CN109628018B - Method for applying oxidized PE wax to sealing protection of circuit board - Google Patents
Method for applying oxidized PE wax to sealing protection of circuit board Download PDFInfo
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- CN109628018B CN109628018B CN201811447311.7A CN201811447311A CN109628018B CN 109628018 B CN109628018 B CN 109628018B CN 201811447311 A CN201811447311 A CN 201811447311A CN 109628018 B CN109628018 B CN 109628018B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
- C09J123/30—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment by oxidation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention relates to a method for applying oxidized PE wax to sealing protection of a circuit board, which comprises the following steps: brushing a layer of coupling agent on the surface of the circuit board, and air-drying; dehumidifying the circuit board; adding a tackifier and a liquid toughening agent into the melted oxidized polyethylene wax, and uniformly mixing to prepare melted wax; and (3) soaking the dehumidified circuit board into the molten wax for sealing, placing the circuit board on release paper after sealing, and drying to obtain the printed circuit board. The sealing method overcomes the defect that the oxidized PE wax is easy to crack at low temperature and the defect of poor adhesion of the oxidized PE wax, and finally realizes that the oxidized PE wax can meet the effective waterproof and moistureproof sealing of the circuit board in the working environment of 20-60 ℃ below zero by adding the proportion of the tackifier and the toughening agent through repeated experiments. The method makes full use of the good acid and alkali resistance, electrolytic chemical resistance stability and hydrophobicity of the main ingredient PE wax, and a layer of wax film is formed on the surfaces of the circuit board and the components after melting to protect the circuit board.
Description
Technical Field
The invention belongs to a sealing protection method of a circuit board, and particularly relates to a method for effectively realizing normal working operation of the circuit board in an underwater, humid and sultry environment for a long time when oxidized PE wax is applied to waterproof and moistureproof sealing protection of the circuit board.
Background
At present, a circuit board working in an underwater, humid and sultry environment is sealed and protected by mainly adopting a mode of matching three-proofing paint with pouring sealant to completely coat and seal the circuit board with higher thickness. The method relates to the problems that the curing time of the colloid is long, the cost of the potting adhesive is consumed by the size of the circuit board, the glue needs to be buckled during subsequent maintenance, the labor hour is consumed during the colloid dissolution, electronic components are easy to damage, and the recovery and analysis of the fault phenomenon are not facilitated. In order to realize the high-efficiency and low-cost sealing of the circuit board, it is necessary to research the sealing protection of the circuit board by using cheap oxidized PE wax as a main base material.
Patent CN97116401.0 discloses a wax composition for protecting an inner cavity of an automobile and a preparation method thereof, wherein the wax composition comprises wax, resin, a wax film improver, an antirust agent, a filler, a thixotropic agent, a solvent and the like. It has proper viscosity, excellent filming performance, spraying performance, etc.
Patent cn200410042842.x discloses a wax composition for sealing pills which does not contain beeswax. The oil-water-based cleaning agent mainly comprises 10-90 wt% of paraffin wax and 10-90 wt% of oxidized petroleum wax, and can optionally contain polyethylene wax, liquid paraffin, microcrystalline wax, oxidized polyethylene wax, polyethylene, polystyrene wax, EVA (ethylene vinyl acetate), methyl cellulose, ethyl cellulose, carboxymethyl cellulose, animal and vegetable oil or hydrogenated oil, and/or higher alcohol, an anionic surfactant, a nonionic surfactant, and/or bentonite, diatomite, kaolin, calcium carbonate, silicon dioxide and the like. The wax composition for sealing pills has excellent processing and use performance.
However, the low temperature crack resistance of the above wax composition for protection is still to be further improved.
Disclosure of Invention
In order to solve the problems, the invention provides a sealing method for applying oxidized PE wax to the sealing protection of a circuit board, and the method can realize the purposes of sealing, water proofing and moisture proofing of the circuit board, low cost, high efficiency, and convenient testing and maintenance.
In order to achieve the technical purpose, the technical scheme adopted by the invention is as follows:
a composite material for sealing and protecting a circuit board is composed of the following raw materials in parts by weight: 75-80 parts of oxidized polyethylene wax, 12-18 parts of a plastic tackifier and 5-10 parts of a liquid toughening agent.
Oxidized PE waxes in this application mean: oxidized polyethylene wax.
