WO2014074045A1 - Heat dissipation assembly - Google Patents

Heat dissipation assembly Download PDF

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Publication number
WO2014074045A1
WO2014074045A1 PCT/SE2012/051353 SE2012051353W WO2014074045A1 WO 2014074045 A1 WO2014074045 A1 WO 2014074045A1 SE 2012051353 W SE2012051353 W SE 2012051353W WO 2014074045 A1 WO2014074045 A1 WO 2014074045A1
Authority
WO
WIPO (PCT)
Prior art keywords
base plate
heat dissipation
dissipation assembly
thermo
circuit board
Prior art date
Application number
PCT/SE2012/051353
Other languages
French (fr)
Inventor
Igor PEREZ-URIA
Per Ferm
Lars Drugge
Original Assignee
Telefonaktiebolaget L M Ericsson (Publ)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget L M Ericsson (Publ) filed Critical Telefonaktiebolaget L M Ericsson (Publ)
Publication of WO2014074045A1 publication Critical patent/WO2014074045A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10219—Thermoelectric component

Definitions

  • the application relates to a heat dissipation assembly comprising a base plate configured to be mounted to a carrier Printed Wired Board (PWB) or Printed Circuit Board (PCB) .
  • PWB Printed Wired Board
  • PCB Printed Circuit Board
  • thermo-mechanical techniques potting, gap fillers, dam & fill, etc
  • mounting freedom degrees in final assembly e g lead-free surface mounting profiles.
  • a heat dissipation assembly comprising a base plate being a printed wired/circuit board, PWB/PCB comprising a plurality of copper layers and where the base plate is adapted to comprise further thermal/current relieving features to conduct heat from an interconnected carrier PWB/PCB.
  • thermal/current relieving features could for example include:
  • Copper layers with a significant thickness typically 0.1-0.25 mm.
  • thermo-electric modules
  • thermo conductive materials ohmic/high thermo conductive materials.
  • thermo-mechanical concept design is of great value
  • FIGS. 1 to 7 are block diagrams illustrating different embodiments of a heat dissipation assembly.
  • FIG. 1 illustrates an embodiment of a heat dissipation assembly comprising a base plate 100 adapted to receive thermo conductive interconnect elements 110 to secure thermal distribution from hot spot components at a carrier P B/PCB 120.
  • the base plate 100 comprises a PWB/PCB made of a non-conductive substrate (such as epoxy) with a plurality of copper layers with significant thickness (typical 0.1-0.25 mm). Both sides of the base plate 100 have lands of a conductive copper layer where the layer facing the carrier PCB/PWB 120 is adapted to receive the thermo conductive interconnect elements 110, including thermo conductive fastening elements 115 that in addition of keeping the base plate 100 fixed to the carrier PWB/PCB 120 also are thermo conductive.
  • the upper side of the base plate 100 has lands of copper for transporting heat from the base plate to the ambient air or to an attached heat sink or a thermo-electric module (such as a peltier element) .
  • the layout of the copper lands can easily be created by milling in contrast to base plates of aluminum which are more difficult to mechanically machine to a desired layout.
  • copper layers have significantly better conductivity than aluminum and can be thinner.
  • Figure 2 shows the base plate 100 with the upper copper layer comprising copper lands 210 providing isolation between a primary side 221 and a secondary 222 side of a power module circuitry design.
  • Figure 3 illustrates the base plate 100 with a soldered/attached peltier element 310 with the cooling side facing the base plate 100.
  • the peltier element 310 can be powered from the carrier P B/PCB 120.
  • Figure 4 illustrates a further embodiment of a base plate 400 with threaded inserts 420 (e.g. 3 inserts of stainless steel or brass) adapted for the mechanical attachment of a heatsink 410 (e.g. with M3 screws 430) .
  • Figure 4B is a magnified view of the insert 420 adapted to receive a screw 430 for fastening the heatsink 410 to the base plate 400.
  • Figure 5 illustrates an embodiment of a base plate 500 attached to a carrier PWB/PCB 120 with thermo conductive fastening pins 520.
  • the base plate 500 further comprises filled vias 530 configured to conduct heat between the inner and outer copper layers 510 of the base plate 500.
  • the outer copper layer facing the carrier PWB/PCB 120 is further adapted to receive high thermo conductive components and/or interconnect elements such as CI, C2, C3 and 540.
  • the same copper layer can also be provided with cavities (such as blind vias) 535 for receiving penetrating thermo conductive interconnect elements 545 adapted to conduct heat to the different copper layers 510 in the base plate 500.
  • FIG. 6 illustrates a further embodiment of a heat dissipation assembly comprising a base plate 600 with an embedded thermo-electric module, a peltier element 610.
  • the peltier element 610 is mounted with the cooling side towards the interior of the base plate 600 and the warm side towards the ambient air or to a heatsink (not shown) mounted on the base plate 600.
  • the peltier element 610 can be 51353
  • FIG. 7 illustrates yet a further embodiment of a heat dissipation assembly comprising a base plate
  • the drilled holes 710 make it possible to insert thermal conductive polymers such as silicon 720 into the space between the carrier PWB/PCB 750 and the base plate 700 for further thermal conductivity.
  • the base plate in the embodiments described above can act as a flexible platform for not only heat sinks and/or peltier elements but also for other cooling devices such as fans or liquid cooling devices that can be mounted to the base plate.

