JP2005057149A - Electric component module and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electric component module which can be easily manufactured with the use of an usual circuit board, capable of sufficiently cooling the electric component with a Peltier element, and causing no setback for a miniaturization of the device. <P>SOLUTION: The electric component module comprises the usual circuit board 1 generally and widely used, a Peltier element 2 housed in a hole 1a provided in the board 1, the electric component 3 arranged on a cooling side board 2a of the Peltier element 2 through a heat conductive sheet 5, and a metal heatsink 4 fixed on a rear side of the board 1 through an insulating layer 6 and arranged on the heat radiating side board 2b of the Peltier element 2 through the heat conductive sheet 5. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an electrical component module including an electrical component and a circuit board and a manufacturing method thereof, and more particularly, to an electrical component module including an electrical component that is desired to avoid the influence of heat and a manufacturing method thereof.

  Conventionally, various electric and electronic devices have been downsized in order to meet market demands and to differentiate the products of each company. Along with this, miniaturization and high-density arrangement of electric components in each electric and electronic device and circuit boards on which those electric components are mounted have been promoted.

  As a result, the effect of heat has become a problem in electrical components. For example, in the case of a CCD device (charge-coupled device) used for an imaging means, a defect called thermal noise occurs in an image as a result of imaging under a high temperature environment, and remarkable image quality degradation is observed particularly at 70 ° C. or higher. It is done. Such a temperature increase is often caused by heat transmitted from the outside (atmosphere temperature) or by heat generated during operation of an electrical component (for example, a CCD element) itself. The effect of heat transmitted from the outside may be eliminated by providing a heat insulating structure around the electrical component, but in order to prevent performance degradation and shortening of the life due to heat generation of the electrical component itself, the temperature of the electrical component itself is decreased. It is necessary to let

For this reason, a configuration in which a heat radiating member (such as a heat sink or a housing in which the electric component is mounted) is connected to the electric component and naturally radiated is widely adopted. However, it is difficult to secure a sufficient space for heat dissipation due to the remarkable downsizing of recent electronic and electrical devices as described above, and the amount of heat generated increases with the increase in the output of electrical components. It has become difficult to sufficiently lower the temperature of electrical components only by natural heat dissipation. Therefore, in order to forcibly cool the electrical components, there are cases where a water cooling structure using a chilled water pipe and a pump or an air cooling structure using a fan is used.
JP 7-153997 A (full text) JP-A-8-97472 (Claim 19, [0059] to [0064], FIG. 4)

  The water cooling structure and the air cooling structure as described above are relatively large because a cold water pipe, a pump, and a fan are used, which hinders downsizing of electric and electronic equipment.

  Therefore, Patent Document 1 discloses an apparatus in which a printed circuit board on which an electrical component main body is mounted is made of a material that generates a Peltier effect. According to such a configuration, both a sufficient cooling effect and downsizing can be achieved.

  However, in the configuration described in Patent Document 1, since the printed circuit board is made of a material that generates the Peltier effect, a general printed circuit board that is generally widely used cannot be diverted, and is very special. A printed circuit board is used. Although the specific material and manufacturing method of such a special printed circuit board are not disclosed in Patent Document 1, the manufacturing process is very complicated and expensive compared to a normal printed circuit board. It is thought to be.

  Therefore, an object of the present invention is to provide an electrical component module that can use an existing ordinary printed circuit board and that can sufficiently cool an electrical component by a Peltier element and does not hinder downsizing of the device, and a method for manufacturing the same. There is to do.

  The electrical component module of the present invention includes a circuit board having a hole, a Peltier element housed in the hole, an electrical component disposed on the cooling side substrate of the Peltier element and electrically connected to the circuit board, It is arranged on the heat generating side substrate of the Peltier element, and at least a part has a heat radiating plate located on the surface of the circuit board opposite to the surface on which the electrical component is located. According to this configuration, the electrical component is cooled by the heat absorption effect of the cooling-side substrate of the Peltier element, and the heat generated when the electrical component is activated is canceled out and maintained at a relatively constant temperature. The heat from the heat generating side substrate of the Peltier element is naturally radiated from the heat radiating plate. The electrical component module can be easily and inexpensively manufactured using a conventional circuit board that has been widely used.

  If the hole has a planar shape smaller than the planar shape of the electrical component, the outer edge portion of the electrical component can be formed by the inner peripheral edge of the hole, particularly when the electrical component is attached to the circuit board before the Peltier element. It is preferable because it can be supported.

