JP4246758B2 - Manufacturing method of FPD - Google Patents
Manufacturing method of FPD Download PDFInfo
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- JP4246758B2 JP4246758B2 JP2006169618A JP2006169618A JP4246758B2 JP 4246758 B2 JP4246758 B2 JP 4246758B2 JP 2006169618 A JP2006169618 A JP 2006169618A JP 2006169618 A JP2006169618 A JP 2006169618A JP 4246758 B2 JP4246758 B2 JP 4246758B2
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Description
本発明は、熱溶解型の接着剤からなる封止材を用いたFPDの製造方法に関する。 The present invention relates to a method of manufacturing a FPD using a sealant consisting of hot melt type adhesive.
フラットパネルディスプレイ(本明細書ではFPDと称す)は、CRTディスプレイのブラウン管のように膨らみを持った表示装置と対比される用語であり、奥行きが少なく省スペースで、且つ、表示パネルに膨らみがない点に大きな特徴があり、液晶ディスプレイ、プラズマディスプレイ、有機ELディスプレイなどが実用化されている。FPDのうち、特に、液晶ディスプレイは、テレビ受像機だけでなく、携帯電話機やコンピュータ機器などの表示装置としても広く普及している。 A flat panel display (referred to as FPD in this specification) is a term that is contrasted with a display device having a bulge, such as a cathode ray tube of a CRT display, has a small depth, saves space, and has no bulge in the display panel. There is a big feature in the point, and a liquid crystal display, a plasma display, an organic EL display etc. are put into practical use. Among FPDs, in particular, liquid crystal displays are widely used not only as television receivers but also as display devices for mobile phones and computer equipment.
ところで、液晶ディスプレイの軽量化と薄型化の要請に基づき、最近では、液晶ディスプレイを構成する貼合せガラス基板を極限まで化学研磨する方法が好適に採用されている。具体的には、複数の表示パネル領域PN・・・PNを設けた第一と第二のガラス基板60,60を貼合せ、この貼合せガラス基板GLの周縁を厳重に封止した状態で、フッ酸を含んだ水溶液に浸漬させて化学研磨して薄型化している(図3(a)(b)参照)。
By the way, based on the demand for lighter and thinner liquid crystal displays, recently, a method of chemically polishing a laminated glass substrate constituting a liquid crystal display to the limit is suitably employed. Specifically, the first and
この化学研磨方法によれば、複数枚の表示パネルPN・・・PNをまとめて製造できるだけでなく、機械研磨に比べて処理速度が速いので、生産性に優れるという利点がある。また、貼合せガラス基板GLを限界まで薄型化できるので表示パネルPNの薄型化と軽量化の更なる要請にも応えることができる。 According to this chemical polishing method, not only a plurality of display panels PN... PN can be manufactured together, but also the processing speed is faster than that of mechanical polishing, so that there is an advantage that the productivity is excellent. Further, since the laminated glass substrate GL can be thinned to the limit, it is possible to meet further demands for thinning and lightening the display panel PN.
上記の製造方法では、貼合せガラス基板GLの周縁を封止する耐フッ酸性の封止材SEが必要となるが、従来は、封止材SEとしてUV硬化性樹脂が用いられていた(特許文献1)。
しかし、このUV硬化性樹脂の封止材SEは高価なだけでなく、一旦、硬化させると、その後に封止不良箇所が発見されても、その部分を修復できないという問題がある。そのため、一箇所でも封止不良箇所を有する貼合せガラス基板は、もはや薄型化できないことにもなり兼ねず、複数枚の表示パネルPN・・・PNの全てが無駄になるおそれがある。 However, the sealing material SE of the UV curable resin is not only expensive, but once cured, there is a problem that even if a sealing failure portion is discovered thereafter, the portion cannot be repaired. For this reason, a laminated glass substrate having even a poorly sealed portion can no longer be made thinner, and all of the plurality of display panels PN... PN may be wasted.
一方、かかる封止不良箇所の問題を回避するには、勢い塗布量が多くなりがちとなり、この意味でも、UV硬化性樹脂の使用は、製造コストを大きく上げていた。しかも、余分に塗布された樹脂は、ガラス基板が薄型化された後に鋭いエッジとして残ることになり(図3(d)参照)、その処理も極めて煩雑であった。 On the other hand, in order to avoid such a problem of defective sealing, the amount of momentum applied tends to increase. In this sense, the use of the UV curable resin greatly increases the manufacturing cost. In addition, the excessively applied resin remains as a sharp edge after the glass substrate is thinned (see FIG. 3D), and the processing is extremely complicated.