Abstract

The application relates to a heat dissipation assembly comprising a base plate configured to be mounted to a carrier printed circuit board, PCB. Present base plates are often made of aluminum which is difficult to mechanically machine to a desired layout. The solution to this problem is a heat dissipation assembly comprising a base plate (100) made of a non-conductive substrate comprising a plurality of copper layers including lands of copper on both sides of the base plate (100) and where the copper lands at the side facing the carrier PCB (120) are configured to receive at least one thermo conductive interconnect element (110) for the distribution of heat from the carrier PCB (120).

Description

HEAT DISSIPATION ASSEMBLY
TECHNICAL FIELD
The application relates to a heat dissipation assembly comprising a base plate configured to be mounted to a carrier Printed Wired Board (PWB) or Printed Circuit Board (PCB) .
BACKGROUND
To meet market demands in increased power usage, high voltage insulation requirements and less package size of power electronics, efficient cooling devices are necessary.
There are several well known established techniques characterized acc. to standards and best practice techniques e.g. - Use of metal plate bonded/encapsulated/moulded in close vicinity of hot spot components.
- Use of copper-vias (filled or unfilled), plated through holes and metal plates across the multilayer structure carrier PWB/PCB for energy transport.
- Use of thermal interface materials by the mean of gap fillers, gap pads, tapes, adhesives, etc for transport from hot spot to cooling references (e.g chassis) . The tendency towards cost effective and tightly denser electronic packaging' s, also demands flexibility what regards the thermal design around the PWB/PCB populated components and mounting technology. Accessible areas around or nearby the critical hot spots embedded in printed wired boards or located on critical semiconductor components are becoming more limited and hard to get keeping safety regulations, design rules/restrictions and best practice references vs. required component packing density.
Problems with existing solutions are:
• Available thermal management techniques in power application demand critical real estate and are by default cost drivers to reach package's desired performance.
• The industry is targeting higher component population densities leading to miniaturization reaching the limits of what is feasible in relation to package size/real estate/conductor size vs. acceptable stress mechanisms (temperature limits for semiconductors, solder joints, printed wired board, etc) .
• Increased isolation requirements for power trains demand encapsulation with enough dielectric materials, resulting in increased thermal resistance between hotspot components and cooling references.
• Assemblies with base plates/inserts for mechanical attachment of heat sinks demand a set of rules and restrictions in locations where component/conductors placement flexibility degree is desired to enhance product performance. Lack of integrated active cooling solutions compatible with standard manufacturing assembly methodologies.
Lack of design choice flexibility for connecting/grounding base plate to tailored circuitry architectures what regards shielding/grounding or alike.
There are no available cost effective techniques handling galvanic/metal structure to transport heat within a safe isolation margin for high component density power module applications .
Lack of package solutions for thermal management compatible with lead free assembly process parameter window.
Most common thermo-mechanical techniques (potting, gap fillers, dam & fill, etc) require cost driven operations/technologies limiting the mounting freedom degrees in final assembly e g lead-free surface mounting profiles.
SUMMARY
With this background it is the object of the embodiments described below to obviate at least some of the disadvantages mentioned above.
The object is achieved by a heat dissipation assembly comprising a base plate being a printed wired/circuit board, PWB/PCB comprising a plurality of copper layers and where the base plate is adapted to comprise further thermal/current relieving features to conduct heat from an interconnected carrier PWB/PCB.
The thermal/current relieving features could for example include:
Copper layers with a significant thickness (typical 0.1-0.25 mm).
- Soldered filled vias across the PWB/PCB for conducting heat between the copper layers. - Soldered thermo conductive interconnection components securing the thermal/current relief of hotspots/critical devices on the interconnected carrier PWB/PCB.
Embedded threaded inserts (e g M3 made of stainless steel or brass) for the attachment of heatsinks or thermal electric modules (such as peltier elements) .
- Soldered/embedded thermo-electric modules.
An advantage with this solution is that one can obtain a more effective design concept what regards packing density, manufacturing process, performance and cost than available cost effective conventional thermo-cooling techniques.
