CN110305599A - A kind of heat dissipation film and display device - Google Patents
A kind of heat dissipation film and display device Download PDFInfo
- Publication number
- CN110305599A CN110305599A CN201910595626.4A CN201910595626A CN110305599A CN 110305599 A CN110305599 A CN 110305599A CN 201910595626 A CN201910595626 A CN 201910595626A CN 110305599 A CN110305599 A CN 110305599A
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- dissipation film
- foaming agent
- adhesive layer
- product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/87—Arrangements for heating or cooling
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
- C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention relates to field of display technology, a kind of heat dissipation film and display device are disclosed.Wherein, heat dissipation film includes the adhesive layer for being pasted on the heat dissipation film in other structures, includes foaming agent in the adhesive layer.Above-mentioned heat dissipation film, it is compound in its adhesive layer to be added to foaming agent, by heating, foaming agent in adhesive layer can be with foaming and intumescing, adhesive layer viscosity can be made to reduce rapidly, to, it will easily and efficiently can be removed in structure (such as oled panel) that heat dissipation film is covered from it, and the structure (such as oled panel) covered to it is avoided to damage, therefore, when the heat dissipation film is applied in specific product, it can be convenient when occurring and attaching bad and heavy industry reparation carried out to product, improve and the success rate that defective products carries out heavy industry reparation is attached to heat dissipation film；For example, the heat dissipation film is applied in display module product, the success rate of display module product heavy industry reparation can be improved, and then largely reduce the loss of scrap of the product.
Description
Technical field
The present invention relates to field of display technology, in particular to a kind of heat dissipation film and display device.
Background technique
In OLED mould set product production process, usually require to attach heat dissipation film (SCF at the oled panel back side (Panel)
Tape), in procedure for producing, it is limited to the influence of the composite factors such as equipment, technique, personnel's operation, SCF Tape barbola work is logical
It often will lead to a certain proportion of bad products, in order to reduce production cost, pursue improving production management, these bad products can be with
Carry out heavy industry reparation (Rework) operation.The bad products generated after existing SCF Tape packaging technology carry out heavy industry repair
When, it needs first to remove the SCF Tape of defective products.Usually directly removed under normal temperature state when SCF Tape is removed or
It is removed under heated condition, since the adhesion strength between SCF Tape and Panel is usually very big, it is more difficult to remove operation,
And it is very easy to damage OLED Panel ontology, so as to cause heavy industry repairing failure.
Summary of the invention
The invention discloses a kind of heat dissipation film and display devices, it is therefore an objective to a kind of heat dissipation film is provided, to improve heat dissipation film
Attach the success rate of defective products heavy industry reparation.
In order to achieve the above objectives, the present invention the following technical schemes are provided:
A kind of heat dissipation film, including for the heat dissipation film to be pasted on the adhesive layer in other structures, in the adhesive layer
Including foaming agent.
Above-mentioned heat dissipation film, compound in adhesive layer to be added to foaming agent, by heating, the foaming agent in adhesive layer can be sent out
Bubble expansion, can make adhesive layer viscosity reduce rapidly, it is thus possible to the structure for easily and efficiently being covered heat dissipation film from it
It is removed on (such as oled panel), and the structure (such as oled panel) covered to it is avoided to damage, therefore, which answers
When in specific product, it can be convenient when occurring and attaching bad and heavy industry reparation carried out to product, improve and heat dissipation film is attached
The success rate of defective products progress heavy industry reparation；For example, the heat dissipation film is applied in display module product, display module can be improved
The success rate of product heavy industry reparation, and then largely reduce the loss of scrap of the product.
In addition, relative to existing heat dissipation film, the thickness and layer structure of above-mentioned heat dissipation film have almost no change, without additional
Debugging improves heat dissipation film attaching device or technique；Also, heat dissipation film heavy industry reparation (Rework) operation and existing operation mode
Difference very little, without changing Rework power tool or equipment.
Optionally, the foaming agent is organic chemistry foaming agent.
Optionally, the foaming agent is production of low-temperature foaming agent.
