CN104661491A - Rapid heat dissipation plate and manufacturing method thereof - Google Patents
Rapid heat dissipation plate and manufacturing method thereof Download PDFInfo
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- CN104661491A CN104661491A CN201310603266.0A CN201310603266A CN104661491A CN 104661491 A CN104661491 A CN 104661491A CN 201310603266 A CN201310603266 A CN 201310603266A CN 104661491 A CN104661491 A CN 104661491A
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Abstract
The invention discloses a rapid heat dissipation plate and further discloses a method for manufacturing the rapid heat dissipation plate. The method comprises the following steps: preparing a heat conduction metal plate and a low-heat-conduction adhesive, uniformly coating one surface of the heat conduction metal plate with the low-heat conduction adhesive, and then baking and foaming, so as to manufacture the rapid heat dissipation plate. According to the rapid heat dissipation plate disclosed by the invention, the structural design is ingenious and reasonable, the heat conduction metal plate and the low-heat conduction adhesive piece are creatively combined, and on the basis of ensuring rapid heat dissipation, a hot spot region is eliminated, thereby ensuring comfortability in use; furthermore, the rapid heat dissipation plate has relatively good bending processability, is conveniently processed into the structure of any size and shape, has a wide application range, effectively solves the problems that since a graphite piece is adopted in the prior art, powder falling and fracture occur easily to affect the appearance and the use and ensures the quality of a product. The method provided by the invention is simple in process, and by adopting the method, the rapid heat dissipation plate can be rapidly produced, the production period is greatly shortened, and the production efficiency is improved, the whole manufacturing process is simple, easiness in implementation and low cost are achieved, and the quality of the product is effectively ensured.
Description
Technical field
The present invention relates to heating panel technology, particularly a kind of quick heat radiating plate and preparation method thereof.
Background technology
Along with the acceleration of the continuous upgrading of electronic product, high integrated and high performance electronics growing, work package volume size is more and more less, and speed and the efficiency of work are more and more higher, and caloric value is increasing.At present, known metal species heat conduction and heat radiation assembly has been subjected to the restriction of its material and self heat conduction and heat radiation limit, the heat conduction and heat radiation material of advanced heat conduction and heat radiation technique and excellent performance must be adopted to be defined as away heat, to ensure effective work of its electronic product.
In prior art, for accelerating heat-conducting effect, usually adopting high-thermal conductive metal material to make, although it reaches the effect of quick heat radiating, there is comparatively significantly hot spot region, make the use of people bring discomfort, serious, also there will be and scald people's phenomenon.For this reason, people research and develop a kind of graphite heat conducting heat sink material, because distinctive low-density (relative to metal species) and high heat conduction and heat radiation coefficient and low thermal resistance become the preferred material that hyundai electronics series products solves heat conduction and heat radiation technology, there is the effect of uniform heat conduction heat radiation simultaneously.
During use, in order to better dispel the heat, be surface graphite heat conducting and heat radiating fin being bonded in the object needing heat radiation under normal circumstances.Traditional adhesive method is bondd by graphite heat conducting and heat radiating fin with glue, this bonding mode operation more complicated, and need specifically when boning to carry out operation, so likely causes the unstable problem of the uneven bonding brought of glue.Meanwhile, due to the characteristic that graphite is frangible, sometimes need the surperficial binding metal sheet at graphite, this brings complicated operation, the bonding problem such as loosely equally.
For the composite graphite heat conducting radiation fins bondd with glue, because be uneven by the result of glue bonding, easily come off, and heatproof is low, at high temperature easily volatilization loses bond effect.
Summary of the invention
For above-mentioned deficiency, one of the object of the invention is, provides a kind of reasonable in design, ingenious, can uniform heat conduction heat radiation, eliminates hot spot region, and rapid heat dissipation, the quick heat radiating plate that handled easily is installed.
The present invention also aims to, provide a kind of method making above-mentioned quick heat radiating plate, the production process of the method is succinct, and be easy to realize, cost is low, can produce quick heat radiating plate fast.
For achieving the above object, the technical scheme provided is in the present invention:
A kind of quick heat radiating plate, it comprises thermal conductivity values and is greater than the low heat conduction adhesive sheet that the thermal conductive metal plate of 120W/mK and thermal conductivity values be less than 0.2W/mK, and this low heat conduction adhesive sheet and described thermal conductive metal plate fit.
As a modification of the present invention, the thickness of described thermal conductive metal plate is 0.001 ~ 0.2mm, and the thickness of described low heat conduction adhesive sheet is 0.003 ~ 0.15mm.
As a modification of the present invention, described thermal conductive metal plate is adopt copper, aluminium, one of in gold, silver or the lamellar body made of its alloy material.
As a modification of the present invention, the composition mass percent of described low heat conduction adhesive sheet is: acrylate glue 1% ~ 99%, Foamex 1% ~ 99%.