  Further, it is preferable that the thickness of the Peltier element is equal to or less than the thickness of the circuit board because the entire Peltier element is accommodated in the hole of the circuit board.

  When only the minimum wiring pattern necessary for electrical connection of electrical components is formed at least around the hole on the surface of the circuit board, heat is transmitted to the electrical components via a so-called solid pattern with a large area. Since this can be avoided, the cooling effect of electrical parts is high.

  If a separation groove is provided at a position surrounding the electrical component outside the hole of the circuit board, heat transmitted from the outside of the circuit board is blocked by the separation groove and prevented from being transmitted to the electrical component. High cooling effect.

  The heat radiating plate may have conductivity and electromagnetically shield the wiring of the circuit board from the outside. In that case, generation of electromagnetic noise can be suppressed, and the operation of the electric circuit including the electric parts can be made highly accurate.

  When the resin layer covering the connecting portion between the heat sink and the Peltier element is provided, it is possible to prevent the resin layer from causing dew condensation in each member due to heat absorption and heat generation of the electrical component and the Peltier element.

  If the heat radiating plate is formed integrally with the heat generating side substrate of the Peltier element, the structure becomes simple and the manufacture becomes easy.

  The method for manufacturing an electrical component module of the present invention includes a step of forming a circuit board having a hole, a step of housing a Peltier element in the hole, a step of placing an electrical component on the cooling side substrate of the Peltier element, A step of electrically connecting the electrical component to the circuit board; and a heat sink is disposed on the surface of the circuit board opposite to the surface on which the electrical component is located, and the heat sink is positioned on the heat generating side substrate of the Peltier element. And a process.

  Further, another manufacturing method of the electrical component module of the present invention includes a step of forming a circuit board having a hole, a main body having a planar shape smaller than the planar shape of the hole, and a planar shape of the hole. Manufacturing a Peltier element composed of a large-area heating side substrate, housing the Peltier element main body in the hole, and at least part of the large-area heating side substrate of the Peltier element is connected to one of the circuit boards. And a step of mounting the electrical component on the cooling side substrate of the Peltier element, and a step of electrically connecting the electrical component to the circuit board.

  In the present specification, the expressions “on the substrate” and “on the surface” do not mean the vertical direction, but are in contact with the substrate or the surface, or in close proximity to each other with another member interposed therebetween. It means that it is located.

  According to the present invention, the electrical component can be cooled by the heat absorption effect of the Peltier element in the hole of the circuit board, and the heat generated when the electrical component is operated is offset and kept at a relatively constant temperature. Accordingly, it is possible to prevent the performance degradation and the shortening of the life of the electrical component due to the temperature rise. In addition, the heat of the heat generation side substrate of the Peltier element is naturally radiated from the heat radiating plate, and the influence on the electrical components is suppressed.

  Furthermore, the electrical component module of the present invention does not use a special member such as a printed circuit board made of a material having a Peltier effect, and uses a conventional circuit board that has been widely used. It is a structure and can be manufactured easily and inexpensively.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  1 and 2 show an electrical component module according to a first embodiment of the present invention. The basic configuration of this electrical component module is a circuit board 1 that is a general printed board that is widely used in general, a Peltier element 2 housed in a hole 1a provided in the circuit board 1, and An electric component 3 mounted on the Peltier element 2 and a metal heat radiating plate 4 fixed on the back surface of the circuit board 1 (the surface opposite to the surface on which the electric component 3 is located).

  The circuit board 1 according to the present embodiment has a hole 1 a having a smaller planar shape than the electrical component 3. A Peltier element 2 is accommodated in the hole 1a. The Peltier element 2 has a known configuration, and as shown in FIG. 3, a plurality of columnar semiconductors 2c are arranged between a pair of substrates (cooling side substrate 2a and heat generation side substrate 2b). And N-type semiconductors are arranged alternately. When predetermined power is supplied to the electrodes 2d connected to these semiconductors 2c, one substrate (cooling side substrate 2a) has a cooling action, and the other substrate (heating side substrate 2b) has a heating action. Arise. FIG. 1 shows only a part of the electrodes 2d provided on the inner surfaces of the cooling side substrate 2a and the heat generation side substrate 2b.

  The electrical component 3 may be any kind of element, but the present invention is particularly effective for a CCD element or a power IC (power supply IC) for image pickup means that is likely to cause a problem of performance degradation due to heat. The electrical component 3 is fixed on the cooling side substrate 2a of the Peltier element 2 housed in the hole 1a via a heat conductive sheet 5 in the form of a double-sided adhesive tape. The leads 3a of the electrical component 3 are connected to a wiring pattern (not shown) on the surface of the circuit board 1.

