JPS5999475U - Soldering structure of electronic components - Google Patents
Soldering structure of electronic componentsInfo
- Publication number
- JPS5999475U JPS5999475U JP19890982U JP19890982U JPS5999475U JP S5999475 U JPS5999475 U JP S5999475U JP 19890982 U JP19890982 U JP 19890982U JP 19890982 U JP19890982 U JP 19890982U JP S5999475 U JPS5999475 U JP S5999475U
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- copper foil
- lands
- soldering
- wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のハンダ付は構造によるプリント基板への
電子部品の実装形態を示す側面図で、第２図及び第３図
は同要部を拡大した斜視図、第４図は本考案のハンダ付
は構造を適用した電子部品のプリント基板への実装形態
を示す側面図及びその要部の拡大図、第５図は他実施例
の実装形態を示す一部を切断した側面図で、第６図は同
裏面図、第７図は更に他の実施例を示す背面図である。
１・・・プリント基板、２・・・銅箔ラン、ド、３・・
・電子部品、３ａ・・・リード線、１０・・・ジャンパ
線。Fig. 1 is a side view showing the mounting form of electronic components on a printed circuit board using the conventional soldering structure, Figs. Soldering is a side view and an enlarged view of the main parts showing the mounting form of the electronic component on the printed circuit board to which the structure is applied, and Fig. 5 is a side view with a part cut away showing the mounting form of another embodiment. FIG. 6 is a rear view of the same, and FIG. 7 is a rear view showing still another embodiment. 1... Printed circuit board, 2... Copper foil run, C, 3...
・Electronic parts, 3a...Lead wire, 10...Jumper wire.
Claims (1)
のリード線を間隙をもらて対面させるか、銅箔ランド列
に隣接してジャンパ線を配置し、自動ハンダ付は時にジ
ャンパ線又は銅箔ランドとり・ −ド線間にハンダを
付着させることにより銅箔ランド間のハンダブリッジを
防止するようにした電子部品のハンダ付は構造。The lead wires of electronic components are faced with gaps between multiple copper foil lands formed on the printed circuit board, or jumper wires are placed adjacent to the row of copper foil lands, and automatic soldering is sometimes done using jumper wires or copper foil. Soldering of electronic components is structured to prevent solder bridging between copper foil lands by attaching solder between lands and conductive wires.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19890982U JPS5999475U (en) | 1982-12-23 | 1982-12-23 | Soldering structure of electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19890982U JPS5999475U (en) | 1982-12-23 | 1982-12-23 | Soldering structure of electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5999475U true JPS5999475U (en) | 1984-07-05 |
Family
ID=30424465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19890982U Pending JPS5999475U (en) | 1982-12-23 | 1982-12-23 | Soldering structure of electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5999475U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5398065A (en) * | 1977-02-08 | 1978-08-26 | Nissan Motor | Method of mounting electronic element |
| JPS57141992A (en) * | 1981-02-25 | 1982-09-02 | Omron Tateisi Electronics Co | Printed board |
-
1982
- 1982-12-23 JP JP19890982U patent/JPS5999475U/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5398065A (en) * | 1977-02-08 | 1978-08-26 | Nissan Motor | Method of mounting electronic element |
| JPS57141992A (en) * | 1981-02-25 | 1982-09-02 | Omron Tateisi Electronics Co | Printed board |
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