JP5632047B2 - Lead frame and manufacturing method thereof, lead frame with resin and manufacturing method thereof, and LED package and manufacturing method thereof - Google Patents

Lead frame and manufacturing method thereof, lead frame with resin and manufacturing method thereof, and LED package and manufacturing method thereof Download PDF

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JP5632047B2
JP5632047B2 JP2013132906A JP2013132906A JP5632047B2 JP 5632047 B2 JP5632047 B2 JP 5632047B2 JP 2013132906 A JP2013132906 A JP 2013132906A JP 2013132906 A JP2013132906 A JP 2013132906A JP 5632047 B2 JP5632047 B2 JP 5632047B2
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lead frame
resin
lead
portion
die pad
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JP2014029995A (en
Inventor
石 恵 大
石 恵 大
田 和 範 小
田 和 範 小
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大日本印刷株式会社
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors

Description

  The present invention relates to a lead frame and a manufacturing method thereof, a lead frame with a resin and a manufacturing method thereof, and an LED package and a manufacturing method thereof.

  In recent years, lighting devices using LED (light emitting diode) elements as light sources have been used for various home appliances, OA equipment, display lights for vehicle equipment, general lighting, in-vehicle lighting, displays, and the like. Some of such lighting devices include a semiconductor device manufactured by mounting LED elements on a lead frame.

  Conventionally, as a semiconductor device for LED elements (LED package), a SON type (SON package) has been developed from the viewpoint of heat dissipation and the like. In such a SON package, a reflective resin for reflecting light from the LED element is provided (see, for example, Patent Document 1 and Patent Document 2).

JP 2006-156704 A JP 2012-033724 A

  Generally, an LED package is manufactured by molding a reflective resin on a lead frame and then bonding an LED element. Moreover, the metal part of the lead frame exposed after molding the reflective resin is used to reflect light from the LED element. Therefore, it is necessary to make the exposed metal part of the lead frame easily reflect the light from the LED element even after the reflection resin is molded.

  Conventionally, when molding a reflective resin on a lead frame, if the mold and the lead frame are not completely in close contact with each other, there arises a problem that the resin flows into a region of the lead frame where the metal is exposed. Resin that has flowed into a region of the lead frame where the metal is exposed adheres to the lead frame as a resin burr. For this reason, there was a problem that a separate process for removing such resin burrs was required.

  On the other hand, in order to prevent the occurrence of the above-described resin burrs, it is conceivable to strongly press the mold against the lead frame when the reflective resin is molded on the lead frame. However, when the mold strongly presses the lead frame, the unevenness of the mold surface is transferred to the lead frame surface. In this case, mold traces are generated on the surface of the lead frame, which may cause problems such as changes in the optical characteristics of the lead frame and deterioration in bonding properties.

  The present invention has been made in consideration of such points, and can prevent the occurrence of resin burrs in the lead frame, a lead frame and a manufacturing method thereof, a lead frame with a resin and a manufacturing method thereof, An object of the present invention is to provide an LED package and a manufacturing method thereof.

The present invention provides a method for manufacturing a lead frame for mounting an LED element, which is sandwiched between a lower mold and an upper mold when forming a reflective resin, and is separated from the first part and the first part. A lead frame main body including a provided second portion; and a step of forming a reflective plating layer that reflects light from the LED element on the lead frame main body. of the two parts, the corners of the lead frame body, the linear projection projecting from the other portions of the lead frame while being pressed is provided by the upper mold, the linear protrusions, reflected by the electrolytic plating A lead frame manufacturing method characterized in that the lead frame is formed by raising a part of the plating layer.

The present invention relates to a method of manufacturing a lead frame with a resin, wherein the lead frame is manufactured by the lead frame manufacturing method, and the lead frame is sandwiched between the lower mold and the upper mold. and a step of providing a reflecting resin, in the step of providing the reflecting resin, thus linear protrusion upper mold located on the side for mounting the LED element is pressed, thereby reflecting resin first portion or the 2 is a method for manufacturing a resin-attached lead frame, which prevents inflow into the portion 2.

  The present invention relates to a method for manufacturing an LED package, comprising: a step of producing a lead frame with resin by a method of manufacturing a lead frame with resin; a step of mounting an LED element on a lead frame with resin; and an LED element and a lead frame. An LED package manufacturing method comprising: a step of connecting by a conductive portion; and a step of sealing the LED element and the conductive portion with a sealing resin.

  According to the present invention, the linear protrusion prevents the reflective resin from flowing into the first part or the second part. Thereby, it is possible to prevent the occurrence of resin burrs in the lead frame.

FIG. 1 is an overall plan view showing a lead frame according to an embodiment of the present invention. FIG. 2 is a partially enlarged plan view showing a lead frame according to one embodiment of the present invention. FIG. 3 is a partially enlarged bottom view showing a lead frame according to one embodiment of the present invention. 4 is a cross-sectional view showing a lead frame according to an embodiment of the present invention (a cross-sectional view taken along line IV-IV in FIG. 2). FIGS. 5A and 5B are enlarged cross-sectional views showing linear protrusions. FIG. 6 is a sectional view showing a lead frame with resin according to an embodiment of the present invention. FIG. 7 is a cross-sectional view (a cross-sectional view taken along line VII-VII in FIG. 8) showing an LED package manufactured using the lead frame according to the embodiment of the present invention. FIG. 8 is a plan view showing an LED package manufactured using the lead frame according to the embodiment of the present invention. FIGS. 9A to 9F are cross-sectional views illustrating a method for manufacturing a lead frame according to an embodiment of the present invention. FIGS. 10A to 10D are cross-sectional views illustrating a method for manufacturing a resin-attached lead frame according to an embodiment of the present invention. FIGS. 11A to 11E are cross-sectional views illustrating a method for manufacturing an LED package according to an embodiment of the present invention. FIG. 12 is a cross-sectional view showing a modified example (modified example 1) of the LED package. FIG. 13 is a plan view showing a modified example (modified example 1) of the lead frame. FIG. 14 is a cross-sectional view showing a modification (Modification 2) of the LED package. FIG. 15 is a plan view showing a modification (Modification 2) of the lead frame. FIG. 16 is a cross-sectional view showing a modified example (modified example 3) of the LED package. FIG. 17 is a plan view showing a modified example (modified example 3) of the lead frame. FIG. 18 is a cross-sectional view showing a modification (Modification 4) of the LED package. FIG. 19 is a plan view showing a modification (Modification 4) of the lead frame. FIG. 20 is a cross-sectional view showing a modified example (modified example 5) of the LED package. FIG. 21 is a plan view showing a modified example (modified example 5) of the lead frame. FIG. 22 is a plan view showing a modified example (modified example 6) of the lead frame with resin. FIG. 23 is a cross-sectional view showing a modified example (modified example 6) of the LED package. 24A to 24D are cross-sectional views showing a modified example (modified example 6) of the method of manufacturing a lead frame with resin.