Optionally, the decomposition temperature of the foaming agent is 100 DEG C -120 DEG C.
Optionally, the foaming agent includes unifor, azodicarbonamide, N, five methine of N'- dinitroso
One or more of tetramine.
Optionally, the foaming agent is particle shape.
Optionally, the partial size of the particle is 5 μm -20 μm.
Optionally, the foaming agent is fibre morphology.
Optionally, the adhesive layer with a thickness of 20 μm -50 μm.
A kind of display device, including heat dissipation film described in any of the above embodiments, the heat dissipation film are pasted on the display module
Away from the side of light-emitting surface.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of heat dissipation film provided in an embodiment of the present invention；
Fig. 2 be a kind of heat dissipation film provided in an embodiment of the present invention before heating after adhesive layer schematic diagram of structural changes；
Fig. 3 is a kind of partial structure diagram of display device provided in an embodiment of the present invention.
Specific embodiment
It is one in oled panel mobile phone or other electronic product production processes that heat dissipation film (SCF Tape), which attaches processing procedure,
Necessary manufacturing process.Effect of the heat dissipation film in oled panel mould set product specifically includes that heat spreading function, OLED Panel work
When can generate heat, heat dissipation film can contribute to the heat Quick diffusing that generates when Panel work；External (background) light is blocked, is kept away
Exempt to influence the front Panel display effect；Structure enhances protective effect, avoids foreign matter or external force that Panel is caused to damage.
In order to reduce production cost, maximally utilizing for mould group goods, materials and equipments (including Panel) is pursued, lean production pipe is promoted
It manages, (such as SCF Tape attaching offset, attaching fold, attaching foreign matter, attaching bubble are bad for the defective products of heat dissipation film attachment process
Product) heavy industry reparation (Rework) operation can be carried out, that is, the SCF Tape on defective products is removed, after SCF Tape will be removed
Product re-start heat dissipation film attachment process processing procedure again.
The method of heat dissipation film removal is usually directly to be removed from the back side Panel with hand or tool；Alternatively, defective products is put
It is removed again from the back side Panel after being placed on warm table the heating for carrying out certain time.It is attached due to heat dissipation film and the back side Panel
Adhesion strength is larger, therefore, no matter which kind of uses remove mode, is all very easy to destroy Panel, for example, leading to rigid OLED
Panel is broken, or flexible OLED Panel is caused to tilt (Peeling), tearing, package failure.Once there is Panel breakage
Situation will result directly in heavy industry reparation (Rework) failure.
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
As depicted in figs. 1 and 2, the embodiment of the invention provides a kind of heat dissipation films, including for pasting the heat dissipation film
It include foaming agent 11 in the adhesive layer 1 in other structures, the adhesive layer 1.
Above-mentioned heat dissipation film, compound in adhesive layer 1 to be added to foaming agent 11, the foaming agent 11 by heating, in adhesive layer 1
1 viscosity of adhesive layer can be made to reduce rapidly with foaming and intumescing, shown in Fig. 2 (a) to Fig. 2 (b), it is thus possible to easily effectively
Ground will remove in structure (such as oled panel 20) that heat dissipation film is covered from it, and avoid structure (such as OLED covered to it
Panel 20) it damages, therefore, when which applies in specific product, it can be convenient when occurring and attaching bad to production
Product carry out heavy industry reparation, improve and attach the success rate that defective products carries out heavy industry reparation to heat dissipation film；For example, the heat dissipation film is applied
In display module product, the success rate of display module product heavy industry reparation can be improved, and then largely reduce product
The loss scrapped.
In addition, relative to existing heat dissipation film, the thickness and layer structure of above-mentioned heat dissipation film have almost no change, without additional
Debugging improves heat dissipation film attaching device or technique；Also, heat dissipation film heavy industry reparation (Rework) operation and existing operation mode
Difference very little, without changing Rework power tool or equipment.
In a kind of specific embodiment, the foaming agent 11 is organic chemistry foaming agent 11.
Gas can be released after organic chemistry foaming agent 11 is heated, to form pore in adhesive layer 1, to reach
The effect of 1 viscosity of adhesive layer is reduced, easy to use and efficiency is higher.
