CN113851574A - LED packaging structure body and manufacturing method thereof - Google Patents
LED packaging structure body and manufacturing method thereof Download PDFInfo
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- CN113851574A CN113851574A CN202111122519.3A CN202111122519A CN113851574A CN 113851574 A CN113851574 A CN 113851574A CN 202111122519 A CN202111122519 A CN 202111122519A CN 113851574 A CN113851574 A CN 113851574A
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- copper cup
- substrate
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- led chip
- copper
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
Abstract
The application discloses a manufacturing method of an LED packaging structure body, which comprises the steps of manufacturing a complete copper cup at one time, wherein the inner wall of the copper cup is a smooth surface; forming soldering flux on the area where the LED chip and the copper cup are correspondingly arranged on the substrate; fixing the LED chip and the copper cup on the substrate through soldering flux; and fixing the glass sheet at the opening of the copper cup to obtain the LED packaging structure body. Complete copper cup is made alone to the preparation method in this application, the copper cup is once only made, and the inner wall of copper cup is smooth surface, avoid the copper cup surface ripple, unsmooth, promote the technological precision and the yield of copper cup, fix copper cup and LED chip on the base plate again, and fix the glass piece at the opening part of copper cup, when LED packaging structure sent light, the effect reinforcing that light takes place the reflection at the smooth lateral wall of copper cup, and then promote LED packaging structure's light-emitting efficiency. The present application further provides an LED package structure having the above advantages.
Description
Technical Field
The present disclosure relates to the field of LED technologies, and in particular, to an LED package structure and a method for manufacturing the same.
Background
In the manufacturing process of the conventional Light-Emitting Diode (LED) package structure, an LED chip is first combined with a substrate, a copper cup with a certain thickness is then manufactured around the LED chip by multiple times of electroplating on the substrate, and after the copper cup is manufactured, a glass sheet is adhered to the copper cup.
The mode technology of many times electroplating preparation copper cup is more complicated to electroplate at every turn and carry out on the basis of previous electroplated copper layer, can appear the counterpoint of copper layer after electroplating many times and appear squinting, deckle edge scheduling problem, and process accuracy and yield are all lower, and because copper cup inner wall unevenness, to the light reflection difference who shines on the inner wall, influence the light-emitting rate of packaging structure.
Therefore, how to solve the above technical problems should be a great concern to those skilled in the art.
Disclosure of Invention
The present application provides an LED package structure and a method for manufacturing the same, so as to improve the yield and light-emitting rate of the LED package structure.
In order to solve the above technical problem, the present application provides a method for manufacturing an LED package structure, including:
manufacturing a complete copper cup at one time, wherein the inner wall of the copper cup is a smooth surface;
forming soldering flux on the area, where the LED chip and the copper cup are correspondingly arranged, on the substrate;
fixing the LED chip and the copper cup on the substrate through the soldering flux;
and fixing the glass sheet at the opening of the copper cup to obtain the LED packaging structure body.
Optionally, the one-time manufacturing of the complete copper cup includes:
and (4) stamping the copper cup through a stamping die.
Optionally, before forming the flux in the region where the LED chip and the copper cup are correspondingly disposed on the substrate, the method further includes:
coating a mask adhesive on the upper surface of the substrate;
exposing and developing the mask adhesive to reserve the mask adhesive corresponding to the LED chip area;
forming a reflecting layer in the area where the mask glue is developed on the upper surface of the substrate;
and removing the residual mask glue on the substrate.
Optionally, before the LED chip and the copper cup are fixed on the substrate by the flux, the method further includes:
and forming the reflecting layer on the inner surface of the copper cup.
Optionally, when the LED chip is a UVC LED chip, the reflective layer is an aluminum reflective layer.
Optionally, when the LED chip is fixed on the substrate in a normal mounting manner, after the LED chip and the copper cup are fixed on the substrate by the soldering flux, the method further includes:
and welding a lead between the electrode of the LED chip and the substrate.
The present application further provides an LED package structure manufactured by the above method, where the LED package structure includes:
a substrate;
the LED chip and the copper cup are arranged on the upper surface of the substrate;
and the glass sheet is arranged at the opening of the copper cup.
Optionally, the inner wall of the copper cup is an inclined surface.
Optionally, the method further includes:
and the reflecting layer is arranged on the inner wall of the copper cup.
Optionally, the method further includes:
and the reflecting layer is arranged between the substrate and the copper cup.
