JP2010114387A - Light emitting device and method of manufacturing the same, and light emitting module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting device whose manufacturing process is simplified and manufacturing yield is improved. <P>SOLUTION: The surface-mounted LED (light emitting device) includes a substrate 10 made of a metal plate and formed in an electrode pattern, an adhesion layer 20 formed on the substrate 10 and having an insulating function, a reflection frame 30 stacked on the substrate 10 with the adhesion layer 20 interposed and made of a metal plate, and having an opening 31 penetrating it along the thickness, an LED element 40 mounted on the substrate 10 and disposed in a region inside the opening 31, and a light-transmissive member 50 sealing the LED element 40. The substrate 10 is formed by stacking the two metal plates together with the adhesion layer 20 interposed and then etching the lower metal plate, and the reflection frame 30 is formed by etching the upper metal plate. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a light emitting device, a manufacturing method thereof, and a light emitting module, and more particularly, to a light emitting device including a light emitting element, a manufacturing method thereof, and a light emitting module.

  Conventionally, a light-emitting device equipped with a light-emitting element as a light source is known (see, for example, Patent Document 1).

  Patent Document 1 discloses a printed circuit board on which an LED (Light Emitting Diode) element (light emitting element) as a light source is mounted, and a reflective frame body that is provided on the printed circuit board and reflects light from the LED element. A light emitting device comprising a (reflector) is described. In this light emitting device, the reflection frame is made of a metal material, and is fixed on the printed board with a resin adhesive.

  In addition, metal electrodes are formed on the upper surface of the printed board on which the LED elements are mounted, and electrode terminals are formed on the lower surface of the printed board. And the metal electrode and the electrode terminal are electrically connected by the connection part formed in the side surface of the printed circuit board. That is, the printed board is composed of a double-sided board. On the other hand, the LED element on the printed board is electrically connected to the metal electrode of the printed board through a wire.

In the conventional light emitting device configured as described above, the heat dissipation characteristics of the light emitting device can be improved by dissipating the heat from the LED elements from the reflective frame made of a metal material. It becomes possible to make it.
JP 2005-229003 A

  However, in the conventional light emitting device described in Patent Document 1, since the reflective frame is fixed on the printed circuit board by the resin adhesive, when the reflective frame is fixed on the printed circuit board, There is a disadvantage that the resin adhesive protrudes into the inner region. On the other hand, if an attempt is made to suppress the protrusion of the resin adhesive, the adhesion area (resin adhesive formation area) becomes too small. In this case, it is difficult to obtain a desired adhesive strength in fixing the printed circuit board and the reflection frame body, and there is a disadvantage that an adhesion failure occurs. For this reason, the above-described conventional light-emitting device has a problem that reliability is lowered and a manufacturing yield is lowered.

  In addition, if the printed circuit board and the reflective frame are fixed so that the resin adhesive does not protrude into the inner region of the reflective frame and adhesion failure does not occur, the manufacturing process becomes complicated. There is also a point. In addition, since the above-described conventional light emitting device uses a printed board made of a double-sided board, there is also a disadvantage that the manufacturing process of the board becomes complicated. This also complicates the manufacturing process of the light emitting device.

  The present invention has been made to solve the above-described problems, and one object of the present invention is a light-emitting device having high reliability and good light-emitting characteristics, a method for manufacturing the same, and a light-emitting module. Is to provide.

  Another object of the present invention is to provide a light emitting device capable of simplifying the manufacturing process and improving the manufacturing yield, a manufacturing method thereof, and a light emitting module.

  Yet another object of the present invention is to provide a light emitting device capable of improving the light emission characteristics by improving the heat dissipation characteristics.

  In order to achieve the above object, a method of manufacturing a light emitting device according to a first aspect of the present invention includes a step of preparing a first metal plate and a second metal plate, and insulating the first metal plate and the second metal plate. A step of laminating via a functional adhesive layer, a step of patterning the first metal plate into an electrode pattern by etching the first metal plate, and a second metal plate by etching the second metal plate A step of forming an opening for exposing the adhesive layer, a step of removing a predetermined portion of the adhesive layer exposed by the opening, and mounting the light emitting element on the first metal plate in the region inside the opening. And a step of resin-sealing the light-emitting element by filling the region inside the opening with a translucent resin. And the process of forming an opening part in a 2nd metal plate includes the process of forming an opening part so that the inner surface of an opening part may function as a reflective surface which reflects the light from a light emitting element. The step of patterning the first metal plate and the step of forming the opening in the second metal plate may be the same step or different steps. When performing in a separate step, the step of patterning the first metal plate may be prior to or after the step of forming the opening in the second metal plate.

  In the method for manufacturing the light emitting device according to the first aspect, as described above, after the first metal plate and the second metal plate are laminated via the adhesive layer having an insulating function, the first metal plate and the second metal are stacked. By etching the plate, the first metal plate can be formed on the substrate, and the second metal plate can be formed on a reflective frame (reflector) that reflects light from the light emitting element. Further, by removing a predetermined portion of the adhesive layer exposed by the opening, the light emitting element can be mounted on the substrate made of the first metal plate, and the first metal plate (substrate) and the light emission The element can be electrically connected. Thereby, since the board | substrate comprised from a 1st metal plate and the reflective frame body comprised from a 2nd metal plate can be made easy to be reliably adhere | attached, it can suppress the fall of reliability. it can. In addition, the manufacturing yield can be improved by suppressing the decrease in reliability.

  Further, in the first aspect, the substrate composed of the first metal plate and the reflection frame body composed of the second metal plate can be easily fixed (adhered) without causing poor adhesion. The manufacturing process can be simplified. Note that the manufacturing cost of the light-emitting device can be reduced by simplifying the manufacturing process of the light-emitting device and improving the manufacturing yield.

  Further, in the first aspect, since the substrate and the reflection frame are each composed of a metal plate, heat generated by light emission of the light emitting element can be dissipated from the first metal plate (substrate), and the first Heat can also be radiated from the second metal plate (reflective frame) through one metal plate (substrate). As a result, it is possible to effectively dissipate heat generated by the light emitting element emitting light, thereby improving heat dissipation characteristics. Further, by improving the heat dissipation characteristics, the temperature of the light emitting element can be kept low even if the light emitting element generates heat due to light emission. As a result, it is possible to suppress the inconvenience that the light emission characteristics are deteriorated due to the temperature rise of the light emitting element, so that good light emission characteristics can be obtained. In the method for manufacturing the light emitting device according to the first aspect, one or more first metal plates and one or more second metal plates are laminated via an adhesive layer.

  A method for manufacturing a light emitting device according to a second aspect of the present invention includes a step of laminating a first metal plate and a second metal plate via an adhesive layer having an insulating function, and etching the first metal plate. Patterning the first metal plate into an electrode pattern, etching the second metal plate, and exposing the adhesive layer to the second metal plate and forming an opening whose inner surface functions as a reflecting surface; A step of removing a predetermined portion of the adhesive layer exposed by the opening, a step of preparing a laminated plate formed through the opening, and mounting the light emitting element on the first metal plate in a region inside the opening And a step of resin-sealing the light-emitting element by filling a translucent resin in a region inside the opening. Even when configured in this way, it is possible to obtain the same effects as those of the method for manufacturing the light emitting device according to the first aspect.

  In the method for manufacturing a light emitting device according to the second aspect, the step of preparing the laminated plate uses a member obtained by a part of the steps in addition to the case of preparing the laminated plate obtained through the above steps. And the case where a laminated board is obtained by implementing the remaining process is also included.

  In the method of manufacturing the light emitting device according to the first and second aspects, the step of patterning the first metal plate into an electrode pattern includes a second conductor that is insulated and separated through the first conductor portion, the first conductor portion, and the gap portion. It is preferable to include the process of patterning a 1st metal plate so that a conductor part may be included. In addition, one or more 1st conductor parts and one or more 2nd conductor parts are formed by patterning a 1st metal plate.

  In the method for manufacturing a light emitting device according to the first and second aspects, preferably, in the step of removing the adhesive layer, a predetermined portion including a region on which the light emitting element is mounted is formed by laser processing in the region inside the opening. Removing. If comprised in this way, since the predetermined part of the contact bonding layer exposed inside the opening part can be removed easily, a light emitting element can be easily mounted on the board | substrate which consists of a 1st metal plate.

  In the configuration in which the first metal plate is patterned so as to include the first conductor portion and the second conductor portion, preferably, the step of removing the adhesive layer includes a gap portion in the adhesive layer in the region inside the opening. Forming a covering portion for covering. If comprised in this way, in order to make a 1st metal plate function as an electrode, even when forming the 1st conductor part and the 2nd conductor part which were insulated and isolated from each other, the 1st conductor part and the 2nd conductor part It is possible to prevent light from leaking from the gap for insulating and separating the light. Thereby, the fall of the light emission characteristic resulting from light leakage can be suppressed. Further, when configured in this manner, it is possible to prevent the light-transmitting resin from leaking from the gap when the light-emitting element is sealed with the light-transmitting resin.

  In the configuration in which the first metal plate is patterned to include the first conductor portion and the second conductor portion, the step of mounting the light emitting element includes the step of fixing the light emitting element on the first conductor portion, Preferably, the method includes at least a step of electrically connecting to the second conductor portion.

  In the method for manufacturing the light emitting device according to the first and second aspects, the step of forming the opening in the second metal plate preferably includes a step of configuring the opening width of the opening to expand upward. .

  In the method for manufacturing the light emitting device according to the first and second aspects, preferably, the first metal plate and the adhesive layer are formed prior to the step of patterning the first metal plate and the step of forming the opening in the second metal plate. And a step of forming a through hole continuously penetrating the second metal plate in the thickness direction. If comprised in this way, since a 1st metal plate and a 2nd metal plate can be thermally connected, the heat | fever from a light emitting element will be 2nd metal plates (via a 1st metal plate (board | substrate) ( It is possible to facilitate transmission to the reflection frame. Thereby, the heat dissipation characteristic can be easily improved.

