JP5970835B2 - Lead frame member, lead frame member with resin, and semiconductor device - Google Patents

Description

  The present invention relates to a lead frame member for mounting LED elements, a lead frame member with resin for mounting LED elements, and a semiconductor device for LED elements.

  2. Description of the Related Art Conventionally, lighting devices that use LED (light emitting diode) elements as light sources have been used for various home appliances, OA equipment, display lights for vehicle equipment, general lighting, in-vehicle lighting, and displays. Some of such lighting devices include a semiconductor device having an LED element.

  For example, Patent Document 1 discloses a semiconductor device (LED package) in which a reflective resin portion (reflector) that reflects light from an LED element is disposed on a lead frame surface.

JP 2011-151069 A

  In general, in an LED package, there is a problem of moisture absorption deterioration that the LED package deteriorates by absorbing moisture. It is known that this moisture absorption deterioration becomes remarkable when the LED package is placed under severe conditions.

  For example, the conventional LED package described in Patent Document 1 has a structure in which the interface between the transparent sealing resin portion and the lead frame is not exposed from the side surface. For this reason, even if there is some moisture absorption, the portion of the lead frame surface covered by the reflective resin portion is discolored and does not have a great influence on the optical characteristics.

  On the other hand, in recent years, in order to spread the light emitted from the LED element over the entire surface of the LED package, one that does not have a reflective resin portion on the surface of the lead frame has been developed (flat package). Such an LED package has a structure in which an interface between the transparent sealing resin portion and the lead frame exists on the side surface. Therefore, when moisture permeates slightly from the side surface of the LED package and the moisture absorption is deteriorated, the lead frame surface is discolored, and the optical characteristics are immediately deteriorated. In this case, the luminous flux of the light from the LED element may be deteriorated, or the color of the light from the LED element may be changed.

  Further, since the transparent sealing resin portion (especially silicone) does not necessarily have good adhesion to the lead frame (especially silver), moisture absorption (lead) from the interface between the sealing resin portion exposed on the side of the LED package and the lead frame. If the frame is silver, sulfidation is also likely to occur, causing deterioration in reliability.

  The present invention has been made in consideration of the above points, and a lead frame member and a resin capable of preventing the optical characteristics of the semiconductor device from deteriorating by preventing the semiconductor device from deteriorating in moisture absorption. It is an object to provide an attached lead frame member and a semiconductor device.

  The present invention relates to a lead frame member for mounting an LED element, a frame body, an LED element mounting portion on which the LED element is mounted, and a lead portion that is disposed separately from the LED element mounting portion. And each lead frame is connected to a frame or another lead frame via a connecting portion, and the surface sinks from the surface of the frame and the lead frame to the surface of the connecting portion. A lead frame member characterized in that a portion is formed.

  The present invention provides an LED element mounting lead frame member comprising: a frame; an LED element mounting portion that is disposed in the frame and on which the LED element is mounted; and a lead portion that is spaced apart from the LED element mounting portion. The LED element mounting part and the lead part are each connected to the frame body via the connection part, and a surface sagging part that falls from the surface of the frame body, the LED element mounting part and the lead part is formed on the surface of the connection part. A lead frame member characterized by the above.

  The lead frame member according to the present invention is characterized in that the cross section of the connecting portion has a trapezoidal shape that tapers toward the back side.

  The lead frame member according to the present invention is characterized in that the cross section of the connecting portion has a trapezoidal shape that tapers toward the surface side.

  The present invention is the lead frame member in which a back surface depression portion that falls from the back surface of the frame body and the lead frame is further formed on the back surface of the connecting portion.

  The present invention is the lead frame member in which a back surface depression portion that falls from the back surface of the frame body, the LED element mounting portion, and the lead portion is further formed on the back surface of the connection portion.

  The present invention relates to a lead frame member with resin for LED element mounting, which is a lead frame member, a frame body, an LED element mounting portion that is disposed in the frame body, each of which is mounted with an LED element, and an LED element mounting portion A plurality of lead frames including lead portions spaced apart from each other, and each lead frame is connected to a frame or another lead frame via a connecting portion, and a lead frame member and a lead A reflection resin portion provided around each lead frame of the frame member, and the surface of the reflection resin portion is flush with the surface of each lead frame, and the back surface of the reflection resin portion is A lead with resin, which is located on the same plane as the back surface, and has a surface depression portion that falls from the surface of the frame body and the lead frame on the surface of the connecting portion. A frame member.