The application provides a method for manufacturing an LED packaging structure body, which comprises the following steps: manufacturing a complete copper cup at one time, wherein the inner wall of the copper cup is a smooth surface; forming soldering flux on the area, where the LED chip and the copper cup are correspondingly arranged, on the substrate; fixing the LED chip and the copper cup on the substrate through the soldering flux; and fixing the glass sheet at the opening of the copper cup to obtain the LED packaging structure body.
It can be seen that complete copper cup is made alone to LED packaging structure body preparation method in this application, the copper cup is once only made, and the inner wall of copper cup is smooth surface, avoid the copper cup surface ripple, unsmooth, promote the technological precision and the yield of copper cup, fix copper cup and LED chip on the base plate again, and fix the glass piece at the opening part of copper cup, when LED packaging structure body sent light, the effect reinforcing that light takes place the reflection at the smooth lateral wall of copper cup, and then promote LED packaging structure body's luminous efficacy.
In addition, the application also provides an LED packaging structure body with the advantages.
Drawings
For a clearer explanation of the embodiments or technical solutions of the prior art of the present application, the drawings needed for the description of the embodiments or prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a flowchart of a method for manufacturing an LED package structure according to an embodiment of the present disclosure;
fig. 2 is a flowchart of another method for manufacturing an LED package structure according to an embodiment of the present disclosure;
FIG. 3 is a top view of a copper cup in an embodiment of the present application;
FIG. 4 is a top view of a substrate after forming a reflective layer and solder paste thereon in an embodiment of the present invention;
fig. 5 is a schematic structural diagram of an LED package structure according to an embodiment of the present disclosure;
fig. 6 is a schematic structural diagram of another LED package structure provided in the embodiment of the present application.
Detailed Description
In order that those skilled in the art will better understand the disclosure, the following detailed description will be given with reference to the accompanying drawings. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those specifically described and will be readily apparent to those of ordinary skill in the art without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.
As described in the background art, the current way and process for manufacturing the copper cup by multiple times of electroplating are complex, each time of electroplating is performed on the basis of the previous copper layer electroplating, the problems of offset, burrs and the like of the alignment of the copper layer can occur after multiple times of electroplating, the process precision and the yield are low, and the light-emitting rate of the packaging structure body is influenced by the uneven inner wall of the copper cup and the reflection difference of light rays irradiated onto the inner wall.
In view of the above, the present application provides a method for manufacturing an LED package structure, please refer to fig. 1, where fig. 1 is a flowchart of a method for manufacturing an LED package structure according to an embodiment of the present application, and the method includes:
step S101: and manufacturing a complete copper cup at one time, wherein the inner wall of the copper cup is a smooth surface.
The method for manufacturing the complete copper cup at one time is not limited in the application and can be selected by oneself. Optionally, the one-time manufacturing of the complete copper cup includes: and (4) stamping the copper cup through a stamping die. Compared with the mode of manufacturing the copper cup by multiple times of electroplating, the mode of manufacturing the copper cup by stamping has the advantages of simple process, high manufacturing speed and low production cost. Or, the complete copper cup is processed at one time by adopting an etching mode.
Adopt the copper cup of electroplating process preparation among the prior art, its inner wall is vertical, the perpendicular to base plate surface, this application copper cup inner wall both can be vertical, also can be for the slope, and inclination can set up by oneself, and preferably, inclination is at 45 ~ 60. When the inner wall of the copper cup is an inclined surface, the light emitting efficiency of the LED packaging structure body can be increased.
Step S102: and forming soldering flux on the area of the substrate where the LED chip and the copper cup are correspondingly arranged.
The method of forming the flux on the substrate is not limited in the present application, and is determined according to the type of the flux. For example, when the soldering flux is solder paste or insulating paste, the soldering flux can be printed on the substrate in a screen printing manner in the area where the LED chip and the copper cup are correspondingly disposed; when the soldering flux is gold-tin alloy, the soldering flux can be formed in an evaporation mode in an area where the LED chip and the copper cup are correspondingly arranged on the substrate.
Step S103: and fixing the LED chip and the copper cup on the substrate through the soldering flux.
The LED chips include but are not limited to UVC LED chips, red LED chips, blue LED chips, green LED chips and the like, and are specifically arranged according to needs.
In the present application, the manner in which the LED chip is fixed to the substrate is not limited, as the case may be. For example, the LED chip may be fixed on the substrate in a flip-chip manner or in a flip-chip manner.
When the LED chip is fixed on the substrate in a flip-chip manner, the LED chip may be fixed on the substrate in an eutectic soldering manner, where the eutectic soldering manner may be a reflow soldering manner or a hot-pressing manner. The electrodes of the LED chips are electrically connected with the substrate through the soldering flux.
