graphene sheet;
fig. 6 is a schematic structural view of the graphene sheet and the inner core plate when the graphene sheet and the inner core plate are pressed together without drilling.
Detailed Description
The present invention will be further described with reference to the accompanying drawings.
As shown in fig. 1, a graphene heat-conducting PCB comprises a plurality of graphene sheets 2 and an inner core plate 1 which are stacked in a staggered manner, wherein a prepreg 3 is arranged between the graphene sheets 2 and the inner core plate 1, and one side of the outermost graphene sheet, which is far away from the inner core plate, is bonded with a copper foil 5 through a heat-conducting glue 4; the PCB is drilled with a number of via holes 6.
The preparation method of the graphene heat conduction PCB comprises the following steps:
(1) preparing an inner-layer core plate: pre-treating, film pasting, exposing, developing and etching the copper-clad plate to form an inner core plate 1 with a circuit pattern etched on the surface as shown in figure 2, and performing brown oxidation treatment on the inner core plate 1 as shown in figure 3;
(2) preparation of graphene sheets: cutting the graphene sheet 2 to make the size of the graphene sheet consistent with that of the inner core plate 1; firstly, drilling a positioning hole on a graphene sheet 2, and then drilling a plurality of through holes 7 on the graphene sheet 2;
mechanical drilling is adopted for drilling holes in the graphene sheets 2, the graphene sheets 2 are protected in a mode that the resin substrates 8 and the graphene sheets 2 are stacked in a staggered mode during mechanical drilling, and protective films 9 are attached to the upper surfaces and the lower surfaces of the graphene sheets 2 during drilling, as shown in fig. 4.
Or, the graphene sheet 2 is drilled by laser drilling, during the laser drilling, the graphene sheet 2 is directly drilled without adding a resin substrate protective layer, and during the drilling, the upper surface and the lower surface of the graphene sheet 2 are coated with protective films 9, as shown in fig. 5.
After the graphene sheet 2 is drilled, the protective film 9 needs to be removed, and then the graphene sheet 2 is pressed with the inner core plate 1.
(3) Preparing a graphene heat-conducting PCB: overlapping and pressing the drilled graphene sheet 2 and the browned inner core plate 1 in a staggered manner, and inserting a prepreg 3 between the graphene sheet 2 and the inner core plate 1 for insulation; in the pressing process, the resin of the prepreg 3 flows into the through hole 7 of the graphene sheet to fill the through hole, so that insulation is kept between the graphene sheet 2 and the through hole 6 after the through hole 6 is drilled subsequently, as shown in fig. 6;
one side, far away from the inner core plate, of the graphene sheet on the outermost layer is bonded with the copper foil through heat-conducting glue;
drilling a via hole 6 on the laminated PCB, wherein the via hole 6 and the through hole 7 on the graphene sheet 2 have the same hole site, during the specific operation, the laminated PCB can be drilled by the graphene sheet drilling equipment, the same positioning position is selected for the laminated PCB and the previous graphene sheet, and the drilling operation is performed by adopting the same drilling coordinate system, so that the via hole 6 and the through hole 7 have the same hole site; the aperture of the via hole 6 is smaller than that of the through hole 7; and then carrying out copper deposition electroplating on the via holes 6, and uniformly plating copper on the hole walls to obtain the PCB shown in the figure 1, so that the inner core boards 1 which need to be interconnected are mutually communicated.
The above description is only of the preferred embodiments of the present invention, and it should be noted that: it will be apparent to those skilled in the art that various modifications and adaptations can be made without departing from the principles of the invention and these are intended to be within the scope of the invention.
Claims (6)
1. The utility model provides a graphite alkene heat conduction PCB which characterized in that: the graphene composite board comprises a plurality of layers of graphene sheets and an inner core board which are stacked in a staggered mode, wherein a prepreg is arranged between each graphene sheet and the inner core board, one side, away from the inner core board, of the outermost graphene sheet is bonded with a copper foil through a heat-conducting glue, and a plurality of conducting holes are drilled in the PCB.
2. The preparation method of the graphene thermal conductive PCB of claim 1, characterized in that: the method specifically comprises the following steps of,
(1) preparing an inner-layer core plate: pre-treating, film pasting, exposing, developing and etching the copper-clad plate to form an inner core plate with a circuit pattern etched on the surface, and performing brown oxidation treatment on the inner core plate;
(2) preparation of graphene sheets: cutting the graphene sheet to make the size of the graphene sheet consistent with that of the inner core plate; firstly, drilling a positioning hole on a graphene sheet, and then drilling a plurality of through holes on the graphene sheet;
(3) preparing a graphene heat-conducting PCB: overlapping and pressing the drilled graphene sheet and the browned inner core plate in a staggered manner, and inserting a prepreg between the graphene sheet and the inner core plate for insulation; one side, far away from the inner core plate, of the graphene sheet on the outermost layer is bonded with the copper foil through heat-conducting glue;
drilling a via hole on the laminated PCB, wherein the via hole and the through hole on the graphene sheet have the same hole position, and the aperture of the via hole is smaller than that of the through hole; and then carrying out copper deposition electroplating on the via hole, and uniformly plating copper on the hole wall to ensure that the inner layer core plates which need to be interconnected are mutually communicated.
3. The preparation method of the graphene thermal conductive PCB according to claim 2, wherein: mechanical drilling is adopted for drilling holes in the graphene sheets, and the graphene sheets are protected in a mode that the resin substrates and the graphene sheets are stacked in a staggered mode during mechanical drilling.
4. The preparation method of the graphene thermal conductive PCB according to claim 2, wherein: the holes are drilled in the graphene sheet by laser drilling, and during laser drilling, the holes are directly drilled in the graphene sheet without adding a resin substrate protective layer.
5. The method for preparing the graphene thermal conductive PCB according to claim 3 or 4, wherein: when the graphene sheet is drilled, protective films are attached to the upper surface and the lower surface of the graphene sheet.
6. The preparation method of the graphene thermal conductive PCB according to claim 5, wherein: after the graphene sheet is drilled, the protective film needs to be removed, and then the graphene sheet is pressed with the inner core plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910869482.7A CN110602871B (en) | 2019-09-16 | 2019-09-16 | Graphene heat-conducting PCB and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910869482.7A CN110602871B (en) | 2019-09-16 | 2019-09-16 | Graphene heat-conducting PCB and preparation method thereof |
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| Publication Number | Publication Date |
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| CN110602871A true CN110602871A (en) | 2019-12-20 |
| CN110602871B CN110602871B (en) | 2021-10-01 |
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| Publication number | Publication date |
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| CN110602871B (en) | 2021-10-01 |
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