  In this case, the step of forming the through hole preferably includes a step of thermally connecting the first conductor portion of the first metal plate and the second metal plate through the through hole.

  A light emitting device according to a third aspect of the present invention is a light emitting device manufactured using the method according to the first or second aspect. If comprised in this way, the light-emitting device which has high reliability and a favorable light emission characteristic can be obtained easily.

  A light-emitting device according to a fourth aspect of the present invention includes a substrate formed of a first metal plate, formed in an electrode pattern, an adhesive layer having an insulating function formed on the substrate, and the substrate via the adhesive layer. A reflective frame including an opening that is laminated on the second metal plate and penetrates in the thickness direction; a light-emitting element that is placed on the substrate and disposed in a region inside the opening; and a light-emitting element And a sealing body for sealing. The adhesive layer has a predetermined portion including a mounting portion on which the light emitting element is mounted removed in a region inside the opening, and the light emitting element is electrically connected to the substrate and is reflective. The opening of the frame includes an inner side surface that functions as a reflecting surface that reflects light from the light emitting element.

  In the light emitting device according to the fourth aspect, the first metal plate and the second metal plate are laminated after the first metal plate and the second metal plate are laminated via the adhesive layer having an insulating function by being configured as described above. By etching the metal plate, the first metal plate can be configured (formed) on the substrate, and the second metal plate is configured (formed) on a reflection frame (reflector) that reflects light from the light emitting element. can do. Further, by removing a predetermined portion of the adhesive layer inside the opening, the light emitting element can be mounted on the substrate formed of the first metal plate, and the substrate and the light emitting element are electrically connected. Can be connected. Thereby, since the board | substrate comprised from a 1st metal plate and the reflective frame body comprised from a 2nd metal plate can be made easy to be reliably adhere | attached, it can suppress the fall of reliability. it can. In addition, the manufacturing yield can be improved by suppressing the decrease in reliability.

  Further, in the fourth aspect, the substrate composed of the first metal plate and the reflection frame body composed of the second metal plate can be easily fixed (adhered) without causing poor adhesion. The manufacturing process of the light emitting device can be simplified. Note that the manufacturing cost of the light-emitting device can be reduced by simplifying the manufacturing process of the light-emitting device and improving the manufacturing yield.

  Further, in the fourth aspect, since the substrate and the reflection frame are each composed of a metal plate, heat generated by light emission of the light emitting element can be dissipated from the substrate, and the reflection frame is interposed via the substrate. Can also be dissipated. As a result, it is possible to effectively dissipate heat generated by the light emitting element emitting light, thereby improving heat dissipation characteristics. Further, by improving the heat dissipation characteristics, the temperature of the light emitting element can be kept low even if the light emitting element generates heat due to light emission. As a result, it is possible to suppress the inconvenience that the light emission characteristics are deteriorated due to the temperature rise of the light emitting element, so that good light emission characteristics can be obtained.

  In the light emitting device according to the fourth aspect, the substrate includes a first conductor portion and a second conductor portion insulated and separated from the first conductor portion, and the light emitting element is placed on the first conductor portion. At the same time, it is preferably electrically connected to at least the second conductor portion. The substrate includes one or more first conductor portions and one or more second conductor portions.

  In the light emitting device according to the fourth aspect, part or all of the portion of the adhesive layer located in the region inside the opening may be removed.

  In the case where the substrate includes the first conductor portion and the second conductor portion, preferably, the substrate has a gap portion for insulating and separating the first conductor portion and the second conductor portion, and an adhesive layer. Has a covering portion that covers the gap in the region inside the opening. If comprised in this way, since it can suppress that light leaks from the clearance gap part of a board | substrate, the fall of the light emission characteristic resulting from light leakage can be suppressed. Further, when configured in this manner, it is possible to prevent the light-transmitting resin from leaking from the gap when the light-emitting element is sealed with the light-transmitting resin.

  In the case where the substrate includes a first conductor portion and a second conductor portion, preferably, the substrate has a gap portion for insulating and separating the first conductor portion and the second conductor portion, and is sealed The body contains a phosphor that converts the wavelength of light from the light emitting element, and the phosphor is concentrated in a predetermined region including a gap portion of the substrate by being settled in the sealing body. Yes. If comprised in this way, since the light from a light emitting element can be reflected with the fluorescent substance of a clearance gap, the light leakage from a clearance gap can be suppressed effectively.

  In the light emitting device according to the fourth aspect, preferably, the opening of the reflection frame is formed by etching so that the opening width widens upward. If such a configuration is applied to the light emitting device according to the third aspect, the light emission characteristics can be easily improved.

  The light emitting device according to the fourth aspect preferably further includes a through hole that continuously passes through the substrate, the adhesive layer, and the reflective frame in the thickness direction. If comprised in this way, since a board | substrate and a reflective frame body can be thermally connected, the heat | fever from a light emitting element can be easily transmitted to a reflective frame body through a board | substrate. Thereby, the heat dissipation characteristic can be easily improved.

  In this case, it is preferable that the 1st conductor part of a board | substrate and the reflective frame body are thermally connected by the through hole.

  In the light emitting device according to the fourth aspect, it is preferable that at least the inner surface of the opening of the reflection frame is subjected to a surface treatment for improving the light reflectance. Examples of such surface treatment include silver plating treatment, silver + palladium plating treatment, silver + ceramic coating treatment, and alumite treatment.

  In the light emitting device according to the fourth aspect, the region where the light emitting element is placed may be subjected to a surface treatment for improving light reflectivity and facilitating wire bonding or flip connection. Examples of such surface treatment include silver plating treatment and silver + palladium plating treatment.

  Furthermore, in the light emitting device according to the fourth aspect, the solderability is improved so that the back surface of the region where the light emitting element is placed (the back surface of the substrate) can be soldered to a circuit substrate such as a mounting substrate. A surface treatment may be applied. Examples of such surface treatment include silver plating and gold plating.

  In the light emitting device according to the fourth aspect, it is preferable that the first metal plate and the second metal plate are made of the same metal material.

  In this case, the first metal plate and the second metal plate are preferably made of aluminum, aluminum alloy, copper, or copper alloy, respectively.

  In the light emitting device according to the fourth aspect, the light emitting element may be a light emitting diode element, and the light emitting diode element may be electrically connected to the substrate via a bonding wire.

  In the light emitting device according to the fourth aspect, the light emitting element may be a light emitting diode element, and the light emitting diode element may be electrically connected to the substrate by flip connection.

  A light emitting module according to a fifth aspect of the present invention is a light emitting module including a plurality of light emitting devices according to the fourth aspect. If comprised in this way, the light emitting module which has high reliability and a favorable light emission characteristic can be obtained easily.

  As described above, according to the present invention, it is possible to easily obtain a light emitting device having high reliability and good light emission characteristics, a method for manufacturing the same, and a light emitting module.

  Further, according to the present invention, it is possible to easily obtain a light emitting device, a manufacturing method thereof, and a light emitting module capable of simplifying the manufacturing process and improving the manufacturing yield.

  Further, according to the present invention, it is possible to easily obtain a light emitting device capable of improving the light emission characteristics by improving the heat dissipation characteristics.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Embodiments of the invention will be described below with reference to the drawings. In the following embodiments, a case where the present invention is applied to a surface-mounting LED (Light Emitting Diode) which is an example of a light emitting device will be described.

(First embodiment)
FIG. 1 is an exploded perspective view of a surface-mounted LED according to the first embodiment of the present invention, and FIG. 2 is an overall perspective view of the surface-mounted LED according to the first embodiment of the present invention. FIG. 3 is a cross-sectional view of the surface-mounted LED according to the first embodiment of the present invention, and FIG. 4 is a plan view of the surface-mounted LED according to the first embodiment of the present invention as viewed from above. 5-7 is a figure for demonstrating the surface mount type LED by 1st Embodiment of this invention. FIG. 3 shows a cross section taken along the line AA of FIG. First, the structure of the surface-mounted LED according to the first embodiment of the present invention will be described with reference to FIGS.

  As shown in FIGS. 1 to 3, the surface-mount LED according to the first embodiment includes a substrate 10, an adhesive layer 20 having an insulating function formed on the substrate 10, and an adhesive layer 20 on the substrate 10. The reflective frame 30 fixed in this manner, the light emitting diode element (LED element) 40 fixed in a predetermined area on the substrate 10, and the translucency that fills the inside of the reflective frame 30 and seals the LED element 40. The member 50 (refer FIG. 2 and FIG. 3) is provided. The LED element 40 is an example of the “light emitting element” in the present invention, and the translucent member 50 is an example of the “sealing body” in the present invention.

  The substrate 10 is composed of a metal plate (first metal plate) having a thickness of about 0.1 mm to about 0.3 mm. As shown in FIGS. 1, 4, and 5, the substrate 10 includes a first conductor part 11 on which the LED element 40 is mounted and a second conductor part 12 separated from the first conductor part 11. Yes. Further, the metal plate (first metal plate) constituting the substrate 10 is made of aluminum or aluminum alloy having excellent heat dissipation characteristics (thermal conductivity). Specifically, the metal plate (first metal plate) constituting the substrate 10 is made of an Al—Mg—Si heat treatment alloy, for example, a special alloy foil manufactured by Showa Aluminum Co., Ltd. Further, as shown in FIGS. 1 and 5, the substrate 10 has a substantially rectangular shape in plan view, and the first conductor portion 11 of the substrate 10 has one side in the longitudinal direction (X direction). On the other hand, the second conductor portion 12 of the substrate 10 is disposed on the other end side in the longitudinal direction (X direction).