When the LED chip is fixed on the substrate in a normal installation mode, after the LED chip and the copper cup are fixed on the substrate through the soldering flux, the method further comprises the following steps:
and welding a lead between the electrode of the LED chip and the substrate.
Step S104: and fixing the glass sheet at the opening of the copper cup to obtain the LED packaging structure body.
The glass sheet is generally fixed at the opening of the copper cup in an adhesive manner. When the LED chip may be a UVC LED chip, the glass sheet is a quartz glass sheet.
Complete copper cup is made alone to LED packaging structure body manufacturing method in this application, the copper cup is once only made, and the inner wall of copper cup is glossy surface, avoid the copper cup surface ripple to appear, unsmooth, promote the technological precision and the yield of copper cup, fix copper cup and LED chip on the base plate again, and fix the glass piece at the opening part of copper cup, when LED packaging structure body sent light, the effect reinforcing that light takes place the reflection at the smooth lateral wall of copper cup, and then promote LED packaging structure body's luminous efficiency.
Referring to fig. 2, fig. 2 is a flowchart of another method for manufacturing an LED package structure according to an embodiment of the present disclosure.
Step S201: and manufacturing a complete copper cup at one time, wherein the inner wall of the copper cup is a smooth surface.
Step S202: and coating a mask adhesive on the upper surface of the substrate.
The mask photoresist may be a photoresist, or a UV (Ultraviolet) photoresist.
In the step, the mask glue is coated on the whole upper surface of the substrate, and in order to improve the uniformity of the thickness of the mask glue, a spin coating mode can be adopted.
Step S203: and exposing and developing the mask glue to reserve the mask glue corresponding to the LED chip area.
In the step, the area of the substrate corresponding to the LED chip is still provided with the mask glue, and the mask glue in other areas is developed.
Step S204: and forming a reflecting layer in the area where the mask glue is developed on the upper surface of the substrate.
Note that the manner of forming the reflective layer is not limited in the present application and may be selected. For example, a plating method, an evaporation method, a magnetron sputtering method, or the like can be used.
In the present application, the material of the reflective layer is not particularly limited, and is determined according to the type of light emission of the LED package structure. For example, when the LED package structure is a UVC LED package structure, the reflective layer may be made of aluminum, copper, or gold, preferably, when the LED chip is a UVC LED chip, the reflective layer is an aluminum reflective layer, and a reflectivity of aluminum to UVC light is the highest, which is about 99%, so that light extraction efficiency of the LED package structure can be maximally improved; when the LED package structure is a red LED package structure, the material of the reflective layer may be silver, silver-tin alloy, or the like.
Step S205: and removing the residual mask glue on the substrate.
Step S206: and forming soldering flux in the area where the LED chip is correspondingly arranged on the substrate and the area where the copper cup is correspondingly arranged on the reflecting layer.
When the reflective layer is formed on the substrate, the copper cup is disposed on the reflective layer.
Step S207: and respectively fixing the LED chip and the copper cup on the substrate and the reflecting layer through the soldering flux.
Step S208: and fixing the glass sheet at the opening of the copper cup to obtain the LED packaging structure body.
In the method for manufacturing the LED package structure in this embodiment, the reflective layer is disposed around the LED chip on the substrate, so that reflection of light around the LED chip can be enhanced, and thus light extraction efficiency of the LED package structure is improved.
Further, in an embodiment of the present application, before the fixing the LED chip and the copper cup on the substrate by the flux, the method further includes:
and forming the reflecting layer on the inner surface of the copper cup.
Note that the manner of forming the reflective layer is not limited in the present application and may be selected. For example, a plating method, an evaporation method, a magnetron sputtering method, or the like can be used.
In this embodiment, all set up the reflection stratum around the LED chip on the base plate and the inner wall of copper cup, not only the reinforcing is to the reflection of LED chip light all around, can also strengthen the reflection to shining copper cup inner wall light, further promotes the light-emitting efficiency of LED packaging structure body.
It can be understood that, in order to improve the manufacturing efficiency of the LED device, the plurality of substrates are in the form of a substrate array, and the plurality of LED chips and the plurality of copper cups are soldered simultaneously during the corresponding die bonding, and then a glass sheet is attached, and finally the substrate array is cut to obtain a single LED package structure.
