KR101236802B1 - Printed circuit board having a radiant heat function - Google Patents

Abstract

The present invention provides a substrate having a heat radiation function. The substrate having the heat dissipation function is inserted into the substrate body to be in contact with the substrate body on which the electronic component is mounted and the electronic component, the thermoelectric element for dissipating heat generated from the electronic component and the thermoelectric element to contact the thermoelectric element. It is inserted into the substrate body, and includes a heat dissipation unit for transferring the heat radiated to the outside. Therefore, the present invention can easily dissipate heat generated from electronic components mounted on the substrate to the outside by inserting the thermoelectric element and the heat dissipation unit in contact with the thermoelectric element into the substrate.

Description

Substrate with heat dissipation {PRINTED CIRCUIT BOARD HAVING A RADIANT HEAT FUNCTION}

The present invention provides a substrate having a heat dissipation function capable of easily dissipating heat generated from electronic components mounted on the substrate to the outside by inserting a thermoelectric element and a heat dissipation unit in contact with the thermoelectric element to the inside of the substrate. have.

In general, a light emitting device, which is one of electronic components, is being used as a light source lamp of a mobile phone backlight or various home appliances beyond a simple indicator, and its application has been extended to a general lighting lamp having appropriate illumination. .

In general, in order to use a light emitting device as a lamp for lighting, the brightness of thousands of candelas per unit area is required. Since only one light emitting device chip is difficult to achieve the same brightness as above, a plurality of light emitting device arrays are configured. To obtain the required luminance.

In forming the array in the prior art, the problem is that the problem of maximizing the light emission availability by efficiently extracting light as light without converting the light generated from each light emitting device as much heat as possible, and the heat generated quickly Is to release to the outside of the chip inside.

A light emitting device chip, which is an electronic component, is attached to a substrate made of polychlorinated biphenyl (PCB). When a high brightness light emitting device is attached, part of the heat generated from the light emitting device itself is radiated through the volume of the light emitting device itself, The heat dissipation toward the lower PCB, because the PCB itself is very poor heat dissipation characteristics, the amount of heat dissipation through the substrate is very small. Therefore, the heat generated in the device that generates a lot of heat is not emitted well, leading to malfunction of the device, shortening the life.

In particular, in the case of a high-luminance light emitting device array or a laser diode array that generates a lot of heat, such insufficient heat dissipation has made it difficult to increase the integration density or increase the operating current.

Due to this heat problem, a technology using a PCB replacement substrate made of aluminum or alumina having excellent thermal conductivity has been proposed as a printed circuit board for packaging a high brightness light emitting device.

However, in the case of an aluminum substrate, thermal conductivity and radiation characteristics are very advantageous, but the electrical conductivity is very large and the workability is very poor. In the case of an alumina substrate, the electrical insulation is excellent, but it is fragile and the processability is very weak. .

Referring to FIG. 1, another method used in the related art previously attaches the structure 30 considering the heat dissipation and radiation efficiency in advance in manufacturing the light emitting device 20 separately, and then prints the light emitting device 20 on the PCB. The method of mounting on the circuit board 10 has been performed.

However, the individual structures 30 attached to the respective light emitting devices 20 are disadvantageous in terms of manufacturing cost and manufacturing efficiency, and must be excessively packaged in order to provide sufficient heat dissipation. Problems arise, so they do not actually produce satisfactory results.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and an object of the present invention is to insert a thermoelectric element and a heat dissipation unit in contact with the thermoelectric element into a substrate, thereby generating an electronic component mounted on the substrate. It is to provide a substrate having a heat dissipation function that can easily dissipate heat to the outside.

Another object of the present invention is to provide a substrate having a heat dissipation function capable of periodically dissipating electronic components mounted on the substrate.

Still another object of the present invention is to provide a substrate having a heat dissipation function capable of maintaining a constant temperature of an electronic component mounted on the substrate.

In a preferred aspect, the present invention provides a substrate having a heat radiation function.

The substrate having the heat dissipation function is inserted into the substrate body to be in contact with the substrate body on which the electronic component is mounted and the electronic component, the thermoelectric element for dissipating heat generated from the electronic component and the thermoelectric element to contact the thermoelectric element. It is inserted into the substrate body, and includes a heat dissipation unit for transferring the heat radiated to the outside.