  On the back surface of the circuit board 1, that is, on the surface opposite to the surface on which the electrical component 3 is located, a metal heat radiating plate 4 having a high thermal conductivity is disposed via an insulating layer 6. The heat radiating plate 4 is fixed on the heat generating side substrate 2 b of the Peltier element 2 via a heat conductive sheet 5. The insulating layer 6 is provided in order to prevent an electrical short circuit between a wiring pattern (not shown) on the back surface of the circuit board 1 and the heat radiating plate 4. Even a sheet-like insulating member is coated with insulating paint. It may be a thing. However, when the circuit board 1 is a single-sided board having no wiring pattern on the back surface, the insulating layer 6 may not be provided.

  The circuit board 1, the insulating layer 6, and the heat radiating plate 4 are provided with mounting holes 7 for fixing to each other or for mounting to other members. A screw 8 is inserted into the mounting hole 7 or an engaging projection of another member (not shown) is fitted.

  In the electric component module having such a configuration, the electric component 3 connected to a wiring pattern (not shown) of the circuit board 1 operates (for example, imaging by a CCD element is performed), and at the same time, the electrode 2d of the Peltier element 2 is predetermined. Power is supplied. Then, the cooling side substrate 2a of the Peltier element 2 absorbs heat, and the electric component 3 is cooled via the heat conductive sheet 5 by the heat absorption effect of the cooling side substrate 2a. Therefore, the heat generated during operation of the electrical component 3 is offset, and the electrical component 3 is kept at a relatively constant temperature. Therefore, it is possible to prevent deterioration and shortening of the service life due to temperature rise as in the prior art. Since the maximum heat absorption amount of each Peltier element 2 is determined in principle, it is kept constant at the minimum temperature when it is continuously driven to the maximum.

  When predetermined power is supplied to the Peltier element 2, the heat generation side substrate 2b generates heat simultaneously with the heat absorption of the cooling side substrate 2a. The heat of the heat generation side substrate 2b is naturally radiated from the heat radiating plate 4 through the heat conductive sheet 5 as in the conventional configuration. It is preferable that the insulating layer 6 has a low thermal conductivity so that the heat transmitted to the heat radiating plate 4 is not transmitted again to the circuit board 1 and the electrical component 3.

  Thus, according to the present embodiment, the electrical component 3 is forcibly cooled by the cooling effect of the Peltier element 2, and the heat from the heat generating side substrate 2b of the Peltier element 2 can be naturally radiated from the heat radiating plate 4. . Therefore, the temperature rise of the electrical component 3 can be effectively suppressed by the Peltier element 2, and the heat from the heat generating side substrate 2b of the Peltier element 2 can be released. This is a vehicle that has a CCD element and a power IC (power supply IC) for imaging means, which are electrical components that are likely to cause performance degradation due to heat, and can reach a high temperature of, for example, about 100 ° C. It is very effective in electrical and electronic equipment that can be placed inside.

  In addition, it can also be set as the structure which provides a radiation fin in the heat sink 4 and obtains the higher heat dissipation effect. The heat radiating plate 4 is made of a material having a high thermal conductivity like the conventional one.

  The electrical component module manufacturing method described above will be briefly described with reference to FIG. 4. First, the circuit board 1 having the hole 1a is formed (step S1). In this case, the hole 1a may be opened later in the completed circuit board 1, or the circuit board 1 having a shape in which the hole 1a is opened from the beginning may be manufactured.

  Next, the Peltier element 2 is accommodated in the hole 1a of the circuit board 1 (step S2). At this time, the Peltier element 2 is disposed such that the cooling side substrate 2a is positioned on the front surface side of the circuit substrate 1 (the surface side on which the electrical component 3 is disposed). Although not described in detail, the electrode 2d is connected to the wiring pattern of the circuit board 1 or other conduction means so that predetermined power can be supplied to the Peltier element 2. Further, the electrical component 3 is arranged on the cooling side substrate 2a of the Peltier element 2 via the heat conductive sheet 5 (step S3), and the lead 3a of the electrical component 3 is electrically connected to a wiring pattern (not shown) of the circuit substrate 1. (Step S4).

  Then, the heat radiating plate 4 is disposed on the back side of the circuit board 3, that is, the surface opposite to the surface on which the electrical component 3 is located via the insulating layer 6, and the heat radiating plate 4 is attached to the heat conductive sheet 5. And positioned on the heat generation side substrate 2b of the Peltier element 2 (step S5).