  Further, the first conductor portion 11 of the substrate 10 is configured to have a larger planar area than the second conductor portion 12 of the substrate 10. The substrate 10 has a length L of about 4.5 mm in the longitudinal direction (X direction). The first conductor portion 11 of the substrate 10 has a width W1 that is substantially the same as the width W of a reflection frame 30 described later. On the other hand, the width W2 of the second conductor portion 12 of the substrate 10 is configured to be smaller than the width W1 of the first conductor portion 11.

  Here, in 1st Embodiment, the 1st conductor part 11 and the 2nd conductor part 12 which comprise the board | substrate 10 each function as an electrode for electrically feeding the LED element 40 from the external circuit which is not shown in figure. Specifically, the first conductor portion 11 of the substrate 10 functions as a cathode electrode, and the second conductor portion 12 functions as an anode electrode. Then, as shown in FIG. 5, in order to prevent the first conductor portion 11 and the second conductor portion 12 from being electrically short-circuited, the first conductor portion 11 and the second conductor portion 12 are separated from each other by a predetermined distance. Are arranged apart from each other. For this reason, as shown in FIGS. 1, 3, and 5, a gap 13 is formed between the first conductor portion 11 and the second conductor portion 12.

  The reflection frame 30 is composed of a metal plate (second metal plate) made of the same metal material as the metal plate (first metal plate) constituting the substrate 10, and is flat as shown in FIGS. 2 and 4. From the perspective, it is formed in a substantially rectangular shape. Specifically, the reflection frame 30 is made of aluminum or an aluminum alloy (for example, an Al—Mg—Si heat treatment alloy), has a length L of about 4.5 mm in the X direction, It has a width W of about 2 mm in the orthogonal Y direction. Moreover, the reflective frame 30 has a thickness of about 0.4 mm to about 0.8 mm.

  In addition, an opening 31 that penetrates in the thickness direction is formed at the center of the reflective frame 30. The inner side surface 31 a of the opening 31 functions as a reflecting surface that reflects the light emitted from the LED element 40. As shown in FIGS. 1 and 3, the opening 31 is configured such that the opening width widens in a tapered shape (radially) upward. The inner side surface 31a of the reflection frame 30 is an example of the “reflection surface” in the present invention.

  The adhesive layer 20 is composed of, for example, a prepreg, a glass epoxy resin obtained by impregnating a glass base cloth material with an epoxy resin, an epoxy resin adhesive sheet, an imide-modified epoxy resin adhesive sheet, and the like. In addition, you may make it raise the heat conductivity of the contact bonding layer 20 by mixing inorganic type fillers, such as a silica or an alumina, in said epoxy resin. The adhesive layer 20 has a thickness of about 0.1 mm to about 0.3 mm, and has a substantially rectangular shape when seen in a plan view. Specifically, like the reflective frame 30, the adhesive layer 20 has a length L of about 4.5 mm in the X direction and a width W of about 2 mm in the Y direction.

  As shown in FIGS. 1 to 3, the adhesive layer 20 has a predetermined portion located inside the opening 31 of the reflection frame 30 removed, while the inside of the opening 31 of the reflection frame 30, A covering portion 21 that covers the gap portion 13 of the substrate 10 is formed. The reflective frame 30 is fixed on the substrate 10 through the adhesive layer 20.

  Further, the surface-mounted LED of the first embodiment is formed with a plurality of (two) through holes 60 that continuously penetrate the reflective frame 30, the adhesive layer 20, and the substrate 10 in the thickness direction. As shown in FIGS. 3 and 4, the through hole 60 is formed at the end of the first conductor portion 11 in the longitudinal direction (X direction).

  As shown in FIGS. 3 and 6, a plating layer 65 is formed on the back surface of the substrate 10, on the top surface of the reflective frame 30, and on the inner surface of the through hole 60. As shown in FIG. 7, the plating layer 65 is formed of a zinc replacement coating 66a having a thickness of about 0.1 .mu.m and a nickel plating coating having a thickness of about 0.15 .mu.m to about 0.25 .mu.m. 66b and a first plating layer 66 comprising a copper plating film 66c having a thickness of about 3 μm to about 5 μm, and an electrolytic copper plating film 67a having a thickness of about 30 μm to about 35 μm formed on the first plating layer 66. And the second plating layer 67.

  The first conductor portion 11 of the substrate 10 and the reflection frame body 30 are electrically and thermally connected by the above-described through hole 60. Note that the second conductor portion 12 of the substrate 10 and the reflection frame 30 are electrically insulated by the adhesive layer 20.

  As shown in FIGS. 3 and 6, NiAg plating films 70 are respectively formed on the upper surface of the reflection frame 30 and the back surface of the substrate 10. As shown in FIG. 7, the NiAg plating film 70 is formed by sequentially laminating a Ni plating film 70a and an Ag plating film 70b from the plating layer 65 side. The NiAg plating film 70 formed on the upper surface of the reflection frame 30 has a function of improving the light reflectance, and the NiAg plating film 70 formed on the back surface of the substrate 10 is a mounting substrate (not shown). Z)). Instead of the outermost Ag plating film 70b, an AgPd plating film may be formed.

  Moreover, since the width W1 (see FIG. 5) of the first conductor portion 11 of the substrate 10 is configured to be substantially the same as the width W (see FIG. 4) of the reflective frame 30, FIG. 5, the first conductor portion in the lateral direction (Y direction) and the side end face 32 of the reflective frame 30 in the short direction (Y direction) with the reflective frame 30 fixed on the substrate 10. 11 side end surface 11a is the same surface. On the other hand, since the width W2 (see FIG. 5) of the second conductor portion 12 of the substrate 10 is smaller than the width W1 of the first conductor portion 11, the width W of the reflecting frame 30 (see FIG. 4). Smaller than. For this reason, in a state where the reflection frame 30 is fixed on the substrate 10, the side end surface 12a of the second conductor portion 12 in the short direction (Y direction) is a side end surface of the reflection frame 30 when viewed in plan. It is comprised so that it may be located inside 32.

  The LED element 40 has a function of emitting blue light, and a plurality of LED elements 40 are mounted on the first conductor portion 11 of the substrate 10. Specifically, as shown in FIGS. 1 to 3, two LED elements 40 are respectively fixed on the first conductor portion 11 of the substrate 10 with an adhesive 41 (see FIG. 3). That is, the LED elements 40 are each fixed on the first conductor portion 11 of the substrate 10 so as to be positioned in the region inside the reflection frame 30. In addition, one electrode portion (not shown) of the LED element 40 and the second conductor portion 12 of the substrate 10 are electrically connected to each other via the bonding wire 42 and the other of the LED elements 40 is also connected. An electrode part (not shown) and the first conductor part 11 of the substrate 10 are electrically connected to each other via a bonding wire 43. The bonding wires 42 and 43 are made of fine metal wires such as Au, Ag, and Al.

  The translucent member 50 is made of a transparent resin material (sealing material, translucent resin) such as an epoxy resin or a silicone resin. As shown in FIG. 3, the translucent member 50 is formed in the opening 31 of the reflective frame 30. The LED element 40 and the bonding wires 42 and 43 are provided to be sealed. The translucent member 50 has a function of suppressing the LED element 40 and the bonding wires 42 and 43 from coming into contact with air or moisture by sealing the LED element 40 and the bonding wires 42 and 43. Yes. The translucent member 50 is formed by filling the transparent resin material into the opening 31 of the reflection frame 30 and then curing the transparent resin material.

  The translucent member 50 contains phosphor particles (not shown) that convert the wavelength of the blue light emitted from the LED element 40. Thereby, the emitted light from the surface mount type LED is configured to be white light. Note that the translucent member 50 is preferably made of a silicone-based resin in consideration of making it difficult for the light amount to decrease when used for a long time.

  In the surface-mounted LED according to the first embodiment configured as described above, a voltage is applied between the first conductor portion 11 and the second conductor portion 12 of the substrate 10 via the bonding wires 42 and 43. A current flows through the LED elements 40, and each LED element 40 emits blue light. A part of the blue light from the LED element 40 is converted into yellow light by the wavelength conversion by the phosphor in the translucent member 50, and the yellow light and the blue light are mixed to emit white light to the outside. Is done. On the other hand, the heat generated by the light emission of the LED element 40 is radiated from the first conductor portion 11 of the substrate 10, is conducted to the reflective frame body 30 through the through hole 60, and is also radiated from the reflective frame body 30. . As described above, the surface-mounted LED according to the first embodiment is configured to be able to effectively dissipate the heat generated in the LED element 40, so that the light emission efficiency is reduced due to the temperature rise of the LED element 40. In addition to being suppressed, high brightness proportional to the amount of current is obtained, and the effects of improving the functionality and life of the surface-mounted LED are obtained.

  FIGS. 8-24 is a figure for demonstrating the manufacturing method of surface mount type LED by 1st Embodiment of this invention. Next, with reference to FIG. 1, FIG. 2, FIG. 5 and FIG. 7 to FIG. 24, a method for manufacturing the surface-mounted LED according to the first embodiment of the present invention will be described.

  First, a special alloy foil having a thickness of about 0.1 mm to about 0.3 mm, which is a material of a metal plate (first metal plate) 10a constituting the substrate 10, and a metal plate (second plate) constituting the reflective frame 30. Metal plate) 30a special alloy foil having a thickness of about 0.4 mm to about 0.8 mm, and resin member (for example, a prepreg having a thickness of about 0.1 mm to about 0.3 mm) to be the adhesive layer 20 Etc.) and prepare.