The thermoelectric device may include a first insulating substrate having a top surface in contact with a bottom surface of the electronic component and having a plurality of N-type thermoelectric semiconductors disposed on the bottom thereof at a predetermined interval, and interposed with the N-type thermoelectric semiconductors on a top surface thereof. Preferably, the P-type thermoelectric semiconductors have a second insulating substrate disposed at a predetermined interval.

The heat dissipation unit may be any one of a metal plate or a metal member on which a plurality of heat dissipation fins are formed, and the heat dissipation unit may be disposed to be in contact with a bottom surface of the second insulating substrate.

In addition, the substrate further includes a time unit, wherein the time unit is electrically connected to the timer for measuring time, the tire and the thermoelectric element, a periodic heat dissipation time range is preset, the periodic heat dissipation time It is provided with a control module for controlling the operation of the thermoelectric element to achieve a range, wherein the timer and the control module is preferably mounted on the substrate body.

The substrate further includes a temperature control unit, wherein the temperature control unit includes a temperature sensor measuring a temperature value generated from the electronic component, a reference temperature value range, and the measured temperature value from the temperature sensor. And a control module for controlling the operation of the thermoelectric element such that the measured temperature value is received within the reference temperature value range by receiving a temperature value, wherein the temperature sensor and the control module are mounted on the substrate body. Do.

On the other hand, the thickness of the heat dissipation unit is preferably formed to be thicker than a thickness of the thermoelectric element.

And, one side and the bottom surface of the heat dissipation unit is preferably exposed to the outside of the substrate body.

The substrate body may include a first substrate body having a first installation hole into which the heat dissipation unit is inserted, and a second installation hole joined to an upper end of the first substrate body and having a second installation hole into which the thermoelectric element is inserted. It consists of a substrate body.

Here, the first substrate body is preferably formed with a power supply pad for supplying power to the thermoelectric element.

In addition, the substrate body may be composed of a single piece.

In this case, an installation hole for installing the thermoelectric element is formed in the substrate body, a pad for power supply for supplying power to the thermoelectric element is formed, and a copper thin plate is further stacked on the bottom of the thermoelectric element that is dissipated. It may be.

The present invention has an effect of easily dissipating heat generated from electronic components mounted on a substrate to the outside by inserting a thermoelectric element and a heat dissipation unit in contact with the thermoelectric element to the inside of the substrate.

In addition, the present invention has the effect of periodically dissipating the electronic components mounted on the substrate.

In addition, the present invention has the effect of maintaining a constant temperature of the electronic component mounted on the substrate.

1 is a cross-sectional view showing a substrate on which a heat dissipation unit for dissipating a conventional electronic component is installed.
2 is a cross-sectional view showing a substrate having a heat dissipation function according to a first embodiment of the present invention.
3 is a cross-sectional view showing a substrate having a heat dissipation function according to a second embodiment of the present invention.
4 is a cross-sectional view showing a substrate having a heat dissipation function according to a third embodiment of the present invention.
5 is a cross-sectional view showing an example of the case where the substrate body according to the present invention consists of two sheets.

Hereinafter, with reference to the accompanying drawings, it will be described a substrate having a heat radiation function of the present invention.

≪ Embodiment 1 >

Figure 2 shows a first embodiment of the substrate of the present invention.

Referring to FIG. 2, a substrate having a heat dissipation function according to the present invention has a substrate body 100, a thermoelectric element 300, and a heat dissipation unit 400.

The substrate body 100 is provided with an installation hole 110 into which the thermoelectric element 300 and the heat dissipation unit 400 are inserted. The installation hole 110 is formed through a hole forming step such as laser hole processing.

The heat dissipation unit 400 is inserted into the bottom of the substrate body 100. Here, the heat dissipation unit 400 functions to transfer heat to the outside to dissipate heat, and may be made of a metal such as aluminum. In addition, the heat dissipation unit 400 may be made of a metal plate having a predetermined thickness, or may be made of a heat dissipation member having a plurality of heat dissipation fins formed on an outer circumference thereof.

The thermoelectric element 300 is stacked on the top surface of the heat dissipation unit 400.

Here, the bottom surface of the thermoelectric element 300 is preferably in contact with the top surface of the heat dissipation unit 400, the adhesive paste having a thermal conductivity may be further applied therebetween.

