CN105899053A - Graphene radiating thin film - Google Patents
Graphene radiating thin film Download PDFInfo
- Publication number
- CN105899053A CN105899053A CN201610457854.1A CN201610457854A CN105899053A CN 105899053 A CN105899053 A CN 105899053A CN 201610457854 A CN201610457854 A CN 201610457854A CN 105899053 A CN105899053 A CN 105899053A
- Authority
- CN
- China
- Prior art keywords
- thin film
- graphene
- graphite
- heat radiation
- radiation thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 71
- 229910021389 graphene Inorganic materials 0.000 title claims abstract description 32
- 239000010409 thin film Substances 0.000 title claims abstract description 29
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 38
- 239000010439 graphite Substances 0.000 claims abstract description 38
- 229910021645 metal ion Inorganic materials 0.000 claims abstract description 23
- 230000005855 radiation Effects 0.000 claims abstract description 23
- 239000010408 film Substances 0.000 claims description 16
- 239000000853 adhesive Substances 0.000 claims description 14
- 230000001070 adhesive effect Effects 0.000 claims description 14
- 229910052782 aluminium Inorganic materials 0.000 claims description 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 14
- 239000003292 glue Substances 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 6
- 238000009826 distribution Methods 0.000 abstract description 2
- 150000002500 ions Chemical class 0.000 description 10
- 238000000576 coating method Methods 0.000 description 9
- 239000002270 dispersing agent Substances 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 4
- 230000005291 magnetic effect Effects 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 230000005292 diamagnetic effect Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000005408 paramagnetism Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000001149 thermolysis Methods 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- VTLYFUHAOXGGBS-UHFFFAOYSA-N Fe3+ Chemical compound [Fe+3] VTLYFUHAOXGGBS-UHFFFAOYSA-N 0.000 description 1
- 239000011469 building brick Substances 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229910001447 ferric ion Inorganic materials 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000001471 micro-filtration Methods 0.000 description 1
- 238000009856 non-ferrous metallurgy Methods 0.000 description 1
- 230000005298 paramagnetic effect Effects 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000001223 reverse osmosis Methods 0.000 description 1
- 239000010865 sewage Substances 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
- 238000000108 ultra-filtration Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Abstract
The invention discloses a graphene radiating thin film. The radiating thin film is prepared from graphite, graphene and metal ions. A vertical and horizontal graphene distribution pattern is formed by the combination of the graphene and the metal ions in order to achieve the all-around radiation and thermal conduction effects, so that the graphene radiating thin film has a good radiating effect.
Description
Technical field
The invention belongs to the technical field of film, the heat radiation thin film made particularly to Graphene.
Background technology
Film, as a kind of covering, it is widely used in our daily life, development along with technology, the membrane technologies such as ultrafiltration, microfiltration, the reverse osmosis engineer applied scale in fields such as electricity power, nonferrous metallurgy, desalinization, Water purification, reusing sewage and medicine foods expands rapidly, and membrane technology has obtained great application.
But, owing to film is generally of seal, its heat sinking function receives limitation, and common membrane structure, substantially without any radiating effect, only distributes heat energy by faint surface.
Summary of the invention
For solving the problems referred to above, the primary and foremost purpose of the present invention is to provide a kind of Graphene heat radiation thin film, and this heat radiation thin film not only has good coverage effect, also has extraordinary radiating effect.
The primary and foremost purpose of the present invention is to provide a kind of Graphene heat radiation thin film, and this heat-dissipating film structure is stable, can be widely applied to various place.
For achieving the above object, technical scheme is as follows.
A kind of Graphene heat radiation thin film, it is characterised in that this heat radiation thin film is made up of graphite, Graphene and metal ion.
Described graphite, Graphene and metal ion, constituted according to the weight ratio of 1000:50-100:1-5.
Described heat radiation thin film, has farther included adhesive glue, aluminum film, and described adhesive glue is coated on aluminum film, and the mixture of described graphite, Graphene and metal ion covers above adhesive glue, is fixed on aluminum film by adhesive glue.
Graphite, adds the dilute lattice material of the graphite with metal ion, is mixed to prepare thermal dispersant coatings, be subsequently adding be stained with rubber alloy be coated on aluminum diaphragm just complete dispel the heat thin film.
Described metal ion, for ferrum and the chelating ion of copper.
Described Graphene, is the grapheme material of 60 layers.
Further, described ferrum and the chelating ion of copper, account for the 5% optimal of Graphene weight, say, that the chelating ion of ferrum and copper and the weight ratio of Graphene are that 5:100 is best.