  Hereinafter, an embodiment of the present invention will be described with reference to FIGS.

Configuration of Lead Frame First, an outline of the LED element mounting lead frame according to the present embodiment will be described with reference to FIGS.

  The lead frame 10 shown in FIG. 1 is used when producing the LED package 20 (FIGS. 7 and 8) on which the LED elements 21 are mounted.

  Such a lead frame 10 includes a frame body 13 having a rectangular outer shape, and a large number of package regions 14 arranged in a multi-row and multi-stage (matrix shape) within the frame body 13.

  As shown in FIGS. 2 to 4, each of the plurality of package regions 14 includes a die pad (first portion) 25 on which the LED element 21 is mounted, and a lead portion (second portion) provided apart from the die pad 25. Part) 26.

  A gap 16 is formed between the die pad 25 and the lead portion 26 in one package region 14, and after dicing (FIG. 11D), the die pad 25 and the lead portion 26 are electrically connected to each other. It is designed to be insulated. Each package area 14 is an area corresponding to each LED package 20. In FIG. 2, each package region 14 is indicated by a rectangular two-dot chain line.

  As shown in FIG. 2, a reflective resin forming region 45 surrounding the LED element 21 (see FIGS. 7 and 8) is formed around the die pad 25 and the lead portion 26. As will be described later, the reflective resin formation region 45 corresponds to a region where the reflective resin 23 is provided on the surface of the lead frame 10.

  The reflective resin formation region 45 has an inner edge 45a in the shape of an ellipse or a racetrack located in each package region 14, respectively. In other words, the reflective resin formation region 45 is composed of a region extending outside the region surrounded by each inner end edge 45a. Of the surfaces of the die pad 25 and the lead portion 26, a region that is not included in the reflective resin formation region 45 (that is, a region surrounded by the inner edge 45a) constitutes the bottom surface of a recess 23a of the reflective resin 23 described later. (FIGS. 7 and 8).

  The planar shape of the inner edge 45a of the reflective resin forming region 45 is not limited to an oval shape or a racetrack shape, and may be, for example, a rectangle, a circle, an ellipse, or a polygon.

  Further, as shown in FIG. 2, the lead portions 26 in each package region 14 are connected to the lead portions 26 in other package regions 14 adjacent to the upper and lower portions in FIG. Yes. Further, the die pad 25 in each package region 14 is connected to the die pad 25 in another package region 14 adjacent to the upper and lower sides in FIG.

Further, the die pad 25 in each package region 14 is connected to the lead portion 26 in the other package region 14 adjacent to the right in FIG.
Furthermore, the lead portion 26 in each package region 14 is connected to the die pad 25 in another package region 14 adjacent to the left in FIG.

  The lead connecting portion 52, the die pad connecting portion 53, and the package region connecting portion 54 are formed thinner than other portions of the lead frame 10 by being half-etched from the back side. The lead part 26 and the die pad 25 in the package area 14 located on the outermost periphery are connected to the frame body 13 by one or more of the lead connection part 52, the die pad connection part 53, and the package area connection part 54. Has been.

  On the other hand, as shown in the cross-sectional view of FIG. 4, the lead frame 10 includes a lead frame main body 11 and a plating layer 12 formed on the lead frame main body 11.

  Of these, the lead frame body 11 is made of a metal plate. Examples of the material of the metal plate constituting the lead frame body 11 include copper, copper alloy, 42 alloy (Ni 42% Fe alloy), iron alloy (stainless steel, FeNi), aluminum, and the like. The thickness of the lead frame body 11 is preferably 0.05 mm to 0.5 mm, although it depends on the configuration of the LED package.

  The plating layer 12 is provided on the entire surface including the front surface and the back surface of the lead frame main body 11. The plating layer 12 on the front side functions as a reflection layer for reflecting light from the LED element 21. On the other hand, the plating layer 12 on the back side plays a role of increasing the adhesion with the solder. This plating layer 12 may consist of single layer plating, such as silver, palladium, gold | metal | money, or may consist of multilayer plating. When the plating layer 12 is made of multilayer plating, the plating layer 12 may include a base plating layer on the lead frame body 11 side and an outermost surface plating layer on the outermost surface side. Examples of the base plating layer include copper, nickel, palladium, or an electrolytic plating layer in which a plurality of these are stacked. Examples of the outermost plating layer include silver, a silver alloy, gold and its alloys, a platinum group, copper and its alloys, and an aluminum electrolytic plating layer.

  The thickness of the plating layer 12 is extremely thin. Specifically, it is preferable that the thickness of the plating layer 12 be 0.005 μm to 10 μm in the thinnest portion. The plating layer 12 is not necessarily provided on the entire front and back surfaces of the lead frame body 11, and may be provided on only a part of the front and back surfaces of the lead frame body 11.

