CN109713107A - Supporting structure, LED component and lamp group array - Google Patents
Supporting structure, LED component and lamp group array Download PDFInfo
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- CN109713107A CN109713107A CN201811526283.8A CN201811526283A CN109713107A CN 109713107 A CN109713107 A CN 109713107A CN 201811526283 A CN201811526283 A CN 201811526283A CN 109713107 A CN109713107 A CN 109713107A
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Abstract
The present invention provides a kind of supporting structure, LED component and lamp group arrays, wherein supporting structure includes: supporting substrate；Metal framework, metal framework is arranged on supporting substrate, and surrounds the cup chamber for chip, and metal framework includes stacked multiple layer metal frame, and multiple layer metal frame is formed by electroplating technology and is mutually fixedly connected.The problem of present invention solves in the prior art, is formed because the bracket of LED component is whole by ceramic post sintering, and it is difficult that there are process for machining and manufacturing, optical property out that is at high cost and influencing LED component.
Description
Technical field
The present invention relates to technical field of LED light illumination, in particular to a kind of supporting structure, LED component and lamp group battle array
Column.
Background technique
Ultraviolet LED or deep ultraviolet LED, with powerful biocidal efficacies, are made extensively with it in refrigerator or family's electric lighting
With.
In order to ensure the service life of LED component chip, it usually needs be sealed protection to chip.Traditional packaging process
It is middle that protection is sealed to chip using the organic materials such as silica gel, epoxy resin, but above-mentioned organic material is in high temperature, Gao Zi
The job stability of LED component has been seriously affected to easily cause component failure using easy aged deterioration in external environment, because
This, organic packages have gradually been eliminated in LED encapsulation technology field.
In the related technology, inorganic encapsulated is widely used, i.e., package assembling lid made of inorganic translucent material is located at use
In on the bracket of carrying chip, and the two is bonded to play the role of encapsulating chip.
In the prior art, it is normally made of porcelain for carrying the bracket of chip, for convenience between package assembling
Installation connection, while ensuring that the light issued to chip plays the role of convergence, ceramics bracket usually requires setting cup chamber, this shape
The ceramic stand structure of formula is complicated, and sintering difficulty is big, and processing and manufacturing is at high cost, therefore, improves the overall cost of LED component,
It is unfavorable for the promotion of LED component product competitiveness in the market.Moreover, ceramics are lower to the reflectivity of ultraviolet light, and ceramics are also
With the performance of ultraviolet light is absorbed, to affect the optical property out of LED component.
Summary of the invention
The main purpose of the present invention is to provide a kind of supporting structure, LED component and lamp group arrays, to solve the prior art
In LED component bracket integrally formed by ceramic post sintering, there are process for machining and manufacturing difficulty, it is at high cost and influence LED
The problem of going out optical property of device.
To achieve the goals above, according to an aspect of the invention, there is provided a kind of supporting structure, comprising: branch support group
Plate；Metal framework, metal framework is arranged on supporting substrate, and surrounds the cup chamber for chip, and metal framework includes folded
The multiple layer metal frame set.
Further, multiple layer metal frame is formed by electroplating technology and is mutually fixedly connected.
Further, the height H of metal framework is more than or equal to 300um and is less than or equal to 700um, and the thickness of each layer metal frame
It spends T and is not more than 150um.
Further, supporting substrate includes substrate body and metal connecting layer, and metal connecting layer is formed by sintering process
In the upper surface of substrate body, metal framework is arranged in metal connecting layer, and metal framework includes at least double layer of metal frame, and gold
The underlying metal frame for belonging to frame is fixed on the upper surface of metal connecting layer by electroplating technology molding.
Further, the upper surface of metal framework is coated with coat of metal；At least one side surface of metal framework and/or
It is coated with coat of metal.
Further, substrate body is made of ceramic, and metal connecting layer and metal framework are made of copper, and coat of metal is
Layer gold or silver layer.
Further, metal framework towards cup chamber side inner peripheral surface and/or metal framework deviate from cup chamber side
Peripheral surface be the smooth surface for passing through technique for grinding or spraying process and being formed.