Other advantages are: · Enhance the thermo-mechanical package performance .
• Use of standard manufacturing assembly processes . • Provide cooling options for dense electronics
packaging.
• Optimize thermal performance vs. minimum
product height.
• Provides design flexibility and high packing
degree .
• Use of standard PWB/PCB infrastructure.
• Possible to add extra components and
functionality.
• Possibility to target hotspot areas with low
ohmic/high thermo conductive materials.
• Compact design flexibility to address
shielding/grounding circuitry needs.
• Optimize package mass enhancing Pb-reflow
characteristic-Assembly requirement .
• Rationalizing cost driven dielectric parts to
secure safety regulation.
Integrating several design features
(thermal/mechanical/current) into a minimized
thermo-mechanical concept design is of great value
in dense electronics packaging e.g. DC/DC-Power
Modules architectures.
BRIEF DESCRIPTION OF THE DRAWINGS
Figures 1 to 7 are block diagrams illustrating different embodiments of a heat dissipation assembly.
DETAILED DESCRIPTION Figure 1 illustrates an embodiment of a heat dissipation assembly comprising a base plate 100 adapted to receive thermo conductive interconnect elements 110 to secure thermal distribution from hot spot components at a carrier P B/PCB 120.
The base plate 100 comprises a PWB/PCB made of a non-conductive substrate (such as epoxy) with a plurality of copper layers with significant thickness (typical 0.1-0.25 mm). Both sides of the base plate 100 have lands of a conductive copper layer where the layer facing the carrier PCB/PWB 120 is adapted to receive the thermo conductive interconnect elements 110, including thermo conductive fastening elements 115 that in addition of keeping the base plate 100 fixed to the carrier PWB/PCB 120 also are thermo conductive.
The upper side of the base plate 100 has lands of copper for transporting heat from the base plate to the ambient air or to an attached heat sink or a thermo-electric module (such as a peltier element) .
The layout of the copper lands can easily be created by milling in contrast to base plates of aluminum which are more difficult to mechanically machine to a desired layout. In addition, copper layers have significantly better conductivity than aluminum and can be thinner.
An example is illustrated in Figure 2 which shows the base plate 100 with the upper copper layer comprising copper lands 210 providing isolation between a primary side 221 and a secondary 222 side of a power module circuitry design.
Figure 3 illustrates the base plate 100 with a soldered/attached peltier element 310 with the cooling side facing the base plate 100. The peltier element 310 can be powered from the carrier P B/PCB 120.
Figure 4 illustrates a further embodiment of a base plate 400 with threaded inserts 420 (e.g. 3 inserts of stainless steel or brass) adapted for the mechanical attachment of a heatsink 410 (e.g. with M3 screws 430) . Figure 4B is a magnified view of the insert 420 adapted to receive a screw 430 for fastening the heatsink 410 to the base plate 400.
Figure 5 illustrates an embodiment of a base plate 500 attached to a carrier PWB/PCB 120 with thermo conductive fastening pins 520. The base plate 500 further comprises filled vias 530 configured to conduct heat between the inner and outer copper layers 510 of the base plate 500. The outer copper layer facing the carrier PWB/PCB 120 is further adapted to receive high thermo conductive components and/or interconnect elements such as CI, C2, C3 and 540. The same copper layer can also be provided with cavities (such as blind vias) 535 for receiving penetrating thermo conductive interconnect elements 545 adapted to conduct heat to the different copper layers 510 in the base plate 500.
Figure 6 illustrates a further embodiment of a heat dissipation assembly comprising a base plate 600 with an embedded thermo-electric module, a peltier element 610. The peltier element 610 is mounted with the cooling side towards the interior of the base plate 600 and the warm side towards the ambient air or to a heatsink (not shown) mounted on the base plate 600. The peltier element 610 can be 51353
8 powered from the carrier PWB/PCB 120 via connection elements between the carrier PWB/PCB 120 and the base plate 600 and via external and/or internal copper layers at the base plate itself 600. Figure 7 illustrates yet a further embodiment of a heat dissipation assembly comprising a base plate
700 with drilled holes 710. The drilled holes 710 make it possible to insert thermal conductive polymers such as silicon 720 into the space between the carrier PWB/PCB 750 and the base plate 700 for further thermal conductivity.
Another important feature is that the base plate in the embodiments described above can act as a flexible platform for not only heat sinks and/or peltier elements but also for other cooling devices such as fans or liquid cooling devices that can be mounted to the base plate.

