CN107331650A - Tack fin and circuit board and chip - Google Patents
Tack fin and circuit board and chip Download PDFInfo
- Publication number
- CN107331650A CN107331650A CN201710625154.3A CN201710625154A CN107331650A CN 107331650 A CN107331650 A CN 107331650A CN 201710625154 A CN201710625154 A CN 201710625154A CN 107331650 A CN107331650 A CN 107331650A
- Authority
- CN
- China
- Prior art keywords
- tack
- heat
- fin
- substrate
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention provides a kind of tack fin and circuit board and chip, wherein, the tack fin includes：Heat sink body and the heat-conducting glue layer for being attached to the heat sink body one side.The tack fin of the present invention reduces the thickness of heat-conducting glue layer, with preferable heat-conducting effect, and has saved cost.Meanwhile, tack fin of the invention eliminates the operating process that manpower applies heat-conducting glue, reduces human cost, the used time is shorter, more efficient.
Description
Technical field
The present invention relates to technical field of electronic components, more particularly to a kind of tack fin and circuit board and chip.
Background technology
At present, in process of production, the one of which mode of production is that there is provided carrying electronic component for circuit board or chip
Substrate, and in heat conduction sizing materials such as the backside coating tin creams of substrate, fin is then fixed on substrate by the tin cream of coating
On, obtain final finished after finally being solidified.However, drawback present in aforementioned production method is：The heat-conducting glue of consumption
Many, Material Cost is high, and tin cream thickness is thicker.Meanwhile, waste of manpower, during operating cost.
Therefore, in view of the above-mentioned problems, being necessary to propose further solution.
The content of the invention
It is an object of the invention to provide a kind of tack fin and circuit board and chip, deposited in the prior art with overcoming
Deficiency.
For achieving the above object, the present invention provides a kind of tack fin, and it is pasted on the substrate for needing to radiate
On, the tack fin includes：Heat sink body and the heat-conducting glue layer for being attached to the heat sink body one side.
As the improvement of the tack fin of the present invention, the heat sink body is in aluminium, copper, ceramics, boron nitride
It is a kind of.
As the improvement of the tack fin of the present invention, the heat-conducting glue layer is to have the heat-conducting glue layer of base material or without base material
Heat-conducting glue layer.
As the improvement of the tack fin of the present invention, the viscose glue in the heat-conducting glue layer is glue and heat conduction powder
Mixture.
As the improvement of the tack fin of the present invention, the glue is in acrylic resin, silica gel, epoxy resin
One or more, the heat conduction powder is one kind in ceramic powder, copper powder, aluminium powder, graphite powder, graphene powder, boron nitride powder
Or it is several.
As the present invention tack fin improvement, the ceramic powder be aluminium oxide ceramics powder, aluminum nitride ceramic,
One kind in beryllium oxide ceramics powder.
As the improvement of the tack fin of the present invention, the thickness of the heat-conducting glue layer is 1-100 μm.
As the present invention tack fin improvement, the substrate be aluminium base, copper base, iron substrate, steel substrate,
One kind in ceramic wafer.
For achieving the above object, the present invention also provides a kind of circuit board, and it includes：Substrate, electronic component and
Tack fin as described above；
The substrate has the front and back that is oppositely arranged, the integrally disposed front in the substrate of the electronic component,
The fin is pasted on the back side of the substrate by the heat-conducting glue layer.
For achieving the above object, the present invention also provides a kind of chip, and it includes：Substrate, electronic component and such as
Upper described tack fin；
The substrate has the front and back that is oppositely arranged, the integrally disposed front in the substrate of the electronic component,
The fin is pasted on the back side of the substrate by the heat-conducting glue layer.
Compared with prior art, the beneficial effects of the invention are as follows：The tack fin of the present invention reduces heat-conducting glue layer
Thickness, with preferable heat-conducting effect, and saved cost.Meanwhile, tack fin of the invention eliminates manpower painting
The operating process of glue, reduces human cost, and the used time is shorter, more efficient.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the accompanying drawing used required in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments described in invention, for those of ordinary skill in the art, on the premise of not paying creative work,
Other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the Rotating fields schematic diagram of the embodiment of tack fin one of the present invention；
Fig. 2 is the Rotating fields schematic diagram of an embodiment of the circuit board of the present invention.