Further, metal framework towards cup chamber side inner peripheral surface and/or metal framework deviate from cup chamber side
Peripheral surface be the rough surface with concave-convex relief fabric.
Further, the chamber cross-sectional area of cup chamber is gradually increased along the direction far from supporting substrate.
Further, the chamber cross section of cup chamber is round or quadrangle, and one end of the separate supporting substrate of cup chamber, which is formed, opens
Mouthful, and the inner peripheral surface towards cup chamber side of metal framework is tilted from the upper surface of supporting substrate to opening side.
Further, the lower surface of supporting substrate is additionally provided with metal-polar plate, and the bottom of metal-polar plate is provided with gold
Belong to reinforcer.
Further, the peripheral surface of metal framework includes multiple outside wall surfaces being connected, the company of two neighboring outside wall surface
Place is met along cambered surface transition.
Further, projection of the metal framework in the upper surface of supporting substrate is located at the inside of the upper surface of supporting substrate.
According to another aspect of the present invention, a kind of LED component is provided, comprising: supporting structure, supporting structure are above-mentioned
Supporting structure；Chip, chip be mounted on supporting structure cup is intracavitary and and pad solder；Package assembling, package assembling lid are located at
The upper surface of the metal framework of supporting structure, with seal cup chamber.
Further, the upper surface of metal framework has bonding layer compatible with its area, and package assembling passes through splicing
Layer is Nian Jie with metal framework.
Further, package assembling is song of the upper surface in the part of the surface that the flat-plate lens or upper surface of plane are curved surface
Face lens.
Further, the lower surface of package assembling is formed with protrusion, the cross-sectional shape of protrusion and the cup chamber of metal framework
Chamber section be adapted, when package assembling lid is located at the upper surface of metal framework, it is intracavitary that protrusion is located at cup.
According to another aspect of the present invention, a kind of lamp group array, including support frame are provided, with the shape of array on support frame
Formula arrangement is provided with multiple LED components, and LED component is above-mentioned LED component.
It applies the technical scheme of the present invention, by optimizing the composition of supporting structure, supporting structure is arranged to include support
The separate structure form of substrate and the metal framework being arranged on supporting substrate, so that it is independent to form each section of supporting structure
It plays a role；I.e. supporting substrate plays the role of the stabilization installation to chip, and metal framework is for connecting installation with package assembling；
Since metal framework includes the multiple layer metal frame for being formed by electroplating technology and being mutually fixedly connected, the difficulty of processing of itself is obtained
Simplification, and supporting substrate is connected with metal framework, the supporting structure of this separate structure form is also easily worked manufacture, favorably
In the overall cost for reducing supporting structure, the economy and the market competitiveness of LED component are promoted, and utilizes metal framework
Metallic character, so that supporting structure and package assembling have multifarious connection type, and metal framework will not absorb and be located at
The light that the intracavitary chip of cup issues, while being more advantageous to the light issued to chip and reflecting, promote LED component goes out light
Performance, the comprehensive product quality for improving LED component.
Detailed description of the invention
The accompanying drawings constituting a part of this application is used to provide further understanding of the present invention, and of the invention shows
Examples and descriptions thereof are used to explain the present invention for meaning property, does not constitute improper limitations of the present invention.In the accompanying drawings:
Fig. 1 shows the main view schematic cross-sectional view of the supporting structure of embodiment according to the present invention one；
Fig. 2 shows the main view schematic cross-sectional views of the supporting structure of embodiment according to the present invention two；
Fig. 3 shows the main view schematic cross-sectional view of the supporting structure of embodiment according to the present invention three；
Fig. 4 shows the main view schematic cross-sectional view of the supporting structure of embodiment according to the present invention four；
Fig. 5 shows the schematic top plan view of the supporting structure in Fig. 1；
The upper surface that Fig. 6 shows the metal framework of the supporting structure in Fig. 5 is coated with the schematic top plan view of bonding layer；
Fig. 7 shows a kind of main view schematic cross-sectional view of the LED component of alternative embodiment according to the present invention；
Fig. 8 shows the main view schematic cross-sectional view of the LED component of another alternative embodiment according to the present invention.