Make a method for above-mentioned quick heat radiating plate, it comprises the following steps:
(1) thermal conductive metal plate that thermal conductivity values is greater than 120W/mK is prepared;
(2) low heat conduction viscose glue is prepared;
(3) low heat conduction viscose glue is evenly coated in one of thermal conductive metal plate on the surface;
(4) thermal conductive metal plate being coated with low heat conduction viscose glue is moved to baking oven and carry out baking action, to form the low heat conduction adhesive sheet that a thermal conductivity values is less than 0.2W/mK on this thermal conductive metal plate, obtained quick heat radiating plate.
As a modification of the present invention, it is further comprising the steps of: contacted with the heater that need dispel the heat by thermal conductive metal plate, low heat conduction adhesive sheet is contacted with thermal component, the heat conduction produced during heater work is to described thermal conductive metal plate, and quickly diffuse to full wafer thermal conductive metal plate, heat on this thermal conductive metal plate to thermal component through described low heat conduction adhesive sheet uniform conductive, is then distributed by this thermal component, reaches the object of rapid diffusion, Homogeneouslly-radiating.
As a modification of the present invention, the thickness of described thermal conductive metal plate is 0.001 ~ 0.2mm, and this thermal conductive metal plate is adopt copper, aluminium, one of in gold, silver or the lamellar body made of its alloy material.
As a modification of the present invention, described step (2) specifically comprises the following steps:
(2.1) preparing material: the composition mass percent of raw material is: acrylate glue 1% ~ 99%, Foamex 1% ~ 99%;
(2.2) mix: acrylate glue is mixed mutually with Foamex, and stirs, obtained low heat conduction viscose glue.
As a modification of the present invention, described step (4) specifically comprises the following steps:
(4.1) thermal conductive metal plate being coated with low heat conduction viscose glue is moved to baking oven and carry out baking action, the baking temperature of this baking oven is set as 60 ~ 210 DEG C;
(4.2) in bake process, the low heat conduction viscose glue be coated on thermal conductive metal plate starts foaming, solidification, and it is 0.003 ~ 0.15mm that this thermal conductive metal plate is formed a thickness, and thermal conductivity values is less than the low heat conduction adhesive sheet of 0.2W/mK, obtained quick heat radiating plate.
As a modification of the present invention, described low heat conduction adhesive sheet has tack, and the adhesion strength of this low heat conduction adhesive sheet is 0.5g/25mm ~ 5kg/25mm.
Beneficial effect of the present invention is: smart structural design of the present invention, rationally, thermal conductive metal plate and low heat conduction adhesive sheet combine by innovation, the heat conduction produced during heater work is to described thermal conductive metal plate, and quickly diffuse to full wafer thermal conductive metal plate, heat on this thermal conductive metal plate through described low heat conduction adhesive sheet uniform conductive to thermal component, then distributed by this thermal component, reach the object of rapid diffusion, Homogeneouslly-radiating, on the basis ensureing quick heat radiating, eliminate hot spot region, improve the performance of electronic product, ensure that use is comfortable; And there is good bendability, conveniently be processed into arbitrary dimension and shape and structure, the scope of application is wide, effectively solves tradition and adopts graphite flake easily to occur dry linting, fracture, affects outward appearance and uses phenomenon to occur, ensure product quality, improve stability and the reliability of fin, effectively the traditional assembly process of reduction, manufacturing process is few, labour intensity is low thus to realize cost low, and percent defective is low; The consumer electronics field such as mobile phone, notebook computer, flat-panel monitor, portable projector, Digital Video and personal assistant devices LCD, PDP, DVD can be widely used in.The operation of method provided by the invention is succinct, can produce quick heat radiating plate fast, greatly shorten the production cycle, enhance productivity, and whole production process is succinct, is easy to realization, cost is low and effectively ensures product quality.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Embodiment
Embodiment: see Fig. 1, the embodiment of the present invention provides a kind of quick heat radiating plate, and it comprises thermal conductivity values and is greater than the low heat conduction adhesive sheet 2 that the thermal conductive metal plate 1 of 120W/mK and thermal conductivity values be less than 0.2W/mK, and this low heat conduction adhesive sheet 2 fits with described thermal conductive metal plate 1.The thickness of described thermal conductive metal plate 1 is 0.001 ~ 0.2mm, and the thickness of described low heat conduction adhesive sheet 2 is 0.003 ~ 0.15mm.Described thermal conductive metal plate 1 is adopt copper, aluminium, one of in gold, silver or the lamellar body made of its alloy material.The composition mass percent of described low heat conduction adhesive sheet 2 is: acrylate glue 1% ~ 99%, Foamex 1% ~ 99%.