The following explains a method for manufacturing an LED package structure according to the present application, taking a UVC LED chip as an example.
step 9, covering the quartz glass sheet at the opening of the copper cup through adhesive glue to obtain an LED packaging structure array;
step 10, cutting the UVC LED packaging structure array along a cutting pair bit line on the DPC aluminum nitride ceramic substrate, and then irradiating UV light to remove a film to form independent small UVC LED packaging structures;
and step 12, warehousing.
Compared with the existing UVC LED packaging structure body, the light emitting efficiency of the UVC LED packaging structure body manufactured by the method is improved by more than 40%.
The present application also provides an LED package structure, as shown in fig. 5, which is manufactured by the LED package structure manufacturing method according to claim 1, and includes:
a substrate 1;
the LED chip 3 and the copper cup 2 are arranged on the upper surface of the substrate 1;
and the glass sheet 4 is arranged at the opening of the copper cup 2.
The substrate 1 includes, but is not limited to, a ceramic substrate, a metal plate, and a bt (bis amide triazine) plate, wherein a surface of the ceramic substrate is provided with a copper and gold wiring layer 11.
In the present application, the type of the LED chip 3 is not limited, and the LED chip is set as needed. For example, the LED chip 3 may be a UVC LED chip, a red LED chip, a blue LED chip, a green LED chip, or the like. When the LED chip 3 may be a UVC LED chip, the glass sheet 4 is a quartz glass sheet.
It should be noted that the form of the LED chip 3 disposed on the substrate 1 is not limited in the present application, and for example, the LED chip 3 may be fixed on the substrate 1 in a normal mounting manner or fixed on the substrate 1 in a flip-chip manner. The electrodes 31 of the LED chip 3 need to be electrically connected to the substrate 1.
It should be further noted that, in the present application, whether the inner wall of the copper cup 2 is inclined or not is not limited, the inner wall of the copper cup 2 is a vertical surface, or the inner wall of the copper cup 2 is an inclined surface, and the inclination angle may be set by itself, and is preferably 45 ° to 60 °. When the inner wall of the copper cup 2 is an inclined surface, the light emitting efficiency of the LED packaging structure body can be increased.
The glass plate 4 is typically secured to the opening of the copper cup 2 by an adhesive 5.
LED packaging structure in this application, produce complete copper cup 2 alone when the preparation, copper cup 2 once only makes out, and the inner wall of copper cup 2 is glossy surface, avoid the ripple to appear on copper cup 2 surface, unevenness, promote copper cup 2's technological accuracy and yield, fix copper cup 2 and LED chip 3 on base plate 1 again, and fix glass piece 4 at copper cup 2's opening part, when LED packaging structure sent light, the effect reinforcing of reflection takes place at copper cup 2's smooth lateral wall for light, and then promote LED packaging structure's light-emitting efficiency.
Referring to fig. 6, fig. 6 is a schematic structural diagram of another LED package structure according to an embodiment of the present disclosure. On the basis of the above embodiments, in one embodiment of the present application, the LED package structure further includes:
and the reflecting layer 6 is arranged on the inner wall of the copper cup 2.
The reflection of the light rays irradiating the inner wall of the copper cup 2 can be enhanced by the reflection layer 6 on the inner wall of the copper cup 2, and the light emitting efficiency of the LED packaging structure body is further improved.
Further, the LED package structure further includes:
and the reflecting layer 6 is arranged between the substrate 1 and the copper cup 2.
In the present application, the material of the reflective layer 6 is not particularly limited, and is determined according to the type of light emission of the LED package structure. For example, when the LED package structure is a UVC LED package structure, the reflective layer 6 may be made of aluminum, copper, or gold, preferably, when the LED chip 3 is a UVC LED chip 3, the reflective layer 6 is the aluminum reflective layer 6, and the reflectivity of aluminum to UVC light is the highest, which is about 99%, so that the light extraction efficiency of the LED package structure can be maximally improved; when the LED package structure is a red LED package structure, the material of the reflective layer 6 may be silver, silver-tin alloy, or the like.
In this embodiment, all set up reflection stratum 6 around LED chip 3 and the inner wall of copper cup 2 on base plate 1, not only the reinforcing is to the reflection of LED chip 3 light all around, can also strengthen the reflection to the 2 inner wall light of copper cup, further promotes the light-emitting efficiency of LED packaging structure.
The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same or similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
The LED package structure and the method for manufacturing the same provided by the present application are described in detail above. The principles and embodiments of the present application are explained herein using specific examples, which are provided only to help understand the method and the core idea of the present application. It should be noted that, for those skilled in the art, it is possible to make several improvements and modifications to the present application without departing from the principle of the present application, and such improvements and modifications also fall within the scope of the claims of the present application.