Wherein, the above drawings include the following reference numerals:
1, supporting structure；2, chip；3, package assembling；4, bonding layer；10, supporting substrate；11, substrate body；12, metal
Articulamentum；13, metal-polar plate；14, metal reinforcement；20, metal framework；21, cup chamber；211, it is open；22, metal frame；23,
Peripheral surface；231, outside wall surface；24, inner peripheral surface；30, concave-convex relief fabric；31, flat-plate lens；32, toroidal lens；33, convex
Portion；40, pad.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that the described embodiment is only a part of the embodiment of the present invention, instead of all the embodiments.It is right below
The description only actually of at least one exemplary embodiment be it is illustrative, never as to the present invention and its application or use
Any restrictions.Based on the embodiments of the present invention, those of ordinary skill in the art are without creative efforts
Every other embodiment obtained, shall fall within the protection scope of the present invention.
It is formed to solve the bracket entirety of LED component in the prior art by ceramic post sintering, there are processing and manufacturing works
The problem of skill is difficult, optical property out that is at high cost and influencing LED component, the present invention provides a kind of supporting structures, LED component
With lamp group array, wherein lamp group array includes above-mentioned and following LED component, and LED component has above-mentioned and following bracket knot
Structure.
Embodiment one
Fig. 1 shows the main view schematic cross-sectional view of the supporting structure of embodiments herein one, as shown, supporting structure 1
Including supporting substrate 10 and metal framework 20, metal framework 20 is arranged on supporting substrate 10, and surrounds for chip 2
Cup chamber 21, metal framework 20 include stacked multiple layer metal frame 22, and multiple layer metal frame 22 is formed by electroplating technology and mutually fixed
Connection.
By optimizing the composition of supporting structure 1, supporting structure 1 is arranged to include supporting substrate 10 and setting in branch support group
The separate structure form of metal framework 20 on plate 10 individually plays a role so that each section of supporting structure 1 be made to form；Prop up
Support group plate 10 plays the role of the stabilization installation to chip 2, and metal framework 20 is used to connect installation with package assembling 3.
Since metal framework 20 includes the multiple layer metal frame 22 for being formed by electroplating technology and being mutually fixedly connected, itself
Difficulty of processing is simplified, and supporting substrate 10 and metal framework 20 connect, the supporting structure 1 of this separate structure form
It is easily worked manufacture, advantageously reduces the overall cost of supporting structure 1, promotes the economy and the market competitiveness of LED component,
And using the metallic character of metal framework 20, so that supporting structure 1 and package assembling 3 have multifarious connection type.
As shown in figure 5, the peripheral surface 23 of metal framework 20 includes multiple outside wall surfaces 231 being connected, it is two neighboring outer
The junction of wall surface 231 is along cambered surface transition.
Further, projection of the metal framework 20 in the upper surface of supporting substrate 10 is located at the upper surface of supporting substrate 10
It is internal.In this way, metal framework 20 is cut to when preventing from being cut into single led device after multiple LED component co-productions, from
And it damages metal framework 20 and causes LED component light leakage.
In addition, metal framework 20 will not absorb the light of the sending of the chip 2 in cup chamber 21, while being more advantageous to core
The light that piece 2 issues is reflected, and the optical property that goes out of LED component, the comprehensive product quality for improving LED component are promoted.
Optionally, in the present embodiment, the height H of metal framework 20 is more than or equal to 300um and is less than or equal to 700um, and
The thickness T of each layer metal frame 22 is not more than 150um.By the numberical range and single layer of gold that optimize the height H of metal framework 20
The numberical range for belonging to the thickness T of frame 22, not only enables 20 adaptation application of metal framework in the core of various different model sizes
Piece 2 improves the practicality, and the processing and manufacturing for avoiding the excessive height of metal framework 20 and increasing metal framework 20 consumes
Material improves the economy of supporting structure 1.