  A first outer lead portion 27 is formed on the back surface of the die pad 25, and a second outer lead portion 28 is formed on the back surface of the lead portion 26. The first outer lead portion 27 and the second outer lead portion 28 are used when connecting the LED package 20 and an external wiring board (not shown), respectively.

  In the present embodiment, as shown in FIGS. 2 and 4, a groove 18 is provided around the inner edge 45 a of the reflective resin formation region 45 on the surface of the lead frame 10. The groove 18 has a concave cross section that is recessed from the front surface of the lead frame 10 toward the back surface, and constitutes a reflective resin inflow groove into which a reflective resin 23 described later enters.

  As shown in FIG. 2, the planar shape of the groove 18 extends in a ring shape except for the gap 16 formed between the die pad 25 and the lead portion 26, and has a substantially oval or substantially racetrack shape. Yes. Each of the grooves 18 has an outer peripheral edge 18a and an inner peripheral edge 18b each having a plane oval shape or a racetrack shape. Located in the approximate center. The planar shape of the groove 18 is not limited to an oval shape or a race track shape, and may be, for example, a rectangle, a circle, an ellipse, or a polygon.

  Further, as shown in FIGS. 2 to 4, the die pad 25 and the lead portion 26 are provided with linear protrusions 63 that protrude from other portions of the lead frame 10 and extend linearly when viewed from the plane. . The linear protrusion 63 corresponds to the intersection of the lower mold 35 </ b> A or the upper mold 35 </ b> B for forming the reflective resin 23, the reflective resin 23, and the lead frame 10 among the die pad 25 and the lead part 26. It is provided in the part (see FIG. 10C).

  Specifically, on the surface side of the lead frame 10, the linear protrusion 63 is formed along the peripheral edge of the area surrounded by the inner peripheral edge 18 b of the groove 18 and the gap 16 in the die pad 25 and the lead part 26. (See FIG. 2).

  Further, on the back surface side of the lead frame 10, the linear protrusion 63 is formed along the periphery of the first outer lead portion 27 and the second outer lead portion 28 (see FIG. 3).

  In FIG. 4, the linear protrusion 63 is exaggerated in the height direction (the same applies to FIGS. 6, 7 and the like).

  This linear protrusion 63 may be formed by raising a part of the plating layer 12 as shown in FIG.

  Specifically, the linear protrusion 63 may be formed by raising the outermost surface plating layer (for example, a silver plating layer) among the layers constituting the plating layer 12. In this case, even if the linear protrusion 63 is crushed by the lower mold 35A or the upper mold 35B, the film thickness of the plating layer 12 can be secured to a certain extent, so that the occurrence of resin burrs is reliably prevented. can do.

  Alternatively, the linear protrusion 63 may be formed by raising the base plating layer among the layers constituting the plating layer 12. In this case, since it is possible to select the metal constituting the base plating layer from various metals, the hardness of the linear protrusion 63 is matched to the conditions such as the pressure of the lower mold 35A and the upper mold 35B. Can be adjusted. In addition, since a nickel plating layer has a property which is difficult to electrodeposit uniformly, when using a nickel plating layer as a base plating layer, the linear protrusion part 63 can be made easy to form.

  In addition, you may form the linear protrusion part 63 by combining the said method and raising both an outermost surface plating layer and a base plating layer. In this case, the height of the linear protrusion 63 can be increased.

  In FIG. 5A, the thickness of the plating layer 12 in the linear protrusion 63 is preferably 1.2 to 8 times the thickness of the plating layer 12 other than the linear protrusion 63, and is 1.5 to More preferably, it is doubled. The thickness of the plating layer 12 in the linear protrusion 63 is preferably 0.5 μm to 20 μm thicker than the thickness of the plating layer 12 other than the linear protrusion 63.

  Moreover, it is preferable that the width | variety of the linear protrusion part 63 shall be 5 micrometers-100 micrometers.

  Alternatively, the linear protrusion 63 may be formed by raising a part of the lead frame body 11 as shown in FIG. In this case, for example, the region excluding the linear protrusion 63 in the lead frame main body 11 is thinned in advance by, for example, half-etching from the surface side, and then the plating layer 12 is provided on the entire surface of the lead frame main body 11. Alternatively, the linear protrusion 63 may be formed. Since the linear protrusion 63 is formed by raising a part of the lead frame main body 11, it becomes easy to control the shape of the linear protrusion 63, and the linear protrusion 63 from the LED element 21 can be controlled. Light reflection control is facilitated.

Construction of the lead with the resin frame Next, referring to FIG. 6, an embodiment of the fabricated with resin Lead frame will be described with reference to the lead frame 10 shown in FIGS. 1-5.

  The lead frame 30 with resin shown in FIG. 6 is used for mounting the LED element 21 (see FIGS. 7 and 8). Such a lead frame 30 with resin includes the lead frame 10 described above and the reflective resin 23 provided in the reflective resin formation region 45 of the lead frame 10.

  Among them, the configuration of the lead frame 10 is the same as that shown in FIGS. 1 to 5 described above, and detailed description thereof is omitted here.

  On the other hand, the reflective resin 23 is integrated with the lead frame 10 and has a recess 23a surrounding the LED element 21 as will be described later. The gap 16 between the die pad 25 and the lead part 26 is also filled with the reflective resin 23. Details of the reflective resin 23 will be described later.

  As shown in FIG. 6, the reflective resin 23 also enters the groove 18. In this case, the corner portion 23f of the reflective resin 23 is located between the outer peripheral edge 18a and the inner peripheral edge 18b of the groove 18, and is preferably located substantially at the center between the outer peripheral edge 18a and the inner peripheral edge 18b of the groove 18. doing.

  Further, on the surface side of the lead frame 30 with resin, the portion surrounded by the inner peripheral edge 18b of the groove 18 in the die pad 25 and the lead portion 26 is exposed outward, and the linear protrusion 63 is exposed. It is formed on the periphery of the part.