Embodiment
The present invention is described in detail for shown each embodiment below in conjunction with the accompanying drawings, but it should explanation, these
Embodiment not limitation of the present invention, those of ordinary skill in the art according to these embodiment institute work energy, method,
Or equivalent transformation or replacement in structure, belong within protection scope of the present invention.
As shown in figure 1, the tack fin 10 of the present invention can be applied on substrate, to aid in the product using the substrate
Radiated.Specifically, the tack fin includes：Heat sink body 1 and heat-conducting glue layer 2.Tack radiating of the present invention
The applicable substrate of disk includes one kind in aluminium base, copper base, iron substrate, steel substrate, ceramic wafer.
Wherein, the material of the heat sink body 1 can be one kind in the materials such as aluminium, copper, ceramics, boron nitride.
The heat-conducting glue layer 2 is used to realize being fixedly connected and auxiliary heat dissipation for the heat sink body 1 and substrate.It is described
Heat-conducting glue layer 2 can have relatively small thickness, that replace the gluing of existing connection, and its thickness can be 1-100 μm,
With preferable thermal conductivity, and cost is saved.
Specifically, the heat-conducting glue layer is to have the heat-conducting glue layer of base material or the heat-conducting glue layer without base material.Wherein, there is base material
Base material in heat-conducting glue layer can be glass fabric etc..Meanwhile, the viscose glue in the heat-conducting glue layer is glue and heat conduction powder
The mixture of formation.The glue is the one or more in acrylic resin, silica gel, epoxy resin, and the heat conduction powder can
Think the one or more in ceramic powder, copper powder, aluminium powder, graphite powder, graphene powder, boron nitride powder.Preferably, the ceramics
Powder is one kind in aluminium oxide ceramics powder, aluminum nitride ceramic, beryllium oxide ceramics powder.
As shown in Fig. 2 based on tack fin 10 as described above, the present invention also provides a kind of circuit board 20, the electricity
Road plate 20 includes：Substrate 21, electronic component 22 and tack fin 10 as described above.
Wherein, the substrate 21 has the front and back being oppositely arranged, and the electronic component 22 is integrally disposed in institute
The front of substrate 21 is stated, the fin 10 is pasted on the back side of the substrate 21 by the heat-conducting glue layer.Preferably, it is described
Electronic component 22 is welded in the front of the substrate by way of crossing wave-soldering.
In one embodiment, the circuit board 20 is obtained as follows：
S1, offer substrate, the heat-conducting glue layer are attached to the back side of the substrate, and apply pressing effect to the heat-conducting glue layer
Power.Wherein, pressing instrument is preferably used to the uniformly applied pressing active force of heat-conducting glue layer, so that heat-conducting glue layer can be firm
And equably it is attached to the back side of the substrate.
S2, in the heat-conducting glue layer overlying upper protective film.Wherein, the diaphragm is high temperature resistant diaphragm.
S3, electronic component is welded in the front of the substrate by way of crossing wave-soldering.
The diaphragm is torn off after S4, cooling, and heat sink body is directly affixed in the heat-conducting glue layer.
Analogously, based on tack fin 10 as described above, the present invention also provides a kind of chip, the chip bag
Include：Substrate, electronic component and tack fin as described above.
Wherein, the substrate has the front and back being oppositely arranged, and the electronic component is integrally disposed in the base
The front of plate, the fin is pasted on the back side of the substrate by the heat-conducting glue layer.Preferably, the electronic component
The front of the substrate is welded in by way of crossing wave-soldering.
In summary, tack fin of the invention reduces the thickness of heat-conducting glue layer, with preferable heat-conducting effect,
And saved cost.Meanwhile, tack fin of the invention eliminates the operating process of manpower gluing, reduce manpower into
This, the used time is shorter, more efficient.