As shown in Figure 1, supporting substrate 10 includes substrate body 11 and metal connecting layer 12, metal connecting layer 12 passes through sintering
Technological forming is arranged in metal connecting layer 12 in the upper surface of substrate body 11, metal framework 20；In this way, in substrate body 11
Upper surface be sintered to form metal connecting layer 12, it is ensured that metal connecting layer 12 is located at the stability in substrate body 11, and gold
Belong to articulamentum 12 be conducive to and be all metal material metal framework 20 connection, reduce the difficulty of Joining Technology, mention simultaneously
Connective stability between the two is risen, so that the overall structure of supporting structure 1 is firm.
Optionally, metal framework 20 includes at least double layer of metal frame 22, and the underlying metal frame 22 of metal framework 20 passes through
Electroplating technology forms the upper surface for being fixed on metal connecting layer 12.This ensures that, 22 institutes of metal frame that at least two layers of phase is stacked
The cup chamber 21 surrounded has enough volumes and can accommodate chip 2, improves the stabilization that chip 2 is mounted on supporting structure 1
Property；And be conducive to control the overall cost of supporting structure 1.
In this embodiment, it is preferred that metal framework 20 includes three-layer metal frame 22.
Optionally, the upper surface of metal framework 20 is coated with coat of metal；In the embodiment, coat of metal is played pair
The protective effect of the upper surface of metal framework 20 prevents the upper surface of metal framework 20 to be oxidized and surface irregularity, thus shadow
It rings lid and is located at the package assembling 3 on the upper surface of metal framework 20 and the air-tightness between it；And it is protected by optimal control metal
The gross area of sheath, makes it efficiently play performance, is conducive to the forming cost for controlling supporting structure 1.
Certainly, in another alternative embodiment, at least one side surface of metal framework 20 is coated with coat of metal.This
Sample, so that the outer surface of metal framework 20, inner surface and upper surface are protected by coat of metal and avoid oxidation by air,
In addition, the coat of metal that the inner surface of metal framework 20 is coated with can also improve the reflecting effect to emit beam to chip 2, from
And further promote the luminous intensity of LED component.
Optionally, in the present embodiment, substrate body 11 is made of ceramic, and metal connecting layer 12 and metal framework 20 are by copper
At coat of metal is layer gold or silver layer.The supporting structure 1 of this material combining form is convenient for the materials of Each part, pole
The earth has saved the overall processing manufacturing cost of supporting structure 1.
The lower surface of supporting substrate 10 is additionally provided with metal-polar plate 13, and the bottom of metal-polar plate 13 is provided with metal and adds
Strong part 14.The setting of metal reinforcement 14 can be avoided because metal is different from the stress of ceramics, and metal-polar plate 13 is bent
The phenomenon that, prevent the problem of failure welding occur in subsequent LED component use process.
As shown in Figure 1 and Figure 5, in the present embodiment, the inner peripheral surface 24 and gold towards 21 side of cup chamber of metal framework 20
The peripheral surface 23 away from 21 side of cup chamber for belonging to frame 20 is the smooth surface formed by technique for grinding or spraying process.Gold
The inner peripheral surface 24 of category frame 20 is smooth to be conducive to improve the reflecting effect for emitting beam to chip 2, promotes shining for LED component
Intensity；The smooth overall structure appearance for making LED component of the peripheral surface 23 of metal framework 20 is regular, is conducive to promote LED device
The aesthetic appearance of part.
Certainly, it is contemplated that the complexity of the process for machining and manufacturing of supporting structure 1, in the inner peripheral surface to metal framework 20
24 and peripheral surface 23 when being handled, also the property of can choose only to the inner peripheral surface 24 of metal framework 20 or only to metal frame
The peripheral surface 23 of frame 20 is polished or spraying, to form smooth surface.
Embodiment two
As shown in Fig. 2, the difference of the embodiment and embodiment one is, metal framework 20 towards the interior of 21 side of cup chamber
Perimeter surface 24 and the peripheral surface 23 away from 21 side of cup chamber of metal framework 20 are the coarse table with concave-convex relief fabric 30
Face.It should be noted that concave-convex relief fabric 30 is the self-assembling formation when plating multiple layers metal frame 22 is to form metal framework 20
, it is contemplated that the structure size very little of metal framework 20, avoid increasing subsequent processing technology and reduce metal framework 20 at
Type cost, the bumps relief fabric 30 can rationally exist, and not interfere with the Integral luminous effect of LED component, and metal frame
The peripheral surface 23 of frame 20 has concave-convex relief fabric 30, grabs when being easily installed LED component to it.