  Further, the first outer lead portion 27 and the second outer lead portion 28 are exposed outwardly on the back surface side of the resin-attached lead frame 30, and the linear protrusion 63 is formed at the periphery of the exposed portion. Has been.

Configuration of LED Package Next, an embodiment of an LED package manufactured using the lead frame 10 shown in FIGS. 1 to 5 will be described with reference to FIGS. 7 and 8 are a sectional view and a plan view, respectively, showing an LED package (SON type).

  As shown in FIGS. 7 and 8, the LED package (semiconductor device) 20 includes a lead frame 10 (separated), an LED element 21 placed on a die pad 25 of the lead frame 10, and an LED element 21. And a bonding wire (conductive part) 22 that electrically connects the lead part 26 of the lead frame 10.

  A reflective resin 23 having a recess 23 a is provided so as to surround the LED element 21. The reflective resin 23 is integrated with the lead frame 10. Furthermore, the LED element 21 and the bonding wire 22 are sealed with a translucent sealing resin 24. This sealing resin 24 is filled in the recess 23 a of the reflective resin 23.

  Hereinafter, each component which comprises such an LED package 20 is demonstrated sequentially.

  The LED element 21 selects an emission wavelength ranging from ultraviolet light to infrared light by appropriately selecting a material made of a compound semiconductor single crystal such as GaP, GaAs, GaAlAs, GaAsP, AlInGaP, or InGaN as a light emitting layer. Can do. As such an LED element 21, those conventionally used in general can be used.

  The LED element 21 is fixedly mounted on the die pad 25 in the recess 23a of the reflective resin 23 by solder or die bonding paste. When using a die bonding paste, it is possible to select a die bonding paste made of an epoxy resin or a silicone resin having light resistance.

  The bonding wire 22 is made of a material having good conductivity such as gold, and one end thereof is connected to the terminal portion 21 a of the LED element 21, and the other end is connected to the lead portion 26.

  The reflective resin 23 is formed by, for example, transfer molding or injection molding of a thermoplastic resin or a thermosetting resin on the lead frame 10. The shape of the reflective resin 23 can be variously realized by designing a mold used for transfer molding or injection molding. For example, the overall shape of the reflective resin 23 may be a rectangular parallelepiped as shown in FIGS. 7 and 8, or may be a cylindrical shape or a conical shape. The bottom surface of the recess 23a is not limited to an oval shape or a race track shape, but may be a rectangle, a circle, an ellipse, a polygon, or the like. The cross-sectional shape of the side wall of the recess 23a may be constituted by a straight line as shown in FIG. 7, or may be constituted by a curve. The color of the reflective resin 23 may be black as well as white.

  As the thermoplastic resin or thermosetting resin used for the reflective resin 23, it is desirable to select a resin having excellent heat resistance, weather resistance and mechanical strength. As the types of thermoplastic resins, polyamide, polyphthalamide, polyphenylene sulfide, liquid crystal polymer, polyether sulfone, polybutylene terephthalate, polyetherimide, etc., the types of thermosetting resins are silicone resins, epoxy resins, And polyurethane can be used. Furthermore, by adding any one of titanium dioxide, zirconium dioxide, potassium titanate, aluminum nitride, and boron nitride as a light reflecting agent in these resins, the bottom surface and the side wall of the recess 23a can emit light from the light emitting element. It becomes possible to increase the light reflectivity and increase the light extraction efficiency of the entire LED package 20.

  As the sealing resin 24, it is desirable to select a material having a high light transmittance and a high refractive index at the emission wavelength of the LED package 20 in order to improve the light extraction efficiency. Therefore, it is possible to select an epoxy resin or a silicone resin as a resin that satisfies the characteristics of high heat resistance, weather resistance, and mechanical strength. In particular, when a high-brightness LED is used as the LED element 21, the sealing resin 24 is preferably made of a silicone resin having high weather resistance because the sealing resin 24 is exposed to strong light.

  Since the configuration of the lead frame 10 has already been described with reference to FIGS. 1 to 5, a detailed description thereof will be omitted here.

Manufacturing Method of LED Element Mounting Lead Frame Next, a manufacturing method of the lead frame 10 shown in FIGS. 1 to 5 will be described with reference to FIGS. 9A to 9F are cross-sectional views showing a method for manufacturing the lead frame 10 according to the present embodiment, and each correspond to the cross-section shown in FIG.

  In the following description, a case where the linear protrusion 63 is formed by raising a part of the plating layer 12 (FIG. 5A) will be described as an example.

  First, as shown in FIG. 9A, a flat metal substrate 31 is prepared. As the metal substrate 31, as described above, a metal substrate made of copper, copper alloy, 42 alloy (Ni 42% Fe alloy), iron alloy (stainless steel, FeNi), aluminum or the like can be used. In addition, it is preferable to use what the metal substrate 31 performed the degreasing | defatting etc. to the both surfaces, and performed the washing process.

  Next, photosensitive resists 32a and 33a are applied to the entire front and back surfaces of the metal substrate 31, respectively, and dried (FIG. 9B). As the photosensitive resists 32a and 33a, conventionally known resists can be used.

  Subsequently, the metal substrate 31 is exposed through a photomask and developed to form etching resist layers 32 and 33 having desired openings 32b and 33b (FIG. 9C).

  Next, the etching resist layers 32 and 33 are used as an anticorrosion film, and the metal substrate 31 is etched with an etching solution (FIG. 9D). Corrosion liquid can be suitably selected according to the material of the metal substrate 31 to be used. For example, when copper is used as the metal substrate 31, a ferric chloride aqueous solution is usually used and spray etching can be performed from both surfaces of the metal substrate 31.

  Next, the etching resist layers 32 and 33 are peeled and removed to obtain the lead frame body 11 including the frame 13, the plurality of die pads 25, and the plurality of lead portions 26 (FIG. 9E). ).