In a kind of specific embodiment, the foaming agent 11 is low temperature organic chemistry foaming agent 11.Low temperature organic chemistry hair
The lower organic chemistry foaming agent 11 of infusion 11, i.e. decomposition temperature (blowing temperature), decomposition temperature, which is generally less than, is equal to 130 DEG C；
Using low temperature organic chemistry foaming agent 11, the operation that can foam to avoid high temperature generates adverse effect to display module.
Illustratively, the decomposition temperature of the foaming agent 11 can be 100 DEG C -120 DEG C.It in this way can be in order to existing
It is heated on the reparation of heat dissipation film heavy industry (Rework) warm table.
Illustratively, the foaming agent 11 may include unifor (TSH), azodicarbonamide (AC), N, N'-
One or more of dinitrosopentamethlyene tetramine (DPT).
Illustratively, the foaming agent 11 can also include blowing promotor, and blowing promotor is made for adjusting foamed material
Substance increases material fluidity for example, adjusting 11 decomposition temperature of foaming agent and decomposition rate, removes residue stink, prevents
Only corrode mold, improves foam uniformity etc.；It can specifically include the objects such as urea class, phosphoric acid ester, organic acid, metallic salt
Matter.
Specifically, heat dissipation film provided in an embodiment of the present invention, the bonding force of adhesive layer in a normal state and existing skill
Adhesive layer difference very little in art, will not influence the bonding force between heat dissipation film and Panel, in normal temperature environment and reliability ring
It can normal use under border.
When needing the defective products to heat dissipation membrane process to carry out heavy industry reparation (Rework) operation, gone according to existing heat dissipation film
Except method, heat dissipation film is pasted into undesirable product and is placed on Rework warm table, when temperature is increased to the decomposition of foaming agent 11
When temperature (such as 100 DEG C), the rapid foaming and intumescing of foaming agent 11 in adhesive layer 1, shown in Fig. 2 (a) to Fig. 2 (b), adhesive layer 1
Viscosity, which is reduced rapidly, even to disappear, at this point it is possible to easily remove heat dissipation film from the back side Panel, and not will cause
Panel is broken or damage, the efficiency of defective products removal heat dissipation film are substantially improved.Later, the product for eliminating heat dissipation film can be just
Often carry out heat dissipation film attachment process processing procedure.
In a kind of specific embodiment, the adhesive layer 1 with a thickness of 20 μm -50 μm.
In a kind of specific embodiment, as depicted in figs. 1 and 2, the foaming agent 11 can be particle shape.Further
, the partial size of the particle (i.e. expanded particle 110) can be 5 μm -20 μm.It, can be according to practical need in specific embodiment
The expanded particle 110 of suitable big small particle and glue material is selected to carry out compound to prepare adhesive layer 1.
In another specific embodiment, the foaming agent 11 or fibre morphology.
Certainly, 11 form of foaming agent in above-described embodiment is merely illustrative of, can also according to foaming agent 11 itself
Property and preparation process are convenient, and foaming agent 11 is prepared as other suitable forms.
Specifically, the ratio of compound addition foaming agent 11 (expanded particle 110) can be according to relevant test in adhesive layer 1
It is determined, specifically premised on meeting the performance requirement of different OLED mould set products, is not illustrated in the present invention.
Adhesive layer 1 is the layer structure that cementation is played in heat dissipation film, and performance is required to guarantee heat dissipation film and display
The compactness that panel (Panel) attaches guarantees that OLED product is not in scattered under normal use environment or under reliability environment
It cracks between hotting mask and Panel or is not close to state.
Illustratively, the adhesive layer 1 can be designed as reticulate pattern glue.Can specifically be pressed by grid makes glue surface coining
Upper shallow reticulate pattern in length and breadth can prevent the crimp caused by shrinking because of glue-line, and reinforce heat dissipation film and display panel
(Panel) compactness attached.
Illustratively, the glue material in adhesive layer 1 uses acrylic glue (Acrylic) or silica gel (Silicone), can be with
Make adhesive layer 1 that there is biggish bonding force.