Certainly, it is contemplated that the complexity of the process for machining and manufacturing of supporting structure 1, in the inner peripheral surface to metal framework 20
24 and peripheral surface 23 when being handled, also the property of can choose only to the inner peripheral surface 24 of metal framework 20 or only to metal frame
The peripheral surface 23 of frame 20 is polished or spraying, to form smooth surface.Only make the peripheral surface 23 or interior of metal framework 20
There is concave-convex relief fabric 30 in perimeter surface 24.
Embodiment three
As shown in figure 3, the difference of the embodiment and embodiment one is, the peripheral surface 23 of metal framework 20 has bumps
Relief fabric 30；Importantly, the chamber cross-sectional area of cup chamber 21 is gradually increased along the direction far from supporting substrate 10.This knot
The cup chamber 21 of configuration formula is more advantageous to the diverging that chip 2 emits beam, and has greatly improved the luminescent properties of LED component.
Optionally, it is contemplated that formed convenient for cup chamber 21, so that the overall structure of metal framework 20 is regular, the chamber of cup chamber 21 is horizontal
Section is round or quadrangle, and one end of the separate supporting substrate 10 of cup chamber 21 forms opening 211, and the direction of metal framework 20
The inner peripheral surface 24 of 21 side of cup chamber is tilted from the upper surface of supporting substrate 10 to 211 sides of opening.
Example IV
As shown in figure 4, the difference of the embodiment and embodiment three is, the inner peripheral surface 24 of metal framework 20 also has recessed
Convex relief fabric 30.
As shown in Figure 7 and Figure 8, LED component provided by the present application includes supporting structure 1, chip 2 and package assembling 3,
In, supporting structure 1 is above-mentioned supporting structure, and chip 2 is mounted in the cup chamber 21 of supporting structure 1 and welds with pad 40, envelope
Arrangement 3 covers the upper surface for being located at the metal framework 20 of supporting structure 1, with seal cup chamber 21.Pad 40 is the portion of supporting structure 1
Separation structure, part of it is formed in the upper surface of the substrate body 11 of supporting structure 1, and is located in cup chamber 21；In this application,
Chip 2 is chosen as that the chip of ultraviolet light or deep ultraviolet light can be issued.
The difference of Fig. 7 and Fig. 8 for needing to illustrate, wherein Fig. 7 be the embodiment two in Fig. 2 supporting structure 1 on cover
The LED component that package assembling 3 is formed, and package assembling 3 in the embodiment is the flat-plate lens 31 that upper surface is in plane.Add
The package assembling 3 for covering this structure type is conducive to control LED while ensuring LED component with light-out effect is stablized
The overall dimensions of device.And in fig. 8, be the embodiment one in Fig. 1 supporting structure 1 on covered package assembling 3 formation
LED component, and the package assembling 3 in the embodiment is the toroidal lens 32 for the part of the surface that upper surface is curved surface.Cover this
The package assembling 3 of kind structure type, can advanced optimize the area of LED component light emitting angle and light-emitting surface.
Optionally, the upper surface of toroidal lens 32 is the part of the surface of spherical surface or the part of the surface of ellipsoid.
In the alternative embodiment of Fig. 8, the lower surface of package assembling 3 is formed with protrusion 33, the cross-sectional shape of protrusion 33
It is adapted with the chamber section of the cup chamber 21 of metal framework 20, when the lid of package assembling 3 is located at the upper surface of metal framework 20, protrusion
33 are located in cup chamber 21.Protrusion 33 is located in cup chamber 21, the cavity wall face counter stopper with cup chamber 21, to play fool proof work
With convenient for the assembly positioning between package assembling 3 and metal framework 20.As shown in Figures 5 to 7, Fig. 5 shows the reality in Fig. 1
The schematic top plan view of the supporting structure 1 of example one is applied, Fig. 6 shows the upper surface of the metal framework 20 of the supporting structure 1 in Fig. 5
It coats glue and forms bonding layer 4, i.e., as shown in fig. 7, the upper surface of metal framework 20 has splicing compatible with its area
The upper surface that layer 4, i.e. bonding layer 4 are paved with metal framework 20, package assembling 3 are Nian Jie with metal framework 20 by bonding layer 4.It is glued
The setting of layer 4 is conducive to the bonding stability for promoting package assembling 3 and metal framework 20, and improves the whole outer of LED component
See aesthetic feeling.