  Next, as shown in FIG. 8, the conductive laminate is formed by sandwiching the adhesive layer 20 between the metal plate 10 a and the metal plate 30 a and laminating and bonding by hot pressing. Next, as shown in FIG. 9, a through hole 60 is formed by drilling a portion where a through hole is to be connected. Thereafter, surface treatment of aluminum (metal plates 10a and 30a) is performed. The surface treatment of the aluminum is performed by, for example, pretreatment of alkali degreasing, soft etching, acid dipping, double zinc substitution, and as shown in FIG. 7, first, a zinc substitution coating having a thickness of about 0.1 μm. 66a is formed on the metal plates 10a and 30a. Next, a nickel plating film 66b and a copper plating film 66c are sequentially laminated and plated on the zinc replacement film 66a.

  As a method of forming the nickel plating film 66b and the copper plating film 66c, first, a nickel plating film 66b having no pinholes and having a uniform and thin thickness (thickness: about 0.15 μm to about 0.25 μm) by using a nickel sulfamic acid strike bath. Form. A copper plating film 66c having a thickness of about 3 μm to about 5 μm is formed on the surface of the nickel plating film 66b by electroplating using a copper sulfate bath. Thereby, the 1st plating layer 66 which consists of the zinc substitution film 66a, the nickel plating film 66b, and the copper plating film 66c is formed in the surface of the metal plate 10a and the metal plate 30a.

  Next, a second plating layer 67 made of an electrolytic copper plating film 67 a is formed on the first plating layer 66 and on the side surface of the adhesive layer 20 in the through hole 60. The electrolytic copper plating film 67a formed in the through hole 60 is a through hole plating film.

  The second plating layer 67 is subjected to a pretreatment for removing the oxide film of the copper plating film 66c, a catalyst activation treatment, and a chemical copper plating (electroless copper plating) in this order, and then by electroplating using a copper sulfate bath to about 30 μm. Formed as a copper film having a thickness of ˜about 35 μm. And after buffing the surface of this 2nd plating layer 67 (electric copper plating film 67a), it dries for 10 minutes at the temperature of 80 degreeC. As a result, as shown in FIG. 10, a plating layer 65 composed of the first plating layer 66 and the second plating layer 67 is formed on the metal plate 10 a and the metal plate 30 a and on the inner side surface of the through hole 60. Is done.

  Subsequently, as shown in FIG. 11, a dry film 75 serving as a resist is laminated on the surface of the metal plate 10a and the surface of the metal plate 30a, respectively. Then, the dry film 75 is patterned to obtain a mask layer. Next, a predetermined region of the plating layer 65 is selectively removed by etching the plating layer 65 of the metal plate 10a and the plating layer 65 of the metal plate 30a using the dry film 75 as a mask. For the etching of the plating layer 65, for example, a hydrogen peroxide-sulfuric acid based etching solution that is a mixed solution of hydrogen peroxide and sulfuric acid is used. The specific composition of this etching solution is pure water 60 w%, 35% hydrogen peroxide 16 w%, 62.5% sulfuric acid 22.2 w% and hydrogen peroxide stabilizing additive 1 w%. Then, by using this etching solution and performing spray etching for 8 minutes at a liquid temperature of 30 ° C., only the plating layer 65 is first patterned.

  Next, the dry film 75 is peeled off, and the dry film 76 is laminated again and patterned into a resist pattern. At this time, as shown in FIG. 12, the dry film 76 to be laminated is patterned so as to cover the plating layer 65. Then, as shown in FIG. 13, the metal plate 10a is patterned into an electrode pattern by etching the metal plate 10a using the dry film 76 as a mask. Specifically, the metal plate 10a is patterned into a shape as shown in FIGS. At this time, the etching of the metal plate 10a is performed to a depth that reaches the adhesive layer 20 in the thickness direction. Thereby, the metal plate 10a is formed in a shape in which a plurality of substrates 10 including the first conductor portion 11 and the second conductor portion 12 are connected. Further, as shown in FIG. 13, by using the dry film 76 as a mask, the metal plate 30a is etched to form an opening 31 in a predetermined portion of the metal plate 30a. Specifically, the metal plate 30a is etched to a depth that reaches the adhesive layer 20 in the thickness direction, thereby forming a plurality of openings 31 in the metal plate 30a as shown in FIG. Thereby, the metal plate 30a is formed in a shape in which a plurality of reflection frame bodies 30 including the opening 31 are connected.

  For etching the metal plate 10a and the metal plate 30a, for example, a low-concentration ferric chloride-based, low-concentration cupric chloride-based, or phosphoric acid-based etching solution is used. The low concentration is 50% or less. By using this low-concentration ferric chloride or low-concentration cupric chloride-based etchant, the etching rate with respect to copper is greatly reduced, and it is made of aluminum. It becomes possible to selectively etch the metal plate 10a and the metal plate 30a. Then, the metal plate 10a is patterned by the wet etching process using this etching solution, and the opening 31 is formed in the metal plate 30a. Further, by forming the opening 31 in the metal plate 30a by a wet etching process, as shown in FIG. 13, the opening width of the opening 31 is formed so as to taper upward.

  If an undercut portion is generated in the plating layer 65 after the etching of the metal plates 10a and 30a, it is removed by a back etching process. This back etching process can be performed by the same method as the selective etching of the plating layer 65. In addition, when the thickness of the metal plate 10a and the metal plate 30a are significantly different, if the etching of the metal plate 10a and the etching of the metal plate 30a are performed in the same process, the metal plate having a small thickness (for example, the metal plate 10a). Will be over-etched. Therefore, in such a case, it is preferable to perform the etching of the metal plate 10a and the etching of the metal plate 30a in separate steps. For example, if the metal plate not to be etched is protected with a resist (not shown) or the like, only one of the etchings can be performed. At this time, any of the step of etching the metal plate 10a and the step of etching the metal plate 30a may be performed first.

  When the etching of the metal plate 10a and the metal plate 30a is completed, the dry film 76 as a mask layer is peeled off. Thus, as shown in FIG. 17, the metal plate 10 a (substrate 10) patterned into the electrode pattern and the metal plate 30 a (reflective frame 30) in which the opening 31 is formed are stacked via the adhesive layer 20. A laminated board is obtained. In this state, the adhesive layer 20 is exposed inside the opening 31.

  As the above-described dry films 75 and 76, for example, a dry film manufactured by Tokyo Ohka Kogyo Co., Ltd. (Audyl AF250: thickness 50 μm) can be used. The dry films 75 and 76 can be peeled off by, for example, spraying 4% sodium hydroxide (liquid temperature 40 ° C.) for 2 minutes.

  Subsequently, as shown in FIGS. 18 and 19, the adhesive layer 20 exposed in the region inside the opening 31 is removed by laser processing. At this time, the covering portion 21 that covers the gap portion 13 of the substrate 10 (metal plate 10a) is formed by removing a portion of the adhesive layer 20 exposed in the region inside the opening portion 31 without leaving it. To do. For laser processing, for example, YAG laser processing capable of fine processing can be used.

  Next, as shown in FIG. 20, the Ni plating film 70a (FIG. 7) is formed from the lower layer side on the back surface of the metal plate 10a (on the plating layer 65) and the upper surface of the metal plate 30a (on the plating layer 65), respectively. And an Ag plating film 70b (see FIG. 7) are sequentially laminated to form a NiAg plating film 70 composed of the Ni plating film 70a and the Ag plating film 70b. In the first embodiment, the NiAg plating film 70 is not formed on the inner surface of the opening 31 and the region inside the opening 31 in the metal plate 10a. The configuration as described above can be obtained, for example, by forming a mask layer (not shown) in a portion where the NiAg plating film 70 is not formed and then lifting off. It can also be obtained by forming a NiAg plating film 70 on the entire surface and then removing unnecessary portions by etching. Further, such a NiAg plating film 70 may be formed immediately after the formation of the plating layer 65 shown in FIG. In this case, after the NiAg plating film 70 is formed, the steps after the step shown in FIG. 11 are performed.

  Next, the LED element 40 is mounted on the laminate obtained through the above steps shown in FIGS. Specifically, as shown in FIG. 21, two LED elements 40 are fixed with an adhesive 41 on the first conductor portion 11 of the metal plate 10 a located inside the opening 31. And the LED element 40 and the metal plate 10a (board | substrate 10) are electrically connected by performing wire bonding. Specifically, one electrode portion (not shown) of the LED element 40 and the first conductor portion 11 of the metal plate 10a (substrate 10) are electrically connected by the bonding wire 43, and the bonding wire 42 is used. The other electrode part (not shown) of the LED element 40 and the second conductor part 12 of the metal plate 10a (substrate 10) are electrically connected.

  Then, as shown in FIG. 22, a transparent resin material (sealing material) made of a silicone resin or the like is injected (filled) into the opening 31 and then cured, whereby the LED element 40 and the bonding wires 42 and 43 are formed. Sealing is performed with a translucent member 50.

  Then, as shown in FIG. 23, the dicing sheet 80 is affixed on the back surface of the metal plate 10a. Then, as shown in FIGS. 23 and 24, the metal plate 10a and the metal plate 30a are cut (diced) by the dicing line P to be separated into individual pieces. Specifically, the wafer is cut to a halfway depth of the dicing sheet 80 along the dicing line P1 (P) in the X direction and the dicing line P2 (P) in the Y direction. Here, as shown in FIG. 15, since the dicing line P1 (P) in the X direction passes through the region between the adjacent second conductor portions 12, when dicing into pieces, FIG. As shown in FIG. 5, the side end face 12 a of the second conductor portion 12 in the short side direction (Y direction) is positioned on the inner side of the side end face 32 of the reflection frame body 30 in a plan view. Composed. Thereby, even if a metal burr | flash generate | occur | produces in the side end surface 32 of the reflective frame 30 by dicing, since a contact with a metal burr | flash and the 2nd conductor part 12 is suppressed, a 1st conductor is interposed via the reflective frame 30. It is suppressed that the part 11 and the 2nd conductor part 12 are electrically short-circuited. In addition, even if the first conductor portion 11 and the reflection frame body 30 are in contact with each other by the metal burr, there is no problem, and the thermal resistance between the first conductor portion 11 and the reflection frame body 30 is reduced by the metal burr. It is rather preferable.