上記の実情から、封止不良箇所が検出された場合には、これを修復することができ、製造コストの低減化を図ることもできることが強く要望されている。本発明は、上記の要請に基づくものであり、製造コストが安価で、封止不良箇所の修正も容易なFPDの製造方法を提供することを目的とする。 From the above situation, it is strongly desired that when a defective sealing portion is detected, it can be repaired and the manufacturing cost can be reduced. The present invention is based on the above requirements, and an object of the present invention is to provide a method for manufacturing an FPD that is inexpensive to manufacture and that can easily correct a defective sealing portion.
本発明者は、鋭意検討をした結果、特定の軟化点を示す熱可塑性の接着剤が、化学研磨液の浸入を防ぐ封止効果を十分に有することを見出し、さらに封止材として、ガラス基板間に配置されているディスプレイ素子を損傷しない条件での使用可能であることを見出し、本発明を完成した。 As a result of intensive studies, the present inventors have found that a thermoplastic adhesive exhibiting a specific softening point has a sufficient sealing effect to prevent infiltration of a chemical polishing liquid, and further, as a sealing material, a glass substrate The present invention has been completed by finding that it can be used in a condition that does not damage the display element disposed therebetween.
すなわち、第1発明は、熱溶解型の接着剤からなる封止材を60℃以上に加熱して、その粘度が300〜800mPa・sになるよう溶融させる第1工程と、2枚のガラス基板間にディスプレイ素子を配置してなる貼合せガラス基板の周縁側面に形成される間隙に、第1工程で溶融された封止材を帯状に設ける第2工程と、その後、固化された前記封止材を再度溶融させるよう再加熱する第3工程と、前記第3工程の後、冷却固化された前記封止材によって前記周縁側面が封止された前記貼合せガラス基板の外表面を、フッ酸を含有する化学研磨液と接触させガラス基板の外表面を研磨し、前記貼合せガラス基板を所定の厚さまで薄くする第4工程と、を含んで製造されるフラットパネルディスプレイの製造方法である。ここで熱溶解型とは、例えば、室温硬化型、加熱硬化型、感圧型、再湿型、熱溶解型(感熱型)に区分される接着剤のうち、熱溶解型の接着剤(ホットメルト接着剤)を意味する。なお、接着剤は、狭義に解されるものではなく、所定の封止効果を発揮する接着性を有するものを全て含む。 That is, the first invention, a sealing material made of hot melt type adhesive is heated to 60 ° C. or higher, a first step of its viscosity to melt so that the 300~800mPa · s, 2 glass substrates A second step in which the sealing material melted in the first step is provided in a band shape in the gap formed on the peripheral side surface of the laminated glass substrate having a display element disposed therebetween, and then the solidified sealing A third step of reheating so as to melt the material again , and after the third step, the outer surface of the bonded glass substrate whose peripheral side surface is sealed by the cooled and solidified sealing material is hydrofluoric acid. polishing the outer surface of the glass substrate is contacted with the chemical polishing solution containing a fourth step and method of manufacturing a flat panel display manufactured Nde including a thinning of the glass laminate substrate to a predetermined thickness. Here, the hot melt type is, for example, a hot melt type adhesive (hot melt type) among adhesives classified into a room temperature curing type, a heat curing type, a pressure sensitive type, a rewet type, and a thermal melting type (heat sensitive type). Adhesive). In addition, an adhesive agent is not understood in a narrow sense, but contains all what has the adhesiveness which exhibits a predetermined sealing effect.
いずれにしても、本発明の接着剤は、熱可塑性の接着剤であって、加熱により溶融し、冷却により固化して接着する。本発明の接着剤は、熱可塑性であるので、固化後再加熱により再度溶融させることができ、封止不良箇所の修復を行うこともできる。そのため、必要最小限の封止材の使用量で足り、製造コストが低減化されるだけでなく、化学研磨後にエッジが生じることも防止できる。 In any case, the adhesive of the present invention is a thermoplastic adhesive, which melts by heating and solidifies and adheres by cooling. Since the adhesive of the present invention is thermoplastic, it can be melted again by reheating after solidification, and a defective sealing portion can be repaired. Therefore, the minimum required amount of sealing material is sufficient, and not only the manufacturing cost is reduced, but also the occurrence of an edge after chemical polishing can be prevented.