The thermoelectric element 300 is composed of two insulating substrates 310 and 320 and N-type and P-type thermoelectric semiconductors 311 and 321 intersected therebetween. The insulating substrates 310 and 320 may be silicon insulating substrates.

The two insulating substrates 310 and 320 are composed of first and second insulating substrates 310 and 320, and the first insulating substrate 310 is disposed to be exposed to an upper surface of the substrate body 100, and the second insulating substrate 320 is disposed. ) Is disposed in contact with the top surface of the heat dissipation unit 400. In addition, a plurality of P-type thermoelectric semiconductors 321 are disposed at a predetermined interval on an upper surface of the second insulating substrate 320, and a plurality of N-type thermoelectric semiconductors 311 is disposed on a lower surface of the first insulating substrate 310. ) Is placed. Here, the N and P type thermoelectric semiconductors 311 and 321 are installed to cross each other.

When the thermoelectric element 300 receives an operation control signal from the outside, the thermoelectric element 300 may achieve a Paltier effect of absorbing heat from the first insulating substrate 310 and dissipating heat through the second insulating substrate 320.

Therefore, the heat dissipation unit 400 and the thermoelectric element 300 according to the present invention are installed in the installation hole 110, thereby being inserted into the substrate body 100. Here, the upper surface of the second insulating substrate 320 is exposed to the upper portion of the substrate body 100 through the installation hole 110.

The upper surface of the first insulating substrate 310 may be an area that is substantially in contact with the lower surface of the electronic component 200 mounted on the upper surface of the substrate body 100. Of course, a predetermined gap may be formed between the lower surface of the electronic component 200 and the upper surface of the first insulating substrate 310, but in this case, a conductive paste may be further applied to the gap so that they may be directly connected. You can also induce it.

In addition, the electronic component 200 mounted on the upper surface of the substrate body 100 may generate a predetermined heat during operation, and may be a lighting device such as an LED device.

Accordingly, when the electronic component 200 mounted on the upper surface of the substrate body 100 is operated, the electronic component 200 generates a predetermined heat. The generated heat is absorbed through the first insulating substrate 310 and radiated to the outside through the second insulating substrate 320.

The heat to be radiated is transmitted to the heat dissipation unit 400 which is installed in close contact with the thermoelectric element 300, the heat dissipation unit 400 can effectively radiate the heat transferred to the outside of the substrate body (100).

That is, in the first embodiment of the present invention, heat generated from the electronic component 200 is radiated through the thermoelectric element 300 and the heat dissipation unit 400 installed inside the substrate body 100, thereby providing stable electronic components ( There is an advantage that can provide an operating environment of 200). In addition, by inserting the thermoelectric element 300 and the heat dissipation unit 400 required for heat dissipation into the inside of the substrate body 100, the thickness of the entire substrate body 100 can be efficiently reduced and miniaturization can be achieved.

≪ Embodiment 2 >

Figure 2 shows a second embodiment of the substrate of the present invention.

Since the substrate body, the thermoelectric element 300 and the heat dissipation unit 400 in the second embodiment may be substantially the same as the configuration mentioned in the first embodiment, description thereof will be omitted.

The substrate according to the second embodiment further includes a time unit 500.

The time unit 500 includes a timer 510 and a control module 520.

The timer 510 is a kind of electronic component that is a timer element, and is preferably mounted on the upper surface of the substrate body 100. In addition, the control module 520 is also preferably mounted on the upper surface of the substrate body 100 as a control element.

The timer 510 measures an operating time of the electronic component 200.

The control module 520 is electrically connected to the thermoelectric element 300 and the timer 510. A periodic heat dissipation time range is set in the control module 520. Here, the heat dissipation time range is composed of time ranges input to heat dissipation and non-heat dissipation time ranges between these time ranges. For example, if the heat dissipation time range is set to 2 minutes and the non-heat dissipation time is set to 1 minute, the control module 520 receives the operating time of the electronic component 200 from the timer 510 in real time, and the electronic component. The operation of the thermoelectric element 300 may be controlled so that the heat dissipation of the 200 is performed for two minutes and the period of one minute of non-heat dissipation is continuously repeated.

Accordingly, in the second embodiment of the present invention, the electronic component 200 may be periodically radiated at a predetermined time interval through the timer unit 500.