It should be noted that lamp group array provided by the present application, including support frame, arrange in an array manner on support frame
It is provided with multiple above-mentioned LED components.
It should be noted that term used herein above is merely to describe specific embodiment, and be not intended to restricted root
According to the illustrative embodiments of the application.As used herein, unless the context clearly indicates otherwise, otherwise singular
Also it is intended to include plural form, additionally, it should be understood that, when in the present specification using term "comprising" and/or " packet
Include " when, indicate existing characteristics, step, operation, device, component and/or their combination.
Unless specifically stated otherwise, positioned opposite, the digital table of the component and step that otherwise illustrate in these embodiments
It is not limited the scope of the invention up to formula and numerical value.Simultaneously, it should be appreciated that for ease of description, each portion shown in attached drawing
The size divided not is to draw according to actual proportionate relationship.For technology, side known to person of ordinary skill in the relevant
Method and equipment may be not discussed in detail, but in the appropriate case, and the technology, method and apparatus should be considered as authorizing explanation
A part of book.In shown here and discussion all examples, any occurrence should be construed as merely illustratively, and
Not by way of limitation.Therefore, the other examples of exemplary embodiment can have different values.It should also be noted that similar label
Similar terms are indicated in following attached drawing with letter, therefore, once it is defined in a certain Xiang Yi attached drawing, then subsequent attached
It does not need that it is further discussed in figure.
For ease of description, spatially relative term can be used herein, as " ... on ", " ... top ",
" ... upper surface ", " above " etc., for describing such as a device shown in the figure or feature and other devices or spy
The spatial relation of sign.It should be understood that spatially relative term is intended to comprising the orientation in addition to device described in figure
Except different direction in use or operation.For example, being described as if the device in attached drawing is squeezed " in other devices
It will be positioned as " under other devices or construction after part or construction top " or the device of " on other devices or construction "
Side " or " under other devices or construction ".Thus, exemplary term " ... top " may include " ... top " and
" in ... lower section " two kinds of orientation.The device can also be positioned with other different modes and (is rotated by 90 ° or in other orientation), and
And respective explanations are made to the opposite description in space used herein above.
It should be noted that term used herein above is merely to describe specific embodiment, and be not intended to restricted root
According to the illustrative embodiments of the application.As used herein, unless the context clearly indicates otherwise, otherwise singular
Also it is intended to include plural form, additionally, it should be understood that, when in the present specification using term "comprising" and/or " packet
Include " when, indicate existing characteristics, step, work, device, component and/or their combination.
It should be noted that the description and claims of this application and term " first " in above-mentioned attached drawing, "
Two " etc. be to be used to distinguish similar objects, without being used to describe a particular order or precedence order.It should be understood that using in this way
Data be interchangeable under appropriate circumstances, so that presently filed embodiment described herein can be in addition to illustrating herein
Or the sequence other than those of description is implemented.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (18)
1. a kind of supporting structure characterized by comprising
Supporting substrate (10)；
Metal framework (20), the metal framework (20) is arranged on the supporting substrate (10), and surrounds for chip
(2) cup chamber (21), the metal framework (20) include stacked multiple layer metal frame (22).
2. supporting structure according to claim 1, which is characterized in that the multiple layer metal frame (22) by electroplating technology at
Type is simultaneously mutually fixedly connected.
3. supporting structure according to claim 1, which is characterized in that the height H of the metal framework (20) is more than or equal to
300um and be less than or equal to 700um, and the thickness T of each layer metal frame (22) be not more than 150um.