本発明の封止材の軟化点は、好ましくは60℃以上100℃未満、更に好ましくは65℃以上90℃未満、最適には65℃以上85℃未満である。軟化点が60℃未満の場合は、化学研磨工程で十分な封止効果を発揮できない場合がある。また、軟化点が高すぎると封止処理の作業性を損なう。ここで、軟化点とは、JAI(日本接着剤工業会規格)−7の記載に準じた条件で、環球法により測定した値である。好ましくは、自動軟化点測定機を使用して測定される。 The softening point of the sealing material of the present invention is preferably 60 ° C. or higher and lower than 100 ° C., more preferably 65 ° C. or higher and lower than 90 ° C., and most preferably 65 ° C. or higher and lower than 85 ° C. When the softening point is less than 60 ° C., a sufficient sealing effect may not be exhibited in the chemical polishing step. If the softening point is too high, the workability of the sealing process is impaired. Here, the softening point is a value measured by the ring-and-ball method under the conditions described in JAI (Japan Adhesive Industry Association Standard) -7. Preferably, it is measured using an automatic softening point measuring machine.
本発明の接着剤は、好ましくは、溶融温度180℃における溶融粘度が650mPa・s以下(より好ましくは400mPa・s以下)であり、溶融温度80℃における溶融粘度が300mPa・s以上(より好ましくは400mP・s以上)である。測定方法は、JAI−7に準じ、Brook Field形自動粘度計を用いて溶融粘度を計測する(スピンドルNo. 27,回転数10rpm)。本発明の封止材は、溶融した状態でガラス基板の周縁に接着されるが、溶融温度180℃における溶融粘度が650mPa・sを越える場合には、所望の溶融粘度を得るために加熱した場合に、内部のディスプレイ素子が破損されるおそれがある。一方、溶融温度80℃における溶融粘度が300mPa・s未満であると、化学研磨工程などの処理温度域で必要な封止性能を発揮できない可能性がある。 The adhesive of the present invention preferably has a melt viscosity at a melting temperature of 180 ° C. of 650 mPa · s or less (more preferably 400 mPa · s or less), and a melt viscosity at a melting temperature of 80 ° C. of 300 mPa · s or more (more preferably). 400 mP · s or more). The measurement method is according to JAI-7, and the melt viscosity is measured using a Brook Field type automatic viscometer (spindle No. 27, rotation speed 10 rpm). The sealing material of the present invention is bonded to the periphery of the glass substrate in a molten state, but when the melt viscosity at a melting temperature of 180 ° C. exceeds 650 mPa · s, when heated to obtain a desired melt viscosity In addition, the internal display element may be damaged. On the other hand, if the melt viscosity at a melting temperature of 80 ° C. is less than 300 mPa · s, there is a possibility that the necessary sealing performance cannot be exhibited in a processing temperature range such as a chemical polishing step.
本発明の封止材は、封止処理の作業性及び封止材の浸透性の観点から、溶融した状態の粘度としては、200〜1000mPa・s、好ましくは300〜800mPa・s、更に好ましくは350〜650mPa・sの範囲で行われる。粘度が低すぎると封止材がガラス基板に深く浸入して、ガラス基板の周縁を最適に封止できない。 The sealing material of the present invention has a melt viscosity of 200 to 1000 mPa · s, preferably 300 to 800 mPa · s, more preferably, from the viewpoint of workability of the sealing process and the permeability of the sealing material. It is performed in the range of 350 to 650 mPa · s. If the viscosity is too low, the sealing material penetrates deeply into the glass substrate, and the periphery of the glass substrate cannot be optimally sealed.
本発明の封止材として用いられるホットメルト接着剤としては、パラフィンワックス等のパラフィン系物質、又は、熱可塑性樹脂などの合成樹脂を含むものが好ましく例示される。 Preferred examples of the hot melt adhesive used as the sealing material of the present invention include those containing a paraffinic material such as paraffin wax or a synthetic resin such as a thermoplastic resin.
ここで用いられるパラフィン系物質としては、減圧蒸留留出油や減圧蒸留残渣油、重質留出油から分離精製した石油ワックスや天然ワックス、これらに樹脂、特に熱可塑性樹脂等を配合した配合品等が挙げられる。熱可塑性樹脂としては、エチレン・酢酸ビニル共重合体等の合成樹脂、石油樹脂、これらの変性物等を挙げることができる。 Examples of paraffinic substances used here include vacuum wax distillation oil, vacuum distillation residue oil, petroleum wax and natural wax separated and refined from heavy distillate oil, and blended products containing these resins, especially thermoplastic resins, etc. Etc. Examples of the thermoplastic resin include synthetic resins such as ethylene / vinyl acetate copolymer, petroleum resins, and modified products thereof.