  Finally, the surface mounting LED according to the first embodiment of the present invention shown in FIG. 1 and FIG. 2 is obtained by removing the dicing sheet 80 from the separated surface mounting LED.

  In 1st Embodiment, as mentioned above, after laminating | stacking the metal plate 10a and the metal plate 30a via the contact bonding layer 20 which has an insulation function, the metal plate 10a and the metal plate 30a are etched, and thereby the metal plate 10a. Can be formed on the substrate 10, and the metal plate 30 a can be formed on the reflective frame 30 that reflects the light from the LED elements 40. Further, by removing a predetermined portion of the adhesive layer 20 exposed by the opening 31, the LED element 40 can be mounted on the substrate 10 composed of the metal plate 10a, and the metal plate 10a (substrate 10). And the LED element 40 can be electrically connected. Thereby, since the board | substrate 10 comprised from the metal plate 10a and the reflective frame 30 comprised from the metal plate 30a can be easily made into the state adhere | attached reliably, reliability resulting from adhesion failure etc. can be made. The decrease can be suppressed. In addition, the manufacturing yield can be improved by suppressing the decrease in reliability.

  In the first embodiment, by patterning the metal plate 10a into an electrode pattern, the substrate 10 made of the metal plate 10a can also function as an electrode. For this reason, the manufacturing process of the board | substrate 10 can be simplified. Further, as described above, the substrate 10 made of the metal plate 10a and the reflection frame body 30 made of the metal plate 30a can be easily fixed (adhered) without causing poor adhesion. Therefore, a manufacturing process can be simplified by comprising as mentioned above. In addition, while simplifying the manufacturing process of surface mount type LED, and improving a manufacturing yield, the manufacturing cost of surface mount type LED can be reduced.

  In the first embodiment, since the substrate 10 and the reflection frame 30 are each composed of a metal plate made of aluminum or an aluminum alloy, the heat generated by the light emission of the LED element 40 can be dissipated from the substrate 10. In addition, heat can be radiated from the reflection frame 30 via the substrate 10. This makes it possible to effectively dissipate heat generated by the LED element 40 emitting light, thereby improving heat dissipation characteristics. Further, by improving the heat dissipation characteristics, even if the LED element 40 generates heat due to light emission, the temperature of the LED element 40 can be kept low. As a result, it is possible to suppress the inconvenience that the light emission characteristics are deteriorated due to the temperature rise of the LED element 40, so that good light emission characteristics can be obtained.

  In the first embodiment, in a region inside the opening 31, a predetermined portion of the adhesive layer 20 exposed inside the opening 31 is easily removed by using laser processing for the removal process of the adhesive layer 20. Therefore, the LED element 40 can be easily mounted on the substrate 10.

  In the first embodiment, the cover layer 21 that covers the gap 13 of the substrate 10 is provided on the adhesive layer 20 by laser processing, so that the light from the LED element 40 is reflected (partly). Therefore, light can be prevented from leaking from the gap 13 of the substrate 10. Thereby, the fall of the light emission characteristic resulting from light leakage can be suppressed. In addition, by selecting a white material for the adhesive layer 20, the light reflection effect can be improved more than the light absorption. Further, by causing the phosphor particles to settle on the covering portion 21, an even greater light reflection effect can be obtained. Further, by forming the covering portion 21 in the adhesive layer 20, it is possible to prevent the injected transparent resin material from leaking from the gap portion 13 when the transparent resin material is injected (filled) into the opening 31. Can do.

  Moreover, in the said 1st Embodiment, the light emission characteristic of surface mount type LED is easily formed by forming the opening part 31 of the reflective frame 30 in a taper shape so that opening width may spread upwards by an etching. Can be improved.

  In the first embodiment, the through-hole 60 that continuously penetrates the substrate 10, the adhesive layer 20, and the reflection frame 30 in the thickness direction is formed in a predetermined portion of the surface-mounted LED. Since the reflective frame 30 can be thermally connected, heat from the LED element 40 can be easily transmitted to the reflective frame 30 via the substrate 10. Thereby, the heat dissipation characteristic can be easily improved.

  In addition, by using the same material for the metal plate 10a and the metal plate 30a, it is possible to suppress the occurrence of warpage of the laminated plate due to the difference in thermal expansion coefficient.

(Second Embodiment)
FIG. 25 is an exploded perspective view of the surface-mounted LED according to the second embodiment of the present invention. FIG. 26 is a cross-sectional view of a surface-mounted LED according to the second embodiment of the present invention. FIG. 27 is an enlarged cross-sectional view of a part of a surface-mounted LED according to the second embodiment of the present invention. Next, with reference to FIGS. 25 to 27, a surface-mounted LED according to a second embodiment of the present invention will be described.

  As shown in FIGS. 25 and 26, the surface-mounted LED according to the second embodiment has a configuration in which the covering portion by the adhesive layer 20 is not provided in the configuration of the first embodiment. Specifically, in the surface-mounted LED according to the second embodiment, all of the adhesive layer 20 located inside the opening 31 is removed.

  Further, the gap portion 13 of the substrate 10 is filled with a translucent member 50, and as shown in FIG. 27, the particles of the phosphor 51 contained in the translucent member 50 are contained in the translucent member 50. By being settled at, the substrate 10 is concentrated in a predetermined area including the gap 13 of the substrate 10. That is, the gap portion 13 between the first conductor portion 11 and the second conductor portion 12 of the substrate 10 is filled with a large number of particles of the phosphor 51. For this reason, light that is about to leak from the gap portion 13 between the first conductor portion 11 and the second conductor portion 12 is reflected by the particles of the phosphor 51 that fills the gap portion 13. Leakage is effectively suppressed. Note that by reducing the distance between the first conductor portion 11 and the second conductor portion 12 (interval of the gap portion 13), the light leakage suppression effect from the gap portion 13 is improved, but this distance is reduced. If it is too large, the first conductor portion 11 and the second conductor portion 12 are likely to be electrically short-circuited. That is, it is difficult to ensure insulation between the first conductor portion 11 and the second conductor portion 12. For this reason, the distance between the first conductor portion 11 and the second conductor portion 12 (the interval between the gap portions 13) is preferably about 0.1 mm to 0.3 mm.

  Other configurations of the second embodiment are the same as those of the first embodiment.

  28 to 30 are cross-sectional views for explaining a method of manufacturing a surface-mounted LED according to the second embodiment of the present invention. Next, with reference to FIGS. 8-17 and FIGS. 23-30, the manufacturing method of the surface mount type LED by 2nd Embodiment of this invention is demonstrated.

  First, using the same method as in the first embodiment shown in FIGS. 8 to 17, the process up to the step of removing the adhesive layer 20 is performed. Next, as shown in FIG. 28, all the adhesive layers 20 located in the region inside the opening 31 are removed by laser processing. Next, as shown in FIG. 29, two LED elements 40 are fixed with an adhesive 43 on the first conductor portion 11 of the metal plate 10a located inside the opening 31 as in the first embodiment. To do. And the LED element 40 and the metal plate 10a (board | substrate 10) are electrically connected by performing wire bonding. Then, the dicing sheet 80 is affixed on the back surface of the metal plate 10a.

  Subsequently, as shown in FIG. 30, a transparent resin material (sealing material) made of silicone resin or the like is injected (filled) into the opening 31. Here, the transparent resin material contains particles of phosphor 51 (see FIG. 27). Then, the injected transparent resin material is cured while the particles of the phosphor 51 are allowed to settle. In order to facilitate the sedimentation of the phosphor 51, it is preferable to use particles having a relatively large particle size of about 10 μm. Moreover, while using a transparent resin material having a relatively low viscosity before curing, and ensuring a long time until curing, the phosphor 51 can be effectively precipitated. Thereby, the translucent member 50 that seals the LED element 40 and the like is formed in the region inside the opening 31. In addition, as shown in FIG. 27, the translucent member 50 has phosphor 51 particles concentrated in a predetermined region including the gap 13 between the first conductor portion 11 and the second conductor portion 12. Configured to do.

  Thereafter, the metal plates 10a and 30a are diced into pieces by using the same method as that of the first embodiment shown in FIGS. Finally, the dicing sheet 80 is removed from the individual surface-mounted LEDs. In this manner, the surface-mounted LED according to the second embodiment of the present invention shown in FIGS. 25 and 26 is obtained.

  In the second embodiment, as described above, the particles of the phosphor 51 are settled in the translucent member 50 (transparent resin material), so that the phosphor 51 is placed in a predetermined region including the gap portion 13 of the substrate 10. Since the light from the LED element 40 can be reflected by the phosphor 51 in the gap portion 13 by allowing the particles to concentrate, even when the adhesive layer 20 located inside the opening portion 31 is completely removed. In addition, light leakage from the gap 13 can be effectively suppressed.

  Other effects of the second embodiment are the same as those of the first embodiment.

(Third embodiment)
FIG. 31 is an exploded perspective view of the surface-mounted LED according to the third embodiment of the present invention. FIG. 32 is an overall perspective view of the surface-mounted LED according to the third embodiment of the present invention. FIG. 33 is a plan view of the surface-mounted LED according to the third embodiment of the present invention as viewed from above. 34 to 36 are views for explaining a surface-mounted LED according to the third embodiment of the present invention. Next, with reference to FIGS. 31 to 36, a surface-mounted LED according to a third embodiment of the present invention will be described.

  As shown in FIGS. 31 to 33, the surface-mount type LED according to the third embodiment is formed in a square shape in plan view, and is different from the first and second embodiments. LED element 140 is mounted. These three LED elements 140 include an LED element that emits red light, an LED element that emits green light, and an LED element that emits blue light. That is, the surface-mounted LED according to the third embodiment includes an LED element 140 that emits light of each of the three primary colors red, green, and blue, and the light emitted from each color is mixed. Is configured to be white light. The LED element 140 is an example of the “light emitting element” in the present invention.

