JPS59189265U - Electronic component mounting equipment - Google Patents
Electronic component mounting equipmentInfo
- Publication number
- JPS59189265U JPS59189265U JP8358183U JP8358183U JPS59189265U JP S59189265 U JPS59189265 U JP S59189265U JP 8358183 U JP8358183 U JP 8358183U JP 8358183 U JP8358183 U JP 8358183U JP S59189265 U JPS59189265 U JP S59189265U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- component mounting
- mounting equipment
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
゛ 第1図aは従来の電子部品の取付装置の断面図
、同図すは同要部の拡大断面図、第2図aは従来の他の
例における電子部品の取付装置の断面図、同図すは同要
部の拡大断面図、第3図は本考案の一実施例の電子部品
の取付装置を示し、同図aは電子部品の側面図、同図す
は同電子部品を取付けた状態の断面図、同図Cは同要部
の拡大断面図である。
9・・・・・・電子部品、10・・・・・・リード線、
11・・・・・・端部、12・・・・・・プリント基板
、13・・・・・・孔、14・・・・・・導電部、15
・・・・・・ハンダ、16・・・・・・防湿コート。゛ Fig. 1a is a sectional view of a conventional electronic component mounting device, which is an enlarged sectional view of the same main part, and Fig. 2a is a sectional view of another conventional electronic component mounting device. Figure 3 shows an enlarged cross-sectional view of the main parts, Figure 3 shows an electronic component mounting device according to an embodiment of the present invention, Figure a is a side view of the electronic component, and Figure 3 shows a side view of the electronic component. A sectional view of the state, and Figure C is an enlarged sectional view of the main part. 9...Electronic components, 10...Lead wires,
11... end, 12... printed circuit board, 13... hole, 14... conductive part, 15
... Solder, 16 ... Moisture-proof coat.
Claims (1)
成し、前記リード線の端部をプリント基板の孔に挿入し
てプリント基板の裏面に沿って折曲するとともにハンダ
固着し、少なくとも前記ノ1ンダ固着部に防湿コートを
被着した電子部品の取付装置。An end of a lead wire of an electronic component is cut obliquely to form a tapered shape, the end of the lead wire is inserted into a hole of a printed circuit board, bent along the back surface of the printed circuit board, and fixed with solder, A mounting device for electronic components, wherein at least a moisture-proof coating is applied to the solder fixing portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8358183U JPS59189265U (en) | 1983-05-31 | 1983-05-31 | Electronic component mounting equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8358183U JPS59189265U (en) | 1983-05-31 | 1983-05-31 | Electronic component mounting equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59189265U true JPS59189265U (en) | 1984-12-15 |
Family
ID=30213539
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8358183U Pending JPS59189265U (en) | 1983-05-31 | 1983-05-31 | Electronic component mounting equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59189265U (en) |
-
1983
- 1983-05-31 JP JP8358183U patent/JPS59189265U/en active Pending
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