第2発明は、2枚のガラス基板間にディスプレイ素子を配置してなる貼合せガラス基板の周縁側面に、熱溶解型の接着剤からなる封止材を軟化させることなく載置する載置工程と、前記載置工程で載置された前記封止材について、その粘度が300〜800mPa・sになるよう加熱溶解させて前記周縁側面の隙間に浸入させる加熱工程と、前記加熱工程の後、冷却固化された前記封止材によって前記周縁側面が封止された前記貼合せガラス基板の外表面を、フッ酸を含有する化学研磨液と接触させガラス基板の外表面を研磨し、前記貼合せガラス基板を所定の厚さまで薄くする研磨工程と、を含んで製造されるフラットパネルディスプレイの製造方法である。 2nd invention is the mounting process which mounts on the peripheral side surface of the bonding glass substrate formed by arrange | positioning a display element between two glass substrates, without softening the sealing material which consists of a hot melt type adhesive agent. And, with respect to the sealing material placed in the previous placing step, after the heating step, the heating step of dissolving the heat so that the viscosity is 300 to 800 mPa · s and entering the gap on the peripheral side surface , The outer surface of the bonded glass substrate whose peripheral side surface is sealed by the cooled and solidified sealing material is brought into contact with a chemical polishing liquid containing hydrofluoric acid to polish the outer surface of the glass substrate, and the bonding a polishing step for thinning the glass substrate to a predetermined thickness, a comprise manufacturing method of a flat panel display that is producing.
何れの発明でも、FPD製造用の封止材は、貼合せガラス基板(2枚のガラス基板)の周縁に生じる間隙に帯状に設けられる。封止材を設ける位置は、貼合せガラス基板の表裏の外側表面を含まない側面が好ましい。封止材の幅は狭い方が好ましいが、一方、狭すぎると十分な封止効果が得られにくくなるので、両者の兼ね合いで適当な幅が決められる。 In any of the inventions, the sealing material for manufacturing the FPD is provided in a band shape in the gap generated at the peripheral edge of the laminated glass substrate (two glass substrates). The side where the sealing material is provided does not include the outer surfaces of the front and back surfaces of the laminated glass substrate. The width of the sealing material is preferably narrow, but on the other hand, if it is too narrow, it becomes difficult to obtain a sufficient sealing effect, so an appropriate width is determined by the balance between the two.
第1の発明では、加熱して溶融させた封止材に、貼合せガラス基板を所定の深さだけディップ(浸漬)し、ガラス基板の間隙に溶融した封止材を浸入させる方法を例示することができる。ディップ方式を採る場合には、貼合せガラス基板の側面を除いた、表裏の外側表面をマスキング処理して、貼合せガラス基板の側面のみに封止材を設けるのが好ましい。 In the first aspect of the invention, the sealing material is melted by heating, illustrates a method of dip the glass laminate substrate by a predetermined depth (immersion), Ru is penetrating the sealing material which is melted in the gap between the glass substrate can do. When the dip method is adopted, it is preferable to mask the outer surfaces of the front and back surfaces except for the side surfaces of the laminated glass substrate, and to provide the sealing material only on the side surfaces of the laminated glass substrate.
第1発明の方法として、直立させた貼合せガラス基板の上側の周縁側面に、溶融した封止材を塗布するのも好適である。この場合、塗布作業には、周縁側面の間隙に向けて、溶融した封止材を緩やかに吐出させるのが好ましい。また、封止材の塗布工程の後に、封止材を再加熱する工程を設ける。この場合、貼合せガラス基板の4辺に同様の処理が繰り返されるが、1辺ごとに塗布処理と再加熱処理とを連続させても良いし、4辺の塗布作業を終えてから、改めて各4辺に対して再加熱処理を実行しても良い。 As a method of the first invention , it is also preferable to apply a molten sealing material to the upper peripheral side surface of the upright laminated glass substrate. In this case, it is preferable that the molten sealing material is slowly discharged toward the gap on the peripheral side surface during the coating operation. Moreover, the process of reheating a sealing material is provided after the application | coating process of a sealing material. In this case, the same process is repeated on the four sides of the laminated glass substrate, but the coating process and the reheating process may be continued for each side, and after finishing the coating process on the four sides, each process is repeated. You may perform a reheating process with respect to 4 sides.
第2発明では、例えば、幅の狭い帯状、或いは、所定太さの糸状(断面は丸形又は角形)に形成した封止材を貼合せガラス基板の周縁側面に載置し、加熱溶解させてガラス基板の間隙に浸入させた後、固化させる。 In the second invention, for example, a sealing material formed in a narrow band shape or a thread shape having a predetermined thickness (the cross section is round or square) is placed on the peripheral side surface of the laminated glass substrate , and heated and dissolved. After entering the gap between the glass substrates, it is solidified.
