CN103118521A - Uniform cooling fin and production method thereof - Google Patents
Uniform cooling fin and production method thereof Download PDFInfo
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- CN103118521A CN103118521A CN2013100337684A CN201310033768A CN103118521A CN 103118521 A CN103118521 A CN 103118521A CN 2013100337684 A CN2013100337684 A CN 2013100337684A CN 201310033768 A CN201310033768 A CN 201310033768A CN 103118521 A CN103118521 A CN 103118521A
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Abstract
The invention discloses a uniform cooling fin, and further discloses a production method of the uniform cooling fin. The production method includes preparing a high thermal-conducting metal sheet and low thermal-conducting viscose; evenly coating a surface of the high thermal-conducting metal sheet with the low thermal-conducting viscose; and then roasting and foaming to form a uniform cooling fin. The uniform cooling fin is clever and reasonable in structure design with creative combination of the high thermal-conducting metal sheet and the low thermal-conducting viscose. On the basis of guaranteeing quick heat dissipation, the hotpoint areas are eliminated to guarantee comfort in use. The uniform cooling fin is also better in bending work property, convenient to process into optional sizes, shapes and structure, and wide in application range. Affection on appearance and use caused by cracking and breaking conventional graphite fins is avoided effectively and product quality is guaranteed. By the production method, the uniform cooling fin can be produced quickly, producing period is reduced greatly, and producing efficiency is improved. The whole procedure is compact, easy to realize and low in cost; and quality of products is guaranteed efficiently.
Description
Technical field
The present invention relates to heat dissipation technology, particularly a kind of Homogeneouslly-radiating sheet and preparation method thereof.
Background technology
Along with the acceleration of the continuous upgrading of electronic product, high integrated and high-performance electric subset growing, the work package volume size is more and more less, and speed and the efficient of work are more and more higher, and caloric value is increasing.At present, known metal species heat conduction and heat radiation assembly has been subjected to the restriction of its material and self heat conduction and heat radiation limit, must adopt advanced heat conduction and heat radiation technique and the heat conduction and heat radiation material of excellent performance to be defined as away heat, guarantee effective work of its electronic product.
In prior art, for accelerating heat-conducting effect, usually adopt the high-thermal conductive metal material to make, although it reaches the effect of quick heat radiating, have comparatively significantly hot spot region, make people's use bring discomfort, serious, people's phenomenon also can appear scalding.For this reason, people research and develop a kind of graphite heat conducting heat sink material, because distinctive low-density (with respect to metal species) and high heat conduction and heat radiation coefficient and low thermal resistance become the preferred material that the hyundai electronics series products solves the heat conduction and heat radiation technology, has simultaneously the effect of uniform heat conduction heat radiation.
During use, in order better to dispel the heat, be generally graphite heat conducting and heat radiating fin to be bonded in the surface of the object that needs heat radiation.Traditional adhesive method is with glue, graphite heat conducting and heat radiating fin to be bondd, this bonding mode operation more complicated, and need to when bonding concrete carry out operation, because graphite has characteristic frangible and that sheet is peeled off, powdered graphite drop and bond unstable phenomenon not only easily occurs and occur, also greatly slow down service speed, reduce production efficiency, and graphite flake distortion or fracture phenomena very easily appear, be difficult to guarantee product quality.In addition, sometimes also need to be at the surperficial binding metal sheet of graphite, this brings complicated operation, the bonding problem such as not firm equally.
Summary of the invention
For above-mentioned deficiency, one of the object of the invention is, a kind of reasonable in design, ingenious is provided, and can uniform heat conduction dispel the heat, and eliminates the hot spot region, and rapid heat dissipation, the Homogeneouslly-radiating sheet that handled easily is installed.
The present invention also aims to, a kind of method of making above-mentioned Homogeneouslly-radiating sheet is provided, the production process of the method is succinct, is easy to realize, cost is low, can produce fast the Homogeneouslly-radiating sheet.
The present invention for achieving the above object, the technical scheme that provides is: a kind of Homogeneouslly-radiating sheet, it comprises thermal conductivity values greater than the high-thermal conductive metal sheet of 100W/mK and the thermal conductivity values low heat conduction adhesive-layer less than 0.2W/mK, and this low heat conduction adhesive-layer and described high-thermal conductive metal sheet fit.