  In this way, the electrical component module of this embodiment is completed. In the present embodiment, the printed circuit board itself is not made of a material having the Peltier effect as in the invention described in Patent Document 1 described above, but a normal circuit board 1 that has been widely used in the past is used. It can be manufactured only by adding a simple process of forming the hole 1a in the circuit board 1 and disposing the Peltier element 2 in the hole 1a. Therefore, manufacturing is very easy and cost reduction is possible. And as above-mentioned, the temperature rise of the electrical component 3 can be suppressed.

  In addition, you may perform step S3 and S4 which arrange | position and connect the electrical component 3 prior to step S2 which accommodates the Peltier device 2 in the hole 1a. In that case, an electrical component is arranged above the position where the Peltier element 2 in the hole 1 a is to be accommodated, and the lead 3 a is connected to the circuit board 1. Thereafter, the Peltier element 2 is inserted into the hole 1a from the back side of the circuit board 1, and as a result, the electrical component 3 is placed on the cooling side board 2a. In particular, when steps S3 and S4 are performed prior to step S2, the hole 1a has a smaller planar shape than the planar shape of the electrical component 3, and is determined by the inner peripheral edge of the hole 1a. It is preferable that the outer edge portion of the electrical component 3 be supported. Further, as shown in FIG. 1, the thickness of the Peltier element 2 is preferably equal to or less than the thickness of the circuit board 1 so that the entire Peltier element 2 is accommodated in the hole 1 a of the circuit board 1. As shown in the figure, the Peltier element 2 of the present embodiment is very small. Therefore, although not specifically described here, it is effective to manufacture the Peltier element 2 using a manufacturing method described in, for example, Japanese Patent Laid-Open No. 8-97472.

  An electrical component module according to a second embodiment of the present invention will be described. In addition, the same code | symbol is provided to the part substantially the same as 1st Embodiment, and description is abbreviate | omitted. As shown in FIGS. 5 and 6, the circuit board 1 of the electrical component module of the present embodiment can be divided into an inner region 1b and an outer region 1c. That is, although not shown in detail, only the minimum wiring pattern necessary for electrical connection of the electrical component 3 is formed in the inner region 1b around the hole 1a on the surface of the circuit board 1. In addition to the necessary minimum wiring pattern, the outer region 1c is formed with a large-area conductive pattern, so-called a solid pattern, such as a power supply pattern composed of copper foil, a power supply layer, a GND layer, and a shield pattern. ing.

  Conventionally, a solid pattern as described above is generally formed on the entire circuit board in addition to the minimum necessary wiring pattern for electrical connection of electrical components. However, in the present embodiment, in order to avoid heat being transferred to the electric component 3 through the solid pattern of a large area, at least the solid pattern around the electric component 3, that is, the inner region 1 b around the hole 1 a. It is the structure which does not provide. If there is no problem in electrical wiring, the circuit board 1 may be configured so as not to have a solid pattern over the entire surface but to have only a minimum necessary wiring pattern for electrical connection of electrical components. The configuration and manufacturing method other than those described above are substantially the same as those in the first embodiment.

  An electrical component module according to a third embodiment of the present invention will be described. In addition, the same code | symbol is provided to the part substantially the same as 1st, 2nd embodiment, and description is abbreviate | omitted. As shown in FIG. 7, the circuit board 11 of the electrical component module of the present embodiment is provided with a separation groove 11b at a position surrounding the electrical component 3 outside the hole 11a, and a region inside the separation groove 11b. And the outer region are connected only by the beam portion 11c. According to this configuration, heat transmitted from the outside of the circuit board 11 is blocked by the separation groove 11b and is difficult to be transmitted to the central region, and therefore, heat can be prevented from being transmitted to the electrical component 3. Of course, heat transfer through the beam portion 11c cannot be prevented, but the heat transfer is greatly increased by forming the separation groove 11b over most of the periphery of the hole portion 11a and the electrical component 3 as shown in FIG. Can be suppressed. In the present embodiment, a solid pattern may not be provided at least in the area around the hole 11a, as in the second embodiment. The configuration and manufacturing method other than those described above are substantially the same as those in the first embodiment.

