CN204022738U - Electronics heat-resisting protective adhesive tape - Google Patents
Electronics heat-resisting protective adhesive tape Download PDFInfo
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- CN204022738U CN204022738U CN201420361931.XU CN201420361931U CN204022738U CN 204022738 U CN204022738 U CN 204022738U CN 201420361931 U CN201420361931 U CN 201420361931U CN 204022738 U CN204022738 U CN 204022738U
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- graphite flake
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Adhesive Tapes (AREA)
Abstract
The utility model discloses a kind of electronics heat-resisting protective adhesive tape, comprises a graphite flake, and the upper and lower surface of this graphite flake is all covered with metal level; One off-style paper layer surface is covered with heat-conducting glue adhesion coating and bonds with the metal level of graphite flake lower surface, the laminated polyester film that a lower surface is coated with adhesive layer is covered on graphite flake upper surface, this laminated polyester film length and width are all greater than length and the width of graphite flake, one off-style paper layer is covered on another surface of heat-conducting glue adhesion coating, the length of this off-style paper layer and width are greater than length and the width of graphite flake respectively, and laminated polyester film length and width size is equal with off-style paper layer length and width size; Described off-style paper layer is the PET film scribbling silicon layer, and the silicon layer on this PET film surface is bonding with described heat-conducting glue adhesion coating, and the Thickness Ratio of described graphite flake and metal level is 1:0.05 ~ 0.5.The utility model electronics heat-resisting protective adhesive tape can prevent the Graphite Powder 99 of graphite flake and graphite granule from coming off, thus avoids short circuit and the electrical impact on wiring board, and the heavy losses that electrostatic causes.
Description
Technical field
The utility model relates to a kind of electronics heat-resisting protective adhesive tape, belongs to adhesive material technical field.
Background technology
Along with the fast development of electron trade, now from common desktop computer, to notebook computer, panel computer, smart mobile phone, scientific and technical innovation is advanced by leaps and bounds.Electronic product carries more and more lighting, and volume is more and more less, and function from strength to strength, causes integrated level more and more higher like this.Cause volume reducing like this, function grow is large, directly causes the cooling requirements of electronic devices and components more and more higher.Graphite material has property widely, comprise heigh clarity, high conductivity, high thermal conductivity, high strength etc., utilize graphite material, various product application type can be developed, such as graphite circuit structure, graphite core chip architecture, graphite touch screen structure, etc.Although there is various application possibility, being directed to graphite material, how effectively processing it, such as clean cut, is still the problem needing to solve.But graphite flake also has weak point, though be that high conductive graphite sheet has certain folding resistance, the intensity between material is weak, can be torn easily, or because of the displacement of institute's adhesive attachment means, disrepair phenomenon occurs, entry material comes off, thus causes the short circuit of circuit.
Summary of the invention
The utility model object is to provide a kind of electronics heat-resisting protective adhesive tape, and this electronics heat-resisting protective adhesive tape can prevent the Graphite Powder 99 of graphite flake and graphite granule from coming off, thus avoids short circuit and the electrical impact on wiring board, and the heavy losses that electrostatic causes.
For achieving the above object, the kind technical scheme that the utility model adopts is: a kind of electronics heat-resisting protective adhesive tape, comprise a graphite flake, on this graphite flake, lower surface is all covered with metal level, one off-style paper layer surface is covered with heat-conducting glue adhesion coating and bonds with the metal level of graphite flake lower surface, the laminated polyester film that a lower surface is coated with adhesive layer is covered on graphite flake upper surface, this laminated polyester film length and width are all greater than length and the width of graphite flake, one off-style paper layer is covered on another surface of heat-conducting glue adhesion coating, the length of this off-style paper layer and width are greater than length and the width of graphite flake respectively, and laminated polyester film length and width size is equal with off-style paper layer length and width size, described off-style paper layer is the PET film scribbling silicon layer, and the silicon layer on this PET film surface is bonding with described heat-conducting glue adhesion coating, and the Thickness Ratio of described graphite flake and metal level is 1:0.05 ~ 0.5.
In technique scheme, further improved plan is as follows:
1., in such scheme, the length of described laminated polyester film and width all exceed 1 ~ 2mm than the length of graphite flake and width.
2., in such scheme, described graphite flake thickness is 20 ~ 100 μm.
Because technique scheme is used, the utility model compared with prior art has following advantages and effect:
The utility model electronics heat-resisting protective adhesive tape, its laminated polyester film length and width are all greater than length and the width of graphite flake, one off-style paper layer is covered on another surface of heat-conducting glue adhesion coating, the length of this off-style paper layer and width are greater than length and the width of graphite flake respectively, and laminated polyester film length and width size is equal with off-style paper layer length and width size, can prevent the Graphite Powder 99 of graphite flake and graphite granule from coming off, thus avoid short circuit and the electrical impact on wiring board, improve the reliability of product; Secondly, the upper and lower surface of graphite flake is all covered with metal level, adopt the metal level of wire index anisotropy and isotropy metal layer combination, both improve the thermal conductivity along length, also improve thickness direction thermal conductivity, achieve the homogeneity of adhesive tape heat conductivility, exempt from adhesive tape local superheating, improve performance and the life-span of product.
Accompanying drawing explanation
Accompanying drawing 1 is the utility model electronics heat-resisting protective adhesive tape structure schematic diagram.
In above accompanying drawing: 1, graphite flake; 2, heat-conducting glue adhesion coating; 3, off-style paper layer; 31, silicon layer; 32, PET film; 4, metal level; 5, laminated polyester film; 6, adhesive layer.