  The present invention relates to a lead frame member with resin for LED element mounting, which is a lead frame member, and is disposed within the frame body, an LED element mounting portion on which the LED element is mounted, and spaced apart from the LED element mounting portion. The LED element mounting part and the lead part are connected to the frame body via the connecting part, and the LED element mounting part and the lead part of the lead frame member. And the surface of the reflective resin portion is located on the same plane as the surface of the LED element mounting portion and the lead portion, and the back surface of the reflective resin portion is the LED element mounting portion and the lead. The resin-coated lie is characterized in that a surface depression is formed on the same plane as the back surface of the part, and is formed on the surface of the coupling part from the surface of the frame, the LED element mounting part, and the lead part. A frame member.

  The present invention is the lead frame member with resin, wherein the cross section of the connecting portion has a trapezoidal shape that tapers toward the back side.

  The present invention is the lead frame member with resin, wherein the cross section of the connecting portion has a trapezoidal shape that tapers toward the surface side.

  The present invention is the lead frame member with resin, wherein a back surface depression portion that falls from the back surface of the frame body and the lead frame is further formed on the back surface of the connecting portion.

  The present invention is the lead frame member with resin, in which a back surface depression portion that falls from the back surface of the frame body, the LED element mounting portion, and the lead portion is further formed on the back surface of the connection portion.

  The present invention relates to an LED element mounting portion, a lead portion spaced apart from the LED element mounting portion, an LED element mounting portion, a connecting portion connected to the lead portion, an LED element mounting portion, and a semiconductor device. Provided on the surface of the reflective resin part provided around the lead part, the LED element mounted on the LED element mounting part, the connection part for connecting the lead part and the LED element, and the LED element mounting part and the lead part A sealing resin part that seals the LED element and the connection part, the surface of the reflective resin part is located on the same plane as the surface of the LED element mounting part and the lead part, and the back surface of the reflective resin part is Located on the same plane as the back surface of the LED element mounting portion and the lead portion, a surface drop portion that falls from the surface of the lead frame is formed on the surface of the connecting portion, and the connecting portion is exposed laterally from the reflective resin portion. This A wherein a.

  The present invention is the semiconductor device characterized in that the cross section of the connecting portion has a trapezoidal shape that tapers toward the back surface side.

  The present invention is the semiconductor device characterized in that the cross section of the connecting portion has a trapezoidal shape that tapers toward the surface side.

  The present invention is the semiconductor device characterized in that a back surface depression portion that falls from the back surface of the frame body, the LED element mounting portion, and the lead portion is further formed on the back surface of the connection portion.

  According to the present invention, since the surface depression portion that falls from the surface of the frame body and the lead frame is formed on the surface of the connection portion, the interface between the sealing resin portion and the lead frame is not exposed from the side surface of the semiconductor device. ing. As a result, the semiconductor device can be prevented from deteriorating in moisture absorption, and the optical characteristics of the semiconductor device can be prevented from deteriorating.

The top view which shows the lead frame member by one embodiment of this invention. FIG. 2 is a partially enlarged plan view showing a lead frame member according to an embodiment of the present invention (an enlarged view of a portion II in FIG. 1). Sectional drawing which shows the lead frame member by one embodiment of this invention (III-III sectional view taken on the line of FIG. 2). The top view which shows the lead frame member by the modification of one embodiment of this invention. The top view which shows the lead frame member with resin by one embodiment of this invention (VV sectional view taken on the line of FIG. 5). Sectional drawing which shows the lead frame member with resin by one embodiment of this invention (VI-VI sectional view taken on the line of FIG. 5). 1 is a perspective view showing a semiconductor device according to an embodiment of the present invention. The top view which shows the semiconductor device by one embodiment of this invention. Sectional drawing which shows the semiconductor device by one embodiment of this invention (the IX-IX sectional view taken on the line of FIG. 8). Sectional drawing which shows the manufacturing method of the lead frame member by one embodiment of this invention. Sectional drawing which shows the manufacturing method of the lead frame member with a resin and semiconductor device by one embodiment of this invention. Sectional drawing which shows the modification (modification 1) of a lead frame member. Sectional drawing which shows the modification (modification 1) of the lead frame member with resin. The perspective view which shows the modification (modification 1) of a semiconductor device. Sectional drawing which shows the modification (modification 1) of a semiconductor device (XIV-XIV sectional view taken on the line of FIG. 14). The perspective view which shows the modification (modification 2) of a semiconductor device. The perspective view which shows the modification (modification 3) of a semiconductor device.

  Hereinafter, an embodiment of the present invention will be described with reference to FIGS. In this specification, the “front surface” refers to the surface on which the LED element 21 is mounted (that is, the upper surface in FIGS. 3, 6, and 9), and the “back surface” refers to the wiring board (see FIG. This refers to the surface to which the device is connected (that is, the lower surface of FIGS. 3, 6, and 9).

Configuration of Lead Frame Member First, an outline of the LED element mounting lead frame member according to the present embodiment will be described with reference to FIGS. 1 to 3 are views showing a lead frame member according to the present embodiment.