Third Embodiment

Figure 3 shows a third embodiment of the substrate of the present invention.

Since the substrate body 100, the thermoelectric element 300, and the heat dissipation unit 400 in the third embodiment may be substantially the same as those mentioned in the first embodiment, description thereof will be omitted. do.

The substrate according to the second embodiment further includes a temperature control unit 600.

The temperature control unit 600 is a temperature sensor 610 for measuring the temperature value generated from the electronic component 200 and a reference temperature value range is set in advance, and the temperature value measured from the temperature sensor 610 The control module 620 is configured to control the operation of the thermoelectric element 300 so that the measured temperature value is received and included in the reference temperature value range.

Here, the temperature sensor 610 and the control module 620 may be mounted on the substrate body 100.

The temperature sensor 610 may be directly connected to the electronic component 200 so as to directly measure the heating temperature value of the electronic component 200, and measure the temperature value of a region adjacent to the electronic component 200. The electronic component 200 may be arranged to enclose the electronic component 200.

Accordingly, the temperature sensor 610 may measure the direct heating temperature value of the electronic component 200 or the temperature value surrounding the electronic component 200 and transmit the measured temperature value to the control module 620 in the form of an electrical signal.

Subsequently, the control module 620 receiving the measured temperature value may control the operation of the thermoelectric element 300 in real time so that the measured temperature value may be included in a preset reference temperature value range.

Accordingly, the third embodiment controls the operation of the thermoelectric element 300 such that the heat generation temperature of the electronic component 200 is always included in the reference temperature value range, thereby overheating the resulting electronic component 200 and the resulting components. In addition to preventing the risk of damage in advance, there is an advantage that can provide a stable operating environment of the electronic component (200).

Meanwhile, the thickness of the heat dissipation unit 400 may be formed to be thicker than the thickness of the thermoelectric element 300 by a predetermined thickness. By reducing the thickness of the thermoelectric element 300, it is possible to quickly transfer the heat generated from the electronic component 200 to the heat dissipation unit 400 side, and the heat dissipation unit 400 received the heat transfer a constant heat dissipation area Through this, heat can be efficiently radiated to the outside.

In particular, one side and the bottom surface of the heat dissipation unit 400 according to the present invention is preferably exposed to the outside of the substrate body (100).

Therefore, the heat dissipation unit 400 may efficiently dissipate heat transferred from the thermoelectric element 300 to the outside of the substrate body 100.

In addition, although not shown in the drawing, the outer surface of the heat dissipation unit 400 exposed to the outside of the substrate body 100 may be further formed with heat-dissipating protrusions of the concave-convex shape so that the contact area with air can be increased.

In addition, the lower surface of the thermoelectric element 300 (the lower surface of the second insulating substrate 320) and the upper surface of the heat dissipation unit 400 may be unevenly coupled to each other. Therefore, since they can increase the contact area between each other, the time for heat transfer can be effectively shortened, which can result in the effect of shortening the heat dissipation time of the electronic component.

On the other hand, although not shown in the drawings, the above-mentioned timer unit 400 and the temperature control unit 600 may be installed on the substrate body 100 at the same time.

In this case, the timer unit 500 and the temperature control unit 600 may be selected and operated under a predetermined operating condition by a selection device (not shown) electrically connected to the control modules 520 and 620.

For example, when a malfunction occurs such that the heat dissipation time range is not periodically implemented in the timer unit 500, the selection element detects this to operate the temperature control unit 600, and the electronic component ( If the temperature value of 200 is not continuously included in the reference temperature value range, the selection element may operate the timer unit 500.

In addition, when the timer unit 500 and the temperature control unit 600 generate all of the above malfunctions, the selection element may generate an alarm for the malfunction through a separate alarm element (not shown).

On the other hand, the substrate body according to the present invention may be made of two substrate bodies, it may be made of one substrate body.

Referring to FIG. 5, when the substrate body is formed of two sheets, the substrate body includes a first substrate body 101 having a first installation hole 111 into which the heat dissipation unit 400 is inserted, and the first substrate body. The second substrate body 102 is joined to the upper end of the 101 and is formed with a second installation hole 112 into which the thermoelectric element 300 is inserted. In addition, a power supply pad (not shown) for supplying power to the thermoelectric element 300 may be formed in the first substrate body 101.