Smart structural design of the present invention, rationally, thermal conductive metal plate 1 and low heat conduction adhesive sheet 2 combine by innovation, the heat conduction produced during heater work is to described thermal conductive metal plate 1, and quickly diffuse to full wafer thermal conductive metal plate 1, heat on this thermal conductive metal plate 1 through described low heat conduction adhesive sheet 2 uniform conductive to thermal component, then distributed by this thermal component, reach the object of rapid diffusion, Homogeneouslly-radiating, on the basis ensureing quick heat radiating, eliminate hot spot region, improve the performance of electronic product, ensure that use is comfortable; And there is good bendability, conveniently be processed into arbitrary dimension and shape and structure, the scope of application is wide, effectively solves tradition and adopts graphite flake easily to occur dry linting, fracture, affects outward appearance and uses phenomenon to occur, ensure product quality, improve stability and the reliability of fin, effectively the traditional assembly process of reduction, manufacturing process is few, labour intensity is low thus to realize cost low, and percent defective is low; The consumer electronics field such as mobile phone, notebook computer, flat-panel monitor, portable projector, Digital Video and personal assistant devices LCD, PDP, DVD can be widely used in.
Make a method for above-mentioned quick heat radiating plate, it comprises the following steps:
(1) thermal conductive metal plate 1 that thermal conductivity values is greater than 120W/mK is prepared; The thickness of described thermal conductive metal plate 1 is 0.001 ~ 0.2mm, and this thermal conductive metal plate 1 is adopt copper, aluminium, one of in gold, silver or the lamellar body made of its alloy material.
(2) low heat conduction viscose glue is prepared; Described step (2) specifically comprises the following steps: (2.1) preparing material: the composition mass percent of raw material is: acrylate glue 1% ~ 99%, Foamex 1% ~ 99%; (2.2) mix: acrylate glue is mixed mutually with Foamex, and stirs, obtained low heat conduction viscose glue.
(3) low heat conduction viscose glue is evenly coated in one of thermal conductive metal plate 1 on the surface;
(4) thermal conductive metal plate 1 being coated with low heat conduction viscose glue is moved to baking oven and carry out baking action, to form the low heat conduction adhesive sheet 2 that a thermal conductivity values is less than 0.2W/mK on this thermal conductive metal plate 1, obtained quick heat radiating plate.Described step (4) specifically comprises the following steps: the thermal conductive metal plate 1 being coated with low heat conduction viscose glue is moved to baking oven and carries out baking action by (4.1), and the baking temperature of this baking oven is set as 60 ~ 210 DEG C; (4.2) in bake process, the low heat conduction viscose glue be coated on thermal conductive metal plate 1 starts foaming, solidification, and it is 0.003 ~ 0.15mm that this thermal conductive metal plate 1 is formed a thickness, and thermal conductivity values is less than the low heat conduction adhesive sheet 2 of 0.2W/mK, obtained quick heat radiating plate.
(5) thermal conductive metal plate 1 is contacted with the heater that need dispel the heat, low heat conduction adhesive sheet 2 is contacted with thermal component, the heat conduction produced during heater work is to described thermal conductive metal plate 1, and quickly diffuse to full wafer thermal conductive metal plate 1, heat on this thermal conductive metal plate 1 through described low heat conduction adhesive sheet 2 uniform conductive to thermal component, then distributed by this thermal component, reach the object of rapid diffusion, Homogeneouslly-radiating.
Described low heat conduction adhesive sheet 2 has tack, and the adhesion strength of this low heat conduction adhesive sheet 2 is 0.5g/25mm ~ 5kg/25mm.
The operation of method provided by the invention is succinct, can produce quick heat radiating plate fast, greatly shorten the production cycle, enhance productivity, and whole production process is succinct, is easy to realization, cost is low and effectively ensures product quality.
In the present embodiment, described thermal conductive metal plate 1 is preferably the lamellar body adopting copper product to make.In other embodiment, described thermal conductive metal plate 1 can one of for adopting aluminium, in gold, silver or the lamellar body made of its alloy material.Certainly, the lamellar body that other thermal conductivity values also can be adopted to be greater than the metal of 120W/mK or nonmetallic materials make.
In concrete production process, the thickness of thermal conductivity that can be required and low heat conduction adhesive sheet 2 carrys out the mass percent between corresponding adjustment adjustment acrylate glue and Foamex.
During use, because product quick heat radiating plate of the present invention has good bendability, respective shapes size can be processed according to required form.Then by the thermal conductive metal plate 1 on product quick heat radiating plate of the present invention towards the heater that need dispel the heat, and make thermal conductive metal plate and the heater close contact that need dispel the heat, by low heat conduction adhesive sheet and thermal component close contact, the heat conduction produced during heater work is to described thermal conductive metal plate, and quickly diffuse to full wafer thermal conductive metal plate, heat on this thermal conductive metal plate through described low heat conduction adhesive sheet uniform conductive to thermal component, then distributed by this thermal component, reach the object of rapid diffusion, Homogeneouslly-radiating.On the basis ensureing quick heat radiating, eliminate hot spot region, improve the performance of electronic product, ensure that use is comfortable.