  The lead frame member 10 shown in FIGS. 1 to 3 is used when manufacturing the semiconductor device 20 (FIGS. 7 to 9) on which the LED elements 21 are mounted. Such a lead frame member 10 includes a frame body 13 having a rectangular outer shape, and a plurality of lead frames 14 arranged in a multi-row and multi-stage (matrix shape) within the frame body 13.

  As shown in FIG. 2, each of the plurality of lead frames 14 includes an LED element mounting portion (die pad) 25 on which the LED elements 21 are mounted, and a lead portion 26 that is spaced apart from the LED element mounting portion 25. It is out.

  A gap 16 is formed between the LED element mounting portion 25 and the lead portion 26 of each lead frame 14, and after dicing (FIG. 11E), the LED element mounting portion 25 and the lead portion 26 Are electrically insulated from each other. Each lead frame 14 corresponds to a region (package region) included in each semiconductor device 20.

  As shown in FIG. 2, each lead frame 14 is connected to the frame 13 or another lead frame 14 via a connecting portion 27. That is, in FIG. 2, the lead portion 26 of each lead frame 14 is adjacent to the lead portion 26 of the other lead frame 14 adjacent to the upper portion (Y-axis plus direction in FIG. 2) and below (the Y-axis minus direction in FIG. 2). ) To the lead part 26 of the other lead frame 14 adjacent to the LED element mounting part 25 of the other lead frame 14 adjacent to the left side (X-axis minus direction in FIG. 2), respectively, via the connecting part 27. Are connected. In addition, the LED element mounting portion 25 of each lead frame 14 includes an LED element mounting portion 25 of another lead frame 14 adjacent above it, an LED element mounting portion 25 of another lead frame 14 adjacent below it, and The other lead frame 14 adjacent to the right side (X-axis plus direction in FIG. 2) is connected to a lead part 26 via a connecting part (tie bar) 27, respectively. The lead part 26 and the LED element mounting part 25 of the lead frame 14 located on the outermost periphery are connected to the frame body 13 via connecting parts 27, respectively.

  As shown in FIG. 3, a surface drop portion 28 that falls from the surfaces of the frame 13 and the lead frame 14 is formed on the surface of the connecting portion 27. For example, when the lead frame member 10 is formed by etching, the surface sagging portion 28 is simultaneously formed by half etching. On the other hand, the back surface of the connecting portion 27 is located on the same plane as the LED element mounting portion 25 and the lead portion 26. Note that the thickness of the connecting portion 27 may be 30% or more of the thickness of the frame 13 and the lead frame 14 or 50 μm or more. By setting the thickness of the connecting portion 27 to 30% or more of the thickness of the frame 13 and the lead frame 14 or the thickness of the connecting portion 27 to 50 μm or more, deformation of the lead frame member 10 due to insufficient strength of the connecting portion 27 is prevented. be able to. On the other hand, the depth of the surface sagging portion 28 is desirably 50 μm or more. When the reflective resin portion 23 is formed using a mold, the resin flow can be prevented and the resin filling property can be improved.

  In the present embodiment, the surface sagging portion 28 is desirably formed on all of the plurality of connecting portions 27 over the entire longitudinal direction of each connecting portion 27. The reason is that the resin can be reliably filled into the surface sagging portion 28 when the reflective resin portion 23 is formed using a mold. However, the present invention is not limited to this, and the surface sagging portion 28 may be formed at least in a portion of each connecting portion 27 that is cut by dicing (see FIG. 11E). Further, the surface sagging portion 28 may be formed only in some of the connecting portions 27 among the plurality of connecting portions 27.

  Further, as shown in FIG. 3, the lead frame member 10 includes a lead frame main body 11 and a plating layer 12 formed on the lead frame main body 11.

  Of these, the lead frame body 11 is made of a metal plate. Examples of the material of the metal plate constituting the lead frame body 11 include copper, copper alloy, 42 alloy (Ni 42% Fe alloy), and the like. The thickness of the lead frame main body 11 may be 0.05 mm to 0.5 mm, although it depends on the configuration of the semiconductor device 20.

  The plating layer 12 is provided on the entire surface including the front surface and the back surface of the lead frame main body 11. The plating layer 12 on the front side functions as a reflection layer for reflecting light from the LED element 21. On the other hand, the plating layer 12 on the back side plays a role of increasing the adhesion with the solder. The plating layer 12 is made of, for example, an electrolytic plating layer of silver (Ag). The plating layer 12 is formed to be extremely thin, and specifically, it is preferably set to 0.005 μm to 10 μm. The plating layer 12 is not necessarily provided on the entire front and back surfaces of the lead frame body 11, and may be provided on only a part of the front and back surfaces of the lead frame body 11. As a metal constituting the plating layer 12, in addition to the silver described above, a silver alloy, gold or an alloy thereof, a platinum group, copper or an alloy thereof, aluminum, or the like may be used.

