JP4776175B2 - Light emitting element storage package, method for manufacturing the same, light emitting device, and lighting device - Google Patents

Description

  The present invention relates to a light-emitting element housing package for housing a light-emitting element, a method for manufacturing the same, a light-emitting device, and a lighting device, which are used in display devices using light-emitting elements such as light-emitting diodes.

  2. Description of the Related Art Conventionally, a ceramic package has been used as a light emitting element housing package (hereinafter also referred to as a package) for housing a light emitting element such as a light emitting diode. As shown in a sectional view in FIG. 5, the conventional ceramic package has a mounting portion 11a made of a conductor layer for mounting the light emitting element 13 at the center of the upper surface, and the mounting portion 11a and its periphery from the lower surface. A rectangular frame shape having a rectangular parallelepiped or quadrangular flat plate-like ceramic base body 11 having a pair of wiring conductors 14 led to the top surface and a through hole 12a for accommodating the light emitting element 13 at the center. And a ceramic frame body 12 (see, for example, Patent Document 1 below).

  Then, the light emitting element 13 is fixed to the mounting portion 11a made of a conductor to which the one wiring conductor 14 on the upper surface of the base body 11 is connected through a conductive bonding material, and the electrode of the light emitting element 13 and the other wiring conductor 14 are connected. Are electrically connected via bonding wires 15, and then a transparent resin (not shown) is filled in the through holes 12 a of the frame body 12 to seal the light emitting element 13, thereby producing a light emitting device. Is done. Thereby, the light which the light emitting element 13 emits can be radiated | emitted to the exterior (in FIG. 5, upper direction) of a package.

  Further, in order to reflect the light of the light emitting element 13 at the inner peripheral surface of the through hole 12a of the frame body 12 and radiate the light above the package, nickel (Ni) is formed on the inner peripheral surface of the through hole 12a of the frame body 12. A light reflecting layer 16 made of a metallized layer having a plating metal layer such as a plating layer or a gold (Au) plating layer on its surface may be applied.

  Further, the above package is manufactured as follows by a ceramic green sheet lamination method. First, a ceramic green sheet to be the base 11 and a ceramic green sheet to be the frame 12 are prepared, and through holes and through holes 12a for leading the wiring conductors 14 to these ceramic green sheets are formed by a punching method.

  Next, a wiring conductor 14 made of a metallized layer is formed in a through hole and a predetermined portion of a laminate of ceramic green sheets to be the base 11 (hereinafter, a laminate of ceramic green sheets to be the base 11 is simply referred to as a laminate A). A conductive paste is printed by a screen printing method or the like. Further, a light reflecting layer is formed on the inner peripheral surface of the through hole serving as the through hole 12a of the laminated body of the ceramic green sheets to be the frame body 12 (hereinafter, the laminated body of the ceramic green sheets to be the frame body 12 is simply referred to as the laminated body B). A conductor paste No. 16 is applied by screen printing or the like.

  Next, the laminated bodies A and B are stacked and bonded to form a laminated body for forming a package, which is cut into a predetermined size to form a molded body, which is fired at a high temperature (about 1600 ° C.) Eggplant. Thereafter, a package is manufactured by depositing a plated metal layer such as Ni, Au, palladium (Pd), or platinum (Pt) on the exposed surface of the wiring conductor 14 and the metallized layer by an electroless plating method or an electrolytic plating method. Is done.

Further, in order to further increase the light emission efficiency of the light emitting device, and to enhance the connectivity between the mounting portion 11a and the wiring conductor 14, the light emitting element 13, and the bonding wire 16, the penetration of the frame 12 is performed. A package has been proposed in which a silver plating layer is deposited on the inner peripheral surface of the hole 12a so that the gold plating layer is exposed on the exposed surface of the wiring conductor 14.
Japanese Patent Laid-Open No. 2002-232017

  However, in the conventional package described above, when the silver plating layer is deposited on the nickel plating layer which is the base, the adhesive strength between the silver plating layer and nickel is weak, so that the silver plating layer can be satisfactorily attached to the through hole 12a. There was a problem that the inner peripheral surface could not be deposited and the light emitted from the light emitting element could not be radiated well to the outside.