It is obvious to a person skilled in the art that the invention is not restricted to the details of above-mentioned one exemplary embodiment, Er Qie
In the case of without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, embodiment all should be regarded as exemplary, and be nonrestrictive, the scope of the present invention is by appended power
Profit is required rather than described above is limited, it is intended that all in the implication and scope of the equivalency of claim by falling
Change is included in the present invention.Any reference in claim should not be considered as to the claim involved by limitation.
Moreover, it will be appreciated that although the present specification is described in terms of embodiments, not each embodiment is only wrapped
Containing an independent technical scheme, this narrating mode of specification is only that for clarity, those skilled in the art should
Using specification as an entirety, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
It may be appreciated other embodiment.
Claims (10)
1. a kind of tack fin, it is pasted on the substrate for needing to radiate, it is characterised in that the tack fin bag
Include：Heat sink body and the heat-conducting glue layer for being attached to the heat sink body one side.
2. tack fin according to claim 1, it is characterised in that the heat sink body be aluminium, copper, ceramics,
One kind in boron nitride.
3. tack fin according to claim 1, it is characterised in that the heat-conducting glue layer is the heat-conducting glue for having base material
Layer or the heat-conducting glue layer without base material.
4. tack fin according to claim 1, it is characterised in that viscose glue in the heat-conducting glue layer for glue with
The mixture of heat conduction powder.
5. tack fin according to claim 4, it is characterised in that the glue is acrylic resin, silica gel, ring
One or more in oxygen tree fat, the heat conduction powder is ceramic powder, copper powder, aluminium powder, graphite powder, graphene powder, boron nitride
One or more in powder.
6. tack fin according to claim 5, it is characterised in that the ceramic powder is aluminium oxide ceramics powder, nitrogen
Change one kind in aluminium ceramic powder, beryllium oxide ceramics powder.
7. tack fin according to claim 1, it is characterised in that the thickness of the heat-conducting glue layer is 1-100 μm.
8. tack fin according to claim 1, it is characterised in that the substrate is aluminium base, copper base, iron-based
One kind in plate, steel substrate, ceramic wafer.
9. a kind of circuit board, it is characterised in that the circuit board includes：Substrate, electronic component and such as claim 1 ~ 8 times
Tack fin described in one；
The substrate has the front and back that is oppositely arranged, the integrally disposed front in the substrate of the electronic component,
The fin is pasted on the back side of the substrate by the heat-conducting glue layer.
10. a kind of chip, it is characterised in that the chip includes：Substrate, electronic component and such as claim 1 ~ 8 are any
Tack fin described in；
The substrate has the front and back that is oppositely arranged, the integrally disposed front in the substrate of the electronic component,
The fin is pasted on the back side of the substrate by the heat-conducting glue layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710625154.3A CN107331650A (en) | 2017-07-27 | 2017-07-27 | Tack fin and circuit board and chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710625154.3A CN107331650A (en) | 2017-07-27 | 2017-07-27 | Tack fin and circuit board and chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107331650A true CN107331650A (en) | 2017-11-07 |
Family
ID=60227929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710625154.3A Pending CN107331650A (en) | 2017-07-27 | 2017-07-27 | Tack fin and circuit board and chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107331650A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109722180A (en) * | 2019-01-28 | 2019-05-07 | 深圳市睿晖新材料有限公司 | A kind of mucilage materials with heating conduction and the radiator being made of it |
| CN114096118A (en) * | 2021-11-03 | 2022-02-25 | 武汉华星光电半导体显示技术有限公司 | Heat radiating fin, preparation method thereof and electronic device |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2790114Y (en) * | 2005-04-27 | 2006-06-21 | 上海小糸车灯有限公司 | Radiating structure for paster light-emitting diode |