In order to overcome the problem of poor low-temperature adhesion of the oxidized PE wax and improve the sealing, waterproof and moistureproof effects, the acid and alkali resistance, the electrolytic chemical resistance and the hydrophobicity, a certain amount of tackifier and liquid toughening agent are added into the oxidized polyethylene wax to improve the toughness, the bonding property and the like. But because different kinds of tackifier and liquid toughening agent can have great difference to the influence that melting point, the pliability of oxidized polyethylene wax produced, in order to guarantee that composite material can satisfy the sealed requirement of circuit board, the preferred combination of tackifier and liquid toughening agent of this application is: APP tackifying master batches and special toughening agents for PE materials.
In some embodiments, the composition comprises the following raw materials in parts by weight: 77-79 parts of oxidized polyethylene wax, 14-16 parts of plastic tackifier and 7-9 parts of liquid toughening agent.
In some embodiments, the composition comprises the following raw materials in parts by weight: 77 parts of oxidized polyethylene wax, 16 parts of plastic tackifier and 7 parts of liquid toughening agent.
In some embodiments, the plastic tackifier is an atactic polypropylene (APP) tackifying masterbatch that enhances the bonding strength between bonded materials by surface diffusion or internal diffusion.
In some embodiments, the liquid toughening agent is a PE material specific toughening agent, such as: a-608, can enhance the toughness, cold resistance and impact resistance of PE.
The invention also provides a method for applying the oxidized PE wax to the sealing protection of the circuit board, which comprises the following steps:
brushing a layer of coupling agent on the surface of the circuit board, and air-drying;
in some embodiments, the coupling agent (i.e., PRIMER1600 under the trademark hasp ast) is a silane coupling agent solution containing multiple active groups and capable of chemically reacting with multiple different materials, and for the circuit board, after the circuit board is treated by the PRIMER1600, a very satisfactory tackifying effect can be achieved with the composite material of the present application, and the crack resistance of the composite material at low temperature is remarkably enhanced. On the other hand, the silicone rubber can be well adhered to a wide variety of circuit board substrates.
Dehumidifying the circuit board;
adding a tackifier and a liquid toughening agent into the melted oxidized polyethylene wax, and uniformly mixing to prepare melted wax;
and (3) soaking the dehumidified circuit board into the molten wax for sealing, placing the circuit board on release paper after sealing, and drying to obtain the printed circuit board.
In some embodiments, the oxidized polyethylene wax is heated at a temperature of 100 to 103 ℃ and a heating temperature of 120 to 124 ℃.
In some embodiments, the circuit board welded with the conducting wire needs to shake the conducting wire back and forth during sealing, so that the wax liquid is completely immersed into the notch position of the cable sheath.
The invention also provides the packaged circuit board prepared by any one of the methods, and the thickness of the wax layer of the circuit board is basically 0.1-1 mm.
The invention also provides the packaging circuit board used for manufacturing the computer motherboard, the mouse board, the display card, the office equipment, the printer, the duplicator, the remote controller, the charger, the calculator, the digital camera, the radio, the television motherboard, the limited television amplifier, the mobile phone, the washing machine, the electronic scale, the telephone, the LED lamp and the household appliance: air conditioning, refrigerator, stereo, MP3, industrial equipment, GPS, automotive, instrumentation, medical instrumentation, aircraft, military weapons, missiles, or satellites.
The invention has the beneficial effects that:
1) the sealing method overcomes the defect that the oxidized PE wax is easy to crack at low temperature and the defect of poor adhesion of the oxidized PE wax, and finally realizes that the oxidized PE wax can meet the effective waterproof and moistureproof sealing of the circuit board in the working environment of 20-60 ℃ below zero by adding the types and the proportions of the tackifier and the flexibilizer through repeated experiments. The method fully utilizes the good acid and alkali resistance, electrolytic chemical resistance stability and hydrophobicity of the PE wax-based composite material, and a layer of wax film is formed on the surfaces of the circuit board and the components after melting to protect the circuit board.
2) The sealing method realizes the mass production and application of the circuit board protection, and saves a large amount of production working hour cost and sealant cost. Overcomes the defects of large using amount of the sealing colloid, long curing time, high cost and inconvenient repair in the prior art.
3) The sealing method is simple, efficient, easy to popularize and high in practicability
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the application and, together with the description, serve to explain the application and are not intended to limit the application.
Fig. 1 is a process flow diagram of the waterproof treatment of the circuit board of the present application.
Detailed Description
It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the disclosure. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
As introduced in the background art, the method aims at the problems of long colloid curing time, high cost and inconvenient subsequent maintenance in the existing circuit board sealing protection mode. Therefore, the invention provides a method for applying the oxidized PE wax to the sealing protection of the circuit board,
the design of the protection mode fully utilizes the hydrophobicity of the oxidized PE wax, but the toughness of the oxidized PE wax is poor in a low-temperature state, the toughness of the oxidized PE wax is improved by adding the toughening agent, and the excellent toughness and waterproof performance of the material are realized through repeated experiments. But because the adhesion between the oxidized PE wax and the PCB and the components of the current common epoxy board is not good enough, the adhesion of the circuit board and the components is enhanced by adding the tackifier and adopting the primer coupling agent and the reinforcing material.