  Further, a first outer lead portion 41 is formed on the back surface of the LED element mounting portion 25, and a second outer lead portion 42 is formed on the bottom surface of the lead portion 26. The first outer lead portion 41 and the second outer lead portion 42 are surfaces exposed on the back side of the semiconductor device 20 (FIGS. 7 to 9), respectively, and the semiconductor device 20 and an external wiring board (not shown). ).

  The lead frame member 10 preferably has a plurality of lead frames 14 each including an LED element mounting portion 25 and a lead portion 26. The reason for this is that the number of LED element mounting portions 25 and lead portions 26 obtained per unit area is increased, and the amount of cutting the frame 13 is reduced when dicing or the like is separated into pieces, which is added to the blade for dicing. This is because the load can be reduced. However, the present invention is not limited to this, and as shown in FIG. 4, the lead frame member 10 includes a frame 13, and one lead frame 14 including an LED element mounting portion 25 and a lead portion 26. It may be.

Configuration of Leadframe Member with Resin Next, an embodiment of a leadframe member with resin manufactured using the leadframe member shown in FIGS. 1 to 3 will be described with reference to FIGS. 5 and 6 are views showing a resin-attached lead frame member according to the present embodiment.

  The lead frame member 30 with resin shown in FIGS. 5 and 6 is used for mounting the LED element 21 (see FIGS. 7 to 9). Such a lead frame member 30 with resin includes the lead frame member 10 described above and a reflective resin portion 23 provided around each lead frame 14 of the lead frame member 10.

  Among these, the lead frame member 10 has a frame body 13 and a plurality of lead frames 14 arranged in the frame body 13, and each lead frame 14 has an LED element mounting portion on which the LED element 21 is mounted. 25 and a lead portion 26 that is spaced apart from the LED element mounting portion 25. The configuration of the lead frame member 10 is the same as that shown in FIGS. 1 to 3 described above, and detailed description thereof is omitted here.

  On the other hand, the reflective resin portion 23 is integrated with the lead frame member 10. The reflective resin portion 23 is filled between the frame 13 and the lead frame 14 and between the adjacent lead frames 14. Further, the reflective resin portion 23 is also filled in the gap 16 between the LED element mounting portion 25 and the lead portion 26.

  As shown in FIG. 6, the surface of the reflective resin portion 23 is located on the same plane as the surface of each lead frame 14 (the surface of the LED element mounting portion 25 and the surface of the lead portion 26). The back surface of each lead frame 14 is located on the same plane as the back surface of each lead frame 14 (the back surface of the LED element mounting portion 25 and the back surface of the lead portion 26). Further, the surface of the connecting portion 27 is filled with the reflecting resin portion 23, and the surface of the reflecting resin portion 23 provided on the connecting portion 27 is also flush with the surface of the lead frame 14. positioned.

The reflective resin portion 23 is formed by, for example, injection molding of a thermoplastic resin to the lead frame member 10 or by injection molding or transfer molding of a thermosetting resin. As the thermoplastic resin or thermosetting resin used for the reflective resin portion 23, it is desirable to select a resin having excellent heat resistance, weather resistance and mechanical strength. The type of the thermoplastic resin, polyamide, polyphthalamide (PPA), polyphenylene sulfide, liquid crystal polymers, polyether sulfone, polyether imide and polybutylene terephthalate, polyolefins, cyclo polyolefins, as the thermosetting resin, e Poxy, polyimide, etc. can be used. Furthermore, by adding any one of titanium dioxide, zirconium dioxide, potassium titanate, aluminum nitride, and boron nitride as a light reflecting agent in these resins, the surface of the reflecting resin portion 23 can be separated from the LED element 21. Thus, it becomes possible to increase the light extraction efficiency of the entire semiconductor device 20.

  5 and 6, the lead frame member 10 of the resin-attached lead frame member 30 has a plurality of lead frames 14 each including an LED element mounting portion 25 and a lead portion 26. However, the present invention is not limited to this. It is not something that can be done. The resin-attached lead frame member 30 may have one lead frame 14 including the LED element mounting portion 25 and the lead portion 26.

Structure of a semiconductor device Next, FIGS. 7 to 9, an embodiment of a semiconductor device manufactured (LED package) will be described with reference to the lead frame member 10 shown in FIGS. 7 and 9 are a cross-sectional view and a plan view, respectively, showing a semiconductor device (SON type).