  The surface-mounted LED according to the third embodiment is composed of a substrate 110 made of a metal plate (first metal plate) and a metal plate (second metal plate), as in the first and second embodiments. The reflective frame 130 is laminated with the adhesive layer 120 interposed therebetween. In addition, the metal plate which comprises the board | substrate 110 has thickness of about 0.1 mm-about 0.3 mm, and the metal plate which comprises the reflective frame 130 has thickness of about 0.4 mm-about 0.8 mm. have. The adhesive layer 120 has a thickness of about 0.1 mm to about 0.5 mm. Moreover, the board | substrate 110 and the reflective frame 130 are comprised from the same metal material. Specifically, the substrate 110 and the reflection frame 130 are made of aluminum or an aluminum alloy as in the first and second embodiments. The adhesive layer 120 is also made of the same material as in the first and second embodiments. Specifically, the adhesive layer 120 includes, for example, a prepreg, a glass epoxy resin obtained by impregnating a glass base cloth material with an epoxy resin, an epoxy resin adhesive sheet, an imide-modified epoxy resin adhesive sheet, and the like.

  In addition, as shown in FIG. 33, the surface-mounted LED according to the third embodiment has a length of about 3.5 mm in the X direction and a length of about 3.5 mm in the Y direction orthogonal to the X direction. It is formed in the square shape which has.

  As shown in FIGS. 31 and 36, the substrate 110 includes a first conductor portion 111 on which the LED element 140 is mounted (fixed), and a second conductor portion 112 separated from the first conductor portion 111. Yes.

  Here, in the third embodiment, the substrate 110 described above includes a plurality (six) of second conductor portions 112 separated from each other. Each of these second conductor portions 112 functions as an electrode for supplying power to the LED element 140 from an external circuit (not shown). In addition, in order to suppress that the 1st conductor part 111 and the 2nd conductor part 112 are electrically short-circuited, the 1st conductor part 111 and the 2nd conductor part 112 are arrange | positioned at predetermined distance mutually. . Further, in order to prevent the second conductor portions 112 from being electrically short-circuited, the second conductor portion 112 and the adjacent second conductor portion 112 are arranged at a predetermined distance from each other. For this reason, a gap 113 is formed between the first conductor portion 111 and the second conductor portion 112 and between the second conductor portions 112.

  As shown in FIGS. 31, 34, and 35, an opening 131 that penetrates in the thickness direction is formed at the center of the reflection frame 130. The inner side surface 131 a of the opening 131 functions as a reflection surface that reflects the light emitted from the LED element 140. Further, the opening 131 is formed in a circular shape as viewed in a plan view as shown in FIG. 33, and as shown in FIGS. 34 and 35, it widens in a tapered shape (radially) upward. It is configured.

  Moreover, in 3rd Embodiment, as shown in FIG. 32 and FIG. 33, the notch part 160 is each formed in the four corners of surface mount type LED. Specifically, an arcuate cutout 160 is formed at a corner formed by two side surfaces adjacent to each other. In the manufacturing method described later, the notch 160 is formed by dividing the through-hole by dicing after a through-hole that continuously penetrates the reflective frame 130, the adhesive layer 120, and the substrate 110 in the thickness direction is formed. Is formed. And the 1st conductor part 111 and the reflective frame 130 of the board | substrate 110 are electrically and thermally connected by the above-mentioned notch part 160. FIG.

  A surface treatment film similar to that in the first and second embodiments is formed on the back surface of the substrate 110, on the upper surface of the reflection frame 130, and on the surface of the notch 160.

  As shown in FIGS. 31 to 33, the adhesive layer 120 that bonds the substrate 110 and the reflective frame 130 has a predetermined portion located inside the opening 131 of the reflective frame 130 removed, while the reflective frame 120 A cover 121 that covers the gap 113 of the substrate 110 is formed inside the opening 131 of the body 130.

  Further, the LED element 140 described above is fixed onto the first conductor portion 111 of the substrate 110 by an adhesive 41 (see FIGS. 34 and 35) and the like. As shown in FIG. 33, these LED elements 140 are electrically connected to corresponding second conductor portions 112 via bonding wires 141. The bonding wire 141 is made of the same material as that of the first and second embodiments.

  As shown in FIGS. 34 and 35, a translucent member 150 that seals the LED element 140 and the like is formed in a region inside the reflective frame 130 (inside the opening 131). The translucent member 150 is an example of the “sealing body” in the present invention. The translucent member 150 is made of a transparent resin material (sealing material) such as silicone resin. The translucent member 150 is formed by filling the transparent resin material into the opening 131 of the reflective frame 130 and then curing the transparent resin material.

  Other configurations of the third embodiment are the same as those of the first and second embodiments.

  FIGS. 37 to 40 are plan views for explaining a method of manufacturing a surface-mounted LED according to the third embodiment of the present invention. Next, with reference to FIGS. 8 to 17, FIG. 23, FIG. 24 and FIGS. 31 to 40, a method for manufacturing a surface-mounted LED according to the third embodiment of the present invention will be described.

  First, using the same method as in the first embodiment shown in FIGS. 8 to 17, the process up to the step of removing the adhesive layer 120 is performed. At this time, as shown in FIGS. 37 and 38, a plurality of through-holes 160a are formed by drilling holes at intersections between the dicing line P (P1) in the X direction and the dicing line P (P2) in the Y direction. Form. Unlike the first and second embodiments, the metal plate 10a constituting the substrate 110 is patterned into a shape as shown in FIGS. Further, a plurality of openings 131 as shown in FIG. 38 are formed in the metal plate 30a constituting the reflection frame 130.

  Next, as shown in FIG. 39, the adhesive layer 120 exposed in the region inside the opening 131 is removed by laser processing. At this time, the cover layer 121 that covers the gap portion 113 of the substrate 110 (metal plate 10a) is formed by removing a part of the adhesive layer 120 that is exposed in the region inside the opening 131 and leaving a part thereof. To do. Next, as shown in FIG. 40, the three LED elements 140 are fixed on the first conductor portion 111 of the metal plate 10 a located inside the opening 131 with the adhesive 41 (see FIGS. 34 and 35). To do. And the LED element 140 and the metal plate 10a (board | substrate 110) are electrically connected by performing wire bonding.

  Subsequently, a transparent resin material (sealing material) made of silicone resin or the like is injected (filled) into the opening 131 and then cured to seal the LED element 140 and the bonding wire 141 with the translucent member 150. To do.

  Thereafter, a dicing sheet is attached to the back surface of the metal plate 10a, and the metal plates 10a and 30a are diced along the dicing line P using the same method as in the first embodiment shown in FIGS. It separates into pieces. Finally, the dicing sheet is removed from the individual surface-mounted LEDs. In this manner, the surface-mounted LED according to the third embodiment of the present invention shown in FIGS. 31 to 33 is obtained.

  The effect of the third embodiment is the same as that of the first embodiment.

(Fourth embodiment)
FIG. 41 is an overall perspective view of the surface-mounted LED according to the fourth embodiment of the present invention. FIG. 42 is a plan view of a surface-mounted LED according to the fourth embodiment of the present invention as viewed from above. FIG. 43 is a plan view of a surface-mounted LED according to the fourth embodiment of the present invention viewed from below. 44 is a cross-sectional view taken along the line AA in FIG. 42, and FIG. 45 is a cross-sectional view taken along the line BB in FIG. Next, with reference to FIGS. 41 to 45, a surface-mounted LED according to a fourth embodiment of the present invention will be described.

  In the surface-mounted LED according to the fourth embodiment, as shown in FIGS. 41 and 44, in the surface-mounted LED according to the third embodiment, three LED elements 240 are flip-connected on the substrate 110. . In the fourth embodiment, the three LED elements 240 include an LED element that emits red light, an LED element that emits green light, and an LED element that emits blue light, and each can be flip-connected. It has become a structure. The LED element 240 is an example of the “light emitting element” in the present invention.

The substrate 110 includes a first conductor portion 111 and a second conductor portion 112 separated from the first conductor portion 111, and is patterned into a shape as shown in FIG.
Here, in the fourth embodiment, the above-described substrate 110 includes a plurality (three) of second conductor portions 112 separated from each other. Each of these second conductor portions 112 functions as an electrode for supplying power to the LED element 240 from an external circuit (not shown). Further, the first conductor portion 111 separated from the second conductor portion 112 functions as a common electrode for supplying power to the LED element 240 from an external circuit (not shown). In addition, in order to suppress that the 1st conductor part 111 and the 2nd conductor part 112 are electrically short-circuited, the 1st conductor part 111 and the 2nd conductor part 112 are arrange | positioned at predetermined distance mutually. . Further, in order to prevent the second conductor portions 112 from being electrically short-circuited, the second conductor portion 112 and the adjacent second conductor portion 112 are arranged at a predetermined distance from each other. For this reason, a gap 113 is formed between the first conductor portion 111 and the second conductor portion 112 and between the second conductor portions 112.

  As shown in FIGS. 41 to 43, notches 160 are formed at the four corners of the surface-mounted LED, respectively, and the notches 160 allow the first conductor portion 111 of the substrate 110 and the reflective frame to be formed. 130 is electrically and thermally connected.

  Note that the same surface treatment coating as that in the first to third embodiments is formed on the back surface of the substrate 110, the upper surface of the reflective frame 130, and the surface of the notch 160.

  The adhesive layer 120 that bonds the substrate 110 and the reflective frame 130 is removed from a predetermined portion located inside the opening 131 of the reflective frame 130, while inside the opening 131 of the reflective frame 130, A covering portion 122 that covers the gap portion 113 of the substrate 110 is formed.