Manufacture magnetic graphite dilute, mainly with paramagnetism and diamagnetic metal ion in lattice.Apply the chelating ion state species of ferrum and copper in terms of preparation, penetrated in graphite lattice.With the dilute material of the graphite of 60 layers, after preparing, when being mixed with graphite and adhesive glue, during being coated on aluminum film, flow out coating fluid plus magnetic force pipeline, just can draw cross type heat radiation thin film.
Because chelates ferric ions is diamagnetic, copper chelating ion is paramagnetic.Under the attraction of north and south Magnet, the graphite with ferrum copper ion lattice is dilute, can form the thermolysis indulging away direction.Then thin film can reach the thermolysis moved towards in length and breadth.
Therefore, the present invention utilizes the dilute combination with metal ion of graphite, forms the Graphene Distribution Pattern of cross type, to reach to dispel the heat and conductive force comprehensively, thus has good radiating effect.
And, this heat-dissipating film structure is stable, can be widely applied to various place.
Accompanying drawing explanation
Fig. 1 is implemented the structural representation of heat radiation thin film by the present invention.
Detailed description of the invention
In order to make the purpose of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
Think in many scientific appraisals；Graphite is blocks of sheet-like state, so the electron stream of graphite and heat transfer type are all horizontal ways to get there ... and the outwards conduction ratio of longitudinal way to get there is the most much smaller.Traditional graphite not only cannot function as heat sink material, uses as insulation material often.
Studying discovery through inventor, the heat dissipation direction of graphite is horizontal feature, and longitudinal aspect will lean on the supplementing with metal ion lattice that graphite is dilute, can make cross type all sidedly and dispel the heat and conductive force comprehensively.
Therefore, the example that the present invention is implemented, as it can be seen, this Graphene heat radiation thin film, includes three layers, and one layer 1 is thermal dispersant coatings, and this thermal dispersant coatings is made up of graphite, Graphene and metal ion；Two layer 2 is adhesive glue, and three layer 3 is aluminum film.
Adhesive glue 2 is coated on aluminum film 3, and the thermal dispersant coatings 1 that the mixture of graphite, Graphene and metal ion is formed covers above adhesive glue 2, is fixed on aluminum film 3 by adhesive glue 2.
Generally, graphite, Graphene and metal ion, constitute according to the weight ratio of 1000:50-100:1-5.
Graphene, is the grapheme material of 60 layers.Metal ion, for ferrum and the chelating ion of copper.Graphite, the most nano level graphite powder.
Thus, graphite, add the dilute lattice material of the graphite with metal ion, be mixed to prepare thermal dispersant coatings, be subsequently adding be stained with rubber alloy be coated on aluminum diaphragm just complete dispel the heat thin film.
Ferrum and the chelating ion of copper, account for the 5% optimal of Graphene weight, say, that the chelating ion of ferrum and copper and the weight ratio of Graphene are that 5:100 is best.
When making, in the graphite of per kilogram, add the lattice material gained that the graphite with metal ion of 50g is dilute, wherein metal ion is the metal ion of Chelating state, its consumption is 5:100 with the weight ratio of Graphene, preparing thermal dispersant coatings 1, thermal dispersant coatings 1 adds adhesive glue 2 and is coated on aluminum film 3 and just completes, and prepares heat radiation thin film.
Manufacture magnetic graphite dilute, mainly with paramagnetism and diamagnetic metal ion in lattice.Apply the chelating ion state species of ferrum and copper in terms of preparation, penetrated in graphite lattice.With the dilute material of the graphite of 60 layers, the copper ferrum chelating ion of application about hundred parts five proportioning proper.After preparing, be mixed with graphite and when being stained with rubber alloy, be coated on aluminum thin upper during flow out coating fluid plus magnetic force pipeline, just can show that cross type dispels the heat thin film.
Therefore, utilizing the high and resistant to elevated temperatures characteristic of heat transfer rate of graphite, the present invention produces the conducting membranes of province's heat-dissipating space, to help the electronic building brick of limited space to dispel the heat.Tiny and light and handy due to the volume of heat radiation thin film again, it is particularly well-suited between the heat radiation on LED illuminating lamp and equipment topic.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all any amendment, equivalent and improvement etc. made within the spirit and principles in the present invention, should be included within the scope of the present invention.
Claims (6)
1. a Graphene heat radiation thin film, it is characterised in that this heat radiation thin film is made up of graphite, Graphene and metal ion.
2. graphite dilute heat radiation thin film as claimed in claim 1, it is characterised in that described graphite, Graphene and metal ion, is constituted according to the weight ratio of 1000:50-100:1-5.