Claims (10)
1. A method for manufacturing an LED packaging structure body is characterized by comprising the following steps:
manufacturing a complete copper cup at one time, wherein the inner wall of the copper cup is a smooth surface;
forming soldering flux on the area, where the LED chip and the copper cup are correspondingly arranged, on the substrate;
fixing the LED chip and the copper cup on the substrate through the soldering flux;
and fixing the glass sheet at the opening of the copper cup to obtain the LED packaging structure body.
2. The method for manufacturing an LED package structure according to claim 1, wherein the one-time manufacturing of the complete copper cup comprises:
and (4) stamping the copper cup through a stamping die.
3. The method of manufacturing an LED package structure according to claim 1, wherein before forming the flux in the region where the LED chip and the copper cup are provided on the substrate, the method further comprises:
coating a mask adhesive on the upper surface of the substrate;
exposing and developing the mask adhesive to reserve the mask adhesive corresponding to the LED chip area;
forming a reflecting layer in the area where the mask glue is developed on the upper surface of the substrate;
and removing the residual mask glue on the substrate.
4. The method of manufacturing an LED package structure according to claim 3, wherein before the fixing the LED chip and the copper cup on the substrate by the flux, the method further comprises:
and forming the reflecting layer on the inner surface of the copper cup.
5. The method of manufacturing an LED package structure according to claim 4, wherein when the LED chip is a UVC LED chip, the reflective layer is an aluminum reflective layer.
6. The method of manufacturing an LED package structure according to any one of claims 1 to 5, wherein, when the LED chip is fixed on the substrate in a face-up form, after the fixing of the LED chip and the copper cup on the substrate by the flux, further comprising:
and welding a lead between the electrode of the LED chip and the substrate.
7. An LED package structure produced by the LED package structure production method according to claim 1, comprising:
a substrate;
the LED chip and the copper cup are arranged on the upper surface of the substrate;
and the glass sheet is arranged at the opening of the copper cup.
8. The LED package structure of claim 7, wherein the inner wall of the copper cup is a sloped surface.
9. The LED package structure of claim 8, further comprising:
and the reflecting layer is arranged on the inner wall of the copper cup.
10. The LED package structure according to any one of claims 7 to 9, further comprising:
and the reflecting layer is arranged between the substrate and the copper cup.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111122519.3A CN113851574A (en) | 2021-09-24 | 2021-09-24 | LED packaging structure body and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111122519.3A CN113851574A (en) | 2021-09-24 | 2021-09-24 | LED packaging structure body and manufacturing method thereof |
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| CN113851574A true CN113851574A (en) | 2021-12-28 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202601729U (en) * | 2012-05-31 | 2012-12-12 | 深圳市华高光电科技有限公司 | LED (Light-Emitting Diode) encapsulating structure |
| JP2014063777A (en) * | 2012-09-19 | 2014-04-10 | Chang Wah Electromaterials Inc | Method of manufacturing light-emitting diode package and structure thereof |
| CN106299084A (en) * | 2016-08-30 | 2017-01-04 | 开发晶照明（厦门）有限公司 | LED flip chip base plate for packaging and LED encapsulation structure |
| CN109713107A (en) * | 2018-12-13 | 2019-05-03 | 佛山市国星光电股份有限公司 | Supporting structure, LED component and lamp group array |
| CN112885942A (en) * | 2021-03-18 | 2021-06-01 | 宁波升谱光电股份有限公司 | UVC packaging device, manufacturing method thereof and UVC light source |
-
2021
- 2021-09-24 CN CN202111122519.3A patent/CN113851574A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202601729U (en) * | 2012-05-31 | 2012-12-12 | 深圳市华高光电科技有限公司 | LED (Light-Emitting Diode) encapsulating structure |
| JP2014063777A (en) * | 2012-09-19 | 2014-04-10 | Chang Wah Electromaterials Inc | Method of manufacturing light-emitting diode package and structure thereof |
| CN106299084A (en) * | 2016-08-30 | 2017-01-04 | 开发晶照明（厦门）有限公司 | LED flip chip base plate for packaging and LED encapsulation structure |
| CN109713107A (en) * | 2018-12-13 | 2019-05-03 | 佛山市国星光电股份有限公司 | Supporting structure, LED component and lamp group array |
| CN112885942A (en) * | 2021-03-18 | 2021-06-01 | 宁波升谱光电股份有限公司 | UVC packaging device, manufacturing method thereof and UVC light source |
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