4. supporting structure according to claim 1, which is characterized in that the supporting substrate (10) includes substrate body (11)
With metal connecting layer (12), the metal connecting layer (12) is molded over the upper table of the substrate body (11) by sintering process
Face, the metal framework (20) are arranged on the metal connecting layer (12), and the metal framework (20) includes at least two layers institute
State metal frame (22), and metal frame (22) described in the bottom of the metal framework (20) be fixed on by electroplating technology molding it is described
The upper surface of metal connecting layer (12).
5. supporting structure according to claim 4, which is characterized in that
The upper surface of the metal framework (20) is coated with coat of metal；And/or
At least one side surface of the metal framework (20) is coated with coat of metal.
6. supporting structure according to claim 5, which is characterized in that the substrate body (11) is made of ceramic, described
Metal connecting layer (12) and the metal framework (20) are made of copper, and the coat of metal is layer gold or silver layer.
7. supporting structure according to claim 1, which is characterized in that the metal framework (20) towards the cup chamber
(21) inner peripheral surface (24) of side and/or the peripheral surface away from cup chamber (21) side of the metal framework (20)
(23) smooth surface to be formed by technique for grinding or spraying process.
8. supporting structure according to claim 1, which is characterized in that the metal framework (20) towards the cup chamber
(21) inner peripheral surface (24) of side and/or the peripheral surface away from cup chamber (21) side of the metal framework (20)
It (23) is the rough surface with concave-convex relief fabric (30).
9. supporting structure according to any one of claim 1 to 8, which is characterized in that the chamber of the cup chamber (21) is transversal
Area is gradually increased along the direction far from the supporting substrate (10).
10. supporting structure according to claim 9, which is characterized in that the chamber cross section of the cup chamber (21) be it is round or
Quadrangle, one end far from the supporting substrate (10) of the cup chamber (21) form opening (211), and the metal framework
(20) the inner peripheral surface (24) towards cup chamber (21) side is from the upper surface of the supporting substrate (10) to the opening
(211) side tilts.
11. supporting structure according to claim 1, which is characterized in that the lower surface of the supporting substrate (10) is also set up
Have metal-polar plate (13), the bottom of the metal-polar plate (13) is provided with metal reinforcement (14).
12. supporting structure according to claim 1, which is characterized in that the peripheral surface (23) of the metal framework (20)
Including multiple outside wall surfaces (231) being connected, the junction of the two neighboring outside wall surface (231) is along cambered surface transition.
13. supporting structure according to claim 1, which is characterized in that the metal framework (20) is in the supporting substrate
(10) projection of upper surface is located at the inside of the upper surface of the supporting substrate (10).
14. a kind of LED component characterized by comprising
Supporting structure (1), the supporting structure (1) are supporting structure described in any one of claims 1 to 13；
Chip (2), the chip (2) are mounted in the cup chamber (21) of the supporting structure (1) and weld with pad (40)；
Package assembling (3), package assembling (3) lid are located at the upper surface of the metal framework (20) of the supporting structure (1), with
Seal the cup chamber (21).
15. LED component according to claim 14, which is characterized in that the upper surface of the metal framework (20) have with
The compatible bonding layer of its area (4), the package assembling (3) are viscous by the bonding layer (4) and the metal framework (20)
It connects.
16. LED component according to claim 14, which is characterized in that the package assembling (3) is upper surface in plane
Flat-plate lens (31) or upper surface are the toroidal lens (32) of the part of the surface of curved surface.
17. LED component according to claim 14, which is characterized in that the lower surface of the package assembling (3) is formed with convex
The chamber section in portion (33), the cup chamber (21) of the cross-sectional shape and metal framework (20) of the protrusion (33) is adapted, when described
When package assembling (3) lid is located at the upper surface of the metal framework (20), the protrusion (33) is located in the cup chamber (21).
