JPS59101462U - Grounding structure of electronic components - Google Patents
Grounding structure of electronic componentsInfo
- Publication number
- JPS59101462U JPS59101462U JP19543182U JP19543182U JPS59101462U JP S59101462 U JPS59101462 U JP S59101462U JP 19543182 U JP19543182 U JP 19543182U JP 19543182 U JP19543182 U JP 19543182U JP S59101462 U JPS59101462 U JP S59101462U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- circuit board
- printed circuit
- copper foil
- foil pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図乃至第４図は従来例を示し、第１図はプリント基
板にチップ状の電子部品を仮止めし、金属棒を挿入した
状態を示す平面図、第２図は同電子部品を半田付けした
状態を示す第１図Ａ−Ａ断面図、第３図は第１図に於て
シールド板を装着した状態を示す平面図、第４図は第３
図のＡ−Ａ断 。
面図、第５図乃至第７図は本考案を示し、第５図イ１口
は電子部品の接地構造を示し、同図イは金属端子板をプ
リント基板に圧入する状態を示す要部斜視図、同図口は
同図イに更にシールド板を嵌合する状態を示す要部斜視
図、第６図は第５図に於て、各部品を組み込み後半田付
けを完了した状態に於ける第５図口のＡ−Ａ線の要部断
面図、第 ′７図は同Ｂ＝Ｂ線の要部断面図であ
る。
１５．１６・・・・・・プリント基板、１７・・・・・
・電子部品、１８．１９・・・・・・電極、２０，２１
．２９・・・・・・銅箔パターン、２２・・・・・・第
１の透孔、２３・・・・・・第２の透孔、２４・・・・
・・金属端子板、２５・・・・・・シールド板、２６・
・・・・・溝、２７・・・・・・隙間、２８．３０・・
・・・・半田。Figures 1 to 4 show conventional examples, Figure 1 is a plan view showing a state in which a chip-shaped electronic component is temporarily fixed to a printed circuit board and a metal rod is inserted, and Figure 2 is a plan view showing the state in which the electronic component is soldered. Figure 1 is a cross-sectional view taken along line A-A showing the state in which the shield plate is attached; Figure 3 is a plan view showing the state in which the shield plate is attached in Figure 1;
A-A section of the figure. The top view and FIGS. 5 to 7 show the present invention, FIG. 5 A shows the grounding structure of electronic components, and FIG. Figure 6 is a perspective view of the main part showing the state in which the shield plate is further fitted to the figure A, and Figure 6 is the same as Figure 5, with each part assembled and soldering completed. FIG. 5 is a cross-sectional view of the main part taken along the line A--A, and FIG. 7 is a cross-sectional view of the main part taken along the line B=B. 15.16...Printed circuit board, 17...
・Electronic components, 18.19... Electrodes, 20, 21
．． 29...Copper foil pattern, 22...First through hole, 23...Second through hole, 24...
...Metal terminal board, 25...Shield plate, 26.
...Groove, 27...Gap, 28.30...
····solder.
Claims (1)
面に設けた電子部品取付用の銅箔パターン上に、第１の
透孔と、該透孔に略直交する第２の透孔を設け、前記第
１の透孔には金属端子板を挿入し、第２の透孔には、前
記金属端子板を挟む溝を有するシールド板を挿入し、プ
リント基板の他方の表面への半田付けによって、該プリ
ント基板の他方の表面に設けられた接地用の銅箔パター
ンと一方の表面に設けられた銅箔パターンとが前−記金
属端子を狭んだシールド板に形成された溝を介して接地
されるとともに、前記シールド板と、前記プリント基板
の表面の銅箔パターンとが接続されたことを特徴とする
電子部品の接地構造。A first through hole and a second through hole substantially perpendicular to the through hole are provided on a copper foil pattern for mounting electronic components provided on one surface of a printed circuit board on which an electric circuit is formed on each surface, A metal terminal plate is inserted into the first through hole, a shield plate having a groove that sandwiches the metal terminal plate is inserted into the second through hole, and soldered to the other surface of the printed circuit board. The grounding copper foil pattern provided on the other surface of the printed circuit board and the copper foil pattern provided on one surface are grounded through a groove formed in the shield plate that narrows the metal terminal. A grounding structure for an electronic component, characterized in that the shield plate is connected to a copper foil pattern on the surface of the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19543182U JPS59101462U (en) | 1982-12-27 | 1982-12-27 | Grounding structure of electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19543182U JPS59101462U (en) | 1982-12-27 | 1982-12-27 | Grounding structure of electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59101462U true JPS59101462U (en) | 1984-07-09 |
Family
ID=30419720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19543182U Pending JPS59101462U (en) | 1982-12-27 | 1982-12-27 | Grounding structure of electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59101462U (en) |
-
1982
- 1982-12-27 JP JP19543182U patent/JPS59101462U/en active Pending
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