  Further, when a silver plating layer is applied to the inner peripheral surface of the through hole 12a after the gold plating layer is applied to the wiring conductor 14 or the mounting portion 11a by the electrolytic plating method, the wiring conductor 14 or the mounting portion 11a. When the package is immersed in a gold plating bath for depositing a gold plating layer on the nickel plating layer, the nickel of the nickel plating layer deposited on the inner peripheral surface of the through hole 12a is in the gold plating bath during the gold plating process. The nickel particles are peeled off from the nickel plating layer due to the elution and being deposited on the gold plating layer of the wiring conductor 14 and the mounting portion 11a, or due to vibration during transportation before the silver plating process. 11a has a problem in that the adhesion of the light emitting element 13 and the bonding property are deteriorated due to adhesion on the gold plating layer 11a.

  Further, when a gold plating layer is applied to the wiring conductor 14 or the mounting portion 11a after the silver plating layer is applied to the inner peripheral surface of the through hole 12a by electrolytic plating, the ionization tendency between silver and gold Due to the difference, silver and gold are substituted and gold particles are deposited on the silver plating layer. As a result, the silver plating layer on the inner peripheral surface of the through hole 12a is discolored, and the light emitting element 13 reflects light emitted from the light. There was a problem that the rate decreased.

  Accordingly, the present invention has been completed in view of the above-mentioned problems of the prior art, and the object thereof is to efficiently reflect the light of the light emitting element 13 and radiate it uniformly and satisfactorily to the outside. It is an object of the present invention to provide a light emitting element storage package, a light emitting device, and an illuminating device that can be firmly joined to each other.

The light emitting element storage package of the present invention includes a flat base having a light emitting element mounting portion on the upper surface, and a gold plating layer and silver on the inner peripheral surface joined to the upper surface of the base so as to surround the mounting portion. A frame having a light reflection layer formed by sequentially depositing a plating layer, a wiring conductor led out from an upper surface to a side surface or a lower surface of the substrate, and having a gold plating layer formed on an exposed surface; and the wiring conductor A first plating conductor for forming the gold plating layer on the surface of the wiring conductor , electrically connected to the wiring conductor, and the first plating conductor is insulated and electrically connected to the light reflecting layer And a second plating conductor for forming the gold plating layer and the silver plating layer on the inner peripheral surface of the frame body , the base being the first substrate and the first A second substrate disposed on the upper surface of the substrate, The first plating conductor and the second plating conductor are located on the upper surface of the first substrate and the second plating conductor is located on the upper surface of the second substrate. It is electrically insulated through the second substrate .

The light emitting element storage package of the present invention includes a flat base having a light emitting element mounting portion on the upper surface, a frame body joined to the upper surface of the base so as to surround the mounting portion, and a side surface or a lower surface from the upper surface of the base. And a wiring conductor having a gold plating layer formed on the exposed surface, and the frame is a light reflecting member in which a gold plating layer and a silver plating layer are sequentially deposited on the inner peripheral surface. Since the layer is formed, since the adhesive strength between the silver plating layer and the gold plating layer is strong, the silver plating layer can be firmly formed on the inner peripheral surface of the frame. Therefore, the light of the light emitting element can be favorably reflected on the silver plating layer having a high reflectance and can be emitted to the outside.
At this time, a first plating conductor electrically connected to the wiring conductor and a second plating conductor electrically insulated from the first plating conductor and electrically connected to the light reflecting layer are further provided. Since it has, it can form a gold plating layer on a wiring conductor easily, and can form a gold plating layer and a silver plating layer in the inner peripheral surface of a frame.

  In addition, when a nickel plating layer is formed as a base on the inner peripheral surface of the frame, the gold plating layer is deposited on the nickel plating layer, so that the nickel deposited on the inner peripheral surface of the through hole 12a Nickel in the plating layer elutes into the gold plating bath during the gold plating process and adheres to the gold plating layer on the wiring conductor and mounting part, or due to vibration during transportation before the silver plating process, etc. Thus, the nickel particles are peeled off and adhered onto the wiring conductor or the gold plating layer of the mounting portion, so that it is possible to suppress a decrease in the fixing property of the light emitting element and a decrease in the bonding property.

  The light emitting element storage package of the present invention will be described in detail below. FIG. 1A is a cross-sectional view showing an example of an embodiment of a package of the present invention, and FIG. 1B is an enlarged cross-sectional view of a main part of a frame body in the package of FIG. Is a base body, and 2 is a frame, which mainly constitutes a package for housing the light emitting element 3.

  The light emitting element storage package of the present invention includes a flat base 1 having a mounting portion 1a for the light emitting element 3 on the upper surface, a frame 2 joined to the upper surface of the base 1 so as to surround the mounting portion 1a, and the base 1 Wiring conductors 4a and 4b led out from the upper surface to the side surface or the lower surface, and the frame 2 has a light reflecting layer 6 in which a gold plating layer and a silver plating layer are sequentially deposited on the inner peripheral surface. Is formed.

  The substrate 1 of the present invention has a rectangular parallelepiped shape or a rectangular flat plate shape made of ceramics or resin such as an aluminum oxide sintered body (alumina ceramics) or an aluminum nitride sintered body. And the base | substrate 1 is a support body which supports the light emitting element 3, and has the mounting part 1a which mounts the light emitting element 3 on the upper surface.

  The mounting portion 1a may be a conductor or a part of the upper surface of the base body 1. In the present embodiment, an example in which the mounting portion 1a is a conductor formed of a part of the wiring conductor 4a is shown.

  When the substrate 1 is made of, for example, an aluminum oxide sintered body, a suitable organic binder, solvent, etc. are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide to form a mud. A ceramic green sheet (ceramic green sheet) is obtained by forming into a sheet shape by a well-known doctor blade method or calendar roll method, etc. After that, the ceramic green sheet is subjected to appropriate punching processing, and a plurality of these are laminated to obtain a high temperature. It is manufactured by firing at (about 1600 ° C.).

  The substrate 1 is led out from the mounting portion 1a to the lower surface, the wiring conductor 4a having a gold plating layer deposited on the exposed surface, and the exposed surface led out from the periphery to the lower surface of the mounting portion 1a. A wiring conductor 4b having a layer deposited thereon is deposited. The wiring conductors 4a and 4b are made of, for example, metal powder metallization such as tungsten or molybdenum, and function as a conductive path for electrically connecting the light emitting element 3 accommodated therein to the outside. A light emitting element 3 such as a light emitting diode or a semiconductor laser is fixed to the mounting portion 1a formed of a part of the wiring conductor 4a by a conductive bonding material such as gold-silicon alloy or silver-epoxy resin, and the wiring conductor 4b. The electrode of the light emitting element 3 is electrically connected through the bonding wire 5. The light emitting element 3 may be flip-chip mounted on the mounting portion 1a and the wiring conductor 4b.

  The mounting portion 1a and the wiring conductors 4a and 4b can be formed by attaching a metal having excellent corrosion resistance such as nickel as a base metal layer to a thickness of about 1 to 20 μm. Oxidation and corrosion can be effectively prevented, and the mounting portion 1a and the light emitting element 3 can be firmly fixed and the wiring conductor 4b and the bonding wire 5 can be firmly bonded. Therefore, a nickel plating layer having a thickness of about 1 to 10 μm and a gold plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited on the exposed surfaces of the mounting portion 1a and the wiring conductors 4a and 4b by an electrolytic plating method or an electroless plating method. Has been.

  The frame body 2 of the present invention is made of ceramics, resin, or metal, and is joined to the upper surface of the base 1 so as to surround the mounting portion 1a. For example, when the frame 2 is made of an aluminum oxide sintered body, a through-hole 2a having a circular or square cross-sectional shape for accommodating the light emitting element 3 is formed in the center of the frame 2 on the ceramic green sheet. It is manufactured by performing a punching process in order to stack a plurality of sheets and firing them at a high temperature (1600 ° C.).

  The frame body 2 of the present invention can be formed by punching through holes 2a in a ceramic green sheet for the frame body 2 using a punching die. At this time, the through hole 2a formed in the ceramic green sheet for the frame 2 is formed. Then, the ceramic green sheet for the frame 2 formed by cutting to a predetermined size is laminated on the green sheet for the substrate 1, and is fired at a high temperature (1600 ° C.) to form the frame 2 integrally with the substrate 1. can do. The frame 2 and the base 1 may be separately manufactured and bonded with a bonding material.

  Further, the inner peripheral surface of the through hole 2a of the frame body 2 is an inclined surface, and the angle θ formed by the inner peripheral surface and the upper surface of the base body 1 is increased upward at an angle of 35 to 70 °. It is preferable to spread outward. When the angle θ exceeds 70 °, it tends to be difficult to favorably reflect the light emitted by the light emitting element 3 accommodated in the through hole 2a to the outside. On the other hand, when the angle θ is less than 35 °, it tends to be difficult to stably and efficiently form the inner peripheral surface of the through hole 2a at such an angle, and the package is likely to be enlarged.

  The cross-sectional shape of the through hole 2a of the frame body 2 may be various shapes such as a circular shape, an oval shape, an elliptical shape, a quadrangular shape, and a polygonal shape, but a circular shape is particularly preferable. In this case, the light emitted from the light emitting element 3 accommodated in the through hole 2a is uniformly reflected above the package by the surface of the metal layer 6 formed on the inner peripheral surface of the through hole 2a, and radiated to the outside very uniformly. can do.

  And in this invention, the light reflection layer 6 by which the gold plating layer 6c and the silver plating layer 6d are adhere | attached one by one on the internal peripheral surface of the through-hole 2a of the frame 2 is formed. Thereby, since the adhesive strength between the silver plating layer 6d and the gold plating layer 6c is strong, the silver plating layer 6d can be firmly attached to the gold plating layer 6c, so that the silver plating layer 6d is attached to the inner peripheral surface of the frame body. And can be firmly formed. Therefore, the light of the light emitting element 3 can be favorably reflected on the silver plating layer 6d having a high reflectance and can be emitted to the outside.

  Further, when the nickel plating layer 6b is formed as the base of the inner peripheral surface of the frame body 2, since the gold plating layer 6c is deposited on the nickel plating layer 6b, the inside of the through hole 12a of the frame body 2 Nickel of the nickel plating layer deposited on the peripheral surface elutes into the gold plating bath during the gold plating treatment, and is deposited on the gold plating layers of the wiring conductors 4a and 4b and the mounting portion 1a, or silver plating treatment. The nickel particles are peeled off from the nickel plating layer due to vibration or the like during the previous conveyance, and adhere to the wiring conductors 4a and 4b or the gold plating layer of the mounting portion 1a. It is possible to suppress the deterioration of the property.

  Such a light reflection layer 6 has a nickel plating layer 6b having a thickness of about 1 to 20 μm on a metallization layer 6a made of metallization such as tungsten or molybdenum formed on the inner peripheral surface of the through hole 2a of the frame 2. It can be formed by sequentially depositing a gold plating layer 6c of about 0.01 to 3 μm and a silver plating layer 6d of about 0.1 to 4 μm by an electroless plating method or an electrolytic plating method.

  In addition, the thickness of the silver plating layer 6d deposited on the gold plating layer 6c is particularly preferably 2 μm or more. Thereby, the unevenness | corrugation of the surface of the silver plating layer 6d can be made small, and the surface of the silver plating layer 6d can be made glossy, and the light emitted from the light emitting element can be easily reflected.

  In addition, the arithmetic average roughness Ra of the surface of the light reflecting layer 6 on the inner peripheral surface of the through hole 2a is preferably 3 μm or less. If it exceeds 3 μm, the light emitted from the light emitting element 3 accommodated in the through hole 2a is scattered, and it becomes difficult to uniformly radiate the reflected light to the outside with high reflectivity.

  In addition, when forming the nickel plating layer 6b and the gold plating layer 6c on the inner peripheral surface of the frame body 2, the nickel plating layer and the gold plating layer are simultaneously applied onto the mounting portion 1a and the wiring conductors 4a and 4b. Is preferred. As a result, the process can be simplified, and the silver plating layer 6d is used as the final plating process. Therefore, silver and gold are replaced, and gold is deposited on the surface of the light reflection layer 6 to cause discoloration or reflection. It is not necessary to perform masking or the like for preventing the gold plating layer from being deposited on the light reflecting layer 6 while not causing a decrease in the rate.

For example, as shown in FIG. 2, such a package is easy to handle when the package is very small, and in order to efficiently manufacture a large number of packages, a large number of packages are arranged in a vertical and horizontal direction. It is produced as a substrate for use. Hereinafter, a method for manufacturing a light emitting element storage package according to the present invention will be described using the substrate for multi-piece production. FIG. 2A is a plan view of the multi-piece substrate. FIG. 2 (b) is for plating a multi-piece substrate 1 'for a substrate 1 on which a first plating conductor layer 7 to which a mounting portion 1a and wiring conductors 4a and 4b are electrically connected is formed. FIG. 6 is an internal plan view showing the conductor layer 7 (the mounting portion 1a and the wiring conductors 4a and 4b are not shown). FIG. 2 (c) shows a multi-piece production for the frame 2 in which the second plated conductor layer 8 electrically connected to the metallized layer 6a on the inner peripheral surface of the through hole 2a of the frame 2 is formed. It is an internal top view (metallized layer 6a is not shown) which shows the 2nd plating conductor layer 8 of board | substrate 2 '. FIG. 2D is a plan view after the light reflecting layer 6 is formed on the substrate for multi-piece fabrication. FIG. 3 is a cross-sectional view of a light-emitting element storage package manufactured using a multi-chip substrate.

  First, the base 1 and the frame shown in FIG. 2 (a) are joined by joining the multi-piece substrate 1 ′ of FIG. 2 (b) and the multi-piece substrate 2 ′ of FIG. 2 (c). 2 is formed, and the substrate for multi-cavity formation is immersed in a nickel plating bath, and then the first plating conductor layer 7 and the second plating conductor layer 8 are formed. Then, a nickel plating layer is deposited on the metallized layer 6a on the inner peripheral surface of the mounting portion 1a, the wiring conductors 4a and 4b, and the frame body 2 by electrolytic plating.

  Next, after immersing the multi-piece substrate in a gold plating bath, the mounting portion 1a and the wiring conductor are electroplated through the first plating conductor layer 7 and the second plating conductor layer 8. 4a, 4b, a gold plating layer is deposited on the nickel plating layer 6b on the inner peripheral surface of the frame 2.

  Next, after immersing the substrate for taking a large number in a silver plating bath, the silver plating layer 6d is formed on the gold plating layer 6c of the light reflection layer 6 by electrolytic plating through the second plating conductor layer 8. Adhere.

  Thereby, the light reflection layer 6 in which the gold plating layer 6 c and the silver plating layer 6 d are sequentially deposited is formed on the inner peripheral surface of the frame 2.

  If the thicknesses of the nickel plating layer and the gold plating layer of the light reflecting layer 6 on the inner peripheral surface of the mounting portion 1a, the wiring conductors 4a and 4b, and the frame 2 are different, the first plating conductor layer 7 and the second plating layer 7 A nickel plating layer and a gold plating layer can be applied through each of the plating conductor layers 8.

  And the light emitting element storage package of this invention can be obtained by dividing | segmenting into the area | region of each light emitting element storage package.

  In the present invention, the gold plating layer 6c preferably has a thickness of 0.2 μm or more. Thereby, it can reduce more effectively that the nickel of the nickel plating layer deposited on the inner peripheral surface of the through hole 2a is eluted into the gold plating bath. As a result, when the gold plating layer 6c is deposited, nickel of the nickel plating layer deposited on the inner peripheral surface of the through hole 2a elutes into the gold plating bath and deposits on the wiring conductor and the mounting portion. Can be effectively prevented. Accordingly, it is possible to prevent the light-emitting element 3 from being fixed to the mounting portion 1a and the bonding property to the wiring conductors 4a and 4b from being deteriorated.

  Moreover, the nickel plating layer and the gold plating layer may be formed of a plurality of plating layers. For example, a gold plating layer of about 0.01 μm is deposited on a nickel plating layer, and then a gold plating layer is deposited again, so that a gold plating layer of 0.2 μm or more is firmly coated on the nickel plating layer. It can be formed.

  The light emitting device of the present invention includes the package of the present invention, the light emitting element 3 mounted on the mounting portion 1a, and a translucent member that covers the light emitting element 3. As a result, the light emitted from the light emitting element 3 is well reflected and can be radiated to the outside uniformly and efficiently.

  As the translucent member, a transparent resin such as silicone, or a transparent resin plate or a glass plate is used. When the translucent member is a transparent resin, the translucent member may cover only the light emitting element 3 and the periphery thereof, or may fill the through hole 2a of the frame 2 and cover the light emitting element 3. Good. Further, when the translucent member is a transparent resin plate or a glass plate, the translucent member is attached so as to block the through hole 2a of the frame body 2 on the upper surface or the inner peripheral surface of the frame body 2.

  Furthermore, the light having a desired light spectrum is emitted from the light emitting device by converting the wavelength of the light emitted from the light emitting element 3 by adding or attaching a fluorescent material to the translucent member. It is good.

  The light-emitting device of the present invention is a single light-emitting device installed in a predetermined arrangement, or a plurality of, for example, a lattice shape, a staggered shape, a radial shape, a circular shape or a polygonal shape made up of a plurality of light-emitting devices. By installing the light emitting device groups in a predetermined arrangement such as a plurality of light emitting device groups formed concentrically, a lighting device can be obtained. Thereby, since light emission by recombination of electrons of the light emitting element 3 made of a semiconductor is used, it is possible to achieve lower power consumption and longer life than a lighting device using a conventional discharge, and generate less heat. It can be set as a small illuminating device. As a result, fluctuations in the center wavelength of the light generated from the light emitting element 3 can be suppressed, and light can be emitted with a stable radiant light intensity and radiant light angle (light distribution distribution) over a long period of time. It can be set as the illuminating device by which the color nonuniformity in the surface and the bias of illuminance distribution were suppressed.

  Further, by installing a plurality of light emitting devices of the present invention in a predetermined arrangement as a light source, and installing a reflecting jig, an optical lens, a light diffusing plate, etc. optically designed in an arbitrary shape around these light emitting devices It can be set as the illuminating device which can radiate | emit light of arbitrary light distribution.

  Such lighting devices include, for example, lighting fixtures used indoors and outdoors, electronic bulletin boards, traffic lights, displays and other backlights (liquid crystal backlights and touch panels such as mobile phones), car headlamps, cameras and mobile phones. Examples include a flashlight such as a telephone, a light source for exposure of a printing machine such as a scanner, a moving image device, and a decoration.

Hereinafter, the evaluation results of the light emitting element storage package of the present invention will be described based on examples. First, a nickel plating layer 6b having a thickness of 4 μm was formed on the inner peripheral surface of the frame 2 of the light emitting element storage package, and a gold plating layer 6c having various thicknesses as described below was formed thereon. In addition, the gold plating layer 6c has nine types of 0 μm, 0.05 μm, 0.1 μm, 0.15 μm, 0.2 μm, 0.25 μm, 0.3 μm, 0.5 μm, and 0.75 μm for accommodating the light emitting element. Sample No. of package 1-No. It was set to 9. These were immersed in a gold plating bath having a pH of 5.83 and a liquid temperature of 65 ° C. for 2 hours, and the elution amount of nickel in the gold plating bath was measured. The results are shown in Table 1.

  As is clear from the results in Table 1, by increasing the thickness of the gold plating layer 6c, the elution amount of nickel into the gold plating bath can be reduced. In particular, the thickness of the gold plating layer 6c is 0.2 μm. By setting it as the above (sample No.5-No.9), it turned out that it is 1/20 or less and it is excellent compared with the case where the gold plating layer 6c is not attached to the inner peripheral surface of the frame 2. .

  Next, the light emitting element storage package (samples No. 1 to No. 9) in which the nickel plating layer is also deposited on the mounting portion 1a and the wiring conductors 4a and 4b (sample Nos. 1 to 9) is immersed in the gold plating bath, A product obtained by depositing a gold plating layer of 1.5 μm on the nickel plating layer of the mounting portion 1a and the wiring conductors 4a and 4b by electrolytic plating was manufactured and evaluated. As an evaluation method, the bonding property of the mounting portion 1a was evaluated as follows. For the bonding property evaluation, 25 μmφ gold wire bonding was performed on the mounting portion 1a with a wire bonding machine, and the tensile strength and ball shear strength evaluation of the gold wire bonding were performed.

  In the tensile strength test and ball shear strength evaluation test, first, using a 25 μmφ gold wire, the first bonding (1st) side is weighted 0.30 N, temperature is 185 ° C., ultrasonic conditions are 40 mW, 15 ms, and the next bonding (2nd) side. Was subjected to heat treatment under conditions of a weight of 0.80 N, a temperature of 185 ° C., an ultrasonic condition of 90 mW, 15 ms, and 350 ° C./3 min, followed by wire bonding, which was used for a tensile strength test and a shear strength test of a wire ball.

  In the tensile strength test, X is less than 0.010 N, Δ is 0.010 to 0.012 N, and O is 0.012 N, and the shear strength test is X in less than 0.020 N, 0.021 to 0. Evaluation was performed by setting 030N as Δ, and a case exceeding 0.030N as ◯.

  As is clear from the results in Table 1, the sample No. 2 in which the thickness of the gold plating layer 6c of the frame 2 is 0.2 μm or more. 5-No. No. 9 had a tensile strength of 0.012 N or more and a shear strength test of 0.030 N or more (indicated by a circle in the table). Sample 2 in which the thickness of the gold plating layer 6c of the frame 2 is less than 0.2 μm has a tensile strength of 0.010 to 0.012N, and the shear strength test is 0.021 to 0.030N. (Indicated by Δ in the table). Sample 1 in which the gold plating layer 6c is not attached to the frame 2 has a tensile strength of less than 0.010N and a shear strength test of less than 0.020N (indicated by x in the table). ).

  From this, the elution of nickel when immersed in the gold plating bath is reduced by setting the thickness of the gold plating layer 6c, which is the base of the silver plating layer 6d in the light reflecting layer 6 of the frame 2, to 0.2 μm or more. It was found that the adhesion and bonding properties of the mounting portion 1a and the wiring conductors 4a and 4b can be improved. Moreover, since the elution of nickel into the gold plating bath is small, it is possible to suppress the contamination of impurities into the gold plating bath.

  It should be noted that the present invention is not limited to the above-described embodiments and examples, and various modifications may be made without departing from the scope of the present invention. For example, as shown in the sectional view of the package in FIG. 4, the light emitting element 3 is directly mounted on the upper surface of the base 1 through a bonding material such as a resin adhesive, with the mounting portion 1 a as the mounting region on the upper surface of the base 1. The wiring conductors 4a and 4b to which the electrodes of the light emitting element 3 are connected may be formed around the mounting portion 1a.

  In addition, a transparent resin film such as a silicone resin or an epoxy resin, or a glass film such as sol-gel glass or low-melting glass is preferably formed on the surface of the light reflecting layer 6c on the silver plating layer 6. Thereby, it can prevent effectively that the silver plating layer 6 is oxidized and a light reflectivity falls.

(A) is sectional drawing which shows an example of embodiment about the light emitting element accommodation package of this invention, (b) is a principal part expanded sectional view in light emission element accommodation for this invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 shows a multi-piece substrate for producing a light emitting element storage package of the present invention, wherein (a) is a plan view of the substrate, and (b) is a substrate on which a first plating conductor layer is formed. FIG. 4C is a plan view of the substrate side, FIG. 4C is a plan view of the frame on which the second plating conductor layer is formed, and FIG. 4D is a plan view of the substrate after the light reflecting layer is formed. It is sectional drawing which shows another example of embodiment about the light emitting element storage package of this invention. It is sectional drawing which shows another example of embodiment about the light emitting element storage package of this invention. It is sectional drawing of the conventional package for light emitting element accommodation.

Explanation of symbols

1: Base 1a: Mounting portion 2: Frame body 3: Light emitting element 4a, 4b: Wiring conductor 6: Light reflection layer 6c: Gold plating layer formed on inner peripheral surface of frame body 6d: Silver plating layer

Claims (5)

A flat substrate having a light emitting element mounting portion on the upper surface, and a gold plating layer and a silver plating layer sequentially deposited on the inner peripheral surface joined to the upper surface of the substrate so as to surround the mounting portion. a frame body having a light-reflecting layer, derived on the side surface or the lower surface from the upper surface of the substrate, a wiring conductor gold plating layer is formed on the exposed surface, which is electrically connected to the wiring conductor, the wiring A first plating conductor for forming the gold plating layer on the surface of the conductor, and the first plating conductor is insulated and electrically connected to the light reflecting layer ; Comprising a second plating conductor for forming the gold plating layer and the silver plating layer on a peripheral surface ;
The base comprises a first substrate and a second substrate disposed on an upper surface of the first substrate;
The first plating conductor is located on the upper surface of the first substrate and the second plating conductor is located on the upper surface of the second substrate, and the first plating conductor and the second A light emitting element storing package, wherein the plating conductor is electrically insulated through the second substrate .   The light-emitting element storage package according to claim 1, wherein the gold plating layer formed on the inner peripheral surface of the frame body has a thickness of 0.2 µm or more. A claim 1 or claim 2 method of manufacturing a light-emitting element storage package according, through the first plating conductors, by electrolytic plating, gold plating on the exposed front surface of the wiring conductor A step of depositing a layer, a step of depositing a gold plating layer on the inner peripheral surface of the frame body by electrolytic plating via the second plating conductor, and the second plating conductor. through it, collecting the solution plating, for housing a light-emitting element package, characterized in that it the silver plating layer on the frame inner peripheral surface formed gold plating layer on; and a step of depositing Manufacturing method.   The light emitting element storage package according to claim 1, a light emitting element mounted on the mounting portion and electrically connected to the wiring conductor, and a translucent member covering the light emitting element. A light emitting device characterized by that.   5. A lighting device, wherein the light emitting device according to claim 4 is installed in a predetermined arrangement.

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