CN101857797A - Carbon-based composite heat dissipation material and preparation method and application thereof - Google Patents
Carbon-based composite heat dissipation material and preparation method and application thereof Download PDFInfo
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- CN101857797A CN101857797A CN201010187223A CN201010187223A CN101857797A CN 101857797 A CN101857797 A CN 101857797A CN 201010187223 A CN201010187223 A CN 201010187223A CN 201010187223 A CN201010187223 A CN 201010187223A CN 101857797 A CN101857797 A CN 101857797A
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- dissipation material
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Abstract
The invention relates to the technical field of heat dissipation materials, in particular to a carbon-based composite heat dissipation material and a preparation method and application thereof. The carbon-based composite heat dissipation material is characterized by consisting of a carbon-based material and metal particles; and according to the formula, the carbon-based composite heat dissipation material comprises over 82 weight percent of carbon-based material and below 18 weight percent of metal copper, aluminum, gold, silver or tin. Compared with the prior art, the material has the advantages of simple process, high economy, high heat conductivity and high processability, can be applied to LED heat dissipation substrates, semiconductor heat dissipation components and various rectification and heat dissipation fields, and is prepared by blanking natural graphite and then compounding the blank and metal ions; the volume density and strength of the composite material are improved by combining metal; and the composite material is suitable for manufacturing radiating fins of a semiconductor device LED and a semiconductor device heat radiator, can be repeatedly used, is made of carbon and causes no pollution to the environment.
Description
Technical field
The present invention relates to the heat sink material technical field, is a kind of carbon-based composite heat dissipation material and its production and use specifically.
Background technology
The high-end electronic industry device of China (for example high power density electron device) develops to compact in size, compact constructionization, function diversification, high power density direction at present, the heat dissipation problem of Yin Faing has badly influenced the job stability and the reliability of high power electronic device thus, therefore, the heat that produces in its operational process is strengthened to derive with diffusing have higher requirement.Thermal control part used on these electron devices generally adopts metallic substance such as aluminium, copper, silver, but, such material not only thermal conductivity is low, and quality is heavy, thermal expansivity is big etc., greatly limited its being extensive use of as the electron device package heat sink material, so the type material that research and development light weight, thermal conductivity is high is significant for the miniaturization that realizes parts, device lightweight and operation high efficiency.
For this reason, people have developed new carbon back heat sink material, overcome the problem that quality is heavy, thermal expansivity is big of metallic substance.During use, usually carbon back heat sink material and metallic substance are carried out compoundly according to certain proportioning, the compound carbon back heat sink material that obtains is used to replace existing heat dissipation metal material.But the thermal conductivity of the carbon back heat sink material of prior art is still waiting to improve.
Therefore, this area presses for the compound carbon back heat sink material that the high novel carbon back heat sink material of a kind of light weight, thermal conductivity and this carbon back heat sink material and metal composite obtain.
Summary of the invention
Be to overcome the deficiencies in the prior art order of the present invention, a kind of light weight, novel carbon-based composite heat dissipation material that thermal conductivity is high and its production and use are provided.
For achieving the above object, design a kind of carbon-based composite heat dissipation material, it is characterized in that carbon-based material and metallics constitute carbon-based composite heat dissipation material, described formulation weight per-cent: the carbon-based material of carbon content more than 82%, the metallic copper below 18%, aluminium, gold and silver or tin.
Described preparation method's step is as follows: than the allotment powder mixture, described powder mixture particle diameter is below the 2.0mm to a. by above-mentioned weight counterweight; B. described powder mixture is suppressed, made block blank; C. block blank is carried out roasting, make the roasting blank; D. described roasting blank carries out graphitization processing, obtains the graphite blank; E. metallic copper, aluminium, gold and silver or tin being dissolved the back adopts high pressure method to be pressed into the graphite blank, described high pressure method is meant puts into mould with graphite, the metal liquid of molten state is poured among the mould then, the effect of pressing down, make liquid metal internal voids with higher speed filling graphite block under temperature, and under pressure, solidify, thereby obtain the plain matrix material of charcoal.
Described carbon-based composite heat dissipation material heat transfer direction is controlled, Z-direction thermal conductivity 300w/m.k-450w/m.k, and the X/Y car is by thermal conductivity 50w/m.k-200w/m.k.
Described carbon-based composite heat dissipation material resistivity≤5 μ Ω m.