  An electric component module according to a fourth embodiment of the present invention will be described. In addition, the same code | symbol is provided to the part substantially the same as 1st-3rd embodiment, and description is abbreviate | omitted. The heat radiating plate 12 of the electrical component module of the present embodiment shown in FIG. 8 is made of a conductive metal, or has a surface plated with metal so that at least the surface is conductive. The conductive portion of the heat sink 12 is grounded (not shown). In this embodiment, the wiring of the circuit board 1 is electromagnetically shielded by the heat radiating plate 12 from the outside, particularly the lower side of FIG. Thereby, the generation of electromagnetic noise can be suppressed, and the operation of the electric circuit including the electric component 3 can be made highly accurate. Note that the present embodiment may be arbitrarily combined with the second and third embodiments. Configurations and manufacturing methods other than those described above are substantially the same as those in the first to third embodiments.

  An electrical component module according to a fifth embodiment of the present invention will be described. In addition, the same code | symbol is provided to the part substantially the same as 1st-4th embodiment, and description is abbreviate | omitted. As shown in FIG. 9, in the electrical component module of the present embodiment, resin is injected into the hole 1 a, and a resin layer 13 that covers a connection portion between the electrical component 3, the Peltier element 2, and the heat sink 4 is provided. . The resin layer 13 is made of an epoxy-based adhesive or the like, and has an effect of preventing dew condensation on each member due to heat absorption or heat generation of the electrical component 3 or the Peltier element 2. Further, the resin layer 13 has heat resistance so as not to be deteriorated by heat from the heat generation side substrate 2 b of the Peltier element 2, and heat so that heat from the heat generation side substrate 2 b of the Peltier element 2 is not easily transmitted to the electrical component 3. It is preferable that the conductivity is low, it has electrical insulation to prevent an electrical short circuit between the members, and elasticity so that the expansion and contraction of each member due to heat can be absorbed. In addition, it can also be set as the structure which combined this embodiment arbitrarily with the 2nd-4th embodiment. Configurations and manufacturing methods other than those described above are substantially the same as those in the first to fourth embodiments.

  An electrical component module according to a sixth embodiment of the present invention will be described. In addition, the same code | symbol is provided to the part substantially the same as 1st-5th embodiment, and description is abbreviate | omitted. As shown in FIG. 10, the electrical component module of the present embodiment has a configuration in which a heat radiating plate is integrally formed on the heat generation side substrate 14 b of the Peltier element 14. That is, the main body portion 14e (the heat generation side substrate 14a, the semiconductor 14c, and the electrode 14d) excluding the heat generation side substrate 14b of the Peltier element 14 is small enough to be accommodated in the hole 1a as in the first to fifth embodiments. Although it is formed in a planar shape with an area, the heat generation side substrate 14b is similar to the heat generation side substrate 2b of the first to fifth embodiments, and the first to fifth small area portions 14f that can be accommodated in the hole 1a. The large area part 14g located in the back surface of the circuit board 1 is integrated like the heat sink 4 of the embodiment.

  A method for manufacturing the electrical component module of the present embodiment will be briefly described with reference to FIG. First, the circuit board 1 having the hole 1a is formed (step S1). In this case, the hole 1a may be opened later in the completed circuit board 1, or the circuit board 1 having a shape in which the hole 1a is opened from the beginning may be manufactured.

  On the other hand, as described above, the heat generation side substrate 14b including the portion 14g having a larger area than the planar shape of the hole 1a is attached to the main body portion 14e having a planar shape smaller than the planar shape of the hole 1a. The Peltier element 14 is manufactured (step S6).

  Next, the main body portion 14e of the Peltier element 14 is accommodated in the hole 1a of the circuit board 1, and the cooling side board 14a is positioned on the surface side of the circuit board 1 (surface side on which the electrical component 3 is disposed) to generate heat. At least a part of the large area portion 14g of the side substrate 14b is positioned on the back surface of the circuit substrate 1, that is, the surface opposite to the surface on which the electrical component 3 is positioned, via the insulating layer 6 (step S7). Although not described in detail, the electrode 14d is connected to the wiring pattern of the circuit board 1 or other conduction means so that predetermined power can be supplied to the Peltier element 14. Further, the electrical component 3 is arranged on the cooling side substrate 2a of the Peltier element 14 via the heat conductive sheet 5 (step S3), and the lead 3a of the electrical component 3 is electrically connected to a wiring pattern (not shown) of the circuit substrate 1. (Step S4). In this way, the electrical component module of this embodiment is completed.