Claims

CIAIMS
A heat dissipation assembly comprising a base plate (100) configured to be mounted to a carrier printed circuit board (120) wherein the base plate (100) is made of a non-conductive substrate comprising a plurality of copper layers including copper lands (210) on both sides of the base plate (100) and where the copper lands at the side facing the carrier printed circuit board (120) are configured to receive at least one thermo conductive interconnect element (110) for the distribution of heat from the carrier printed circuit board (120) .
A heat dissipation assembly as in claim 1 wherein the copper layers of the base plate (100) have a thickness between 0.1-0.25 mm.
A heat dissipation assembly as in claim 1 or 2 wherein the base plate (500) further comprises at least one soldered filled via (530) across a plurality of the copper layers (510) for conducting heat between the copper layers (510) .
A heat dissipation assembly as in any preceding claim wherein the base plate (600) further comprises an embedded thermo-electric module (610) with the cooling side faced towards the interior of the base plate (600) .
A heat dissipation assembly as in claim 4 wherein the embedded thermo-electric module (610) is electrically connected to copper layers in the base plate (600) for powering the module (610) .
6. A heat dissipation assembly as in claim 4 or 5 where the thermo-electric module (610) is a peltier element.
7. A heat dissipation assembly as in any preceding claim wherein the base plate (400) further comprises at least one embedded threaded insert (420) for attaching an external heatsink (410) with a screw (430) .
8. A heat dissipation assembly as in any of the claims 1 to 3 further comprising a thermo-electric module (310) attached to the base plate (100) with the cooling side faced towards one of the surfaces of the base plate
(100) .
9. A heat dissipation assembly as in claim 8 wherein the thermo-electric module (310) is configured to receive power from the carrier printed circuit board (120) . 10. A heat dissipation assembly as in claim 8 or 9 where the thermo-electric module (310) is a peltier element.
11. A heat dissipation assembly as in any preceding claim further comprising a carrier printed circuit board (120) and a plurality of thermo conductive fastening pins (520) for keeping the base plate (500) fixed to the carrier printed circuit board (120) and a plurality of thermo conductive interconnect elements (540, 545, CI) on the carrier printed circuit board (120) in thermal contact with the copper lands of the base plate (500).
12. A heat dissipation assembly as in claim 11 wherein the base plate (700) further comprises at least one drilled through-hole (710) and wherein the assembly further comprises a thermal conductive polymer (720) that has been inserted into the space between the base plate
(700) and the carrier printed circuit board (750) .
PCT/SE2012/051353 2012-11-06 2012-12-07 Heat dissipation assembly WO2014074045A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261722856P 2012-11-06 2012-11-06
US61/722,856 2012-11-06

Publications (1)

Publication Number Publication Date
WO2014074045A1 true WO2014074045A1 (en) 2014-05-15

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ID=47471977

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SE2012/051353 WO2014074045A1 (en) 2012-11-06 2012-12-07 Heat dissipation assembly

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2991461A1 (en) * 2014-08-13 2016-03-02 Fujitsu Limited Circuit board and electronic apparatus

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5921087A (en) * 1997-04-22 1999-07-13 Intel Corporation Method and apparatus for cooling integrated circuits using a thermoelectric module
US20010038527A1 (en) * 1999-07-15 2001-11-08 Incep Technologies, Inc. Inter-circuit encapsulated packaging
US20080130234A1 (en) * 2006-11-30 2008-06-05 Daisuke Maehara Electronic Apparatus
KR20120105965A (en) * 2011-03-17 2012-09-26 (주)아이스써킷 Pcb device
KR20120114516A (en) * 2011-04-07 2012-10-17 남경 주식회사 Printed circuit board having a radiant heat function

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5921087A (en) * 1997-04-22 1999-07-13 Intel Corporation Method and apparatus for cooling integrated circuits using a thermoelectric module
US20010038527A1 (en) * 1999-07-15 2001-11-08 Incep Technologies, Inc. Inter-circuit encapsulated packaging
US20080130234A1 (en) * 2006-11-30 2008-06-05 Daisuke Maehara Electronic Apparatus
KR20120105965A (en) * 2011-03-17 2012-09-26 (주)아이스써킷 Pcb device
KR20120114516A (en) * 2011-04-07 2012-10-17 남경 주식회사 Printed circuit board having a radiant heat function

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2991461A1 (en) * 2014-08-13 2016-03-02 Fujitsu Limited Circuit board and electronic apparatus
US9867274B2 (en) 2014-08-13 2018-01-09 Fujitsu Limited Circuit board and electronic apparatus

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