Described carbon-based composite heat dissipation material thermal expansivity is 1.29 * 10
-6/ ℃.
Described carbon-based composite heat dissipation material volume density is 2.0-5.9g/cm3.
Described carbon-based composite heat dissipation material ultimate compression strength is 56-115Mpa, and folding strength is 40-80Mpa.
Described carbon-based composite heat dissipation material is applied to cooling electronic component field, LCD LCD TV heat radiation backboard, the luminous heat-radiating substrate of LED, power rectifier triode heating panel, computer CPU radiator.
The present invention compared with prior art, preparation technology is simple, has good and economic, have high thermal conductivity and good workability, can be applicable to LED heat-radiating substrate and semiconductor heat-dissipating parts and various rectification heat radiation field, by constituting with metal ion is compound behind the natural graphite base, volume density and intensity with metal in conjunction with the raising matrix material, be suitable for making radiator element and the heat radiator for semiconductor part of semiconducter device LED, can reuse, form by carbon, can not produce any pollution environment.
Embodiment
The invention will be further described below in conjunction with specific embodiment.
Carbon-based material and metallics constitute carbon-based composite heat dissipation material, described formulation weight per-cent: the carbon-based material of carbon content more than 82%, the metallic copper below 18%, aluminium, gold and silver or tin.
Preparation method's step is as follows: than the allotment powder mixture, described powder mixture particle diameter is below the 2.0mm to a. by above-mentioned weight counterweight; B. described powder mixture is suppressed, made block blank; C. block blank is carried out roasting, make the roasting blank; D. described roasting blank carries out graphitization processing, obtains the graphite blank; E. metallic copper, aluminium, gold and silver or tin being dissolved the back adopts high pressure method to be pressed into the graphite blank.
Carbon-based composite heat dissipation material heat transfer direction is controlled, Z-direction thermal conductivity 300w/m.k-450w/m.k, and the X/Y car is by thermal conductivity 50w/m.k-200w/m.k.
Carbon-based composite heat dissipation material resistivity≤5 μ Ω m.
The carbon-based composite heat dissipation material thermal expansivity is 1.29 * 10
-6/ ℃.
The carbon-based composite heat dissipation material volume density is 2.0-5.9g/cm3.
Carbon-based composite heat dissipation material ultimate compression strength is 56-115Mpa, and folding strength is 40-80Mpa.
The carbon-based composite heat dissipation material environmental pollution is identified through SGS, meets the electronic product industry standard, does not contain any lead, mercury, cadmium, sexavalent chrome, Polybrominated biphenyl and six kinds of objectionable impuritiess of polybromodiphenyl ether.
Compound carbon back heat sink material of the present invention can apply to the cooling electronic component field.
For example, be used for following field:
(1) LCD LCD TV heat radiation backboard
LCD LCD TV heat radiation backboard application requiring: amount is light, good, the dimensionally stable of thermal diffusivity, easily processing.The present invention meets the demands fully with its superior performance.
(2) the luminous heat-radiating substrate of LED
The luminous heat-radiating substrate application requiring of LED: good, the easy processing of thermal diffusivity, low, the dimensionally stable of cost.The present invention satisfies its application requiring equally.
(3) power rectifier triode heating panel: good, the easy processing of thermal diffusivity, low, the dimensionally stable of cost.The present invention satisfies its application requiring equally.
(4) computer CPU radiator: good, the easy processing of thermal diffusivity, low, the dimensionally stable of cost.The present invention satisfies its application requiring equally.
Claims (8)
1. a carbon-based composite heat dissipation material is characterized in that carbon-based material and metallics constitute carbon-based composite heat dissipation material, described formulation weight per-cent: the carbon-based material of carbon content more than 82%, the metallic copper below 18%, aluminium, gold and silver or tin.
2. the preparation method of a carbon-based composite heat dissipation material is characterized in that described preparation method's step is as follows: than the allotment powder mixture, described powder mixture particle diameter is below the 2.0mm to a. by above-mentioned weight counterweight; B. described powder mixture is suppressed, made block blank; C. block blank is carried out roasting, make the roasting blank; D. described roasting blank carries out graphitization processing, obtains the graphite blank; E. metallic copper, aluminium, gold and silver or tin being dissolved the back adopts high pressure method to be pressed into the graphite blank, described high pressure method is meant puts into mould with graphite, the metal liquid of molten state is poured among the mould then, the effect of pressing down, make liquid metal internal voids with higher speed filling graphite block under temperature, and under pressure, solidify, thereby obtain the plain matrix material of charcoal.