The announcement of book and instruction according to the above description, those skilled in the art in the invention can also change above-mentioned execution mode and revise.Therefore, the present invention is not limited to embodiment disclosed and described above, also should fall in the protection range of claim of the present invention modifications and changes more of the present invention.In addition, although employ some specific terms in this specification, these terms just for convenience of description, do not form any restriction to the present invention.
Claims (10)
1. a quick heat radiating plate, is characterized in that, it comprises thermal conductivity values and is greater than the low heat conduction adhesive sheet that the thermal conductive metal plate of 120W/mK and thermal conductivity values be less than 0.2W/mK, and this low heat conduction adhesive sheet and described thermal conductive metal plate fit.
2. quick heat radiating plate according to claim 1, is characterized in that, the thickness of described thermal conductive metal plate is 0.001 ~ 0.2mm, and the thickness of described low heat conduction adhesive sheet is 0.003 ~ 0.15mm.
3. quick heat radiating plate according to claim 1 and 2, is characterized in that, described thermal conductive metal plate is adopt copper, aluminium, one of in gold, silver or the lamellar body made of its alloy material.
4. quick heat radiating plate according to claim 1 and 2, is characterized in that, the composition mass percent of described low heat conduction adhesive sheet is: acrylate glue 1% ~ 99%, Foamex 1% ~ 99%.
5. make a method for the described quick heat radiating plate of one of claim 1-4, it is characterized in that, it comprises the following steps:
(1) thermal conductive metal plate that thermal conductivity values is greater than 120W/mK is prepared;
(2) low heat conduction viscose glue is prepared;
(3) low heat conduction viscose glue is evenly coated in one of thermal conductive metal plate on the surface;
(4) thermal conductive metal plate being coated with low heat conduction viscose glue is moved to baking oven and carry out baking action, to form the low heat conduction adhesive sheet that a thermal conductivity values is less than 0.2W/mK on this thermal conductive metal plate, obtained quick heat radiating plate.
6. method according to claim 5, is characterized in that, it is further comprising the steps of:
(5) thermal conductive metal plate is contacted with the heater that need dispel the heat, low heat conduction adhesive sheet is contacted with thermal component, the heat conduction produced during heater work is to described thermal conductive metal plate, and quickly diffuse to full wafer thermal conductive metal plate, heat on this thermal conductive metal plate through described low heat conduction adhesive sheet uniform conductive to thermal component, then distributed by this thermal component, reach the object of rapid diffusion, Homogeneouslly-radiating.
7. method according to claim 5, is characterized in that, the thickness of described thermal conductive metal plate is 0.001 ~ 0.2mm, and this thermal conductive metal plate is adopt copper, aluminium, one of in gold, silver or the lamellar body made of its alloy material.
8. method according to claim 2, is characterized in that, described step (2) specifically comprises the following steps:
(2.1) preparing material: the composition mass percent of raw material is: acrylate glue 1% ~ 99%, Foamex 1% ~ 99%;
(2.2) mix: acrylate glue is mixed mutually with Foamex, and stirs, obtained low heat conduction viscose glue.
9. method according to claim 5, is characterized in that, described step (4) specifically comprises the following steps:
(4.1) thermal conductive metal plate being coated with low heat conduction viscose glue is moved to baking oven and carry out baking action, the baking temperature of this baking oven is set as 60 ~ 210 DEG C;
(4.2) in bake process, the low heat conduction viscose glue be coated on thermal conductive metal plate starts foaming, solidification, and it is 0.003 ~ 0.15mm that this thermal conductive metal plate is formed a thickness, and thermal conductivity values is less than the low heat conduction adhesive sheet of 0.2W/mK, obtained quick heat radiating plate.
10. making heat spreader approach according to claim 5, is characterized in that, described low heat conduction adhesive sheet has tack, and the adhesion strength of this low heat conduction adhesive sheet is 0.5g/25mm ~ 5kg/25mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310603266.0A CN104661491A (en) | 2013-11-25 | 2013-11-25 | Rapid heat dissipation plate and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310603266.0A CN104661491A (en) | 2013-11-25 | 2013-11-25 | Rapid heat dissipation plate and manufacturing method thereof |
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| CN104661491A true CN104661491A (en) | 2015-05-27 |
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| CN201310603266.0A Pending CN104661491A (en) | 2013-11-25 | 2013-11-25 | Rapid heat dissipation plate and manufacturing method thereof |
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- 2013-11-25 CN CN201310603266.0A patent/CN104661491A/en active Pending
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Application publication date: 20150527 |