  Note that steps S3 and S4 for arranging and connecting the electrical component 3 may be performed prior to step S7 for attaching the Peltier element 14 to the circuit board 1. In that case, an electrical component is arranged above the position of the hole 1 a where the main body portion 14 e of the Peltier element 14 is to be accommodated, and the lead 3 a is connected to the circuit board 1. Thereafter, the main body portion 14e of the Peltier element 14 is inserted into the hole 1a from the back side of the circuit board 1, and as a result, the electrical component 3 is placed on the cooling side board 14a. Further, when the Peltier element 14 is manufactured, the small area portion 14f and the large area portion 14g, which are separately formed in advance, may be bonded together to form the heat generating side substrate 14b. However, the small area portion 14f and the large area portion 14g may be formed. May be integrally formed at the same time to form the heat generation side substrate 14b.

  In the present embodiment, since the heat radiation plate and the heat generation side substrate of the first to fifth embodiments are substantially integrated, the heat conductive sheet 5 on the heat generation side substrate side is unnecessary. At the same time, the manufacturing process is simplified. Note that the present embodiment can be arbitrarily combined with the second to fifth embodiments. Configurations other than those described above are substantially the same as those in the first embodiment.

It is sectional drawing which shows the electrical component module of the 1st Embodiment of this invention. It is a top view which shows the electrical component module shown in FIG. It is an enlarged view which shows the Peltier device of the electrical component module shown in FIG. It is a flowchart which shows the manufacturing method of the electrical component module shown in FIG. It is sectional drawing which shows the electrical component module of the 2nd Embodiment of this invention. It is a top view which shows the electrical component module shown in FIG. It is a top view which shows the electrical component module of the 3rd Embodiment of this invention. It is sectional drawing which shows the electrical component module of the 4th Embodiment of this invention. It is sectional drawing which shows the electrical component module of the 5th Embodiment of this invention. It is sectional drawing which shows the electrical component module of the 6th Embodiment of this invention. It is a figure which shows the manufacturing method of the electrical component module of 6th Embodiment of this embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,11 Circuit board 1a, 11a Hole 1b Inner area | region 1c Outer area | region 2,14 Peltier element 2a, 14a Cooling side board | substrate 2b, 14b Heat generating side board | substrate 2c, 14c Semiconductor 2d, 14d Electrode 3 Electrical component 3a Lead 4,12 Heat dissipation Plate 5 Thermally conductive sheet 6 Insulating layer 7 Mounting hole 8 Screw 11b Separation groove 11c Beam part 13 Resin layer 14e Main body part 14f Small area part 14g Large area part

Claims (10)

A circuit board having a hole;
A Peltier element housed in the hole,
An electrical component disposed on the cooling side substrate of the Peltier element and electrically connected to the circuit board;
An electrical component module disposed on a heat generation side substrate of the Peltier element, and having at least a part of the circuit board on a surface opposite to the surface on which the electrical component is disposed. The electrical component module according to claim 1, wherein the hole has a planar shape smaller than a planar shape of the electrical component. The electrical component module according to claim 1, wherein a thickness of the Peltier element is equal to or less than a thickness of the circuit board. 4. The method according to claim 1, wherein only a minimum wiring pattern necessary for electrical connection of the electrical component is formed at least around the hole on the surface of the circuit board. 5. Electrical component module. The electrical component module according to any one of claims 1 to 4, wherein a separation groove is provided at a position surrounding the electrical component outside the hole of the circuit board. The electrical component module according to claim 1, wherein the heat radiating plate has conductivity and electromagnetically shields the wiring of the circuit board from the outside. The electrical component module of any one of Claims 1-6 which has a resin layer which covers the connection part of the said heat sink and the said Peltier element. The electrical component module according to claim 1, wherein the heat radiating plate is integrally formed with the heat generation side substrate of the Peltier element. Forming a circuit board having a hole;
Storing a Peltier element in the hole;
Placing an electrical component on the cooling side substrate of the Peltier element;
Electrically connecting the electrical component to the circuit board;
Disposing a heat sink on a surface of the circuit board opposite to a surface on which the electric component is located, and positioning the heat sink on a heat generating side substrate of the Peltier element. Production method. Forming a circuit board having a hole;
A step of manufacturing a Peltier element comprising a main body portion having a planar shape smaller than the planar shape of the hole, and a heat generating side substrate having a larger area than the planar shape of the hole;
Storing the body portion of the Peltier element in the hole, and positioning at least a part of the large-area heating-side substrate of the Peltier element on one surface of the circuit board;
Placing an electrical component on the cooling side substrate of the Peltier element;
And a step of electrically connecting the electrical component to the circuit board.

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