3. a kind of carbon-based composite heat dissipation material as claimed in claim 1 or 2 is characterized in that described carbon-based composite heat dissipation material heat transfer direction is controlled, Z-direction thermal conductivity 300w/m.k-450w/m.k, X/Y axle thermal conductivity 50w/m.k-200w/m.k.
4. a kind of carbon-based composite heat dissipation material as claimed in claim 1 or 2 is characterized in that described carbon-based composite heat dissipation material resistivity≤5 μ Ω m.
5. a kind of carbon-based composite heat dissipation material as claimed in claim 1 or 2 is characterized in that described carbon-based composite heat dissipation material thermal expansivity is 1.29 * 10
-6/ ℃.
6. a kind of carbon-based composite heat dissipation material as claimed in claim 1 or 2 is characterized in that described carbon-based composite heat dissipation material volume density is 2.0-5.9g/cm3.
7. a kind of carbon-based composite heat dissipation material as claimed in claim 1 or 2 is characterized in that described carbon-based composite heat dissipation material ultimate compression strength is 56-115Mpa, and folding strength is 40-80Mpa.
8. the purposes of a carbon-based composite heat dissipation material is characterized in that described carbon-based composite heat dissipation material is applied to cooling electronic component field, LCD LCD TV heat radiation backboard, the luminous heat-radiating substrate of LED, power rectifier triode heating panel, computer CPU radiator.
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| CN201010187223A CN101857797A (en) | 2010-05-31 | 2010-05-31 | Carbon-based composite heat dissipation material and preparation method and application thereof |
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| CN201010187223A CN101857797A (en) | 2010-05-31 | 2010-05-31 | Carbon-based composite heat dissipation material and preparation method and application thereof |
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| CN101857797A true CN101857797A (en) | 2010-10-13 |
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| CN201010187223A Pending CN101857797A (en) | 2010-05-31 | 2010-05-31 | Carbon-based composite heat dissipation material and preparation method and application thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105899053A (en) * | 2016-06-23 | 2016-08-24 | 柯良节 | Graphene radiating thin film |
| CN108290353A (en) * | 2015-11-24 | 2018-07-17 | 西格里碳素欧洲公司 | For molten metal or the shaping jig of glass |
| CN108800079A (en) * | 2017-04-27 | 2018-11-13 | 神华集团有限责任公司 | A kind of radiator |
| CN114438365A (en) * | 2021-12-22 | 2022-05-06 | 厦门凯纳石墨烯技术股份有限公司 | High-thermal-conductivity carbon-based metal composite heat dissipation material and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1944698A (en) * | 2006-10-24 | 2007-04-11 | 北京科技大学 | Super high heat conduction, low heat expansion coefficient composite material and its preparing method |
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2010
- 2010-05-31 CN CN201010187223A patent/CN101857797A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1944698A (en) * | 2006-10-24 | 2007-04-11 | 北京科技大学 | Super high heat conduction, low heat expansion coefficient composite material and its preparing method |
Non-Patent Citations (2)
| Title |
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| 师昌绪等: "《材料科学与工程手册 下 第9篇 复合材料篇》", 31 January 2004 * |
| 王启立等: "《炭-石墨多孔材料制备工艺中的逾渗研究》", 《润滑与密封》 * |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108290353A (en) * | 2015-11-24 | 2018-07-17 | 西格里碳素欧洲公司 | For molten metal or the shaping jig of glass |
| CN105899053A (en) * | 2016-06-23 | 2016-08-24 | 柯良节 | Graphene radiating thin film |
| CN105899053B (en) * | 2016-06-23 | 2019-02-01 | 深圳天元羲王材料科技有限公司 | A kind of graphene heat dissipation film |
| CN108800079A (en) * | 2017-04-27 | 2018-11-13 | 神华集团有限责任公司 | A kind of radiator |
| CN108800079B (en) * | 2017-04-27 | 2024-04-02 | 国家能源投资集团有限责任公司 | Radiator |
| CN114438365A (en) * | 2021-12-22 | 2022-05-06 | 厦门凯纳石墨烯技术股份有限公司 | High-thermal-conductivity carbon-based metal composite heat dissipation material and preparation method thereof |
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Application publication date: 20101013 |