上記した何れの方法を採った場合でも、研磨工程に先立って、貼合せガラス基板の周縁側面に存在する封止材を削り取る切除工程を設けても良い。この場合には、化学研磨処理によってガラス基板が如何に薄型化されても、残存する封止材がエッジを形成することがない。但し、このような切除工程を設けなくても、細い帯状の封止材を用いたり、必要に応じて再加熱工程を設けることで、貼合せガラス基板の周縁側面に余分な封止材を残さないことは可能である。 Even when any of the above-described methods is employed, an excision step of scraping off the sealing material present on the peripheral side surface of the bonded glass substrate may be provided prior to the polishing step. In this case, no matter how thin the glass substrate is by chemical polishing, the remaining sealing material does not form an edge. However, even without such a cutting step, an extra sealing material is left on the peripheral side surface of the laminated glass substrate by using a thin strip-shaped sealing material or by providing a reheating step as necessary. It is possible not to.
このようにして貼合せガラス基板の周縁を封止材で封止した後、前記ガラス基板の外表面を、化学研磨液と接触させガラス基板の外表面を研磨し、ガラス基板を所定の厚さまで薄くする。化学研磨液と接触させる方法としては、ガラス基板を化学研磨液に浸漬する、ガラス基板の外表面に化学研磨液を塗布する等の方法を挙げることができる。 After sealing the periphery of the laminated glass substrate with a sealing material in this way, the outer surface of the glass substrate is brought into contact with a chemical polishing liquid to polish the outer surface of the glass substrate, and the glass substrate is made to a predetermined thickness. make it thin. Examples of the method of bringing into contact with the chemical polishing liquid include a method of immersing the glass substrate in the chemical polishing liquid or applying the chemical polishing liquid to the outer surface of the glass substrate.
化学研磨液としては、フッ酸を必須のエッチング成分として含有するフッ酸水等が挙げられ、好適には1〜45重量%、より好適には1〜35重量%、更に好適には1〜25重量%の濃度範囲で使用される。フッ酸濃度が45重量%を上回るとエッチング速度が速くなりすぎて、エッチングされたガラス部分の平坦性が悪くなる弊害が生じる。一方、フッ酸濃度が1重量%を下回ると、エッチング速度が遅くなりすぎて、エッチングに要する時間が長くなる。 Examples of the chemical polishing liquid include hydrofluoric acid water containing hydrofluoric acid as an essential etching component, preferably 1 to 45% by weight, more preferably 1 to 35% by weight, and still more preferably 1 to 25%. Used in a concentration range of weight percent. If the concentration of hydrofluoric acid exceeds 45% by weight, the etching rate becomes too fast, resulting in a problem that the flatness of the etched glass portion is deteriorated. On the other hand, when the hydrofluoric acid concentration is less than 1% by weight, the etching rate becomes too slow and the time required for etching becomes long.
フッ酸に加えて塩酸、硫酸、硝酸及びリン酸から選ばれる少なくとも1種以上の無機酸を含有してもよい。又、エッチングにより生じた珪フッ化物等の反応生成物がガラス基板上に付着するのを防止する観点から、フッ酸に加えてカルボン酸系、フェノール系、アミド系、脂肪酸エステル系、リン酸エステル系、硫酸エステル系、スルホン酸系、アミン系、エーテル系、高分子アルコールから選ばれる少なくとも1種以上の界面活性剤を含有してもよい。研磨速度としては、特に限定されないが、通常0.5〜10μm/分程度で行われる。 In addition to hydrofluoric acid, it may contain at least one inorganic acid selected from hydrochloric acid, sulfuric acid, nitric acid and phosphoric acid. In addition to hydrofluoric acid, carboxylic acid, phenolic, amide, fatty acid ester, and phosphoric acid ester are added in addition to hydrofluoric acid from the viewpoint of preventing reaction products such as silicofluoride generated by etching from adhering to the glass substrate. It may contain at least one surfactant selected from a system, a sulfate ester system, a sulfonic acid system, an amine system, an ether system, and a polymer alcohol. Although it does not specifically limit as a grinding | polishing speed | rate, Usually, it carries out at about 0.5-10 micrometers / min.
このようにして各ガラス基板の外表面を研磨して貼合せガラス基板を所定の厚さにした後、洗浄水で洗浄されてFPDが得られる。 Thus, after polishing the outer surface of each glass substrate to make the laminated glass substrate have a predetermined thickness, the FPD is obtained by washing with washing water.