  As shown in FIGS. 7 to 9, the semiconductor device (LED package) 20 is provided around the lead frame 14 including the LED element mounting portion 25 and the lead portion 26, and the LED element mounting portion 25 and the lead portion 26. The reflective resin portion 23, the LED element 21 mounted on the LED element mounting portion 25, and a bonding wire (connection portion) 22 that electrically connects the LED element 21 and the lead portion 26 are provided.

  The LED element 21 and the bonding wire 22 are sealed with a light-transmitting sealing resin portion 24. The sealing resin portion 24 is provided on the surface of the lead frame 14.

  In addition, the connection part 27 is each connected with the LED element mounting part 25 and the lead part 26, and each connection part 27 is exposed to the side from the reflective resin part 23. FIG. As shown in FIG. 7, the cross section of the connecting portion 27 (the cross section perpendicular to the longitudinal direction of the connecting portion 27) has a substantially rectangular shape.

  Hereinafter, the respective constituent members constituting such a semiconductor device 20 will be sequentially described.

  The LED element 21 selects an emission wavelength ranging from ultraviolet light to infrared light by appropriately selecting a material made of a compound semiconductor single crystal such as GaP, GaAs, GaAlAs, GaAsP, AlInGaP, or InGaN as a light emitting layer. Can do. As such an LED element 21, those conventionally used in general can be used.

  The LED element 21 is fixedly mounted on the LED element mounting portion 25 by solder or die bonding paste. When using a die bonding paste, it is possible to select a die bonding paste made of an epoxy resin or a silicone resin having light resistance.

  The bonding wire 22 is made of a material having good conductivity such as gold, and one end thereof is connected to the terminal portion 21 a of the LED element 21, and the other end is connected to the lead portion 26. A terminal portion (not shown) is also provided on the back surface of the LED element 21, and the terminal portion on the back surface side and the LED element mounting portion 25 are electrically connected.

  For the sealing resin portion 24, it is desirable to select a material having a high light transmittance and a high refractive index at the emission wavelength of the semiconductor device 20 in order to improve the light extraction efficiency. Therefore, it is possible to select an epoxy resin or a silicone resin as a resin that satisfies the characteristics of high heat resistance, weather resistance, and mechanical strength. In particular, when a high-brightness LED is used as the LED element 21, the sealing resin portion 24 is preferably made of a silicone resin having high weather resistance because the sealing resin portion 24 is exposed to strong light.

  Since the configurations of the lead frame 14 and the reflective resin portion 23 have already been described with reference to FIGS. 1 to 6, detailed description thereof is omitted here.

Method for Manufacturing Lead Frame for Mounting LED Element Next, a method for manufacturing the lead frame member 10 shown in FIGS. 1 to 3 will be described with reference to FIGS. 10A to 10F are cross-sectional views showing a method for manufacturing the lead frame member 10 according to the present embodiment, and each correspond to the cross section shown in FIG.

  First, as shown in FIG. 10A, a flat metal substrate 31 is prepared. As the metal substrate 31, a metal substrate made of copper, copper alloy, 42 alloy (Ni 42% Fe alloy) or the like can be used as described above. In addition, it is preferable to use what the metal substrate 31 performed the degreasing | defatting etc. to the both surfaces, and performed the washing process.

  Next, photosensitive resists 32a and 33a are applied to the entire front and back surfaces of the metal substrate 31, respectively, and dried (FIG. 10B). As the photosensitive resists 32a and 33a, conventionally known resists can be used.

  Subsequently, the metal substrate 31 is exposed through a photomask and developed to form etching resist layers 32 and 33 having desired openings 32b and 33b (FIG. 10C).

  Next, the etching resist layers 32 and 33 are used as an anticorrosion film, and the metal substrate 31 is etched with an etching solution (FIG. 10D). Corrosion liquid can be suitably selected according to the material of the metal substrate 31 to be used. For example, when copper is used as the metal substrate 31, a ferric chloride aqueous solution is usually used and spray etching can be performed from both surfaces of the metal substrate 31. At this time, by appropriately adjusting the pattern shape and the like of the etching resist layers 32 and 33, the surface sagging portion 28 is formed by half etching on the surface of the portion corresponding to the connecting portion 27 in the metal substrate 31. .

  Next, the etching resist layers 32 and 33 are peeled and removed to obtain the lead frame main body 11 including the frame 13 and the plurality of lead frames 14 arranged in the frame 13 (FIG. 10 ( e)).

  Next, by electroplating the front and back surfaces of the lead frame main body 11, a metal (for example, silver) is deposited on the lead frame main body 11, and the plating layer 12 is formed on the entire surface including the front and back surfaces of the lead frame main body 11. Is formed (FIG. 10F).