As a modification of the present invention, the thickness of described high-thermal conductive metal sheet is 0.001～0.2mm, and the thickness of described low heat conduction adhesive-layer is 0.003～0.15mm.
As a modification of the present invention, described high-thermal conductive metal sheet is the lamellar body that one of adopts in copper, aluminium, gold, silver or its alloy material is made.
As a modification of the present invention, the composition mass percent of described low heat conduction adhesive-layer is: acrylate glue and/or viscous silica gel 1%～99%, Foamex 1%～99%.
A kind of method of making above-mentioned Homogeneouslly-radiating sheet, it comprises the following steps: (1) preparation thermal conductivity values is greater than the high-thermal conductive metal sheet of 100W/mK; (2) the low heat conduction viscose glue of preparation; (3) will hang down the heat conduction viscose glue evenly is coated on a surface of high-thermal conductive metal sheet; The high-thermal conductive metal sheet that (4) will be coated with low heat conduction viscose glue moves to baking oven and toasts action, to form a thermal conductivity values less than the low heat conduction adhesive-layer of 0.2W/mK on this high-thermal conductive metal sheet, makes the Homogeneouslly-radiating sheet.
As a modification of the present invention, it is further comprising the steps of: the high-thermal conductive metal sheet is contacted with the heater that needs heat radiation, to hang down the heat conduction adhesive-layer contacts with thermal component, the heat that produces during heater work conducts to described high-thermal conductive metal sheet, and quickly diffuse to full wafer high-thermal conductive metal sheet, heat on this high-thermal conductive metal sheet evenly conducts to thermal component through described low heat conduction adhesive-layer, then distributes by this thermal component, reaches the purpose of rapid diffusion, Homogeneouslly-radiating.
As a modification of the present invention, the thickness of described high-thermal conductive metal sheet is 0.001～0.2mm, and this high-thermal conductive metal sheet is the lamellar body that one of adopts in copper, aluminium, gold, silver or its alloy material is made.
As a modification of the present invention, described step (2) specifically comprises the following steps: (2.1) preparing material: the composition mass percent of raw material is: acrylate glue and/or viscous silica gel 1%～99%, Foamex 1%～99%; (2.2) mix: acrylate glue and/or viscous silica gel are mixed mutually with Foamex, and stir, make low heat conduction viscose glue.
As a modification of the present invention, described step (4) specifically comprises the following steps: the high-thermal conductive metal sheet that (4.1) will be coated with low heat conduction viscose glue moves to baking oven and toasts action, and the baking temperature of this baking oven is set as 60～210 ℃; (4.2) in bake process, the low heat conduction viscose glue that is coated on the high-thermal conductive metal sheet begins foaming, solidifies, and forming a thickness on this high-thermal conductive metal sheet is 0.003～0.15mm, and thermal conductivity values makes the Homogeneouslly-radiating sheet less than the low heat conduction adhesive-layer of 0.2W/mK.
As a modification of the present invention, described low heat conduction adhesive-layer has tack, and the adhesion strength of this low heat conduction adhesive-layer is 0.5g/25mm～5kg/25mm.
beneficial effect of the present invention is: structural design of the present invention is ingenious, rationally, innovation combines high-thermal conductive metal sheet and low heat conduction adhesive-layer, the heat that produces during heater work conducts to described high-thermal conductive metal sheet, and quickly diffuse to full wafer high-thermal conductive metal sheet, heat on this high-thermal conductive metal sheet evenly conducts to thermal component through described low heat conduction adhesive-layer, then distribute by this thermal component, reach rapid diffusion, the purpose of Homogeneouslly-radiating, on the basis that guarantees quick heat radiating, eliminate the hot spot region, improve the performance of electronic product, guarantee to use comfortable, and has a bendability preferably, conveniently be processed into arbitrary dimension and shape and structure, the scope of application is wide, effectively solves tradition and adopts graphite flake to be prone to dry linting, fracture, affects outward appearance and uses phenomenon to occur, guarantee product quality, improve stability and the reliability of fin, effectively reduce traditional assembly process, manufacturing process is few, realize that cost is low thereby labour intensity is low, percent defective is low, can be widely used in the E-consumer such as mobile phone, notebook computer, flat-panel monitor, portable projector, Digital Video and personal assistant's equipment LCD, PDP, DVD field.The operation of method provided by the invention is succinct, can produce fast the Homogeneouslly-radiating sheet, greatly shortens the production cycle, enhances productivity, and whole production process is succinct, is easy to realize, cost is low and effectively guarantee product quality.