18. a kind of lamp group array, which is characterized in that including support frame, arrangement is provided in an array manner on support frame as described above
Multiple LED components, the LED component are LED component described in any one of claim 14 to 17.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201811526283.8A CN109713107A (en) | 2018-12-13 | 2018-12-13 | Supporting structure, LED component and lamp group array |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811526283.8A CN109713107A (en) | 2018-12-13 | 2018-12-13 | Supporting structure, LED component and lamp group array |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113851574A (en) * | 2021-09-24 | 2021-12-28 | 宁波升谱光电股份有限公司 | LED packaging structure body and manufacturing method thereof |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1638160A (en) * | 2003-12-26 | 2005-07-13 | 三洋电机株式会社 | Package for light emitting element and process for fabricating same |
| CN101252164A (en) * | 2007-02-22 | 2008-08-27 | 夏普株式会社 | Surface mounting type light emitting diode and method for manufacturing the same |
| CN101322254A (en) * | 2005-10-28 | 2008-12-10 | 阿莫先思电子电器有限公司 | Electronic parts packages and method for forming a cavity thereof |
| CN101809768A (en) * | 2007-08-31 | 2010-08-18 | Lg伊诺特有限公司 | Light emitting device package |
| CN101958390A (en) * | 2010-08-13 | 2011-01-26 | 李刚 | Light-emitting chip packaging structure |
| CN202018960U (en) * | 2010-12-10 | 2011-10-26 | 奉化市匡磊半导体照明有限公司 | Luminous chip packaging structure of insulating bottom plate |
| CN103078040A (en) * | 2011-08-22 | 2013-05-01 | Lg伊诺特有限公司 | Light emitting device package and light unit |
| CN103872211A (en) * | 2012-12-14 | 2014-06-18 | Lg伊诺特有限公司 | Light emitting device package |
| CN108807638A (en) * | 2017-04-26 | 2018-11-13 | 三星电子株式会社 | Semiconductor package |
| CN108922953A (en) * | 2014-05-23 | 2018-11-30 | 亿光电子(中国)有限公司 | Method for manufacturing light emitting device |
| CN209150149U (en) * | 2018-12-13 | 2019-07-23 | 佛山市国星光电股份有限公司 | Supporting structure, LED component and lamp group array |
-
2018
- 2018-12-13 CN CN201811526283.8A patent/CN109713107A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1638160A (en) * | 2003-12-26 | 2005-07-13 | 三洋电机株式会社 | Package for light emitting element and process for fabricating same |
| CN101322254A (en) * | 2005-10-28 | 2008-12-10 | 阿莫先思电子电器有限公司 | Electronic parts packages and method for forming a cavity thereof |
| CN101252164A (en) * | 2007-02-22 | 2008-08-27 | 夏普株式会社 | Surface mounting type light emitting diode and method for manufacturing the same |
| CN101809768A (en) * | 2007-08-31 | 2010-08-18 | Lg伊诺特有限公司 | Light emitting device package |
| CN101958390A (en) * | 2010-08-13 | 2011-01-26 | 李刚 | Light-emitting chip packaging structure |
| CN202018960U (en) * | 2010-12-10 | 2011-10-26 | 奉化市匡磊半导体照明有限公司 | Luminous chip packaging structure of insulating bottom plate |
| CN103078040A (en) * | 2011-08-22 | 2013-05-01 | Lg伊诺特有限公司 | Light emitting device package and light unit |
| CN103872211A (en) * | 2012-12-14 | 2014-06-18 | Lg伊诺特有限公司 | Light emitting device package |
| CN108922953A (en) * | 2014-05-23 | 2018-11-30 | 亿光电子(中国)有限公司 | Method for manufacturing light emitting device |
| CN108807638A (en) * | 2017-04-26 | 2018-11-13 | 三星电子株式会社 | Semiconductor package |
| CN209150149U (en) * | 2018-12-13 | 2019-07-23 | 佛山市国星光电股份有限公司 | Supporting structure, LED component and lamp group array |
Non-Patent Citations (3)
| Title |
|---|
| 智川，许文才，智文广，蒋磊: "《包装印刷》", 31 December 2016 * |
| 毕国亮，俞永平: "《平制晒版》", 31 December 1981 * |
| 马蓉: "《装备用低频电缆组件组装工艺》", 31 December 2017 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113851574A (en) * | 2021-09-24 | 2021-12-28 | 宁波升谱光电股份有限公司 | LED packaging structure body and manufacturing method thereof |
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