A method for applying oxidized PE wax to circuit board sealing protection comprises the following steps: the method comprises the following steps:
(1) firstly, uniformly coating a thin layer of PRIMER coupling agent (PRIMER 1600 PRIMER of HASUNCAST brand) on the surface of a circuit board, and naturally drying.
(2) The circuit board is subjected to a dehumidification process, enters an oven for baking, and moisture absorbed in the storage and circulation process of the circuit board and the components is discharged.
(3) The preparation method comprises the steps of dissolving and uniformly mixing oxidized PE wax, a tackifier (APP tackifying master batch) and a liquid toughening agent (A-608 of Shenzhen Daquan company is selected), selecting the oxidized PE wax with the melting point of 100 ℃, and adopting 120 ℃ for melting, so that the problem of adhesive force in the process of thermal expansion and cold contraction is solved by considering the addition of the tackifier to solve the adhesive force between the oxidized PE wax and a circuit board and components. In order to solve the problem that the toughness of the oxidized PE wax is not enough in a low-temperature environment, a toughening agent with a proper proportion is added to solve the problem that a wax layer is cracked at the low temperature of 20 ℃ below zero.
(4) Repeated grouping experiments show that when the proportion of the oxidized PE wax is 77, the proportion of the tackifier is 16% and the proportion of the liquid toughening agent is 7%, the thickness of the composite wax film obtained after mixing is moderate, and the performances of viscosity, toughness and water resistance in the high-low temperature impact process are the most excellent.
(5) Putting a circuit board into a wax melting container at a certain angle, wherein the circuit board is welded with a lead and needs to shake the lead back and forth, so that wax liquid is completely immersed into the notch position of the cable sheath to achieve the purpose of sealing protection; and after the whole bubble of the circuit board is completely discharged, taking out the circuit board, placing the circuit board on release paper, and standing to complete sealing protection.
(6) The thickness of the wax-dipped on the surfaces of the circuit board and the component is controlled by controlling the temperature of the mixed wax solution, and multiple comparison tests show that the thickness of the obtained wax layer is basically within 1mm when the heating temperature is maintained at 120 ℃ and the oxidized PE wax with the melting point of 100 ℃. Due to the properties of the wax, the higher the temperature is, the lower the viscosity of the wax is in the temperature range above the melting point and below the boiling point, and the higher the viscosity of the wax is when the temperature is reduced to be closer to the melting point. After high-low temperature impact tests, the thickness of a wax layer is found to be less than 1mm, so that good adhesive force and low-temperature toughness can be ensured.
The invention is further described with reference to the accompanying drawings and the detailed description.
In the following examples, a coupling agent was used as prime coating agent of PRIMER1600 of HASHUNCAST brand, the melting point of the oxidized PE wax was 100 ℃, the tackifier was APP tackifying master batch, and the liquid toughener was a special toughener for PE material A-608 of Shenzhen Daquan company.
Example 1
The basic composition of the composite wax liquid is shown in table 1:
TABLE 1
Oxidized PE wax: the hydrophobicity and the chemical stability of the PVC film are fully utilized, and a layer of PVC film with excellent waterproof, damp-proof and mildew-proof performances is formed on the surface after heating and curing.
Tackifier: the adhesive property of the adhesive is fully utilized, and the adhesive force of the main material, namely the oxidized PE wax, the circuit board and the components is increased.
A toughening agent: the excellent toughness of the oxidized PE wax in a low-temperature state is fully utilized, and the problem that the wax film is easy to crack in the processes of low temperature expansion and cold contraction of the oxidized PE wax is solved.
The technological process of waterproof treatment of the circuit board comprises the following steps:
the whole waterproof treatment process has three important links, namely, pretreatment, dip coating and cooling of the circuit board.
The first step of pretreatment: the impurities such as rosin, tin slag and the like on the surfaces of the circuit board and the components are cleaned, and the bonding capability of the wax film with the surfaces of the circuit board and the components is improved. The cleaning process adopts plate washing water cleaning or ultrasonic machine cleaning.
A second step of pretreatment: and uniformly coating a thin layer of coupling agent for priming on the surface of the circuit board, and naturally drying.
The third step of pretreatment: the circuit board is subjected to a dehumidification process, enters an oven for baking, and moisture absorbed in the storage and circulation process of the circuit board and the components is discharged.