Description of drawings
Fig. 1 is structural representation of the present invention.
Embodiment
Embodiment: referring to Fig. 1, the embodiment of the present invention provides a kind of Homogeneouslly-radiating sheet, it comprises thermal conductivity values greater than the high-thermal conductive metal sheet 1 of 100W/mK and the thermal conductivity values low heat conduction adhesive-layer 2 less than 0.2W/mK, and this low heat conduction adhesive-layer 2 fits with described high-thermal conductive metal sheet 1.The thickness of described high-thermal conductive metal sheet 1 is 0.001～0.2mm, and the thickness of described low heat conduction adhesive-layer 2 is 0.003～0.15mm.Described high-thermal conductive metal sheet 1 is the lamellar body that one of adopts in copper, aluminium, gold, silver or its alloy material is made.The composition mass percent of described low heat conduction adhesive-layer 2 is: acrylate glue and/or viscous silica gel 1%～99%, Foamex 1%～99%.
Structural design of the present invention is ingenious, reasonable, innovation combines high-thermal conductive metal sheet 1 and low heat conduction adhesive-layer 2, the heat that produces during heater work conducts to described high-thermal conductive metal sheet 1, and quickly diffuse to full wafer high-thermal conductive metal sheet 1, heat on this high-thermal conductive metal sheet 1 evenly conducts to thermal component through described low heat conduction adhesive-layer 2, then distribute by this thermal component, reach the purpose of rapid diffusion, Homogeneouslly-radiating, on the basis that guarantees quick heat radiating, eliminate the hot spot region, improve the performance of electronic product, guarantee to use comfortable; And has a bendability preferably, conveniently be processed into arbitrary dimension and shape and structure, the scope of application is wide, effectively solves tradition and adopts graphite flake to be prone to dry linting, fracture, affects outward appearance and uses phenomenon to occur, guarantee product quality, improve stability and the reliability of fin, effectively reduce traditional assembly process, manufacturing process is few, realize that cost is low thereby labour intensity is low, percent defective is low; Can be widely used in the E-consumer such as mobile phone, notebook computer, flat-panel monitor, portable projector, Digital Video and personal assistant's equipment LCD, PDP, DVD field.
A kind of method of making above-mentioned Homogeneouslly-radiating sheet, it comprises the following steps: (1) preparation thermal conductivity values is greater than the high-thermal conductive metal sheet 1 of 100W/mK; The thickness of described high-thermal conductive metal sheet 1 is 0.001～0.2mm, and this high-thermal conductive metal sheet 1 is the lamellar body that one of adopts in copper, aluminium, gold, silver or its alloy material is made.(2) the low heat conduction viscose glue of preparation; Described step (2) specifically comprises the following steps: (2.1) preparing material: the composition mass percent of raw material is: acrylate glue and/or viscous silica gel 1%～99%, Foamex 1%～99%; (2.2) mix: acrylate glue and/or viscous silica gel are mixed mutually with Foamex, and stir, make low heat conduction viscose glue.(3) will hang down the heat conduction viscose glue evenly is coated on a surface of high-thermal conductive metal sheet 1.The high-thermal conductive metal sheet 1 that (4) will be coated with low heat conduction viscose glue moves to baking oven and toasts action, to form a thermal conductivity values less than the low heat conduction adhesive-layer 2 of 0.2W/mK on this high-thermal conductive metal sheet 1, makes the Homogeneouslly-radiating sheet.Described step (4) specifically comprises the following steps: the high-thermal conductive metal sheet 1 that (4.1) will be coated with low heat conduction viscose glue moves to baking oven and toasts action, and the baking temperature of this baking oven is set as 60～210 ℃; (4.2) in bake process, the low heat conduction viscose glue that is coated on high-thermal conductive metal sheet 1 begins foaming, solidifies, forming a thickness on this high-thermal conductive metal sheet 1 is 0.003～0.15mm, and thermal conductivity values makes the Homogeneouslly-radiating sheet less than the low heat conduction adhesive-layer 2 of 0.2W/mK.(5) high-thermal conductive metal sheet 1 is contacted with the heater that needs heat radiation, to hang down heat conduction adhesive-layer 2 contacts with thermal component, the heat that produces during heater work conducts to described high-thermal conductive metal sheet 1, and quickly diffuse to full wafer high-thermal conductive metal sheet 1, heat on this high-thermal conductive metal sheet 1 evenly conducts to thermal component through described low heat conduction adhesive-layer 2, then distribute by this thermal component, reach the purpose of rapid diffusion, Homogeneouslly-radiating.