| CN202799529U (en) * | 2012-08-16 | 2013-03-13 | 苏州金科信汇光电科技有限公司 | Self-adhesive soft heat conduction substrate |
| CN103118521A (en) * | 2013-01-30 | 2013-05-22 | 东莞龙郝胶粘制品有限公司 | Uniform cooling fin and production method thereof |
| CN203261615U (en) * | 2013-03-05 | 2013-10-30 | 华越科技股份有限公司 | Flexible metal radiating fin |
| CN103715110A (en) * | 2012-09-28 | 2014-04-09 | 三垦电气株式会社 | Method for manufacturing semiconductor module, joint device and semiconductor module |
| CN203774320U (en) * | 2014-03-13 | 2014-08-13 | 杭州明果教育咨询有限公司 | Multi-field-effect-transistor integrating module |
| CN205320449U (en) * | 2016-01-21 | 2016-06-15 | 浪潮电子信息产业股份有限公司 | Fin with heat -conducting glue and sticker |
-
2017
- 2017-07-27 CN CN201710625154.3A patent/CN107331650A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2790114Y (en) * | 2005-04-27 | 2006-06-21 | 上海小糸车灯有限公司 | Radiating structure for paster light-emitting diode |
| CN202799529U (en) * | 2012-08-16 | 2013-03-13 | 苏州金科信汇光电科技有限公司 | Self-adhesive soft heat conduction substrate |
| CN103715110A (en) * | 2012-09-28 | 2014-04-09 | 三垦电气株式会社 | Method for manufacturing semiconductor module, joint device and semiconductor module |
| CN103118521A (en) * | 2013-01-30 | 2013-05-22 | 东莞龙郝胶粘制品有限公司 | Uniform cooling fin and production method thereof |
| CN203261615U (en) * | 2013-03-05 | 2013-10-30 | 华越科技股份有限公司 | Flexible metal radiating fin |
| CN203774320U (en) * | 2014-03-13 | 2014-08-13 | 杭州明果教育咨询有限公司 | Multi-field-effect-transistor integrating module |
| CN205320449U (en) * | 2016-01-21 | 2016-06-15 | 浪潮电子信息产业股份有限公司 | Fin with heat -conducting glue and sticker |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109722180A (en) * | 2019-01-28 | 2019-05-07 | 深圳市睿晖新材料有限公司 | A kind of mucilage materials with heating conduction and the radiator being made of it |
| CN114096118A (en) * | 2021-11-03 | 2022-02-25 | 武汉华星光电半导体显示技术有限公司 | Heat radiating fin, preparation method thereof and electronic device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105517423B (en) | A kind of high heat conduction graphene heat radiating metal foil | |
| JP2015002351A (en) | Method for forming thermal coupling between heat spreader or lid and heat source | |
| CN105419667B (en) | Thermally conductive high viscous metal base double faced adhesive tape | |
| CN106129240B (en) | High-power LED chip and its COB packaging method based on graphene material | |
| CN102700230A (en) | Preparation method of heat-conducting fiber reinforced high-heat-conducting graphite heat radiating fin | |
| CN106626583A (en) | Ultra-thin heat dissipation film and preparation method thereof | |
| CN109021786A (en) | High thermal conductivity compound resin and preparation method thereof | |
| CN107331650A (en) | Tack fin and circuit board and chip | |
| CN207869492U (en) | Graphene heat-radiating substrate | |
| CN103943763B (en) | A kind of encapsulating structure and method of flip LED chips | |
| CN102555340A (en) | High heat dissipation membrane composite structure and manufacturing method thereof | |
| CN204999844U (en) | Heat dissipation sticky tape | |
| CN103025127A (en) | Radiating film | |
| Chen et al. | Vertically aligned carbon nanotube arrays as thermal interface material for vibrational structure of piezoelectric transformer | |
| CN203590662U (en) | Electronic component cooling device | |
| CN202941077U (en) | Graphite heat radiation structure for electronic product | |
| CN108864979A (en) | A kind of chip package conductive glue and preparation method thereof | |
| CN105977227B (en) | A kind of integrated antenna package of composite substrate | |
| CN109996423B (en) | Composite multilayer graphite sheet structure, manufacturing method, heat dissipation structure and electronic device | |
| CN207294673U (en) | A kind of heat conduction and heat radiation adhesive tape | |
| CN205609502U (en) | Copper aluminium composite substrate with fin structure | |
| CN109722180A (en) | A kind of mucilage materials with heating conduction and the radiator being made of it | |
| CN108384478A (en) | A kind of heat dissipation double faced adhesive tape | |
| CN202958092U (en) | Radiating film | |
| CN208173583U (en) | Conductive structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171107 |
|
| RJ01 | Rejection of invention patent application after publication |