  In the meantime, specifically, the lead frame main body 11 is sequentially subjected to, for example, an electrolytic degreasing step, a pickling step, a chemical polishing step, a copper strike step, a water washing step, a neutral degreasing step, a cyan washing step, and a silver plating step. The plating layer 12 is formed. In this case, examples of the plating solution for electrolytic plating used in the silver plating step include a silver plating solution mainly composed of silver cyanide. In the actual process, a water washing process is appropriately added between the processes as necessary. Further, the plating layer 12 may be formed only on a part of the lead frame main body 11 by interposing a patterning step in the middle of the above steps.

  In this way, the lead frame member 10 shown in FIGS. 1 to 3 is obtained (FIG. 10 (f)).

Manufacturing Method of Leadframe Member with Resin Next, a manufacturing method of the leadframe member 30 with resin shown in FIGS. 5 and 6 and a manufacturing method of the semiconductor device 20 shown in FIGS. A description will be given using (f). FIGS. 11A to 11F are cross-sectional views illustrating a method for manufacturing the resin-attached lead frame member 30 and the semiconductor device 20 according to the present embodiment.

  First, the lead frame member 10 is manufactured by the above-described steps (FIGS. 10A to 10G). The lead frame member 10 thus obtained is mounted in, for example, a mold (not shown) of an injection molding machine or a transfer molding machine, and a thermosetting resin is poured into the mold and cured. Thereby, the reflective resin portion 23 is formed around each lead frame 14 of the lead frame member 10. Alternatively, the reflective resin portion 23 may be formed using a coating method such as a printing method using a squeegee or a die coat. In this way, the resin-attached lead frame member 30 in which the reflective resin portion 23 and the lead frame member 10 are integrally formed is obtained (FIG. 11A).

  At this time, the reflective resin portion 23 is also formed on the gap 16 between the LED element mounting portion 25 and the lead portion 26 and on the surface drop portion 28 of the connecting portion 27. Further, the surface of the reflective resin portion 23 is located on the same plane as the surface of each lead frame 14, and the back surface of the reflective resin portion 23 is located on the same plane as the back surface of each lead frame 14.

  Next, the LED element 21 is mounted on the LED element mounting portion 25 of each lead frame 14. In this case, the LED element 21 is mounted and fixed on the LED element mounting portion 25 using a solder or a die bonding paste (die attach process) (FIG. 11B).

  Next, the terminal portion 21a of the LED element 21 and the surface of the lead portion 26 are electrically connected to each other by the bonding wire 22 (wire bonding step) (FIG. 11C).

  Thereafter, a sealing resin portion 24 is provided on the surface of the lead frame 14, and the LED element 21 and the bonding wire 22 are sealed by the sealing resin portion 24 (FIG. 11D).

  Next, the reflective resin portion 23 and each connecting portion 27 are cut to separate the resin-attached lead frame member 30 for each LED element 21 (dicing step) (FIG. 11E). At this time, the lead frame member 30 with resin is first placed and fixed on the dicing tape 37, and then the reflective resin portion 23 and the connecting portion 27 between the LED elements 21 are connected by a blade 38 made of, for example, a diamond grindstone. Disconnect.

  In this way, the semiconductor device 20 shown in FIGS. 7 to 9 is obtained (FIG. 11 (f)).

  As described above, according to the present embodiment, since the surface sagging portion 28 that falls from the surface of the frame 13 and the lead frame 14 is formed on the surface of the connecting portion 27, the sealing resin portion 24 and the lead frame 14 Is not exposed from the side surface of the semiconductor device 20 (see FIG. 3). Accordingly, there is no possibility that moisture or sulfur in the air enters from the interface between the sealing resin portion 24 and the lead frame 14. Thereby, it can prevent that the optical characteristic of the semiconductor device 20 deteriorates. Specifically, it is possible to prevent the light flux from the LED element 21 from deteriorating or the color of the light from the LED element 21 from changing.

  Further, even if moisture enters the side surface of the semiconductor device 20 from the interface between the connecting portion 27 and the reflective resin portion 23, the surface of the connecting portion 27 is covered with the reflective resin portion 23. Moisture does not reach the surface of the LED element mounting portion 25 or the lead portion 26, and the optical characteristics are not affected. In addition, since the sealing resin portion 24 and the reflective resin portion 23 are in close contact with each other, there is no possibility that moisture enters from the interface between the sealing resin portion 24 and the reflective resin portion 23.

Modified Example Next, modified examples of the lead frame member, the lead frame member with resin, and the semiconductor device (LED package) will be described with reference to FIGS. 12 to 16, the same parts as those of the embodiment shown in FIGS. 1 to 11 are denoted by the same reference numerals, and detailed description thereof is omitted.