  Next, by electroplating the front and back surfaces of the lead frame main body 11, a metal (for example, silver) is deposited on the lead frame main body 11, and the plating layer 12 is formed on the entire surface including the front and back surfaces of the lead frame main body 11. Is formed (FIG. 9F).

  In the meantime, specifically, the lead frame main body 11 is sequentially subjected to, for example, an electrolytic degreasing step, a pickling step, a chemical polishing step, a copper strike step, a water washing step, a neutral degreasing step, a cyan washing step, and a silver plating step. The plating layer 12 is formed. In this case, examples of the plating solution for electrolytic plating used in the silver plating step include a silver plating solution mainly composed of silver cyanide. In the actual process, a water washing process is appropriately added between the processes as necessary. Further, the plating layer 12 may be formed only on a part of the lead frame main body 11 by interposing a patterning step in the middle of the above steps.

  As described above, when the plating layer 12 is formed, the die pad 25 and the lead part 26 are formed with the linear protrusions 63 protruding from the other parts of the lead frame 10. The linear protrusion 63 includes a lower mold 35A or an upper mold 35B (FIG. 10B) for forming the reflective resin 23 of the die pad 25 and the lead part 26, the reflective resin 23, and the lead frame. 10 is formed at a portion corresponding to the intersection with 10.

  Specifically, in the step of forming the plating layer 12 by electrolytic plating, for example, the flow of the plating solution, the position of the electrode (anode) for electrolytic plating, the temperature of the plating solution, the additive in the plating solution, and / or By controlling the current value between the electrodes, it is possible to concentrate the electric field on the portion of the lead frame body 11 where the linear protrusion 63 is to be formed (particularly the corner of the lead frame body 11). . As a result, the plating layer 12 where the electric field is concentrated is selectively thickened, and the linear protrusion 63 is formed.

  In this way, the lead frame 10 shown in FIGS. 1 to 5 is obtained.

Manufacturing Method of Resin-Included Lead Frame Next, a manufacturing method of the resin-attached lead frame 30 shown in FIG. 6 will be described with reference to FIGS.

  First, the lead frame 10 is manufactured by the steps described above (FIGS. 9A to 9F) (FIG. 10A).

  Subsequently, the lead frame 10 is sandwiched between a lower mold 35A and an upper mold 35B of an injection molding machine or a transfer molding machine (not shown) (FIG. 10B). A space 35a corresponding to the shape of the reflective resin 23 is formed in the upper mold 35B. Further, the upper mold 35 </ b> B has a convex portion 35 c corresponding to the concave portion 23 a of the reflective resin 23. This convex part 35c contacts the linear protrusion 63 formed on the surface of the die pad 25 and the lead part 26, and presses the linear protrusion 63 from above. On the other hand, the lower mold 35A abuts against the linear protrusion 63 formed on the back surface of the die pad 25 and the back surface of the lead portion 26, and presses the linear protrusion 63 from below.

  At this time, as shown in FIG. 10 (b), the surfaces (functional surfaces) 25a and 26a surrounded by the linear protrusions 63 among the surfaces of the die pad 25 and the lead part 26 are directly on the upper mold 35B. Do not touch. Further, of the first outer lead portion 27 and the second outer lead portion 28, the surfaces (functional surfaces) 27a and 28a surrounded by the linear protrusion 63 do not directly contact the lower mold 35A. Therefore, the pressure from the lower mold 35 </ b> A and the upper mold 35 </ b> B is intensively applied to the linear protrusion 63. As a result, the linear protrusion 63 is crushed by the lower mold 35A and the upper mold 35B, and the linear protrusion 63 comes into close contact with the lower mold 35A and the upper mold 35B.

  Next, a thermosetting resin or a thermoplastic resin is poured between the lower mold 35A and the upper mold 35B from a resin supply part (not shown) of the injection molding machine or transfer molding machine, and then cured or solidified. Thereby, the reflective resin 23 is formed in the reflective resin formation region 45 of the lead frame 10 (FIG. 10C). At this time, the gap 16 between the die pad 25 and the lead part 26 is also filled with the reflective resin 23. The reflective resin 23 also flows into the groove 18 on the surface of the lead frame 10.

  In this case, since the linear protrusion 63 of the die pad 25 and the lead part 26 is pressed by the lower mold 35A and the upper mold 35B and is in close contact with the lower mold 35A and the upper mold 35B, reflection is performed. The resin 23 does not flow inward of the die pad 25 and the lead part 26 in the horizontal direction.

  That is, on the surface side of the lead frame 10, the reflective resin 23 is blocked by the linear protrusion 63 and does not flow into the surface 25 a of the die pad 25 and the surface 26 a of the lead portion 26. Further, on the back surface side of the lead frame 10, the reflective resin 23 is blocked by the linear protrusion 63, and does not flow into the surface 27 a of the first outer lead portion 27 and the surface 28 a side of the second outer lead portion 28.

  Next, the lead frame 10 on which the reflective resin 23 is formed is taken out from the lower mold 35A and the upper mold 35B. In this way, the lead frame 30 with resin in which the reflective resin 23 and the lead frame 10 are integrally formed is obtained (FIG. 10D).

Manufacturing Method of LED Package Next, a manufacturing method of the LED package 20 shown in FIGS. 7 and 8 will be described with reference to FIGS.

  First, the resin-attached lead frame 30 is produced by the above-described steps (FIGS. 10A to 10D). The LED element 21 is mounted. In this case, the LED element 21 is placed and fixed on the die pad 25 using a solder or a die bonding paste (die attach step) (FIG. 11A).

  Next, the terminal portion 21a of the LED element 21 and the surface of the lead portion 26 are electrically connected to each other by the bonding wire 22 (wire bonding step) (FIG. 11B).