  Further, the LED element 240 described above is flip-connected on the substrate 110 so as to straddle the gap 113 as shown in FIGS. 42 and 44. Thereby, one electrode part (not shown) of the LED element 240 is electrically connected to the first conductor part 111, and the other electrode part (not shown) of the LED element 240 is connected to the second conductor part 112. And electrically connected.

  Further, as shown in FIGS. 44 and 45, a translucent member 150 similar to that in the first to third embodiments is formed in a region inside the reflective frame 130 (inside the opening 131). The LED element 240 is sealed by the translucent member 150.

  Other configurations of the fourth embodiment are the same as those of the third embodiment. The effects of the fourth embodiment are the same as those of the first and third embodiments.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and further includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the first to fourth embodiments, the example in which the present invention is applied to the surface-mounted LED is shown. However, the present invention is not limited to this, and the present invention is applied to light emitting devices other than the surface-mounted LED. May be.

  Moreover, in the said 1st-4th embodiment, although the example separated into individual surface mount type LED by dicing was shown, this invention is not restricted to this, The process of the individualization by dicing is abbreviate | omitted. Thus, a light emitting module in which a plurality of surface mount LEDs are assembled may be used. In this case, the electrode pattern can be changed as appropriate. Alternatively, the light emitting module may be configured by mounting a plurality of individual surface-mounted LEDs on a mounting substrate or the like.

  In the first to fourth embodiments, the example in which the predetermined portion of the adhesive layer is removed by laser processing has been described. However, the present invention is not limited to this, and the predetermined portion of the adhesive layer is removed by a method other than laser processing. May be. For example, a predetermined portion of the adhesive layer may be removed by machining such as milling.

  Moreover, in the said 1st-4th embodiment, the magnitude | size of surface mount type LED can be changed variously. For example, in the third and fourth embodiments, the surface-mounted LED is configured in a square shape having a side length of 3.5 mm, but the surface-mounted LED is configured in a square shape having a side length of 7 mm. You can also. In this case, the thickness of the reflective frame (second metal plate) is preferably about 1.0 mm to about 1.5 mm.

  Moreover, in the said 1st-4th embodiment, although the board | substrate and the reflective frame body each showed the example comprised from aluminum or aluminum alloy, this invention is not restricted to this, Metal materials other than aluminum or aluminum alloy The substrate and the reflection frame may be configured from. For example, you may comprise a board | substrate and a reflective frame from copper, a copper alloy, magnesium, a magnesium alloy, etc. In addition, in the case of using aluminum or an aluminum alloy, in addition to the Al—Mg—Si alloy, for example, pure aluminum, Al—Cu, Al—Mn, Al—Si, Al—Mg, Al—Zn -A material such as Mg may be used.

  Moreover, in the said 1st-4th embodiment, the number of the LED elements mounted in surface mount type LED can be changed suitably.

  Moreover, in the said 1st-4th embodiment, although the example which used the LED element as an example of the light emitting element was shown, this invention is not restricted to this, You may use light emitting elements other than an LED element. For example, an organic EL element may be used instead of the LED element.

  Moreover, in the said 1st-4th embodiment, you may use together the conductor part (1st conductor part) in which an LED element is mounted with a GND electrode.

  Moreover, in the said 1st-4th embodiment, although the example which formed the plating layer in the upper surface of a reflective frame and the lower surface (back surface) of a board | substrate was shown, this invention is not restricted to this, In addition to the said area | region, A plating layer may also be formed on the inner surface of the opening of the reflection frame and the upper surface of the substrate located in the region inside the reflection frame. Such a configuration is, for example, by forming the opening of the reflection frame and removing the adhesive layer, and then applying a surface treatment to the surface of the reflection frame, thereby providing an inner surface of the opening of the reflection frame, and A plating layer can be formed on the upper surface of the substrate located in the region inside the reflection frame. Further, if the inner side surface of the opening of the reflection frame is protected in advance with a resist or the like, a plating layer can be formed on a portion other than the inner surface of the opening of the reflection frame. Note that the plating layer can be formed on a portion other than the inner surface of the opening of the reflection frame by removing the plating layer formed on the inner surface of the opening of the reflection frame by etching or the like. Further, the composition and configuration of the plating layer may be configurations other than those in the first to fourth embodiments. Moreover, it is preferable to form a surface treatment film for improving light reflectance such as a NiAg plating film on the surface of the plating layer. The surface treatment film can be formed on a portion where the plating layer is not formed.

  Moreover, in the said 1st-4th embodiment, although the example which formed the plating layer on the surface of a board | substrate (1st metal plate) and the surface of a reflective frame (2nd metal plate) was shown, this invention is based on this. However, the present invention is not limited to this, and a configuration in which no plating layer is formed may be employed. In this case, it is preferable to form a surface treatment film for improving light reflectance such as a NiAg plating film on the reflection frame and the substrate.

  In the first to fourth embodiments, the example in which the inner surface of the through hole is plated with the through hole is shown. However, the present invention is not limited to this, and instead of the through hole plating, the through hole is electrically conductive. The material may be filled. Further, the through hole may be filled with a conductive material in a state where the through hole plating is performed. It is also possible to adopt a configuration in which no through hole is formed.

  Moreover, in the said 1st-4th embodiment, you may change various structures of surface mount type LED by changing suitably the electrode pattern, adhesive layer, and reflective frame of a board | substrate. For example, in the configuration of the third embodiment, the substrate 110 may be configured as in the first modification of the present invention shown in FIGS. Further, the opening 135 of the reflection frame 130 may be configured such that the inner side surface 135a thereof is substantially perpendicular to the substrate 110 as shown in FIG. Further, a predetermined portion of the adhesive layer 120 may be removed so that a part of the adhesive layer 120 protrudes from the inner side surface 135a of the opening 135. If comprised in this way, even if the (insulation) adhesive layer 120 is thin, the board | substrate 110 (1st metal plate) and the reflective frame 130 (2nd metal plate) can be insulated reliably. Further, like the second modification example of the present invention shown in FIGS. 48 and 49, in the structure of the first modification example, the cover layer 123 (see FIGS. 46 and 47) is not provided in the adhesive layer 120. May be. In this case, as shown in the second embodiment, phosphor particles may be filled in the gap 113 of the substrate 110 as a countermeasure against light leakage. Further, instead of phosphor particles, a white powder such as titanium oxide may be precipitated in the translucent member 150 so that light leakage from the gap 113 can be suppressed. Further, a surface-mounted LED may be configured as in the third modification of the present invention shown in FIGS. 50 and 51, or the surface as in the fourth modification of the present invention shown in FIGS. A mountable LED may be configured.

  Moreover, in the said 1st-4th embodiment, the example which manufactured the surface mount type LED using the laminated board of the 2 layer structure which has the metal plate which comprises a board | substrate, and the metal plate which comprises a reflective frame was shown. However, the present invention is not limited to this, and a surface-mounted LED may be manufactured by using a laminate having two or more layers, for example, a three-layer structure. In this case, for example, as in the fifth modified example of the present invention shown in FIG. 54, the substrate 110 is configured as a double-sided substrate by configuring the substrate 110 using the two lower metal plates 10a and 10b. May be. At this time, the upper metal plate 110 a and the lower metal plate 110 b can be electrically connected through the through hole 115. Further, as in the sixth modified example of the present invention shown in FIG. 55, the upper two metal plates 30a and 30b may be used as the reflecting frame 130. At this time, the translucent member 150 may be provided only inside the opening of the metal plate 30a. In addition, a laminated board can also be made into the multilayered structure more than a 4 layer structure.

  Moreover, in the said 1st-4th embodiment, you may fix (stack | stack) the metal plate which comprises members, such as a reflective frame body processed separately. In this case, the member may be completed by processing a part of the metal plate before fixing (lamination) and further processing after fixing (lamination).

  Moreover, in the said 1st-4th embodiment (a modification is included), you may purchase the laminated board on which the metal plate was laminated | stacked, and may implement a subsequent process using the purchased laminated board. That is, in the method for manufacturing a surface-mounted LED, a member obtained by a part of the process may be purchased and the surface-mounted LED may be completed by performing the remaining processes. The laminated plate may be subjected to through-hole processing, etching processing, adhesion layer removal processing, plating processing, or the like, or only a part of the processing may be performed. Good.

  In the first and second embodiments, the first conductor portion of the substrate is a cathode electrode, and the second conductor portion of the substrate is an anode electrode. However, the present invention is not limited to this. The cathode electrode and the anode electrode may be reversed.

  Moreover, in the said 3rd and 4th embodiment, although the example which formed the notch part in which the through hole was divided | segmented in the four corners of surface mount type LED was shown, this invention is not limited to this, The said 1st and 2nd As in the embodiment, through-holes that are not divided may be formed in the surface-mounted LED.

  In the third and fourth embodiments, only the LED element that emits blue light is mounted, and the phosphor particles that convert the wavelength of the blue light from the LED element are dispersed in the translucent member. The emitted light may be configured to be white light.

  Moreover, in the said 3rd and 4th embodiment, although the example which formed the cover part which covers the clearance gap part of a board | substrate was shown in the contact bonding layer, this invention is not limited to this, A cover cover part is not provided in a contact bond layer. It may be configured. In this case, the white powder such as titanium oxide is allowed to settle in the translucent member so that light leakage from the gap portion can be suppressed.

  In the third and fourth embodiments, the example in which the emitted light is white light by mixing the light from the three LED elements has been described. However, the present invention is not limited to this. By individually controlling the current values flowing through the three LED elements, it is possible to emit light of a color other than white light.