3. graphite dilute heat radiation thin film as claimed in claim 1, it is characterized in that described heat radiation thin film, farther included adhesive glue, aluminum film, described adhesive glue is coated on aluminum film, the mixture of described graphite, Graphene and metal ion covers above adhesive glue, is fixed on aluminum film by adhesive glue.
4. graphite dilute heat radiation thin film as claimed in claim 1, it is characterised in that described metal ion, for ferrum and the chelating ion of copper.
5. graphite dilute heat radiation thin film as claimed in claim 1, it is characterised in that described Graphene, is the grapheme material of 60 layers.
6. graphite dilute heat radiation thin film as claimed in claim 4, it is characterised in that the chelating ion of ferrum and copper and the weight ratio of Graphene are 5:100.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610457854.1A CN105899053B (en) | 2016-06-23 | 2016-06-23 | A kind of graphene heat dissipation film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610457854.1A CN105899053B (en) | 2016-06-23 | 2016-06-23 | A kind of graphene heat dissipation film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105899053A true CN105899053A (en) | 2016-08-24 |
| CN105899053B CN105899053B (en) | 2019-02-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610457854.1A Active CN105899053B (en) | 2016-06-23 | 2016-06-23 | A kind of graphene heat dissipation film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105899053B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106432777A (en) * | 2016-09-28 | 2017-02-22 | 常德鑫睿新材料有限公司 | Composite electroconductive thin film for electromagnetic shielding and preparation method thereof |
| CN106531902A (en) * | 2016-11-16 | 2017-03-22 | 广州宏庆电子有限公司 | Extremely-thin flexible heat-radiation film and method for manufacturing the same |
| WO2019109200A1 (en) * | 2017-12-04 | 2019-06-13 | 东旭集团有限公司 | Upper substrate for miniature led component, miniature led component, and miniature led display device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101857797A (en) * | 2010-05-31 | 2010-10-13 | 许长新 | Carbon-based composite heat dissipation material and preparation method and application thereof |
| CN103449421A (en) * | 2013-08-23 | 2013-12-18 | 上海第二工业大学 | Preparation method of heat conduction and insulation graphene oxide paper |
| CN203537732U (en) * | 2013-11-06 | 2014-04-09 | 中国科学院宁波材料技术与工程研究所 | Graphene heat radiation film |
| CN203590668U (en) * | 2013-11-26 | 2014-05-07 | 昆山汉品电子有限公司 | Composite cooling film |
| CN104582428A (en) * | 2013-10-25 | 2015-04-29 | 加川清二 | Heat-dissipating film, and its production method and apparatus |
-
2016
- 2016-06-23 CN CN201610457854.1A patent/CN105899053B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101857797A (en) * | 2010-05-31 | 2010-10-13 | 许长新 | Carbon-based composite heat dissipation material and preparation method and application thereof |
| CN103449421A (en) * | 2013-08-23 | 2013-12-18 | 上海第二工业大学 | Preparation method of heat conduction and insulation graphene oxide paper |
| CN104582428A (en) * | 2013-10-25 | 2015-04-29 | 加川清二 | Heat-dissipating film, and its production method and apparatus |
| CN203537732U (en) * | 2013-11-06 | 2014-04-09 | 中国科学院宁波材料技术与工程研究所 | Graphene heat radiation film |
| CN203590668U (en) * | 2013-11-26 | 2014-05-07 | 昆山汉品电子有限公司 | Composite cooling film |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106432777A (en) * | 2016-09-28 | 2017-02-22 | 常德鑫睿新材料有限公司 | Composite electroconductive thin film for electromagnetic shielding and preparation method thereof |
| CN106531902A (en) * | 2016-11-16 | 2017-03-22 | 广州宏庆电子有限公司 | Extremely-thin flexible heat-radiation film and method for manufacturing the same |
| WO2019109200A1 (en) * | 2017-12-04 | 2019-06-13 | 东旭集团有限公司 | Upper substrate for miniature led component, miniature led component, and miniature led display device |
| US11545607B2 (en) | 2017-12-04 | 2023-01-03 | Tunghsu Group Co., Ltd. | Upper substrate for miniature LED component, miniature LED component, and miniature LED display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105899053B (en) | 2019-02-01 |
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Effective date of registration: 20181206 Address after: Guangdong city of Shenzhen province Qianhai Shenzhen Hong Kong cooperation zone before Bay Road No. 1 building 201 room A (located in Shenzhen Qianhai business secretary Co. Ltd.) Applicant after: Shenzhen Tianyuan Xi Wang Mstar Technology Ltd Address before: Room 5, 10/F, Fengli Industrial Centre, 1 Huotan Suihe Road, Shatian, Hong Kong, China Applicant before: Ke Liangjie |
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