Referring to the configuration thereof, a pad for power supply for supplying power to the thermoelectric element 300 is formed on the first substrate body 101, and the thermoelectric element 300 and the heat dissipation unit (2) on the second substrate body 102. The installation holes 111 and 112 into which the 400 can be inserted can be dug out by a router, and the two substrate bodies 101 and 102 can be joined to each other.

In addition, when one (single) substrate body is formed, an installation hole in which the thermoelectric element 300 is installed is formed in the substrate body 100. Here, the installation hole may correspond to the installation hole '112' shown in FIG.

In addition, an electrode pad (not shown) for supplying power to the thermoelectric element 300 is formed on the substrate body 100, and a copper thin plate may be further stacked on the lower end of the thermoelectric element 300 to be radiated. . Here, the copper thin plate may correspond to the heat dissipation unit 300 in FIG. 2, except that the copper thin plate is formed in a plate shape.

Referring to this configuration, after the pad for power supply of the thermoelectric element 300 is formed in the substrate body 100, the thermoelectric element 300 is inserted into the installation hole 112, but the heat dissipation of the thermoelectric element 300 The copper thin plate may be laminated on a portion of the thermoelectric element 300, for example, to effectively radiate external heat. Here, an insulating layer (not shown) may be further formed on the lower end of the copper thin plate and the thermoelectric element 300.

100: substrate body 110: mounting hole
200: electronic component 300: thermoelectric element
310: first insulating substrate 320: second insulating substrate
400: heat dissipation unit 500: timer unit
510: timer 520: control module of the timer unit
600: temperature control unit 610: temperature sensor
620: control module of the temperature control unit

Claims (9)

Board body on which electronic components are mounted
A thermoelectric element inserted into the substrate body to be in contact with the electronic component and dissipating heat generated from the electronic component;
A heat dissipation unit inserted into the substrate body to be in contact with the thermoelectric element and transferring the heat to be radiated to the outside;
The thermoelectric element,
A first insulating substrate having an upper surface in contact with a lower surface of the electronic component and having a plurality of N-type thermoelectric semiconductors disposed at a predetermined interval on the lower surface thereof, and P-type thermoelectric semiconductors being electrically disposed so as to intersect the N-type thermoelectric semiconductors on the upper surface thereof. And a second insulating substrate disposed at intervals. delete The method of claim 1,
The heat dissipation unit,
Any one of a metal plate or a metal member formed with a plurality of heat radiation fins,
And a heat dissipation function, the substrate being in contact with a bottom surface of the second insulating substrate. The method of claim 1,
The substrate further includes a time unit,
The time unit is a timer for measuring a time, electrically connected to the timer and the thermoelectric element, a control for controlling the operation of the thermoelectric element so as to form a periodic heat dissipation time range and to achieve the periodic heat dissipation time range With modules,
And the timer and the control module are mounted on the substrate body. The method of claim 1,
The substrate further comprises a temperature control unit,
The temperature control unit may include a temperature sensor measuring a temperature value generated from the electronic component, a reference temperature value range, and the temperature value measured by the temperature sensor, and the temperature value being the reference temperature value. The control module for controlling the operation of the thermoelectric element to be included in the range,
And the temperature sensor and the control module are mounted on the substrate body. The method of claim 1,
The thickness of the heat dissipation unit is a substrate having a heat dissipation function, characterized in that formed by a certain thickness thicker than the thickness of the thermoelectric element. The method of claim 1,
One side and the bottom surface of the heat dissipation unit is a substrate having a heat dissipation function, characterized in that exposed to the outside of the substrate body. The method of claim 1,
The substrate body may include a first substrate body having a first installation hole into which the heat dissipation unit is inserted, and a second substrate body joined to an upper end of the first substrate body and having a second installation hole into which the thermoelectric element is inserted. Consisting of,
And a power supply pad for supplying power to the thermoelectric element is formed in the first substrate body. The method of claim 1,
The substrate body is made of a single piece,
The substrate body is provided with an installation hole in which the thermoelectric element is installed, a pad for power supply for supplying power to the thermoelectric element is formed,
A substrate having a heat dissipation function, characterized in that a thin copper plate is further laminated on the bottom of the thermoelectric element to be dissipated.

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