Described low heat conduction adhesive-layer 2 has tack, and the adhesion strength of this low heat conduction adhesive-layer 2 is 0.5g/25mm～5kg/25mm.
The operation of method provided by the invention is succinct, can produce fast the Homogeneouslly-radiating sheet, greatly shortens the production cycle, enhances productivity, and whole production process is succinct, is easy to realize, cost is low and effectively guarantee product quality.
In the present embodiment, described high-thermal conductive metal sheet 1 is preferably the lamellar body that adopts copper product to make.In other embodiment, described high-thermal conductive metal sheet 1 can be the lamellar body that one of adopts in aluminium, gold, silver or its alloy material is made.The lamellar body that certainly, also can adopt other thermal conductivity values to make greater than metal or the nonmetallic materials of 100W/mK.
In concrete production process, the thickness of thermal conductivity that can be required and low heat conduction adhesive-layer 2 comes the mass percent between corresponding adjustment adjustment acrylate glue and/or viscous silica gel and Foamex.Can adopt separately acrylate glue and Foamex to mix mutually and make low heat conduction viscose glue, also can adopt separately viscous silica gel and Foamex to mix mutually and make low heat conduction viscose glue; Can also adopt the mixed mixture of acrylate glue and viscous silica gel and Foamex to mix mutually and make low heat conduction viscose glue.Satisfy different user demands.
During use, because product Homogeneouslly-radiating sheet of the present invention has bendability preferably, can process the respective shapes size according to required form.Then with the heater of the high-thermal conductive metal sheet 1 on product Homogeneouslly-radiating sheet of the present invention towards the need heat radiation, and the heater close contact that makes the high-thermal conductive metal sheet and need to dispel the heat, to hang down heat conduction adhesive-layer and thermal component close contact, the heat that produces during heater work conducts to described high-thermal conductive metal sheet, and quickly diffuse to full wafer high-thermal conductive metal sheet, heat on this high-thermal conductive metal sheet evenly conducts to thermal component through described low heat conduction adhesive-layer, then distribute by this thermal component, reach the purpose of rapid diffusion, Homogeneouslly-radiating.On the basis that guarantees quick heat radiating, eliminate the hot spot region, improve the performance of electronic product, guarantee to use comfortable.
The announcement of book and instruction according to the above description, those skilled in the art in the invention can also change and revise above-mentioned execution mode.Therefore, the embodiment that discloses and describe above the present invention is not limited to also should fall in the protection range of claim of the present invention modifications and changes more of the present invention.In addition, although used some specific terms in this specification, these terms do not consist of any restriction to the present invention just for convenience of description.
Claims (10)
1. a Homogeneouslly-radiating sheet, is characterized in that, it comprises thermal conductivity values greater than the high-thermal conductive metal sheet of 100W/mK and the thermal conductivity values low heat conduction adhesive-layer less than 0.2W/mK, and this low heat conduction adhesive-layer and described high-thermal conductive metal sheet fit.
2. Homogeneouslly-radiating sheet according to claim 1, is characterized in that, the thickness of described high-thermal conductive metal sheet is 0.001～0.2mm, and the thickness of described low heat conduction adhesive-layer is 0.003～0.15mm.