  Then, the sealing resin 24 is filled in the recess 23a of the reflective resin 23, and the LED element 21 and the bonding wire 22 are sealed with the sealing resin 24 (FIG. 11C).

  Next, the reflective resin 23 and the lead frame 10 are cut into portions between the package regions 14 to separate the reflective resin 23 and the lead frame 10 for each LED element 21 (dicing step) (FIG. 11 ( d)). At this time, the lead frame 10 is first placed and fixed on the dicing tape 37, and thereafter, the reflective resin 23 between the LED elements 21 and the lead connecting portion of the lead frame 10 by a blade 38 made of, for example, a diamond grindstone. 52, the die pad connecting portion 53 and the package region connecting portion 54 are cut.

  Thus, the LED package 20 shown in FIGS. 7 and 8 can be obtained (FIG. 11E).

  As described above, according to the present embodiment, in the die pad 25 and the lead portion 26, the portion corresponding to the intersection of the lower mold 35 </ b> A and the upper mold 35 </ b> B, the reflective resin 23, and the lead frame 10. A linear protrusion 63 that is pressed by the lower mold 35A and the upper mold 35B and protrudes from the other part of the lead frame 10 is provided. Further, when the reflective resin 23 is formed by the linear protrusions 63 (FIG. 10C), the reflective resin 23 flows into the die pad 25 and the inside of the lead part 26 (surfaces 25a, 26a, 27a, 28a). Is preventing. As a result, the generation of resin burrs on the die pad 25 and the lead part 26 can be suppressed, and a deburring step for removing the resin burrs can be eliminated.

  Further, since it is possible to suppress the occurrence of resin burrs in the die pad 25 and the lead portion 26, it is possible to reduce the pressure with which the lower mold 35A and the upper mold 35B sandwich the lead frame 10.

  Furthermore, when the reflective resin 23 is formed (FIG. 10C), the pressure applied by the lower mold 35A and the upper mold 35B is concentrated on only the linear protrusion 63, and the surfaces 25a, 27a of the die pad 25 and It does not join the surfaces 26a, 28a of the lead part 26. Accordingly, since no mold marks are generated on these surfaces 25a, 26a, 27a, 28a, the quality of the die pad 25 and the lead portion 26 (for example, appearance, glossiness, visible light reflectance, plating thickness, surface roughness, bonding property) Etc.) can be stabilized. As a result, it is possible to prevent the optical characteristics of the die pad 25 and the lead part 26 from changing and the bonding property from deteriorating.

Modified Examples Next, various modified examples (modified examples 1 to 6) of the lead frame and the LED package will be described with reference to FIGS. 12 to 24, the same parts as those of the embodiment shown in FIGS. 1 to 11 are denoted by the same reference numerals, and detailed description thereof is omitted.

Modification 1
12 and 13 are diagrams showing a modified example (modified example 1) of the present embodiment. 12 is a cross-sectional view (corresponding to FIG. 7) showing the LED package 20A manufactured using the lead frame 10A, and FIG. 13 is a plan view (corresponding to FIG. 2) showing the lead frame 10A. Figure).

  12 and 13, unlike the embodiment shown in FIGS. 1 to 11, the reflective resin 23 does not protrude to the surface side of the lead frame 10A, and the gap 16 between the die pad 25 and the lead portion 26, The die pad 25 and the lead portion 26 are filled.

  In this case, the linear protrusion 63 is provided at a portion of the die pad 25 and the lead 26 corresponding to the intersection of the lower mold 35A or the upper mold 35B, the reflective resin 23, and the lead frame 10A. .

  That is, on the surface side of the lead frame 10 </ b> A, the linear protrusion 63 is formed along the periphery of the die pad 25 and the lead part 26. Further, the linear protrusion 63 is formed along the peripheral edges of the first outer lead 27 and the second outer lead 28 on the back side of the lead frame 10 </ b> A.

  In this case, since the linear protrusions 63 are provided at substantially the same position on the front surface side and the back surface side of the lead frame 10A, when the reflective resin 23 is formed, the lead is formed by the lower mold 35A and the upper mold 35B. The frame 10 is pressed substantially evenly. For this reason, the linear protrusions 63 of the die pad 25 and the lead part 26 are securely in close contact with the lower mold 35A and the upper mold 35B, and resin burrs are reliably generated on the die pad 25 and the lead part 26. Can be prevented. Thereby, the LED element 21 can be easily placed on the die pad 25, and wire bonding can be easily performed on the lead portion 26.

Modification 2
FIG. 14 and FIG. 15 are diagrams showing a modified example (modified example 2) of the present embodiment. 14 is a cross-sectional view (corresponding to FIG. 7) showing an LED package 20B manufactured using the lead frame 10B, and FIG. 15 is a plan view showing the lead frame 10B (corresponding to FIG. 2). Figure).

  14 and 15, unlike the embodiment shown in FIGS. 1 to 11, the linear protrusion 63 has a portion corresponding to the intersection of the upper mold 35 </ b> B, the reflective resin 23, and the lead frame 10 </ b> B. It is provided only in a part.

  That is, the linear protrusions 63 are provided only on the edges facing the gap 16 on the thin portions 25 b and 26 b of the die pad 25 and the lead portion 26. The thin portions 25b and 26b are formed by half-etching from the back side of the lead frame 10B.

  In general, the thin portions 25b and 26b are likely to bend when pressed by the convex portion 35c (FIG. 10B) of the upper mold 35B. For this reason, the reflective resin 23 flows into the thin portions 25b and 26b. , Resin burrs tend to occur. Therefore, by forming the linear protrusions 63 in the thin portions 25b and 26b, even if the thin portions 25b and 26b are bent, the reflective resin 23 flows into the die pad 25 and the lead portion 26. This can be prevented.

  The thin portion 26b of the lead portion 26 has a shape having a protrusion protruding toward the gap 16 side. For this reason, when a force is applied to the edge of the lead portion 26 facing the gap 16, this force is distributed between the gap 16 side and the opposite side of the gap 16, and the thin portion 26 b is likely to be distorted. For this reason, by forming the linear protrusion 63 at the edge facing the gap 16 of the lead portion 26, even when the thin portion 26 b is distorted, the reflective resin 23 moves to the inside of the lead portion 26. Inflow can be prevented.

Modification 3
16 and 17 are diagrams showing a modification (Modification 3) of the present embodiment. 16 is a cross-sectional view (corresponding to FIG. 7) showing an LED package 20C manufactured using the lead frame 10C, and FIG. 17 is a plan view showing the lead frame 10C (corresponding to FIG. 2). Figure).

  16 and 17, unlike the embodiment shown in FIGS. 1 to 11, the plating layer 12 is provided only on the inner side of the inner peripheral edge 18 b of the groove 18 on the surface of the die pad 25 and the surface of the lead portion 26. .

  16 and 17, the linear protrusion 63 is provided at a portion of the die pad 25 and the lead 26 corresponding to the intersection of the upper mold 35B, the reflective resin 23, and the lead frame 10C.

  That is, on the surface side of the lead frame 10 </ b> C, the linear protrusion 63 is formed along the peripheral edge of the area surrounded by the inner peripheral edge 18 b of the groove 18 and the gap 16 in the die pad 25 and the lead part 26. . On the other hand, the linear protrusion 63 is not provided on the back side of the lead frame 10C.

  In this case, the plating layer 12 is not provided on the side surface of the die pad 25 and the lead portion 26 that faces the gap 16 side. For this reason, there is no possibility that the gap 16 between the die pad 25 and the lead portion 26 is narrowed by providing the plating layer 12, and the distance between the die pad 25 and the lead portion 26 can be reduced. In particular, when the plating layer 12 is made of a silver plating layer, the occurrence of electrochemical migration between the silver plating layer on the side surface of the die pad 25 and the silver plating layer on the side surface of the lead portion 26 can be prevented.

Modification 4
18 and 19 are diagrams showing a modification (Modification 4) of the present embodiment. 18 is a cross-sectional view (corresponding to FIG. 7) showing the LED package 20D manufactured using the lead frame 10D, and FIG. 19 is a plan view showing the lead frame 10D (corresponding to FIG. 2). Figure).

  18 and 19, unlike the embodiment shown in FIGS. 1 to 11, the lead connecting portion 52, the die pad connecting portion 53, and the package region connecting portion 54 are half-etched from the front side, thereby forming the lead frame 10D. It is formed thinner than other parts. Further, the reflective resin 23 is filled in the gap 16 between the die pad 25 and the lead part 26 and the periphery of the die pad 25 and the lead part 26 without protruding to the surface side of the lead frame 10D.

  In FIG. 18 and FIG. 19, the linear protrusion 63 is located at a portion of the die pad 25 and the lead portion 26 corresponding to the intersection of the lower mold 35A or the upper mold 35B, the reflective resin 23, and the lead frame 10D. Is provided.

  That is, on the surface side of the lead frame 10 </ b> D, the linear protrusion 63 is formed along the periphery of the die pad 25 and the lead part 26. Further, the linear protrusion 63 is formed along the periphery of the first outer lead portion 27 and the second outer lead portion 28 on the back surface side of the lead frame 10D.

  In this case, since the linear protrusion 63 is also provided on the package region connecting portion 54 side of the die pad 25 and the lead portion 26, the reflective resin 23 is formed on the die pad 25 and the lead portion 26 from the package region connecting portion 54 side. It is possible to prevent entry into the inside.

Modification 5
20 and 21 are diagrams showing a modification (modification 5) of the present embodiment. 20 is a cross-sectional view (corresponding to FIG. 7) showing an LED package 20E manufactured using the lead frame 10E, and FIG. 21 is a plan view showing the lead frame 10E (corresponding to FIG. 2). Figure).

  20 and 21, unlike the embodiment shown in FIGS. 1 to 11, the lead frame 10 </ b> E includes a first portion 65 and a second portion 66 provided apart from the first portion 65. have. Each of the first portion 65 and the second portion 66 has inner lead portions 65a and 66a provided on the front surface side and connected to the bonding wire 22, and outer lead portions 67 and 68 provided on the back surface side. doing.

  In addition, regions of the first portion 65 and the second portion 66 other than the inner lead portions 65a and 66a are thinned by being half-etched from the surface side. Therefore, as shown in FIG. 20, areas of the first portion 65 and the second portion 66 other than the inner lead portions 65 a and 66 a are covered with the reflective resin 23 on the surface side.

  In this case, the LED element 21 is mounted on the reflective resin 23 formed between the first portion 65 and the second portion 66.

  20 and 21, the linear protrusion 63 is an intersection of the lower mold 35 </ b> A or the upper mold 35 </ b> B, the reflective resin 23, and the lead frame 10 in the first portion 65 and the second portion 66. It is provided in the part corresponding to.

  Specifically, on the surface side of the lead frame 10E, the linear protrusion 63 is formed along the periphery of the inner lead portions 65a and 66a. Further, the linear protrusion 63 is formed along the periphery of the outer lead portions 67 and 68 on the back surface side of the lead frame 10E.

  In this case, since the inner lead portions 65a and 66a made of metal have a small exposed area from the reflective resin 23, even if the inner lead portions 65a and 66a are discolored due to moisture or sulfur components in the air, Changes in the reflectance and color of the LED package 20 can be suppressed. Further, by exposing only the region necessary for wire bonding from the reflective resin 23, the bonding wire 22 covers this exposed surface, and even if the inner lead portions 65a and 66a are discolored, the LED package 20 There is no need to consider changes in reflectance and color. Furthermore, by forming the linear protrusion 63 along the periphery of the inner lead portions 65a and 66a, it is possible to prevent the reflective resin 23 from entering the inner lead portions 65a and 66a having a small area. Further, by providing the linear protrusion 63, the area of the inner lead portions 65a and 66a can be further reduced.

Modification 6
22 to 24 are diagrams showing a modification (Modification 6) of the present embodiment. Of these, FIG. 22 is a cross-sectional view (corresponding to FIG. 6) showing the resin-made lead frame 30F, and FIG. 23 is a cross-sectional view showing the LED package 20F manufactured using the resin-made lead frame 30F (FIG. FIGS. 24A to 24D are cross-sectional views showing the method of manufacturing the lead frame with resin 30F shown in FIG. 22 (the figures corresponding to FIG. 10).

  22 and 23, the surface 63a of the linear protrusion 63 that contacts the lower mold 35A and the surface 63b of the linear protrusion 63 that contacts the upper mold 35B are both flat. Yes. Further, the surface 23g of the reflective resin 23 filled between the die pad 25 and the lead portion 26 and the surface 63b are located on the same plane. Furthermore, the back surface 23h of the reflective resin 23 filled between the die pad 25 and the lead portion 26 and the surface 63a are located on the same plane. Thereby, especially on the surface 23g side of the reflective resin 23, the reflection direction of the light emitted from the LED element 21 can be easily controlled.

  Next, a method for manufacturing the resin-attached lead frame 30F shown in FIG. 22 will be described with reference to FIGS.

  First, the lead frame 10 is manufactured by the steps described above (FIGS. 9A to 9F) (FIG. 24A).

  Subsequently, the lead frame 10 is sandwiched between a lower mold 35A and an upper mold 35B of an injection molding machine or a transfer molding machine (not shown) (FIG. 24B). At this time, the lower mold 35 </ b> A and the upper mold 35 </ b> B come into contact with and press the linear protrusions 63 formed on the die pad 25 and the lead part 26. Thereby, the linear protrusion 63 is crushed and flat surfaces 63a and 63b are formed. In addition, when the plating layer 12 consists of a soft silver plating layer, since the linear protrusion part 63 is easy to be crushed, it is easy to planarize the surfaces 63a and 63b.

  Next, a thermosetting resin or a thermoplastic resin is poured between the lower mold 35A and the upper mold 35B from a resin supply part (not shown) of the injection molding machine or transfer molding machine, and then cured or solidified. As a result, the reflective resin 23 is formed in the reflective resin formation region 45 of the lead frame 10 (FIG. 24C).

  In this case, the linear protrusions 63 of the die pad 25 and the lead portion 26 are pressed by the lower mold 35A and the upper mold 35B and are brought into close contact with the lower mold 35A and the upper mold 35B. Further, the surface 63a of the linear protrusion 63 that contacts the lower mold 35A and the surface 63b of the linear protrusion 63 that contacts the upper mold 35B are both crushed and flattened. As a result, the linear protrusion 63 and the lower mold 35A or the upper mold 35B are in close contact with each other over a wide range, and the reflective resin 23 is reliably prevented from flowing into the die pad 25 and the lead part 26 in the horizontal direction.

  Next, the lead frame 10 on which the reflective resin 23 is formed is taken out from the lower mold 35A and the upper mold 35B. In this way, a lead frame 30F with resin in which the reflective resin 23 and the lead frame 10 are integrally formed is obtained (FIG. 24D).

  In addition, in each modification 1-6 shown in FIG. 12 thru | or 21, you may make the surface which contacts the lower metal mold | die 35A or the upper metal mold | die 35B among the linear protrusion parts 63 flat.

  As described above, in each of the modifications shown in FIGS. 12 to 24, when the reflective resin 23 is formed, the reflective resin 23 can be prevented from flowing into the inside of the die pad 25 and the lead portion 26. Generation of resin burrs in the lead portion 26 can be suppressed. In addition, substantially the same effects as those of the embodiment shown in FIGS. 1 to 10 described above can be obtained.

10, 10A-10E Lead frame 11 Lead frame body 12 Plating layer 20, 20A-20F LED package 21 LED element 22 Bonding wire (conductive portion)
23 Reflective resin 24 Sealing resin 25 Die pad (first part)
26 Lead part (second part)
27 First outer lead portion 28 Second outer lead portion 30, 30F Lead frame with resin 35A Lower die 35B Upper die 45 Reflective resin forming region 52 Lead connecting portion 53 Die pad connecting portion 54 Package region connecting portion 63 Linear Protrusion

Claims (3)

  1. In the manufacturing method of the lead frame for LED element mounting that is sandwiched between the lower mold and the upper mold when forming the reflective resin,
    Preparing a lead frame body including a first portion and a second portion spaced apart from the first portion;
    Forming a reflective plating layer that reflects light from the LED element on the lead frame body,
    One of the first or second portion, the corner portion of the lead frame body, the linear projection projecting from the other portions of the lead frame while being pressed is provided by the upper die,
    The method of manufacturing a lead frame, wherein the linear protrusion is formed by raising a part of the reflective plating layer by electrolytic plating .
  2. In the manufacturing method of the lead frame with resin,
    A method of manufacturing a lead frame according to claim 1 , comprising: producing a lead frame; and providing a reflective resin on the lead frame in a state where the lead frame is sandwiched between the lower mold and the upper mold. ,
    In the step of providing the reflective resin, the linear protrusion is pressed by the upper mold located on the surface side on which the LED element is mounted, thereby preventing the reflective resin from flowing into the first part or the second part. A method for manufacturing a lead frame with resin, comprising:
  3. In the manufacturing method of the LED package,
    A step of producing a lead frame with resin by the method for producing a lead frame with resin according to claim 2 ;
    A process of mounting LED elements on a lead frame with resin;
    Connecting the LED element and the lead frame by a conductive portion;
    And a step of sealing the LED element and the conductive portion with a sealing resin.
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