The dip coating process comprises the following steps:
before the surface temperature of the circuit board dehumidification process is not restored to normal temperature, the circuit board dehumidification process is inclined at a certain angle and is completely immersed in the fully-mixed and uniformly-mixed wax liquid, the circuit board is fully immersed, after the bubble discharge of each air hole is observed, the circuit board is taken out, redundant treatment liquid is immediately removed in a natural suspension, blowing-off, spin-drying and other modes, and the wax film with uniform thickness is obtained.
And (3) cooling: the circuit board is placed on release paper, and the subsequent process assembly can be carried out after the normal temperature is recovered, so that the circuit board is prevented from being directly placed on the surface of a desktop or other objects, and the phenomenon that the wax film is difficult to peel off after the wax film has a bonding effect and the protective effect is influenced is avoided.
The properties of the composite wax liquid are measured, and the results are shown in table 2.
TABLE 2
It should be noted that the above-mentioned embodiments are only preferred embodiments of the present invention, and the present invention is not limited thereto, and although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and equivalents can be made in the technical solutions described in the foregoing embodiments, or equivalents thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention. Although the embodiments of the present invention have been described with reference to the accompanying drawings, it is not intended to limit the scope of the present invention, and it should be understood by those skilled in the art that various modifications and variations can be made without inventive efforts by those skilled in the art based on the technical solution of the present invention.
Claims (7)
1. The composite material for sealing and protecting the circuit board is characterized by comprising the following raw materials in parts by weight: 77 parts of oxidized polyethylene wax, 16 parts of plastic tackifier and 7 parts of liquid toughening agent, wherein the plastic tackifier is APP tackifying master batch; the liquid toughening agent is a toughening agent for PE materials; the step of applying the composite material to the sealing protection of the circuit board comprises the steps of brushing a layer of coupling agent on the surface of the circuit board, and drying in the air; dehumidifying the circuit board; adding a tackifier and a liquid toughening agent into the melted oxidized polyethylene wax, and uniformly mixing to prepare melted wax;
soaking the dehumidified circuit board into the molten wax for sealing; the melting point of the oxidized polyethylene wax is 100 ℃, the heating temperature of the oxidized polyethylene wax during melting is 120 ℃, the coupling agent is a PRIMER1600 of HASUNCAST brand, and the liquid toughening agent is a special toughening agent for PE material A-608 of Shenzhen Dazhong company.
2. A method of applying the composite material of claim 1 to a circuit board for hermetic protection, comprising:
brushing a layer of coupling agent on the surface of the circuit board, and air-drying;
dehumidifying the circuit board;
adding a tackifier and a liquid toughening agent into the melted oxidized polyethylene wax, and uniformly mixing to prepare melted wax;
and (3) soaking the dehumidified circuit board into the molten wax for sealing, placing the circuit board on release paper after sealing, and drying to obtain the printed circuit board.
3. The process of claim 2 wherein said oxidized polyethylene wax has a melting point of 100 ℃ and the heated temperature at which said oxidized polyethylene wax melts is 120 ℃.
4. The method of claim 2, wherein the circuit board with the wires soldered thereon is sealed by shaking the wires back and forth to completely immerse the wax liquid in the cut of the cable sheath.
5. The packaged circuit board prepared by the method according to any one of claims 2 to 4, wherein the wax layer of the circuit board has a thickness of 0.1 to 1 mm.
6. Use of the packaged circuit board of claim 5 in the manufacture of office equipment, home appliances, industrial equipment, medical instruments, military weapons.
7. Use of the packaged circuit board of claim 5 in the manufacture of a computer motherboard, a mouse board, a video card, a printer, a copier, a remote controller, a charger, a calculator, a digital camera, a radio, a television motherboard, a cable television amplifier, a mobile phone, a washing machine, an electronic scale, an LED lamp, an air conditioner, a refrigerator, a stereo, MP3, a GPS, an automobile, a medical instrument, an airplane, a missile, or a satellite.
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| CN201811447311.7A CN109628018B (en) | 2018-11-29 | 2018-11-29 | Method for applying oxidized PE wax to sealing protection of circuit board |
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| CN201811447311.7A CN109628018B (en) | 2018-11-29 | 2018-11-29 | Method for applying oxidized PE wax to sealing protection of circuit board |
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| CN111944360A (en) * | 2020-07-22 | 2020-11-17 | 廖沛锟 | Hot-melt type three-proofing paint and preparation method and use method thereof |
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| CN1458216A (en) * | 2002-05-15 | 2003-11-26 | 中国石油化工股份有限公司 | Sealing wax for electronic element coil |
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