3. Homogeneouslly-radiating sheet according to claim 1 and 2, is characterized in that, described high-thermal conductive metal sheet is the lamellar body that one of adopts in copper, aluminium, gold, silver or its alloy material is made.
4. Homogeneouslly-radiating sheet according to claim 1 and 2, is characterized in that, the composition mass percent of described low heat conduction adhesive-layer is: acrylate glue and/or viscous silica gel 1%～99%, Foamex 1%～99%.
5. a method of making the described Homogeneouslly-radiating sheet of one of claim 1-4, is characterized in that, it comprises the following steps:
(1) the preparation thermal conductivity values is greater than the high-thermal conductive metal sheet of 100W/mK;
(2) the low heat conduction viscose glue of preparation;
(3) will hang down the heat conduction viscose glue evenly is coated on a surface of high-thermal conductive metal sheet;
The high-thermal conductive metal sheet that (4) will be coated with low heat conduction viscose glue moves to baking oven and toasts action, to form a thermal conductivity values less than the low heat conduction adhesive-layer of 0.2W/mK on this high-thermal conductive metal sheet, makes the Homogeneouslly-radiating sheet.
6. method according to claim 5, is characterized in that, it is further comprising the steps of:
(5) the high-thermal conductive metal sheet is contacted with the heater that needs heat radiation, to hang down the heat conduction adhesive-layer contacts with thermal component, the heat that produces during heater work conducts to described high-thermal conductive metal sheet, and quickly diffuse to full wafer high-thermal conductive metal sheet, heat on this high-thermal conductive metal sheet evenly conducts to thermal component through described low heat conduction adhesive-layer, then distribute by this thermal component, reach the purpose of rapid diffusion, Homogeneouslly-radiating.
7. method according to claim 5, is characterized in that, the thickness of described high-thermal conductive metal sheet is 0.001～0.2mm, and this high-thermal conductive metal sheet is the lamellar body that one of adopts in copper, aluminium, gold, silver or its alloy material is made.
8. method according to claim 2, is characterized in that, described step (2) specifically comprises the following steps:
(2.1) preparing material: the composition mass percent of raw material is: acrylate glue and/or viscous silica gel 1%～99%, Foamex 1%～99%;
(2.2) mix: acrylate glue and/or viscous silica gel are mixed mutually with Foamex, and stir, make low heat conduction viscose glue.
9. method according to claim 5, is characterized in that, described step (4) specifically comprises the following steps:
The high-thermal conductive metal sheet that (4.1) will be coated with low heat conduction viscose glue moves to baking oven and toasts action, and the baking temperature of this baking oven is set as 60～210 ℃;
(4.2) in bake process, the low heat conduction viscose glue that is coated on the high-thermal conductive metal sheet begins foaming, solidifies, and forming a thickness on this high-thermal conductive metal sheet is 0.003～0.15mm, and thermal conductivity values makes the Homogeneouslly-radiating sheet less than the low heat conduction adhesive-layer of 0.2W/mK.
