JPS62162850U - - Google Patents
Info
- Publication number
- JPS62162850U JPS62162850U JP5023986U JP5023986U JPS62162850U JP S62162850 U JPS62162850 U JP S62162850U JP 5023986 U JP5023986 U JP 5023986U JP 5023986 U JP5023986 U JP 5023986U JP S62162850 U JPS62162850 U JP S62162850U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- terminal part
- mounting
- side edge
- auxiliary terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 3
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は、本考案の一実施例の正面図、第２図
乃至第４図は使用状態の斜視図、第５図は、他の
実施例の正面図、第６図は、斜視図である。
１……絶縁基板、２……取付用端子部、４，１
４……補助端子部、４ａ……接続用パターン、５
……樹脂モールド部、６，１６……ハイブリツド
集積回路、７，１７……リード線付コネクタ、９
……実装基板（印刷配線板）、１４ａ……接続用
ピン。
Figure 1 is a front view of one embodiment of the present invention, Figures 2 to 4 are perspective views of the device in use, Figure 5 is a front view of another embodiment, and Figure 6 is a perspective view. be. 1...Insulating board, 2...Mounting terminal part, 4, 1
4... Auxiliary terminal section, 4a... Connection pattern, 5
... Resin molded part, 6, 16 ... Hybrid integrated circuit, 7, 17 ... Connector with lead wire, 9
... Mounting board (printed wiring board), 14a ... Connection pin.
Claims (1)
一側縁に印刷配線板への取付用端子部を設けると
ともに、絶縁基板の他の側縁にリード線付コネク
タ等を接続可能な補助端子部を設け、上記取付用
端子部と補助端子部以外の部分を樹脂モールドし
たハイブリツド集積回路。 A predetermined circuit is formed on an insulating substrate, a terminal part for mounting to a printed wiring board is provided on one side edge of the insulating substrate, and an auxiliary terminal that can connect a connector with a lead wire, etc. to the other side edge of the insulating substrate. A hybrid integrated circuit in which the parts other than the mounting terminal part and the auxiliary terminal part are resin-molded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5023986U JPS62162850U (en) | 1986-04-03 | 1986-04-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5023986U JPS62162850U (en) | 1986-04-03 | 1986-04-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62162850U true JPS62162850U (en) | 1987-10-16 |
Family
ID=30873416
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5023986U Pending JPS62162850U (en) | 1986-04-03 | 1986-04-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62162850U (en) |
-
1986
- 1986-04-03 JP JP5023986U patent/JPS62162850U/ja active Pending