本発明のFPD製造用封止材を用いFPDを構成するガラス基板間の間隙の封止を行った場合、従来のUV硬化樹脂の場合と同様、化学研磨液の浸入を防ぐ封止効果を十分に有する。又、この封止材は、貼合せガラス基板で挟持されているディスプレイ素子に損傷を与えることのない条件での使用が可能である。さらに、安価な材料よりこの封止材を得ることができ、又、熱可塑性の接着剤からなるので、封止不良箇所が発生しても、再加熱により、その修正を容易にすることができる。 When the gap between the glass substrates constituting the FPD is sealed using the FPD manufacturing sealing material of the present invention, the sealing effect is sufficiently prevented to prevent the chemical polishing liquid from entering, as in the case of the conventional UV curable resin. Have. Moreover, this sealing material can be used on the conditions which do not damage the display element clamped by the bonding glass substrate. Furthermore, this sealing material can be obtained from an inexpensive material, and since it is made of a thermoplastic adhesive, it can be easily corrected by reheating even if a sealing failure occurs. .
次に、本発明を実施するための最良の形態を、実施例を用いて説明するが、実施例は、本発明の範囲を限定するものではなく、本発明の趣旨を損なわない範囲で、他の形態に変更したものも、本発明の範囲に含まれる。 Next, the best mode for carrying out the present invention will be described with reference to examples. However, the examples do not limit the scope of the present invention, and are not limited to the scope of the present invention. What was changed into this form is also included in the scope of the present invention.
1.ガラス基板の貼り合わせ
2枚のガラス基板(大きさ:50mm×50mm、厚さ:0.7mm)を、テープのりを用いて、ガラス基板間に約10μmの間隙が生じるように、貼り合わせた(以下、貼合せ基板と言う)。
2.封止作業
マスキングテープを約1cm幅にカットし、図1に示すように、前記貼合せ基板の外周部の1辺の両表面に、端面の位置にマスキングテープの端を合わせて貼る。(両面とも約1cmずつはみ出した状態にする。なお、はみ出した部分のテープは互いに接着されるが、作図の都合上、図1では非接着に記載している。)
下記の封止材をホットプレートにて表1に示す溶融粘度になるように加熱して溶融し、その封止材中に、マスキングテープが貼られた一辺を、表1に示す条件(時間)でディップする。その後、空冷により室温まで冷却して封止材を固化した後、両側に約1cmずつはみ出した部分をカットし、さらに基板に貼り付けていたマスキングテープを剥がす。
1. Bonding of glass substrates Two glass substrates (size: 50 mm × 50 mm, thickness: 0.7 mm) were bonded using a tape glue so that a gap of about 10 μm was generated between the glass substrates ( Hereinafter referred to as a bonded substrate).
2. Sealing operation The masking tape is cut to a width of about 1 cm, and as shown in FIG. 1, the edges of the masking tape are attached to both surfaces of one side of the outer peripheral portion of the bonded substrate so that the edges of the masking tape are aligned. (Both sides are protruded by about 1 cm. Note that the protruding tapes are bonded to each other, but for convenience of drawing, they are described as non-bonded in FIG. 1.)
The following sealing material is heated and melted on a hot plate so as to have the melt viscosity shown in Table 1, and the side where the masking tape is stuck in the sealing material is shown in Table 1 (time). Dip with Then, after cooling to room temperature by air cooling and solidifying a sealing material, the part which protruded about 1 cm at a time on both sides is cut, and also the masking tape stuck on the board | substrate is peeled off.
以上の作業を、残りの3辺についても同様に行い、貼り合わせ基板の4辺を封止して、封止済ガラス基板を得た。その後、封止不良箇所の有無を目視にて観察した。その結果を表1に示す。
[封止材]
1)封止材A
軟化点80℃
2)封止材B
軟化点65℃
The above operation was similarly performed for the remaining three sides, and the four sides of the bonded substrate were sealed to obtain a sealed glass substrate. Then, the presence or absence of the sealing defect location was observed visually. The results are shown in Table 1.
[Encapsulant]
1) Sealing material A
Softening point 80 ℃
2) Sealing material B
Softening point 65 ° C
なお、温度測定は、アルコール温度計及び赤外放射温度計を用いて行った。 The temperature was measured using an alcohol thermometer and an infrared radiation thermometer.