10. making heat spreader approach according to claim 5, is characterized in that, described low heat conduction adhesive-layer has tack, and the adhesion strength of this low heat conduction adhesive-layer is 0.5g/25mm～5kg/25mm.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310033768.4A CN103118521B (en) | 2013-01-30 | Homogeneouslly-radiating sheet and preparation method thereof | |
| TW103102766A TWI548855B (en) | 2013-01-30 | 2014-01-24 | Uniform heat sink and method for producing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310033768.4A CN103118521B (en) | 2013-01-30 | Homogeneouslly-radiating sheet and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103118521A true CN103118521A (en) | 2013-05-22 |
| CN103118521B CN103118521B (en) | 2016-11-30 |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106364013A (en) * | 2016-08-30 | 2017-02-01 | 苏州格优碳素新材料有限公司 | Heat conduction and heat insulating material and preparation method and application thereof |
| CN107331650A (en) * | 2017-07-27 | 2017-11-07 | 昆山德睿懿嘉电子材料科技有限公司 | Tack fin and circuit board and chip |
| CN109301382A (en) * | 2018-09-21 | 2019-02-01 | 浙江清优材料科技有限公司 | A kind of integrated technique of thermal insulation layer and heat-conducting layer and liquid cooling plate |
| CN109346797A (en) * | 2018-09-21 | 2019-02-15 | 浙江清优材料科技有限公司 | A kind of integrated technique integrating thermal insulation layer and heat-conducting layer on liquid cooling plate |
| CN109378545A (en) * | 2018-09-21 | 2019-02-22 | 浙江清优材料科技有限公司 | Thermal insulation layer and heat-conducting layer integrated technique based on liquid cooling plate |
| CN109365233A (en) * | 2018-09-21 | 2019-02-22 | 浙江清优材料科技有限公司 | It is integrated with the spraying integrated technique and equipment of the liquid cooling plate of heat-conducting layer |
| CN110305599A (en) * | 2019-07-03 | 2019-10-08 | 京东方科技集团股份有限公司 | A kind of heat dissipation film and display device |
| CN113567500A (en) * | 2021-08-21 | 2021-10-29 | 福州大学 | Delay detection method for transient electromagnetic thermal effect of metal buried crack tip under action of pulse current |
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| CN101458049A (en) * | 2008-12-02 | 2009-06-17 | 王晓山 | Composite graphite heat conducting radiation fins |
| CN102438425A (en) * | 2010-09-29 | 2012-05-02 | 华广光电股份有限公司 | Flexible radiating strip suitable for heating element of electronic equipment |
| CN102555341A (en) * | 2011-02-25 | 2012-07-11 | 北京国科世纪激光技术有限公司 | Thermal conductive interface device |
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| CN101458049A (en) * | 2008-12-02 | 2009-06-17 | 王晓山 | Composite graphite heat conducting radiation fins |
| CN102438425A (en) * | 2010-09-29 | 2012-05-02 | 华广光电股份有限公司 | Flexible radiating strip suitable for heating element of electronic equipment |
| CN102555341A (en) * | 2011-02-25 | 2012-07-11 | 北京国科世纪激光技术有限公司 | Thermal conductive interface device |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106364013A (en) * | 2016-08-30 | 2017-02-01 | 苏州格优碳素新材料有限公司 | Heat conduction and heat insulating material and preparation method and application thereof |
| CN107331650A (en) * | 2017-07-27 | 2017-11-07 | 昆山德睿懿嘉电子材料科技有限公司 | Tack fin and circuit board and chip |
| CN109301382A (en) * | 2018-09-21 | 2019-02-01 | 浙江清优材料科技有限公司 | A kind of integrated technique of thermal insulation layer and heat-conducting layer and liquid cooling plate |
| CN109346797A (en) * | 2018-09-21 | 2019-02-15 | 浙江清优材料科技有限公司 | A kind of integrated technique integrating thermal insulation layer and heat-conducting layer on liquid cooling plate |
| CN109378545A (en) * | 2018-09-21 | 2019-02-22 | 浙江清优材料科技有限公司 | Thermal insulation layer and heat-conducting layer integrated technique based on liquid cooling plate |
| CN109365233A (en) * | 2018-09-21 | 2019-02-22 | 浙江清优材料科技有限公司 | It is integrated with the spraying integrated technique and equipment of the liquid cooling plate of heat-conducting layer |
| CN109346797B (en) * | 2018-09-21 | 2021-05-14 | 浙江清优材料科技有限公司 | Integration process for integrating heat insulation layer and heat conduction layer on liquid cooling plate |
| CN110305599A (en) * | 2019-07-03 | 2019-10-08 | 京东方科技集团股份有限公司 | A kind of heat dissipation film and display device |
| CN110305599B (en) * | 2019-07-03 | 2021-10-22 | 京东方科技集团股份有限公司 | Heat dissipation film and display device |
| CN113567500A (en) * | 2021-08-21 | 2021-10-29 | 福州大学 | Delay detection method for transient electromagnetic thermal effect of metal buried crack tip under action of pulse current |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201437598A (en) | 2014-10-01 |
| TWI548855B (en) | 2016-09-11 |
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