1 is an exploded perspective view of a surface-mounted LED according to a first embodiment of the present invention. 1 is an overall perspective view of a surface-mounted LED according to a first embodiment of the present invention. It is sectional drawing of the surface mount type LED by 1st Embodiment of this invention. It is the top view which looked at the surface mount type LED by 1st Embodiment of this invention from the upper side. It is the top view which looked at the surface mount type LED by 1st Embodiment of this invention from the lower side. It is sectional drawing of the through hole of the surface mount type LED by 1st Embodiment of this invention. It is sectional drawing which expanded and showed a part of surface mount type LED by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the surface mount type LED by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the surface mount type LED by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the surface mount type LED by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the surface mount type LED by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the surface mount type LED by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the surface mount type LED by 1st Embodiment of this invention. It is a top view for demonstrating the manufacturing method of the surface mount type LED by 1st Embodiment of this invention. It is a partially expanded plan view for demonstrating the manufacturing method of the surface mount type LED by 1st Embodiment of this invention. It is a top view for demonstrating the manufacturing method of the surface mount type LED by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the surface mount type LED by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the surface mount type LED by 1st Embodiment of this invention. It is a top view for demonstrating the manufacturing method of the surface mount type LED by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the surface mount type LED by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the surface mount type LED by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the surface mount type LED by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the surface mount type LED by 1st Embodiment of this invention. It is a top view for demonstrating the manufacturing method of the surface mount type LED by 1st Embodiment of this invention. It is a disassembled perspective view of surface mount type LED by 2nd Embodiment of this invention. It is sectional drawing of the surface mount type LED by 2nd Embodiment of this invention. It is sectional drawing which expanded and showed a part of surface mount type LED by 2nd Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the surface mount type LED by 2nd Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the surface mount type LED by 2nd Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the surface mount type LED by 2nd Embodiment of this invention. It is a disassembled perspective view of surface mount type LED by 3rd Embodiment of this invention. It is the whole surface mount type LED perspective view by 3rd Embodiment of this invention. It is the top view which looked at the surface mount type LED by 3rd Embodiment of this invention from the upper side. It is sectional drawing along the AA line of FIG. It is sectional drawing along the BB line of FIG. It is the top view which looked at the surface mount type LED by 3rd Embodiment of this invention from the lower side. It is a top view for demonstrating the manufacturing method of the surface mount type LED by 3rd Embodiment of this invention. It is a top view for demonstrating the manufacturing method of the surface mount type LED by 3rd Embodiment of this invention. It is a top view for demonstrating the manufacturing method of the surface mount type LED by 3rd Embodiment of this invention. It is a top view for demonstrating the manufacturing method of the surface mount type LED by 3rd Embodiment of this invention. It is a whole perspective view of the surface mount type LED by 4th Embodiment of this invention. It is the top view which looked at the surface mount type LED by 4th Embodiment of this invention from the upper side. It is the top view which looked at the surface mount type LED by 4th Embodiment of this invention from the lower side. FIG. 43 is a cross-sectional view taken along line AA in FIG. 42. FIG. 43 is a cross-sectional view taken along line BB in FIG. 42. It is a top view of surface mount type LED by the 1st modification of this invention. It is sectional drawing along the AA line of FIG. It is a top view of surface mount type LED by the 2nd modification of this invention. It is sectional drawing along the AA line of FIG. It is a top view of surface mount type LED by the 3rd modification of this invention. It is sectional drawing along the AA line of FIG. It is a top view of surface mount type LED by the 4th modification of this invention. It is sectional drawing along the AA line of FIG. It is sectional drawing of surface mount type LED by the 5th modification of this invention. It is sectional drawing of surface mount type LED by the 6th modification of this invention.

Explanation of symbols

10, 110 Substrate 10a Metal plate (first metal plate)
11, 111 First conductor part 12, 112 Second conductor part 13, 113 Gap part 20, 120 Adhesive layer 21, 121, 122, 123 Covering part 30, 130 Reflecting frame 30a Metal plate (second metal plate)
31, 131 Opening 31a, 131a Inner side surface (reflection surface)
40, 140, 240 LED element (light emitting element)
42, 43, 141 Bonding wire 50, 150 Translucent member (sealed body)
60, 160a Through hole 65 Plating layer 66 First plating layer 66a Zinc replacement coating 66b Nickel plating coating 66c Copper plating coating 67 Second plating layer 67a Electro copper plating coating 70 NiAg plating coating 70a Ni plating coating 70b Ag plating coating 160 Notch

Claims (24)

Preparing a first metal plate and a second metal plate;
Laminating the first metal plate and the second metal plate via an adhesive layer having an insulating function;
Patterning the first metal plate into an electrode pattern by etching the first metal plate;
Etching the second metal plate to form an opening in the second metal plate to expose the adhesive layer;
Removing a predetermined portion of the adhesive layer exposed by the opening;
Mounting a light emitting element on the first metal plate in a region inside the opening;
A step of resin-sealing the light-emitting element by filling a translucent resin in a region inside the opening,
The step of forming the opening in the second metal plate includes:
A method for manufacturing a light emitting device, comprising: forming the opening so that an inner surface of the opening functions as a reflecting surface for reflecting light from the light emitting element. A step of laminating a first metal plate and a second metal plate through an adhesive layer having an insulating function, a step of patterning the first metal plate into an electrode pattern by etching the first metal plate, Etching the second metal plate to expose the adhesive layer in the second metal plate and forming an opening whose inner surface functions as a reflecting surface; and the adhesion exposed by the opening Removing a predetermined portion of the layer, preparing a laminate formed through,
Mounting a light emitting element on the first metal plate in a region inside the opening;
And a step of resin-sealing the light emitting element by filling a translucent resin in a region inside the opening. The step of patterning the first metal plate into an electrode pattern includes:
2. The method of claim 1, further comprising a step of patterning the first metal plate so as to include a first conductor portion and a second conductor portion that is insulated and separated through a gap portion and the first conductor portion. Or the manufacturing method of the light-emitting device of 2. The step of removing the adhesive layer includes
The light emission according to any one of claims 1 to 3, further comprising a step of removing a predetermined portion including a region on which the light emitting element is mounted in a region inside the opening by laser processing. Device manufacturing method. The step of removing the adhesive layer includes
5. The method for manufacturing a light emitting device according to claim 3, further comprising a step of forming a cover portion covering the gap portion in the adhesive layer in a region inside the opening. 6. The step of mounting the light emitting element includes:
Fixing the light emitting element on the first conductor portion;
The method for manufacturing a light emitting device according to claim 3, further comprising a step of electrically connecting the light emitting element to at least the second conductor portion. The step of forming the opening in the second metal plate includes:
The method for manufacturing a light-emitting device according to claim 1, further comprising a step of configuring the opening so that an opening width of the opening expands upward. Prior to patterning the first metal plate and forming an opening in the second metal plate,
8. The method according to claim 1, further comprising a step of forming a through hole that continuously penetrates the first metal plate, the adhesive layer, and the second metal plate in a thickness direction. The manufacturing method of the light-emitting device of description. The step of forming the through hole includes:
9. The method of manufacturing a light emitting device according to claim 8, further comprising a step of thermally connecting the first conductor portion of the first metal plate and the second metal plate by a through hole.   A light-emitting device manufactured using the method according to claim 1. A substrate composed of a first metal plate and formed in an electrode pattern;
An adhesive layer having an insulating function formed on the substrate;
A reflective frame including an opening that is laminated on the substrate via the adhesive layer and is configured of a second metal plate and penetrates in the thickness direction;
A light emitting element placed on the substrate and disposed in a region inside the opening;
A sealing body for sealing the light emitting element,
The adhesive layer has a predetermined portion including a placement portion on which the light emitting element is placed removed in a region inside the opening,
The light emitting element is electrically connected to the substrate;
The opening of the reflective frame includes an inner surface that functions as a reflective surface that reflects light from the light emitting element. The substrate includes a first conductor portion, and a second conductor portion insulated and separated from the first conductor portion,
The light emitting device according to claim 11, wherein the light emitting element is placed on the first conductor portion and is electrically connected to at least the second conductor portion.   13. The light emitting device according to claim 11, wherein a part or all of a portion of the adhesive layer located in a region inside the opening is removed. The substrate has a gap portion for insulating and separating the first conductor portion and the second conductor portion,
The light emitting device according to claim 12 or 13, wherein the adhesive layer has a covering portion that covers the gap portion in a region inside the opening. The substrate has a gap portion for insulating and separating the first conductor portion and the second conductor portion,
The sealing body contains a phosphor that converts the wavelength of light from the light emitting element,
14. The light emitting device according to claim 12, wherein the phosphor is concentrated in a predetermined region including a gap portion of the substrate by being settled in the sealing body.   The light emitting device according to claim 11, wherein the opening of the reflective frame is formed by etching so that the opening width widens upward.   The light emitting device according to any one of claims 11 to 16, further comprising a through hole that continuously penetrates through the substrate, the adhesive layer, and the reflective frame in a thickness direction.   The light emitting device according to claim 17, wherein the first conductor portion of the substrate and the reflection frame body are thermally connected by the through hole.   The light emission according to any one of claims 11 to 18, wherein at least an inner surface of the opening of the reflection frame is subjected to a surface treatment for improving light reflectance. apparatus.   The light emitting device according to any one of claims 11 to 19, wherein the first metal plate and the second metal plate are made of the same metal material.   21. The light emitting device according to claim 20, wherein each of the first metal plate and the second metal plate is made of aluminum, an aluminum alloy, copper, or a copper alloy. The light emitting element comprises a light emitting diode element,
The light-emitting device according to any one of claims 11 to 21, wherein the light-emitting diode element is electrically connected to the substrate via a bonding wire. The light emitting element comprises a light emitting diode element,
The light-emitting device according to claim 11, wherein the light-emitting diode element is electrically connected to the substrate by a flip connection.   A light emitting module comprising a plurality of the light emitting devices according to any one of claims 11 to 23.

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