表1に示す結果より明らかなように、封止材Aを使用した場合は、溶融粘度650mPa・s、ディップ時間 約9秒の条件で、問題なくガラス基板の周縁を封止することができた。又、封止材Bを使用した場合は、溶融粘度350mPa・s、ディップ時間 約6秒の条件で、問題なくガラス基板の周縁を封止することができた。
3.研磨工程
前記の封止済み及び剥離済ガラス基板(ガラスの総厚:0.7mm×2=1.4mm)を、キャリアにセットし、下記の条件で、総厚が0.3mmとなるまで研磨した。その後、封止材の状態、液浸入の有無を目視にて確認した。その結果、及び研磨に要した時間(研磨時間)を表2に示す。
As is apparent from the results shown in Table 1, when the sealing material A was used, the periphery of the glass substrate could be sealed without any problems under the conditions of a melt viscosity of 650 mPa · s and a dip time of about 9 seconds. . Further, when the sealing material B was used, the periphery of the glass substrate could be sealed without any problems under the conditions of a melt viscosity of 350 mPa · s and a dip time of about 6 seconds.
3. Polishing Step The above-described sealed and peeled glass substrate (total thickness of glass: 0.7 mm × 2 = 1.4 mm) is set on a carrier and polished until the total thickness becomes 0.3 mm under the following conditions. did. Thereafter, the state of the sealing material and the presence or absence of liquid intrusion were visually confirmed. Table 2 shows the results and the time required for polishing (polishing time).
実験の研磨条件にて、2時間53分かけて板厚を総厚1.4mmから0.3mmまで研磨したが、封止材A、封止材Bのいずれを用いた場合も、目視による変化はなく、液浸入もなかった。
4.封止材の接着力の比較実験
UV硬化性樹脂と本発明の封止材の接着力を比較するため、以下に示す実験条件、手順の実験を行った。その結果を表3に示す。
1)実験条件
ガラス基板: 50×50×0.7mmt
封止材 :(1)封止材A
(2)UV硬化性樹脂(従来品)
測定機器:push−pull scale
2)実験手順
[封止材Aの接着力の測定]
a.ガラス基板に封止材Aを0.05g乗せ、ホットプレート上で溶融させる。
b.図2に示すように、底部面積約0.9cm2のクリップを溶けた封止材の上に乗せる。
c.室温に戻してから、更に約5分間放置して封止材を完全に硬化させる。
d.クリップのホックにpush−pull scaleを接続する。
e.ガラス基板を固定して、手動で引き上げ、封止材が剥がれた時の測定値を確認する。同様の操作を繰り返しその平均を求めた。
[UV硬化性樹脂の接着力の測定]
a.ガラス基板にUV硬化性樹脂を0.05g乗せ、図2のように、底部面積約0.9cm2のクリップを溶けた封止材の上に乗せる。
b.約15分間UV照射を行い、封止材を完全に硬化させる。
c.クリップのホックにpush−pull scaleを接続する。
d.ガラス基板を固定して、手動で引き上げ、封止材が剥がれた時の測定値を確認する。同様の操作を5回繰り返しその平均を求めた。
Under the polishing conditions of the experiment, the plate thickness was polished from 1.4 mm to 0.3 mm over 2 hours and 53 minutes. However, when either the sealing material A or the sealing material B was used, the change was visually observed. There was no liquid intrusion.
4). Comparative Experiment of Adhesive Strength of Sealing Material In order to compare the adhesive strength between the UV curable resin and the sealing material of the present invention, the following experimental conditions and procedures were performed. The results are shown in Table 3.
1) Experimental conditions Glass substrate: 50 × 50 × 0.7 mmt
Sealing material: (1) Sealing material A
(2) UV curable resin (conventional product)
Measuring instrument: push-pull scale
2) Experimental procedure [Measurement of adhesive strength of sealing material A]
a. 0.05 g of the sealing material A is placed on a glass substrate and melted on a hot plate.
b. As shown in FIG. 2, a clip having a bottom area of about 0.9 cm 2 is placed on the melted sealing material.
c. After returning to room temperature, it is allowed to stand for about 5 minutes to completely cure the sealing material.
d. Connect a push-pull scale to the clip hook.
e. A glass substrate is fixed, it pulls up manually, and the measured value when a sealing material peels is confirmed. The same operation was repeated and the average was obtained.
[Measurement of adhesive strength of UV curable resin]
a. 0.05 g of UV curable resin is placed on a glass substrate, and a clip having a bottom area of about 0.9 cm 2 is placed on the melted sealing material as shown in FIG.
b. UV irradiation is performed for about 15 minutes to completely cure the encapsulant.
c. Connect a push-pull scale to the clip hook.
d. A glass substrate is fixed, it pulls up manually, and the measured value when a sealing material peels is confirmed. The same operation was repeated 5 times and the average was obtained.