Embodiment
Below in conjunction with embodiment, the utility model is further described:
Embodiment 1: a kind of electronics heat-resisting protective adhesive tape, comprises a graphite flake 1, this upper and lower surface of graphite flake 1 is all covered with metal level 4; One off-style paper layer 3 surface is covered with heat-conducting glue adhesion coating 2 and bonds with the metal level of graphite flake 1 lower surface, the laminated polyester film 5 that a lower surface is coated with adhesive layer 6 is covered on graphite flake 1 upper surface, this laminated polyester film 5 length and width are all greater than length and the width of graphite flake 1, one off-style paper layer 3 is covered on another surface of heat-conducting glue adhesion coating 2, the length of this off-style paper layer 3 and width are greater than length and the width of graphite flake 1 respectively, and laminated polyester film 5 length and width size is equal with off-style paper layer 3 length and width size; Described off-style paper layer 3 is for scribbling the PET film 32 of silicon layer 31, and the silicon layer 31 on this PET film 32 surface is bonding with described heat-conducting glue adhesion coating 2, and described graphite flake 1 is 1:0.05 ~ 0.5 with the Thickness Ratio of metal level 4.
Embodiment 2: a kind of electronics heat-resisting protective adhesive tape, comprises a graphite flake 1, this upper and lower surface of graphite flake 1 is all covered with metal level 4; One off-style paper layer 3 surface is covered with heat-conducting glue adhesion coating 2 and bonds with the metal level of graphite flake 1 lower surface, the laminated polyester film 5 that a lower surface is coated with adhesive layer 6 is covered on graphite flake 1 upper surface, this laminated polyester film 5 length and width are all greater than length and the width of graphite flake 1, one off-style paper layer 3 is covered on another surface of heat-conducting glue adhesion coating 2, the length of this off-style paper layer 3 and width are greater than length and the width of graphite flake 1 respectively, and laminated polyester film 5 length and width size is equal with off-style paper layer 3 length and width size; Described off-style paper layer 3 is for scribbling the PET film 32 of silicon layer 31, and the silicon layer 31 on this PET film 32 surface is bonding with described heat-conducting glue adhesion coating 2, and described graphite flake 1 is 1:0.05 ~ 0.5 with the Thickness Ratio of metal level 4.
The length of above-mentioned laminated polyester film 5 and width all exceed 1.6mm than the length of graphite flake 1 and width; Above-mentioned graphite flake 1 thickness is 66 μm.
When adopting above-mentioned electronics heat-resisting protective adhesive tape, it can prevent the Graphite Powder 99 of graphite flake and graphite granule from coming off, thus avoids short circuit and the electrical impact on wiring board, improves the reliability of product; Secondly, the upper and lower surface of graphite flake is all covered with metal level, adopt the metal level of wire index anisotropy and isotropy metal layer combination, both improve the thermal conductivity along length, also improve thickness direction thermal conductivity, achieve the homogeneity of adhesive tape heat conductivility, exempt from adhesive tape local superheating, improve performance and the life-span of product.
Above-described embodiment, only for technical conceive of the present utility model and feature are described, its object is to person skilled in the art can be understood content of the present utility model and implement according to this, can not limit protection domain of the present utility model with this.All equivalences done according to the utility model spirit change or modify, and all should be encompassed within protection domain of the present utility model.
Claims (3)
1. an electronics heat-resisting protective adhesive tape, is characterized in that: comprise a graphite flake (1), and this graphite flake (1) upper and lower surface is all covered with metal level (4), one off-style paper layer (3) surface is covered with heat-conducting glue adhesion coating (2) and bonds with the metal level of graphite flake (1) lower surface, the laminated polyester film (5) that a lower surface is coated with adhesive layer (6) is covered on graphite flake (1) upper surface, this laminated polyester film (5) length and width are all greater than length and the width of graphite flake (1), one off-style paper layer (3) is covered on another surface of heat-conducting glue adhesion coating (2), the length of this off-style paper layer (3) and width are greater than length and the width of graphite flake (1) respectively, and laminated polyester film (5) length and width size is equal with off-style paper layer (3) length and width size, described off-style paper layer (3) is for scribbling the PET film (32) of silicon layer (31), and the silicon layer (31) on this PET film (32) surface is bonding with described heat-conducting glue adhesion coating (2), and described graphite flake (1) is 1:0.05 ~ 0.5 with the Thickness Ratio of metal level (4).
2. electronics heat-resisting protective adhesive tape according to claim 1, is characterized in that: the length of described laminated polyester film (5) and width all exceed 1 ~ 2mm than the length of graphite flake (1) and width.
3. electronics heat-resisting protective adhesive tape according to claim 1, is characterized in that: described graphite flake (1) thickness is 20 ~ 100 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420361931.XU CN204022738U (en) | 2014-07-01 | 2014-07-01 | Electronics heat-resisting protective adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420361931.XU CN204022738U (en) | 2014-07-01 | 2014-07-01 | Electronics heat-resisting protective adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204022738U true CN204022738U (en) | 2014-12-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420361931.XU Active CN204022738U (en) | 2014-07-01 | 2014-07-01 | Electronics heat-resisting protective adhesive tape |
Country Status (1)
| Country | Link |
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| CN (1) | CN204022738U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108700918A (en) * | 2016-04-06 | 2018-10-23 | 惠普发展公司，有限责任合伙企业 | Lid for equipment |
-
2014
- 2014-07-01 CN CN201420361931.XU patent/CN204022738U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108700918A (en) * | 2016-04-06 | 2018-10-23 | 惠普发展公司，有限责任合伙企业 | Lid for equipment |
| CN108700918B (en) * | 2016-04-06 | 2021-12-07 | 惠普发展公司，有限责任合伙企业 | Cover for an appliance |
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|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |