JP2004228549A - Package for housing light emitting element and light emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve the adhesive strength between a metal layer applied onto the inner surface of a through hole of a frame and a metal plated layer applied onto its surface, and to allow the light of a light emitting element to be well reflected on the inner surface of the through hole so that it is uniformly and efficiently radiated to the outside. <P>SOLUTION: A frame 2 having a through hole 2a for housing a light emitting element 3 is joined to the upper surface of a plate-like base body 1 which has a mounting part 1a for mounting the light emitting element 3 on its upper surface so that it encloses the mounting part 1a, thus constituting the package for housing a light emitting element. A metal layer 6a containing high melting point metal and metal plated layers (6b and 6c) containing cobalt are sequentially applied onto the inner surface of the through hole 2a. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a light-emitting element housing package for housing a light-emitting element such as a light-emitting diode and a light-emitting device.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a ceramic package has been used as a light emitting element housing package (hereinafter, also referred to as a package) for housing a light emitting element such as a light emitting diode. As shown in FIG. 3, the conventional ceramic package has a mounting portion 21a formed of a conductor layer for mounting the light emitting element 23 at the center of the upper surface, and is led out from the mounting portion 21a and its periphery to the lower surface. A substantially rectangular parallelepiped ceramic base (hereinafter, also referred to as a base) 21 having a pair of metallized wiring conductors 24a and 24b, and a through hole 22a that is joined to the upper surface of the base 21 and accommodates the light emitting element 23 in the center. And a substantially square frame-shaped ceramic frame (hereinafter, also referred to as a frame) 22.
[0003]
Then, the light emitting element 23 is fixed to the mounting portion 21a connected to the one metallized wiring conductor 24a led out on the upper surface of the base 21 via a conductive bonding material or the like, and the electrode of the light emitting element 23 and the other metallized wiring are connected. The conductor 24b is electrically connected to the conductor 24b via the bonding wire 25. Thereafter, the through hole 22a of the frame 22 is filled with a transparent resin (not shown) to seal the light emitting element 23, thereby forming a light emitting device. For example, see Patent Document 1 below).
[0004]
Note that, in such a ceramic package, the light emitted by the light emitting element 23 contained therein is reflected by the inner surface of the through hole 22a to improve the luminous efficiency of the light emitting device. A metal layer 26a having a metal plating layer 26b made of a metal such as nickel (Ni) or gold (Au) on its surface is deposited.
[0005]
Further, this package is manufactured by a ceramic green sheet (hereinafter, also referred to as green sheet) lamination method, and specifically, manufactured as follows. A green sheet for the base 21 and a green sheet for the frame 22 are prepared, and these green sheets are mainly provided with through holes for leading the metallized wiring conductors 24a and 24b and through holes for accommodating the light emitting elements 23. Punch almost perpendicular to the surface. Next, a conductor paste made of a high melting point metal powder such as W or Mo for forming metallized wiring conductors 24a and 24b is applied from the upper surface to the lower surface of the green sheet for the base 21 by a conventionally known screen printing method or the like. The conductive paste for forming the metal layer 26a is applied to the inner surface of the through hole of the green sheet 22 by a screen printing method or the like. A green sheet for the base 21 and a green sheet for the frame 22 are vertically stacked, and then fired at a high temperature to form a sintered body. Thereafter, the metallized wiring conductors 24a and 24b and the metal layer 26a are manufactured by depositing a metal plating layer 26b made of a metal such as Ni or Au by an electroless plating method or an electrolytic plating method.
[0006]
However, according to this conventional package, the inner surface of the through hole 22a is substantially perpendicular to the upper surface of the base 11, so that the light reflected on the inner surface of the through hole 22a is not uniformly and satisfactorily radiated to the outside. There is a problem that the luminous efficiency of the light emitting device using is not so high.
[0007]
Therefore, as shown in FIG. 2, a through hole 12a for accommodating the light emitting element 13 is provided at the center on the upper surface of the substantially rectangular parallelepiped base 11 having the mounting portion 11a for mounting the light emitting element 13 on the upper surface. A package formed by joining the frame bodies 12, wherein the inner surface of the through hole 12a of the frame body 12 extends outward at an angle of 55 to 70 degrees with respect to the upper surface of the base 11, and has a center line average roughness on its surface. The present applicant has proposed a package having a metal plating layer 16b having an Ra of 1 to 3 μm and a reflectance of 80% or more for light emitted from the light emitting element 13 (Patent Document 1 below).
[0008]
According to this package, the inner surface of the through hole 12a extends outward at an angle of 55 to 70 degrees with respect to the upper surface of the base 11, and Ra of 1 to 3 μm is emitted on the surface of the inner surface, and the light emitting element 13 emits light. Since the metal plating layer 16b having a reflectance to light of 80% or more is attached, the metal plating layer 16b on the inner surface of the inclined through hole 12a inclines light emitted by the light emitting element 13 housed in the through hole 12a. And radiate uniformly and efficiently toward the outside.
[0009]
This package is manufactured as follows. A through hole 12a is pierced in the green sheet for the frame body 12 so that the inner surface thereof becomes an inclined surface of 55 to 70 degrees, and then a conductive paste is applied to the inner surface of the through hole 12a of the green sheet for the frame body 12, Next, the green sheet for the frame body 12 and the green sheet for the base body 11 are stacked and joined in such a manner that the inner surface of the through hole 12a of the green sheet for the frame body 12 extends outward. These are fired to obtain a sintered body in which the frame body 12 having the through hole 12a on the upper surface of the base 11 is laminated and integrated, and the metal layer 16a is adhered to the inner surface of the through hole 12a. Next, a metal plating layer 16b having Ra of 1 to 3 μm and a reflectance of the light emitting element 13 for light of 80% or more is formed on the metal layer 16a inside the through hole 12a.
[0010]
[Patent Document 1]
Japanese Patent Application Laid-Open No. 14-232017
[Problems to be solved by the invention]
However, according to the package of Patent Document 1, when the thickness of the metal plating layer 16b is increased, when the transparent resin is filled in the through holes 12a of the frame body 12 and the light emitting element 13 is sealed, When heat is applied and cured, thermal stress is generated between the transparent resin and the metal plating layer 16b and between the transparent resin and the metal layer 16a, which acts to peel off the metal plating layer 16b and cause metal stress. There was a problem that the plating layer 16b was peeled off from the metal layer 16a.
[0012]
Also, when the thickness of the metal plating layer 16b is reduced, the heat resistance and corrosion resistance of the metal plating layer 16b are reduced, the bonding strength with the transparent resin is reduced, and the high melting point metal of the metal layer 16a and the glass component of ceramics are reduced. Is diffused onto the metal plating layer 16b, and the reflectance of the metal plating layer 16b with respect to the light of the light emitting element 13 is reduced.
[0013]
Accordingly, the present invention has been completed in view of the above-mentioned conventional problems, and its object is to provide a metal layer adhered to the inner surface of the through hole of the frame and a metal plating layer adhered to the surface. Of the light-emitting element can be reflected well on the inner surface of the through-hole and uniformly and efficiently radiated to the outside, whereby the light-emitting device can have extremely high luminous efficiency. An object of the present invention is to provide a highly reliable package for housing a light emitting element and a light emitting device.
[0014]
[Means for Solving the Problems]
In the light emitting element housing package of the present invention, the ceramic frame having a through hole for housing the light emitting element is provided on the upper surface of a flat ceramic base having a mounting portion for mounting the light emitting element on the upper surface. A light emitting element housing package joined so as to surround the portion, wherein a metal layer containing a high melting point metal and a metal plating layer containing cobalt are sequentially applied to the inner surface of the through hole. It is characterized by.
[0015]
The light-emitting element housing package of the present invention, since a metal layer containing a high melting point metal and a metal plating layer containing cobalt are sequentially applied to the inner surface of the through hole, the metal plating layer containing cobalt is In addition to being firmly adhered to the metal layer containing the high melting point metal, when a reflective layer made of Au, Ag, Pt or the like is adhered on the metal plating layer, the bonding strength with the reflective layer can be increased. .
[0016]
In the light-emitting element housing package of the present invention, preferably, the metal plating layer comprises a first metal plating layer containing cobalt and a second metal plating layer containing cobalt deposited thereon. A reflection layer is provided on the second metal plating layer to reflect light emitted by the light emitting element.
[0017]
In the light-emitting element housing package of the present invention, preferably, the metal plating layer comprises a first metal plating layer containing cobalt and a second metal plating layer containing cobalt deposited thereon, The first metal plating layer containing cobalt is firmly adhered to the metal layer containing the high melting point metal because the reflection layer reflecting the light emitted from the light emitting element is adhered on the metal plating layer of Is done. Further, since the second metal plating layer is deposited on the first metal plating layer and the metal plating layer is firmly deposited on the metal layer, the thickness of the metal plating layer can be increased. As a result, it is possible to effectively prevent components such as the high melting point metal in the metal layer and the glass in the ceramic from diffusing out onto the metal plating layer and the reflection layer, thereby increasing the reflectance of the reflection layer. Since it can be maintained and diffusion on the reflective layer can be prevented, good adhesion between the reflective layer and the transparent resin can be maintained.
[0018]
A light-emitting device according to the present invention includes the light-emitting element storage package according to the present invention, a light-emitting element mounted on the mounting portion, and a transparent resin covering the light-emitting element.
[0019]
According to the light emitting device of the present invention, the metal plating layer is firmly adhered to the inner surface of the through hole of the frame, and the reflectance of the reflection layer is maintained at a high level.
[0020]
BEST MODE FOR CARRYING OUT THE INVENTION
The light emitting element housing package of the present invention will be described in detail below. 1 (a) and 1 (b) are a cross-sectional view and a cross-sectional view showing an example of an embodiment of a package according to the present invention, wherein 1 is a ceramic base, 2 is a ceramic frame, and light is mainly emitted from these. The package of the present invention for housing the element 3 is configured.
[0021]
In the package of the present invention, a frame 2 having a through hole 2a for accommodating the light emitting element 3 is provided on the upper surface of a flat substrate 1 having a mounting section 1a for mounting the light emitting element 3 on the upper surface. And a metal layer 6a containing a refractory metal and a metal plating layer (6b, 6c) containing cobalt are sequentially deposited on the inner surface of the through hole 2a. .
[0022]
The metal layer 6a of the present invention contains a high melting point metal such as tungsten (W) and molybdenum (Mo), and the metal plating layers (6b, 6c) are, for example, Ni or Au plating layers 6b containing cobalt. , And a Ni or Au plating layer 6c containing cobalt is sequentially deposited.
[0023]
The base 1 of the present invention is a substantially rectangular parallelepiped made of ceramics such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, and a glass ceramic sintered body. And a mounting portion 1a formed of a conductor layer for mounting the light emitting element 3 on the upper surface thereof. When the substrate 1 is made of, for example, an aluminum oxide sintered body, a raw material powder of aluminum oxide, silicon oxide, magnesium oxide, calcium oxide, or the like is mixed with a suitable organic binder, a solvent, or the like to form a slurry. Is formed into a sheet by a well-known doctor blade method, calender roll method, or the like to obtain a green sheet (ceramic green sheet). Thereafter, the green sheet is subjected to an appropriate punching process, and a plurality of the green sheets are laminated. (About 1600 ° C.).
[0024]
The base 1 has a metallized wiring conductor 4a extending from the mounting portion 1a on the upper surface to the lower surface and a metallized wiring conductor 4b extending from the periphery of the mounting portion 1a to the lower surface. The mounting portion 1a and the metallized wiring conductors 4a and 4b are made of metallized metal powder such as W, Mo, manganese (Mn), and the metallized wiring conductors 4a and 4b electrically connect the light emitting element 3 housed in the package to the outside. Function as conductive paths. A light emitting element 3 such as a light emitting diode is fixed to the mounting portion 1a by a conductive bonding material such as a gold-silicon alloy or silver-epoxy resin, and an electrode of the light emitting element 3 is bonded to a metallized wiring conductor 4b by a bonding wire. 5 are electrically connected.
[0025]
The mounting portion 1a and the metallized wiring conductors 4a and 4b provided on the base 1 are made of metallized metal powder of high melting point metal such as W, Mo, Mn, etc. The metallized wiring conductors 4a and 4b are wiring conductors of an external electric circuit board not shown. To electrically connect each electrode of the semiconductor element 3 to the external electric circuit board. The metallized wiring conductors 4a and 4b are prepared by adding a suitable organic solvent and a solvent to a high-melting point metal powder such as W, for example, and applying a conductive paste to a green sheet serving as the base 1 in advance by a conventionally known screen printing method. By printing and applying the pattern, it is adhered and formed at a predetermined position on the substrate 1.
[0026]
A metal having excellent corrosion resistance and excellent wettability of a brazing material such as Ni, Au, and Ag is applied to the exposed surfaces of the mounting portion 1a and the metallized wiring conductors 4a and 4b in a thickness of about 1 to 20 μm. In addition, the mounting portion 1a and the metallized wiring conductors 4a and 4b can be effectively prevented from being oxidized and corroded, and the bonding between the mounting portion 1a and the light emitting element 3 and the bonding between the metallized wiring conductor 4b and the bonding wire 5 are strengthened. be able to. Therefore, a Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer or an Ag plating layer having a thickness of about 0.1 to 3 μm are formed on the exposed surfaces of the mounting portion 1a and the metallized wiring conductors 4a and 4b by electrolytic plating. It is better to apply them sequentially by electroless plating.
[0027]
The frame 2 is made of the same material as the base 1 such as an aluminum oxide sintered body (alumina ceramics). When the base 1 is made of an aluminum oxide sintered body as described above, the frame 2 is substantially formed of the same material. The green sheet having the same composition as above is subjected to a punching process for forming a substantially circular or square through hole 2a for accommodating the light emitting element 3 in the central portion of the frame 2, and a plurality of these are laminated, It is laminated on a green sheet serving as the base 1 and sintered to be integrated with the base 1.
[0028]
A conductor paste obtained by adding and mixing an appropriate organic solvent and a solvent to a powder of a high melting point metal such as W or Mo is coated on the inner surface of the through hole 2a of the green sheet serving as the frame 2 by screen printing which is conventionally known. By printing and applying a predetermined pattern by the method, the metal layer 6a is formed on substantially the entire inner surface of the through hole 2a or on a predetermined position.
[0029]
The metal layer 6a preferably contains 1 to 5 parts by weight of Mo with respect to 100 parts by weight of W. When Mo is less than 1 part by weight, the frame 2 made of an alumina-based sintered body (coefficient of thermal expansion of about 7.8 × 10 ⁻⁶ / ° C.) and W (coefficient of thermal expansion of about 4.6 × 10 ⁻⁶ / ° C.) C) and Mo (coefficient of thermal expansion: about 5.7 × 10 ⁻⁶ / ° C.), the thermal stress due to the difference in thermal expansion coefficient between the metal layer 6a and the metal layer 6a increases. It tends to be more easily peeled. If it exceeds 5 parts by weight, the adhesion strength of the metal layer 6a to the frame 2 tends to deteriorate.
[0030]
That is, the metal layer 6a has a thermal expansion coefficient of about 4.6 × 10 ⁻⁶ / ° C., and a thermal expansion coefficient of about 5.7 × 10 ⁻⁶ / ° C., and thus has an alumina sintered body as compared with W. By containing a small amount of Mo having a similar thermal expansion coefficient, the thermal expansion coefficient becomes close to that of the alumina sintered body. As a result, the reliability of the attachment of the metal layer 6a to the frame 2 is greatly improved.
[0031]
In addition, a first metal plating layer 6b made of Ni, Au or the like containing cobalt is deposited on the metal layer 6a. The content of cobalt in the first metal plating layer 6b is preferably 5 to 40 parts by weight, and the thickness of the first metal plating layer 6b is preferably 2 μm or less. When the content of cobalt is less than 5 parts by weight, the effect of improving the adhesion strength by containing cobalt is not so improved, and when it exceeds 40 parts by weight, the heat resistance and corrosion resistance of the first metal plating layer 6 b are increased. Will decrease. If the thickness exceeds 2 μm, the bonding strength between the metal layer 6a and the first metal plating layer 6b tends to decrease.
[0032]
Further, after the first metal plating layer 6b is applied, heat treatment at 700 ° C. or more in a non-oxidizing atmosphere makes the metal plating layer dense, and enhances the adhesion between the metal layer 6a and the first metal plating layer 6b. The joining strength can be improved.
[0033]
Then, a second metal plating layer 6c made of Ni, Au or the like containing cobalt is deposited on the first metal plating layer 6b. The content of cobalt in the second metal plating layer 6c is preferably 5 to 40 parts by weight, and the thickness of the first metal plating layer 6c is preferably 3 μm or less. If the content of cobalt is less than 5 parts by weight, the effect of improving the adhesion strength by containing cobalt is not so improved, and if it exceeds 40 parts by weight, the heat resistance and corrosion resistance of the second metal plating layer 6 c Tends to decrease. On the other hand, if the thickness exceeds 3 μm, the bonding strength with the reflective layer 7 tends to decrease.
[0034]
The total thickness of the first metal plating layer 6b and the second metal plating layer 6c is preferably about 1 to 5 μm, and particularly preferably about 1.5 to 4 μm. When the thickness is less than 1 μm, the high melting point metal in the metal layer 6a and the glass in the ceramics diffuse out onto the second metal plating layer 6c and the reflective layer 7 to lower the reflectivity. Heat resistance and corrosion resistance are reduced, and the bonding strength between the second metal plating layer 6c and the reflective layer 7 and the bonding strength between the reflective layer 7 and the transparent resin are reduced. On the other hand, when the thickness exceeds 5 μm, the bonding strength between the second metal plating layer 6c and the reflective layer 7 is liable to deteriorate because the bonding force at the bonding surface is reduced.
[0035]
Then, the reflection layer 7 is deposited on the second metal plating layer 6c. As the reflective layer 7, a metal plating layer of Au, Ag, Pt, or the like is preferably applied. In this case, the reflectance of the light emitted by the light emitting element 3 housed in the through hole 2a should be 80% or more. preferable. If the reflectance is less than 80%, it becomes difficult to satisfactorily reflect the light emitted from the light emitting element 3 housed in the through hole 2a. In the case where Au, Ag, or Pt is used as the reflective film 7, it is preferable that the reflective film 7 has a thickness of about 0.1 to 3 μm.
[0036]
In the present invention, the angle θ (FIG. 1) formed by the inner surface of the through hole 2a and the upper surface of the base 1 is preferably 35 to 70 degrees. When the angle exceeds 70 degrees, it becomes difficult to reflect light emitted from the light emitting element 3 housed inside the through hole 2a to the outside well. is less than 35 degrees, it is difficult to form the inner surface of the through hole 2a at such an angle stably and efficiently by a punching method, and the package becomes large.
[0037]
The through hole 2a of the frame 2 is formed by punching a through hole in a green sheet for the frame 2 using a punching die. At this time, the inner surface of the through hole formed in the green sheet for the frame 2 is formed so as to spread at an angle θ of 35 to 70 degrees from one main surface to the other main surface of the green sheet. By forming the inner surface of the through hole 2a so as to spread at an angle θ of 35 to 70 degrees from one main surface of the green sheet to the other main surface, the inner surface of the through hole 2a of the frame 2 is It is formed so as to spread outward at an angle θ of 35 to 70 degrees with respect to the upper surface of the base 1. The through-hole 2a preferably has a substantially circular cross-sectional shape. In this case, light emitted from the light-emitting element 3 accommodated in the through-hole 2a is uniformly reflected in all directions by the inner surface of the substantially circular through-hole 2a. Can be radiated very uniformly to the outside.
[0038]
The arithmetic average roughness Ra of the surface of the reflection layer 7 attached to the inner surface of the through hole 2a is preferably 1 to 3 μm. If it is less than 1 μm, it is difficult to uniformly reflect the light emitted from the light emitting element 3 accommodated in the through hole 2a, and the intensity of the reflected light tends to be uneven. If it exceeds 3 μm, the inner surface of the through-hole 2a also becomes a roughly rough surface, but it is difficult to form such a rough surface stably and efficiently.
[0039]
In addition, the metal layer 6a, the first metal plating layer 6b, the second metal plating layer 6c, and the reflection layer 7 are formed at least on the inner surface of the through hole 2a at a position above the light emitting part of the light emitting element 3. Alternatively, the reflection layer 7 may be formed at least on a portion of the second metal plating layer 6c above the light emitting portion of the light emitting element 3, and in this case, the light of the light emitting element 3 is efficiently reflected. Can be. Further, the metal layer 6a, the first metal plating layer 6b, the second metal plating layer 6c, and the reflection layer 7 are provided not only on the inner surface of the through hole 2a but also on the exposed upper surface of the base 1 and the mounting portion 1a and the metallized wiring conductor. It may be formed around 4a, 4b. In this case, light that has been irregularly reflected on the inner surface of the through hole 2a or in the transparent resin and has reached the exposed upper surface of the base 1 can be effectively reflected to the outside.
[0040]
In addition, the upper surface of the frame 2 is coated with black, brown, dark blue, or the like to increase the contrast between the light emitting region (including the reflection region) of the light emitting element 3 and the non-light emitting region, or to light the adjacent light emitting device. Interference can be suppressed.
[0041]
The transparent resin covering the light emitting element 3 is made of an epoxy resin, a urea resin, a silicone resin, or the like.
[0042]
Thus, according to the package of the present invention, the light emitting element 3 is mounted on the mounting portion 1a of the base 1, and the electrodes of the light emitting element 3 are electrically connected to the metallized wiring conductors 4b through the bonding wires 5. Thereafter, a light emitting device is obtained by providing a transparent resin so as to cover the light emitting element 3 or filling the through hole 2a in which the light emitting element 3 is accommodated with the transparent resin to seal the light emitting element 3.
[0043]
Note that the present invention is not limited to the above-described embodiment, and various changes can be made without departing from the spirit of the present invention. For example, as shown in the sectional view of the package in FIG. 4, the light emitting element 3 is directly mounted on the upper surface of the base 1 without forming the mounting portion 1a as a conductor layer, and the electrodes of the light emitting element 3 are electrically May be formed. In this case, the light emitting element 3 is mounted on the mounting portion 1a, and the electrodes of the light emitting element 3 and the metallized wiring conductors 4a, 4b are electrically connected via the bonding wires 5a, 5b and the like.
[0044]
【The invention's effect】
Since the light-emitting element housing package of the present invention has a metal plating layer containing a high melting point metal and a metal plating layer containing cobalt sequentially applied to the inner surface of the through hole, the metal plating layer containing cobalt is In addition to being firmly adhered to the metal layer containing the high melting point metal, when a reflective layer made of Au, Ag, Pt or the like is adhered on the metal plating layer, the bonding strength with the reflective layer can be increased. .
[0045]
In the light-emitting element housing package of the present invention, preferably, the metal plating layer comprises a first metal plating layer containing cobalt and a second metal plating layer containing cobalt deposited thereon, Since the reflective layer that reflects the light emitted from the light emitting element is deposited on the metal plating layer, the first metal plating layer containing cobalt is firmly deposited on the metal layer containing the high melting point metal. You. Further, since the second metal plating layer is deposited on the first metal plating layer and the metal plating layer is firmly deposited on the metal layer, the thickness of the metal plating layer can be increased. As a result, it is possible to effectively prevent components such as the high melting point metal in the metal layer and the glass in the ceramic from diffusing out onto the metal plating layer and the reflection layer, thereby increasing the reflectance of the reflection layer. Can be maintained. In addition, since the above-mentioned diffusion on the reflective layer can be prevented, good adhesion between the reflective layer and the transparent resin can be maintained.
[0046]
The light-emitting device of the present invention includes the light-emitting element housing package of the present invention, the light-emitting element mounted on the mounting portion, and the transparent resin covering the light-emitting element. The layer is firmly applied and the reflectivity of the reflective layer is kept high so that it is highly reliable.
[Brief description of the drawings]
FIG. 1A is a cross-sectional view illustrating an example of an embodiment of a light-emitting element housing package according to the present invention, and FIG. 1B is a cross-sectional view of a main part of FIG.
FIG. 2 is a cross-sectional view of an example of a conventional light emitting element storage package.
FIG. 3 is a cross-sectional view of another example of a conventional light emitting element storage package.
FIG. 4 is a cross-sectional view showing another example of the embodiment of the light emitting element housing package of the present invention.
[Explanation of symbols]
1: Ceramic base 1a: Mounting part 2: Ceramic frame 2a: Through hole 3: Light emitting element 6a: Metal layer 6b: First metal plating layer 6c: Second metal plating layer 7: Reflective layer

Claims (3)

A ceramic frame having a through hole for accommodating the light emitting element is joined to an upper surface of a flat ceramic base having a mounting part for mounting the light emitting element on the upper surface so as to surround the mounting part. A light emitting element housing package, wherein a metal layer containing a high melting point metal and a metal plating layer containing cobalt are sequentially applied to an inner surface of the through hole. The metal plating layer is composed of a first metal plating layer containing cobalt and a second metal plating layer containing cobalt deposited thereon, and the light emitting element is provided on the second metal plating layer. 2. The package for housing a light emitting element according to claim 1, wherein a reflection layer for reflecting light emitted from the light emitting device is provided. A light-emitting device comprising: the light-emitting element storage package according to claim 1; a light-emitting element mounted on the mounting portion; and a transparent resin covering the light-emitting element.

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