本発明のホットメルト接着剤である封止材Aを使用した場合の接着力は、従来の封止材であるUV硬化性樹脂を使用した場合の接着力とほぼ同等であり、約70Nであった。封止材Bについても封止材Aより劣るものの、ほぼ満足できる結果が得られた。 The adhesive strength when using the sealing material A, which is the hot melt adhesive of the present invention, is almost equivalent to the adhesive strength when using the UV curable resin, which is a conventional sealing material, and is about 70 N. It was. Although the sealing material B was inferior to the sealing material A, almost satisfactory results were obtained.
また、封止材Aについては、ディップ温度を変更して溶融粘度500〜800mPa・s程度に変化させ、また封止材Bについては、ディップ温度を変更して溶融粘度300〜500mPa・s程度に変化させて同様の実験を行ったが、全ての性能において上記と、あまり遜色のない結果が得られた。 For the sealing material A, the dip temperature is changed to change the melt viscosity to about 500 to 800 mPa · s. For the sealing material B, the dip temperature is changed to about 300 to 500 mPa · s. The same experiment was carried out by changing, but the results were not inferior to the above in all performances.
Claims (4)
2枚のガラス基板間にディスプレイ素子を配置してなる貼合せガラス基板の周縁側面に形成される間隙に、第1工程で溶融された封止材を帯状に設ける第2工程と、
その後、固化された前記封止材を再度溶融させるよう再加熱する第3工程と、
前記第3工程の後、冷却固化された前記封止材によって前記周縁側面が封止された前記貼合せガラス基板の外表面を、フッ酸を含有する化学研磨液と接触させガラス基板の外表面を研磨し、前記貼合せガラス基板を所定の厚さまで薄くする第4工程と、
を含んで製造されるフラットパネルディスプレイの製造方法。 A first step of heating a sealing material composed of a heat-dissolving adhesive to 60 ° C. or higher and melting it so that its viscosity is 300 to 800 mPa · s ;
A second step in which the sealing material melted in the first step is provided in a band shape in the gap formed on the peripheral side surface of the laminated glass substrate in which the display element is disposed between the two glass substrates;
Thereafter, a third step of reheating so as to melt the solidified sealing material again ,
After the third step, the outer surface of the bonded glass substrate whose peripheral side surface is sealed by the cooled and solidified sealing material is brought into contact with a chemical polishing liquid containing hydrofluoric acid, thereby the outer surface of the glass substrate. And a fourth step of thinning the laminated glass substrate to a predetermined thickness;
Method of manufacturing a flat panel display manufactured Nde including a.
前記載置工程で載置された前記封止材について、その粘度が300〜800mPa・sになるよう加熱溶解させて前記周縁側面の隙間に浸入させる加熱工程と、
前記加熱工程の後、冷却固化された前記封止材によって前記周縁側面が封止された前記貼合せガラス基板の外表面を、フッ酸を含有する化学研磨液と接触させガラス基板の外表面を研磨し、前記貼合せガラス基板を所定の厚さまで薄くする研磨工程と、
を含んで製造されるフラットパネルディスプレイの製造方法。 A placing step of placing a sealing material made of a heat-melting adhesive on the peripheral side surface of a laminated glass substrate in which a display element is disposed between two glass substrates without softening;
About the sealing material placed in the previous placing step, a heating step in which the viscosity is 300 to 800 mPa · s and is dissolved by heating so as to enter the gap on the peripheral side surface ;
After the heating step, the outer surface of the bonded glass substrate whose peripheral side surface is sealed by the cooled and solidified sealing material is brought into contact with a chemical polishing liquid containing hydrofluoric acid to thereby change the outer surface of the glass substrate. A polishing step for polishing and thinning the laminated glass substrate to a predetermined thickness;
Method of manufacturing a flat panel display that is comprise produce.
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JP2006169618A JP4246758B2 (en) | 2006-06-20 | 2006-06-20 | Manufacturing method of FPD |
TW096117410A TW200801152A (en) | 2006-06-20 | 2007-05-16 | Fabricating method of FPD |
KR1020070051333A KR20070120880A (en) | 2006-06-20 | 2007-05-28 | Fabricating method of fpd |
SG200703946-4A SG138535A1 (en) | 2006-06-20 | 2007-05-30 | Method of producing flat panel display |
CN 200710108782 CN101093306A (en) | 2006-06-20 | 2007-05-31 | Manufacturing method of FPD |
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