Specifically, the heat dissipation film of the embodiment of the present invention further includes copper foil layer 3 and foamed cotton layer 2, the glue shown in Fig. 1 and Fig. 2
The side that the foamed cotton layer 2 deviates from copper foil layer 3 is arranged in adhesion coating 1.That is, the heat-dissipation film structure of the embodiment of the present invention can be copper foil
+ foam (Foam)+glue-line (reticulate pattern glue) design.
Further, shown in Fig. 1, the heat dissipation film of the embodiment of the present invention can also include be arranged in 1 side of adhesive layer from
Type film 4；Before heat dissipation film is covered in other structures, need to remove release film 4.
In addition, the embodiment of the present invention also provides a kind of display device shown in Fig. 3, the display device include display module with
And heat dissipation film 10 described in any of the above embodiments, the heat dissipation film 10 are pasted on the side that the display module deviates from light-emitting surface.
Specifically, display module can be rigidity or flexibility OLED display module.
Illustratively, shown in Fig. 3, OLED display module may include oled panel 20, polaroid (not shown), touching
Structures, the heat dissipation films 10 such as control structure 30, cover board 40, flexible circuit board (PFC) 50 are covered in the back side of oled panel 20.
Obviously, those skilled in the art can carry out various modification and variations without departing from this hair to the embodiment of the present invention
Bright spirit and scope.In this way, if these modifications and changes of the present invention belongs to the claims in the present invention and its equivalent technologies
Within the scope of, then the present invention is also intended to include these modifications and variations.
Claims (10)
1. a kind of heat dissipation film, which is characterized in that described including for the heat dissipation film to be pasted on the adhesive layer in other structures
It include foaming agent in adhesive layer.
2. heat dissipation film as described in claim 1, which is characterized in that the foaming agent is organic chemistry foaming agent.
3. heat dissipation film as claimed in claim 2, which is characterized in that the foaming agent is production of low-temperature foaming agent.
4. heat dissipation film as claimed in claim 3, which is characterized in that the decomposition temperature of the foaming agent is 100 DEG C -120 DEG C.
5. heat dissipation film as claimed in claim 3, which is characterized in that the foaming agent includes unifor, azo diformazan
Amide, N, one or more of N'- dinitrosopentamethlyene tetramine.
6. heat dissipation film as described in claim 1, which is characterized in that the foaming agent is particle shape.
7. heat dissipation film as claimed in claim 6, which is characterized in that the partial size of the particle is 5 μm -20 μm.
8. heat dissipation film as described in claim 1, which is characterized in that the foaming agent is fibre morphology.
9. such as the described in any item heat dissipation films of claim 1-8, which is characterized in that the adhesive layer with a thickness of 20 μm -50 μm.
10. a kind of display device, which is characterized in that including display module and the described in any item heat dissipation films of claim 1-9,
The heat dissipation film is pasted on the side that the display module deviates from light-emitting surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910595626.4A CN110305599B (en) | 2019-07-03 | 2019-07-03 | Heat dissipation film and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910595626.4A CN110305599B (en) | 2019-07-03 | 2019-07-03 | Heat dissipation film and display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110305599A true CN110305599A (en) | 2019-10-08 |
| CN110305599B CN110305599B (en) | 2021-10-22 |
Family
ID=68078948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910595626.4A Active CN110305599B (en) | 2019-07-03 | 2019-07-03 | Heat dissipation film and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110305599B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112223866A (en) * | 2020-09-22 | 2021-01-15 | 京东方科技集团股份有限公司 | Curved surface screen, preparation method thereof, heat dissipation film and profiling mold |