Modification 1
12 to 15 are diagrams showing a modification (modification 1) of the present embodiment. FIG. 12 is a cross-sectional view showing a lead frame member 10A according to this modification, and FIG. 13 is a cross-sectional view showing a lead frame member 30A with resin according to this modification. FIG. 14 is a cross-sectional view showing a semiconductor device 20A according to this variation, and FIG. 15 is a cross-sectional view showing the semiconductor device 20A according to this variation.

  12 to 15, unlike the embodiment shown in FIGS. 1 to 11, a back surface depression portion 29 that further falls from the back surface of the frame body 13, the LED element mounting portion 25, and the lead portion 26 is further provided on the back surface of the connecting portion 27. Is formed. A reflective resin portion 23 is also formed on the back surface depression portion 29.

  With such a configuration, the entire periphery of the connecting portion 27 is covered with the reflective resin portion 23. Therefore, for example, when dicing (FIG. 11E), the LED element mounting portion 25 and the lead portion 26 are on the back surface of the reflective resin portion 23. It is possible to prevent the problem of falling off from. Further, since the connecting portion 27 is not exposed from the back surface of the semiconductor device 20A, the shape of the first outer lead portion 41 and the second outer lead portion 42 can be made rectangular, and the semiconductor device 20 can be mounted on a mounting board (not shown). Easy to implement.

  12 to 15, the lead frame member 10A and the lead frame member with resin 30A have a plurality of lead frames 14 each including an LED element mounting portion 25 and a lead portion 26. However, the present invention is not limited to this. Instead, the lead frame member 10 </ b> A and the resin-attached lead frame member 30 </ b> A may have one lead frame 14 including the LED element mounting portion 25 and the lead portion 26.

Modification 2
FIG. 16 is a view showing a modified example (modified example 2) of the present embodiment, and is a cross-sectional view showing a semiconductor device 20B according to the modified example.

  In the semiconductor device 20B shown in FIG. 16, unlike the embodiment shown in FIGS. 1 to 11, the cross section of the connecting portion 27 (the cross section perpendicular to the longitudinal direction of the connecting portion 27) is from the surface side of the connecting portion 27. It has a trapezoidal shape that tapers toward the back side. Such a cross-sectional shape is formed by appropriately adjusting the pattern shapes of the etching resist layers 32 and 33 when the metal substrate 31 is etched to form the connecting portion 27 (FIG. 10D). Is possible. Alternatively, such a cross-sectional shape is a two-step etching method, that is, after etching one surface of the metal substrate 31, a resist is embedded into the surface where the etching is completed, and then the other side of the metal substrate 31 is protected. It can also be formed by etching the surface.

  With such a configuration, since the connecting portion 27 is caught by the reflective resin portion 23, the LED element mounting portion 25 and the lead portion 26 are dropped from the back surface of the reflective resin portion 23 during dicing (FIG. 11E). Can be prevented.

  Although not shown, the lead frame member 10 shown in FIGS. 1 to 3 and the lead frame member 30 with resin shown in FIGS. 5 and 6 also taper the cross section of the connecting portion 27 toward the back surface side. It may be trapezoidal. In this case, the lead frame member 10 and the lead frame member 30 with resin may include a plurality of lead frames 14 or a single lead frame 14.

Modification 3
FIG. 17 is a view showing a modified example (modified example 3) of the present embodiment, and is a cross-sectional view showing a semiconductor device 20C according to the modified example.

  In the semiconductor device 20C shown in FIG. 17, unlike the embodiment shown in FIGS. 1 to 11, the cross section of the connecting portion 27 (the cross section perpendicular to the longitudinal direction of the connecting portion 27) is from the back side of the connecting portion 27. It has a trapezoidal shape that tapers toward the surface. Such a cross-sectional shape is formed by appropriately adjusting the pattern shapes of the etching resist layers 32 and 33 when the metal substrate 31 is etched to form the connecting portion 27 (FIG. 10D). Is possible. Alternatively, such a cross-sectional shape can also be formed by the two-stage etching method described above.

  With such a configuration, when the reflective resin portion 23 is formed on the lead frame member 10, the flow of the resin around the connecting portion 27 becomes good, and the resin can be reliably filled.

  Although not shown, also in the lead frame member 10 shown in FIGS. 1 to 3 and the lead frame member 30 with resin shown in FIGS. 5 and 6, the cross section of the connecting portion 27 is directed from the back side to the front side. A tapered trapezoidal shape may be used. In this case, the lead frame member 10 and the lead frame member 30 with resin may include a plurality of lead frames 14 or a single lead frame 14.

10, 10A Lead frame member 11 Lead frame body 12 Plating layer 13 Frame body 14 Lead frame 16 Gap 20, 20A, 20B Semiconductor device 21 LED element 22 Bonding wire (connection part)
DESCRIPTION OF SYMBOLS 23 Reflective resin part 24 Sealing resin part 25 LED element mounting part 26 Lead part 27 Connecting part 28 Surface depression part 29 Back surface depression part 30, 30A Lead frame member with resin 41 First outer lead part 42 Second outer lead part

Claims (9)

In the lead frame member for LED element mounting,
A frame,
An LED element mounting portion disposed in the frame and on which the LED element is mounted;
A lead portion spaced apart from the LED element mounting portion,
The LED element mounting portion and the lead portion are each connected to the frame body via a connecting portion,
On the surface of the connecting part, a surface drop part that falls from the surface of the frame body, the LED element mounting part and the lead part is formed,
On the back surface of the connecting portion, further form a back surface depression portion that falls from the back surface of the frame, the LED element mounting portion, and the lead portion ,
A lead frame member characterized in that the cross section of the connecting portion has a trapezoidal shape that tapers toward the back side . In the lead frame member for LED element mounting,
A frame,
An LED element mounting portion disposed in the frame and on which the LED element is mounted;
A lead portion spaced apart from the LED element mounting portion,
The LED element mounting portion and the lead portion are each connected to the frame body via a connecting portion,
On the surface of the connecting part, a surface drop part that falls from the surface of the frame body, the LED element mounting part and the lead part is formed,
On the back surface of the connecting portion, further form a back surface depression portion that falls from the back surface of the frame, the LED element mounting portion, and the lead portion,
The cross section of the connecting portion, characterized in that it consists of a trapezoidal shape which is tapered toward the front surface side and to Brighter over lead frame members. In lead frame members with resin for LED element mounting,
A lead frame member, a plurality of leads including a frame body, an LED element mounting portion that is disposed in the frame body, each of which is mounted with an LED element, and a lead portion that is spaced apart from the LED element mounting portion A lead frame member connected to a frame or another lead frame via a connecting portion,
A reflective resin portion provided around each lead frame of the lead frame member,
The surface of the reflective resin part is located on the same plane as the surface of each lead frame,
The back surface of the reflective resin part is located on the same plane as the back surface of each lead frame,
On the surface of the connecting portion, a surface drop portion that falls from the surface of the frame and the lead frame is formed,
A lead frame member with a resin, wherein a back surface depression portion that falls from the back surface of the frame body and the lead frame is further formed on the back surface of the connecting portion. In lead frame members with resin for LED element mounting,
A lead frame member having a frame body, an LED element mounting portion that is disposed in the frame body and on which the LED element is mounted, and a lead portion that is spaced apart from the LED element mounting portion and mounted on the LED element The lead frame member is connected to the frame body via a connecting portion,
An LED element mounting portion of the lead frame member and a reflective resin portion provided around the lead portion;
The surface of the reflective resin part is located on the same plane as the surface of the LED element mounting part and the lead part,
The back surface of the reflective resin portion is located on the same plane as the back surface of the LED element mounting portion and the lead portion,
On the surface of the connecting portion, a surface drop portion that falls from the surface of the frame, the LED element mounting portion, and the lead portion is formed,
A lead frame member with a resin, wherein a back surface depression portion that falls from the back surface of the frame body, the LED element mounting portion, and the lead portion is further formed on the back surface of the connection portion. The lead frame member with resin according to claim 3 or 4 , wherein a cross section of the connecting portion has a trapezoidal shape that tapers toward the back surface side. The cross section of the coupling portion according to claim 3 or 4 resin coated lead frame member according to characterized in that it consists of a trapezoidal shape which is tapered toward the surface side. In semiconductor devices,
An LED element mounting portion;
A lead portion spaced apart from the LED element mounting portion;
A connecting part connected to the LED element mounting part and the lead part,
A reflective resin portion provided around the LED element mounting portion and the lead portion;
LED elements mounted on the LED element mounting portion;
A connecting portion for connecting the lead portion and the LED element;
Provided on the surface of the LED element mounting portion and the lead portion, and includes a sealing resin portion for sealing the LED element and the connection portion,
The surface of the reflective resin part is located on the same plane as the surface of the LED element mounting part and the lead part,
The back surface of the reflective resin portion is located on the same plane as the back surface of the LED element mounting portion and the lead portion,
On the surface of the connecting part, a surface depression part that falls from the surface of the lead frame is formed, the connecting part is exposed to the side from the reflective resin part,
A semiconductor device, wherein a back surface depression portion that falls from the back surface of the frame body, the LED element mounting portion, and the lead portion is further formed on the back surface of the connection portion. 8. The semiconductor device according to claim 7 , wherein the cross section of the connecting portion has a trapezoidal shape that tapers toward the back surface side. 8. The semiconductor device according to claim 7 , wherein the cross section of the connecting portion has a trapezoidal shape that tapers toward the surface side.

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