| WO2022042060A1 (en) * | 2020-08-27 | 2022-03-03 | 京东方科技集团股份有限公司 | Heat dissipation film for display module, and preparation method of display device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010004703A1 (en) * | 2008-07-08 | 2010-01-14 | 日東電工株式会社 | Process for producing organic electroluminescent panel |
| CN103118521A (en) * | 2013-01-30 | 2013-05-22 | 东莞龙郝胶粘制品有限公司 | Uniform cooling fin and production method thereof |
| CN103740312A (en) * | 2013-12-03 | 2014-04-23 | 赛伦（厦门）新材料科技有限公司 | Thermal conduction film binder used for heat repairing |
| KR20170022622A (en) * | 2015-08-21 | 2017-03-02 | 전춘섭 | Tacky tape and display device using the same |
-
2019
- 2019-07-03 CN CN201910595626.4A patent/CN110305599B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010004703A1 (en) * | 2008-07-08 | 2010-01-14 | 日東電工株式会社 | Process for producing organic electroluminescent panel |
| CN103118521A (en) * | 2013-01-30 | 2013-05-22 | 东莞龙郝胶粘制品有限公司 | Uniform cooling fin and production method thereof |
| CN103740312A (en) * | 2013-12-03 | 2014-04-23 | 赛伦（厦门）新材料科技有限公司 | Thermal conduction film binder used for heat repairing |
| KR20170022622A (en) * | 2015-08-21 | 2017-03-02 | 전춘섭 | Tacky tape and display device using the same |
Non-Patent Citations (1)
| Title |
|---|
| 徐毛清: "《印刷橡皮布用户使用技术手册》", 31 July 2012, 印刷工业出版社 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022042060A1 (en) * | 2020-08-27 | 2022-03-03 | 京东方科技集团股份有限公司 | Heat dissipation film for display module, and preparation method of display device |
| CN112223866A (en) * | 2020-09-22 | 2021-01-15 | 京东方科技集团股份有限公司 | Curved surface screen, preparation method thereof, heat dissipation film and profiling mold |
| CN112223866B (en) * | 2020-09-22 | 2023-03-10 | 京东方科技集团股份有限公司 | Curved surface screen, preparation method thereof, heat dissipation film and profiling mold |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110305599B (en) | 2021-10-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI424042B (en) | Double-sided adhesive tape | |
| CN110305599A (en) | A kind of heat dissipation film and display device | |
| JP2007154045A (en) | Tacky adhesive film | |
| CN103964681B (en) | A kind of processing method of cover-plate glass for electronic product | |
| JP2011168727A (en) | Adhesive sheet for electronic device | |
| WO2018107924A1 (en) | Flexible circuit board and preparation method, and solar photovoltaic assembly | |
| JPH06184504A (en) | Thermally peelable adhesive and self-adhesive member | |
| CN104064509A (en) | Temporary bonding method and separation method of wafers | |
| CN109036138A (en) | The applying method and backboard of flexible display screen | |
| KR102222170B1 (en) | Adhesive tape for flat panel display | |
| CN108864975B (en) | Degumming method | |
| CN115322697A (en) | Low-temperature foaming type thermal viscosity-reducing adhesive tape and preparation method and application thereof | |
| JP4246758B2 (en) | Manufacturing method of FPD | |
| CN207458891U (en) | For the clear polyimides composite membrane of flexible display | |
| JP2018008419A (en) | Manufacturing method of article | |
| CN104465528B (en) | The preparation method and flexible base board precast segment of flexible base board | |
| WO2002089553A1 (en) | Method for mounting electronic part on flexible printed wiring board and adhesive sheet for fixing flexible printed wiring board | |
| CN210415735U (en) | UV (ultraviolet) adhesive release film applied to PCB (printed circuit board) production | |
| CN104952702A (en) | Semiconductor device and manufacturing method thereof | |
| CN103826420A (en) | Display device with non-light-transmitting heat dissipation layer and manufacturing method thereof | |
| US10385176B2 (en) | Transparent polyimide composite film for flexible display and method for manufacturing the same | |
| CN110791220A (en) | Transparent polyimide composite film for flexible display and method for manufacturing the same | |
| KR102602153B1 (en) | The double-faced adhesive tape for RDL forming process, Laminate containing the same, and Manufacturing process of Fan-out package | |
| CN113174216A (en) | Removable adhesive tape and preparation method thereof | |
| CN112961616A (en) | Foldable TPU adhesive tape and preparation process thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |